JPS6213731Y2 - - Google Patents

Info

Publication number
JPS6213731Y2
JPS6213731Y2 JP5483983U JP5483983U JPS6213731Y2 JP S6213731 Y2 JPS6213731 Y2 JP S6213731Y2 JP 5483983 U JP5483983 U JP 5483983U JP 5483983 U JP5483983 U JP 5483983U JP S6213731 Y2 JPS6213731 Y2 JP S6213731Y2
Authority
JP
Japan
Prior art keywords
cylindrical body
cylinder
protruding
solder
upper edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5483983U
Other languages
Japanese (ja)
Other versions
JPS59162162U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5483983U priority Critical patent/JPS59162162U/en
Publication of JPS59162162U publication Critical patent/JPS59162162U/en
Application granted granted Critical
Publication of JPS6213731Y2 publication Critical patent/JPS6213731Y2/ja
Granted legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

【考案の詳細な説明】 この考案は噴流式はんだデイツプ装置に関し、
特に当該装置のはんだ液噴き上げ用の筒体外周へ
高低調節可能な突出筒体を取付け、この突出筒体
でプリント配線板を支持し、プリント配線板をあ
やまつてはんだ槽内へ浸すことがなく、しかも適
量のはんだ液で確実にはんだづけするもので、す
なわちはんだ槽1内へダクト2を設け、ダクト2
の入口2aへはんだ液3の送出機構4を設け、ダ
クト2の出口2bへ筒体5を取付け、しかも筒体
5の上縁5aをはんだ槽1の上縁1aより突出さ
せた噴流式はんだデイツプ装置において、筒体5
へ間隔をもつて突出筒体6を外挿するとともに突
出筒体6の上縁6aを筒体5の上縁5aより突出
させ、突出筒体6へ高低調節孔60を形成すると
ともに突出筒体6の上縁6aを水平に形成し、高
低調節孔60へボルト61を挿通するとともにナ
ツト62で締着して筒体5へ突出筒体6を位置調
整自在に取付けることを特徴とするものである。
[Detailed explanation of the invention] This invention relates to a jet-type solder dip device.
In particular, a height-adjustable protruding cylindrical body is attached to the outer periphery of the cylinder for spouting solder liquid in the device, and the protruding cylindrical body supports the printed wiring board, thereby preventing the printed wiring board from being accidentally dipped into the solder bath. Moreover, the soldering is performed reliably using an appropriate amount of solder liquid.
A jet soldering dip is provided with a delivery mechanism 4 for the solder liquid 3 to the inlet 2a of the duct 2, a cylindrical body 5 attached to the outlet 2b of the duct 2, and an upper edge 5a of the cylindrical body 5 protruding from the upper edge 1a of the solder bath 1. In the device, the cylindrical body 5
The protruding cylindrical body 6 is externally inserted with a gap therebetween, and the upper edge 6a of the protruding cylindrical body 6 is made to protrude from the upper edge 5a of the cylindrical body 5. A height adjustment hole 60 is formed in the protruding cylindrical body 6, and the protruding cylindrical body 6 is formed horizontally, and a bolt 61 is inserted into a height adjustment hole 60 and tightened with a nut 62 to attach the protruding cylindrical body 6 to the cylindrical body 5 in a position adjustable manner. be.

