JPS60158742U - Dai collection - Google Patents

Dai collection

Info

Publication number
JPS60158742U
JPS60158742U JP4738284U JP4738284U JPS60158742U JP S60158742 U JPS60158742 U JP S60158742U JP 4738284 U JP4738284 U JP 4738284U JP 4738284 U JP4738284 U JP 4738284U JP S60158742 U JPS60158742 U JP S60158742U
Authority
JP
Japan
Prior art keywords
dai
collection
chip component
hole
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4738284U
Other languages
Japanese (ja)
Inventor
誠 五十嵐
芳男 佐藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP4738284U priority Critical patent/JPS60158742U/en
Publication of JPS60158742U publication Critical patent/JPS60158742U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図は従来使用しているグイコレットのそれ
ぞれの例を示す図で、第1図は斜視図、第2図aは断面
図、第2図すは先端部の正面図である。第3図は本考案
によるグイコレットの実施例を示す斜視図である。 1・・・ノズル、2・・・貫通孔、3・・・金属箔、3
a・・・孔、4・・・凹部。
Figures 1 and 2 are diagrams showing examples of conventionally used guicolets, with Figure 1 being a perspective view, Figure 2 a being a sectional view, and Figure 2 being a front view of the tip. . FIG. 3 is a perspective view showing an embodiment of the guicolette according to the present invention. 1... Nozzle, 2... Through hole, 3... Metal foil, 3
a...hole, 4...recess.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] チップ部品をグイボンディングするため貫通孔を通して
前記チップ部品を先端部に真空吸着するグイフレットに
おいて、前記グイコレット先端部の貫通孔を覆うように
、複数個の小孔を有する金属箔を取付け、前記金属箔に
チップ部品の一面が接触して真空吸着されるように構成
したことを特徴とするグイコレット。
In a Guifret, in which the chip component is vacuum-adsorbed to the tip through a through hole in order to bond the chip component, a metal foil having a plurality of small holes is attached so as to cover the through hole in the tip of the GuiCollet, and the metal foil is Guicolette is characterized in that it is configured such that one side of the chip component contacts and is vacuum-adsorbed.
JP4738284U 1984-03-30 1984-03-30 Dai collection Pending JPS60158742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4738284U JPS60158742U (en) 1984-03-30 1984-03-30 Dai collection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4738284U JPS60158742U (en) 1984-03-30 1984-03-30 Dai collection

Publications (1)

Publication Number Publication Date
JPS60158742U true JPS60158742U (en) 1985-10-22

Family

ID=30562657

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4738284U Pending JPS60158742U (en) 1984-03-30 1984-03-30 Dai collection

Country Status (1)

Country Link
JP (1) JPS60158742U (en)

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