従来より、プリント配線板へ各種の回路部品を
取付け、これら部品の端子へはんだづけするには
種々の方法が知られている。この内、はんだ槽中
で溶融しているはんだ液へ短時間浸してはんだづ
けする方法が、能率的で、しかも迅速にでき、最
も多く利用されている。しかし、この従来法によ
ると、はんだづけ作業の後、回路部に付着したフ
ラツクス等をクロロセンで洗滌しなければならな
い。ところが、各種の回路部品の中には、コネク
ターや各種のスイツチのようにクロロセン洗滌を
行うと構成材料が劣化するものがあり、これらは
他部品と同時に組みこんだり、デイツプしたり、
洗滌するわけにはいかないものである。そこで、
これらの特殊な部品は、後付けと称して、他の部
品のはんだデイツプ作業および洗滌作業が完了し
た後に組み込み、リード線ごとにはんだ鏝ではん
だづけ作業をしている。
Conventionally, various methods are known for attaching various circuit components to a printed wiring board and soldering the terminals of these components. Among these methods, the method of soldering by briefly dipping into molten solder liquid in a solder bath is efficient and quick, and is the most commonly used method. However, according to this conventional method, after the soldering operation, flux and the like adhering to the circuit section must be washed off with chlorocene. However, among various circuit parts, such as connectors and various switches, the constituent materials of some parts deteriorate when washed with chlorocene, and these parts cannot be assembled at the same time as other parts, dipped, etc.
It cannot be washed away. Therefore,
These special parts are called retrofitting and are installed after the soldering work and cleaning work of other parts have been completed, and each lead wire is soldered with a soldering iron.

また、一度はんだデイツプが完了した部品を設
計変更やその他の理由で取りはずす機会も比較的
多く、その場合は空気吸引機付のはんだ鏝を使用
し、はんだづけされた部品のリード線ごとに溶か
しながらはんだを吸着して部品をはずしている。
In addition, there are relatively many occasions when parts that have already been soldered must be removed due to design changes or other reasons. In that case, a soldering iron with an air suction device is used to melt each lead wire of the soldered parts while soldering. The parts are removed by suction.

このような後付け作業や部品取りはずし作業を
はんだ鏝を使用せず、能率よく行うために、小部
分だけを溶融はんだ液に浸し、他のはんだづけの
完了した部分はとけないような噴流式はんだデイ
ツプ装置が最近利用されるようになつてきた。
In order to efficiently perform such retrofitting work and component removal work without using a soldering iron, we have developed a jet-type soldering dip device that immerses only a small part in the molten solder solution and does not melt other soldered parts. has recently come into use.

第3図に示すものが、それであり、図面にした
がつて説明すれば、はんだ槽1底部の水密空間7
内へヒーター8を取付け、ヒーター8の上方へダ
クト2を固定し、ダクト2の入口2aの手前へ、
はんだ液3を送出する機構4として撹拌羽根40
を設け、円筒状の筒体5をダクト2の出口2bへ
突設するとともに筒体5の上縁5aをはんだ槽1
の上縁1aより突出させるものである。そしてヒ
ーター8によりはんだを溶融してはんだ液3と
し、モーター(図示せず)により、撹拌羽根40
を回転させ、はんだ液3をダクト2内へ送り込
み、ここにはんだ液3はダクト2内を矢印のよう
に進み、その一部は筒体5より噴き上がり、矢印
のように環流する。よつてプリント配線板Pを手
で持つて筒体5の上方へ進入させ、はんだづけ部
を噴き上げるはんだ液3の頂上へ当て、筒体5の
内面積分だけ、はんだづけするものである。しか
し、この方法によるとプリント配線板Pを手で持
つて進入させるため、水平に支えることが困難
で、プリント配線板を少しでも傾かせると鎖線で
示すように他の部分がはんだ液3内へ突つ込んで
しまう欠点がある。なお、この点ははんだづけさ
れた部分を後で取外す場合も同様である。または
んだづけするはんだの量はプリント配線板Pと筒
体5上縁5aとの間隔によつて決まるが、手作業
による勘に頼らざるを得ず、熟練を要し、しかも
プリント配線板を傾かせた場合は、肝心なはんだ
づけすべき部分がはんだ不足になり、極めて不都
合である。
What is shown in FIG. 3 is the watertight space 7 at the bottom of the solder bath 1.
Attach the heater 8 inside, fix the duct 2 above the heater 8, and move it in front of the entrance 2a of the duct 2.
A stirring blade 40 serves as a mechanism 4 for delivering the solder liquid 3.
The cylindrical body 5 is provided to protrude toward the outlet 2b of the duct 2, and the upper edge 5a of the cylinder 5 is connected to the solder bath 1.
It is made to protrude from the upper edge 1a of the. Then, the solder is melted by a heater 8 to form a solder liquid 3, and a stirring blade 40 is generated by a motor (not shown).
is rotated to send the solder liquid 3 into the duct 2, where the solder liquid 3 travels inside the duct 2 as shown by the arrow, and a part of it is spouted out from the cylindrical body 5 and circulates as shown by the arrow. Therefore, the printed wiring board P is held by hand and advanced into the upper part of the cylindrical body 5, and the soldering part is applied to the top of the spouting solder liquid 3 to solder only the inner area of the cylindrical body 5. However, according to this method, the printed wiring board P is held in the hands and entered, making it difficult to support it horizontally.If the printed wiring board is tilted even slightly, other parts will fall into the solder liquid 3 as shown by the chain line. There are drawbacks that can be overlooked. Note that this point also applies when the soldered portion is later removed. The amount of solder to be soldered is determined by the distance between the printed wiring board P and the upper edge 5a of the cylindrical body 5, but this requires manual intuition, requires skill, and causes the printed wiring board to tilt. In this case, the important parts to be soldered will be short of solder, which is extremely inconvenient.

この考案は、これらの不都合を解消するもの
で、次に実施例の構造を詳細に説明する。なお、
第3図に示した部材と同一の部材については同一
の符号を付してその説明を省略する。この実施例
は前述の従来例における円筒状の筒体5へ10mm〜
20mmのように小さな間隔をもつて円筒状の突出
筒体6を外挿し、しかも突出筒体6の上縁6aを
筒体5の上縁5aより突出させるものであり、突
出筒体6はステンレス鋼板を丸めて形成し、突出
筒体6へ斜め細長状の高低調節孔60を同一高さ
位置へ3ケ所等配して穿ち、各高低調節孔60に
相対向するように筒体5へもボルト挿通孔51を
真円状に穿ち、段部61′付きボルト61を高低
調節孔60、ボルト挿通孔51へ差し込み、筒体
5へ固着したナツト62に螺着して筒体5へ突出
筒体6を同心円状に取付けるものである。
This invention solves these disadvantages, and the structure of an embodiment will be explained in detail next. In addition,
The same members as those shown in FIG. 3 are designated by the same reference numerals, and their description will be omitted. In this embodiment, the length of the cylindrical body 5 in the conventional example described above is 10 mm ~
A cylindrical protruding body 6 is inserted at a small interval such as 20 mm, and the upper edge 6a of the protruding body 6 is made to protrude from the upper edge 5a of the cylinder 5. The protruding body 6 is made of stainless steel. A steel plate is formed by rolling it, and diagonally elongated height adjustment holes 60 are bored in the protruding cylinder 6 at three equally spaced positions at the same height, and holes are also formed in the cylinder 5 so as to face each height adjustment hole 60. Drill the bolt insertion hole 51 in a perfect circle shape, insert the bolt 61 with the stepped portion 61' into the height adjustment hole 60 and the bolt insertion hole 51, screw it into the nut 62 fixed to the cylinder body 5, and make the cylinder protrude into the cylinder body 5. The bodies 6 are attached concentrically.

また筒体5の下端へ一体形成したフランジ52
およびダクト2の上面板21へそれぞれ複数個の
ネジ孔53,22を螺設し、各ネジ孔53,22
へボルト54を螺着してダクト2へ筒体5を固定
するものである。ボルト54の軸を第1図示のよ
うに長くしたのははんだ液3を入れた後でも適
宜、口径の異なる筒体5を交換する場合、はんだ
槽1外から螺動操作をできるようにするためであ
る。またこの実施例の場合、はんだ液3の送出機
構4は撹拌羽根40とこれを駆動するモーター4
1であり、モーター41はタイマー42に接続さ
れ、このタイマー42は常時運転するためのボタ
ン43および所定の時間例えば3秒間、運転して
切れるためのボタン44を有するものである。さ
らにはんだ槽1内へはんだ液3の温度を検出する
温度センサー80を設け、この温度センサー80
を温度制御器81に接続し、設定温度に応じて温
度制御器81によりヒーター8のオン・オフを制
御するようにしている。
Also, a flange 52 integrally formed on the lower end of the cylinder 5
A plurality of screw holes 53, 22 are screwed into the top plate 21 of the duct 2, and each screw hole 53, 22 is screwed into the top plate 21 of the duct 2.
The cylindrical body 5 is fixed to the duct 2 by screwing the bolt 54 thereon. The reason why the shaft of the bolt 54 is made long as shown in the first diagram is to enable screw operation from outside the solder bath 1 even after the solder liquid 3 has been poured, when replacing the cylindrical body 5 with a different diameter. It is. Further, in the case of this embodiment, the delivery mechanism 4 for the solder liquid 3 includes a stirring blade 40 and a motor 4 that drives the stirring blade 40.
1, the motor 41 is connected to a timer 42, and the timer 42 has a button 43 for constant operation and a button 44 for operation for a predetermined period of time, for example 3 seconds, and then turned off. Furthermore, a temperature sensor 80 is provided in the solder bath 1 to detect the temperature of the solder liquid 3.
is connected to a temperature controller 81, and the temperature controller 81 controls turning on and off of the heater 8 according to the set temperature.

なおこの実施例における筒体5へ突出筒体6を
位置調整しつつ取付けるには、まず、はんだ槽1
外において、各ボルト61を少し緩め、突出筒体
6を少し回動する。ここに静止しているボルト6
1に対し、高低調節孔60は斜めに上昇若しくは
下降するので突出筒体6も回動しながら上昇若し
くは下降する。よつて筒体5の上縁5aより所定
の距離m(2mm〜7mm)だけ突出筒体6を突出さ
せ、上面6aを水平にし、各ボルト61を締め、
突出筒体6を固定する。また前記筒体5をダクト
2へ固定するには、フランジ52をダクト2の出
口2bの周囲へ置き、各ネジ孔53,22へボル
ト54を螺着して固定する。
In addition, in order to attach the protruding cylinder 6 to the cylinder 5 in this embodiment while adjusting the position, first, the solder bath 1 is
On the outside, loosen each bolt 61 a little and rotate the protruding cylinder 6 a little. Bolt 6 is stationary here
1, since the height adjustment hole 60 moves up or down diagonally, the protruding cylinder 6 also moves up or down while rotating. Therefore, the protruding cylinder 6 is made to protrude by a predetermined distance m (2 mm to 7 mm) from the upper edge 5a of the cylinder 5, the upper surface 6a is made horizontal, and each bolt 61 is tightened.
The protruding cylindrical body 6 is fixed. Further, in order to fix the cylinder 5 to the duct 2, the flange 52 is placed around the outlet 2b of the duct 2, and the bolts 54 are screwed into the screw holes 53 and 22 to fix it.

次にこの実施例の使用法および作用を説明す
る。まずはんだづけする部品9の端子9aが筒体
5へ位置するようにプリント配線板Pを突出筒体
6の上縁6aへ載置し、軽く押さえれば、プリン
ト配線板Pは水平に支持される。しかもプリント
配線板Pと筒体5の上縁5aとの間隔mは一定な
ので、噴き上げられた適量のはんだ液3により端
子9aは確実にはんだづけされていく。またボタ
ン44を押せば、モーター41は所定の時間のみ
駆動するので、常時、一定量のはんだ液3が噴き
上げられ、最適のはんだ量により、しかも確実に
はんだづけされるものである。なお一定量のはん
だ液を噴出させるよりも迅速性を優先させたい場
合は、ボタン43を押し、常時はんだ液を噴流さ
せ、プリント配線板Pを次々と交換させていけば
よいものである。また、はんだ済の回路部品をプ
リント配線板より取外す場合も同様の作用によ
る。
Next, the usage and operation of this embodiment will be explained. First, the printed wiring board P is placed on the upper edge 6a of the protruding cylinder 6 so that the terminals 9a of the parts 9 to be soldered are positioned on the cylinder 5, and by pressing lightly, the printed wiring board P is supported horizontally. Moreover, since the distance m between the printed wiring board P and the upper edge 5a of the cylindrical body 5 is constant, the terminals 9a are reliably soldered by an appropriate amount of the solder liquid 3 spouted up. Furthermore, when the button 44 is pressed, the motor 41 is driven only for a predetermined period of time, so that a certain amount of solder liquid 3 is always spouted up, and soldering is performed reliably with the optimum amount of solder. Note that if you want to give priority to speed over spouting a certain amount of solder liquid, you can press the button 43 to constantly jet the solder liquid and replace the printed wiring boards P one after another. The same effect also applies when removing soldered circuit components from a printed wiring board.

なお、実施例のように筒体5と突出筒体6との
間隔を10mm〜20mmのように小さくすれば、プリ
ント配線板上の部品が隅の方にあつてもプリント
配線板を突出筒体上へ確実に載置できる。
Note that if the distance between the cylindrical body 5 and the protruding cylindrical body 6 is made small, such as 10 mm to 20 mm, as in the embodiment, even if the parts on the printed wiring board are located at the corners, the printed wiring board can be moved to the protruding cylindrical body. It can be placed securely on top.

このようにこの考案は筒体へ間隔をもつて突出
筒体を外挿して取付け、しかも突出筒体の上縁を
水平に形成するので、プリント配線板は水平に支
持され、確実にはんだづけがされるとともにプリ
ント配線板自体が傾いて槽内へ突つ込むような不
都合がなく、また突出筒体の上縁を筒体の上縁よ
り突出させ、しかも突出筒体へ形成した高低調節
孔へボルトを挿通するとともにナツトで締着して
筒体へ突出筒体を位置調整自在に取付けるので、
プリント配線板と筒体の間隔をそれぞれの部品に
応じて調節でき、最適なはんだ量を得ることがで
きるものである。
In this way, in this invention, the protruding cylinder is attached to the cylinder by being inserted at a distance, and the upper edge of the protruding cylinder is formed horizontally, so the printed wiring board is supported horizontally and soldering can be performed reliably. At the same time, there is no inconvenience such as the printed wiring board itself tilting and sticking into the tank, and the upper edge of the protruding cylinder is made to protrude from the upper edge of the cylinder, and the bolts can be inserted into the height adjustment hole formed in the protruding cylinder. The protruding cylindrical body is attached to the cylindrical body by inserting it through it and tightening it with a nut, so that the position of the protruding cylindrical body can be adjusted freely.
The distance between the printed wiring board and the cylindrical body can be adjusted according to each component, and the optimum amount of solder can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の実施例の縦断面図、第2図
は要部の斜視図、第3図は従来例の説明図であ
る。 1……はんだ槽、1a……上縁、2……ダク
ト、2a……入口、2b……出口、3……はんだ
液、4……送出機構、5……筒体、5a……上
縁、6……突出筒体、6a……上縁、60……高
低調節孔、61……ボルト、62……ナツト。
FIG. 1 is a longitudinal sectional view of an embodiment of this invention, FIG. 2 is a perspective view of the main parts, and FIG. 3 is an explanatory diagram of a conventional example. 1...Solder bath, 1a...Top edge, 2...Duct, 2a...Inlet, 2b...Outlet, 3...Solder liquid, 4...Delivery mechanism, 5...Cylinder, 5a...Top edge , 6...Protruding cylindrical body, 6a...Upper edge, 60...Height adjustment hole, 61...Bolt, 62...Nut.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] はんだ槽1内へダクト2を設け、ダクト2の入
口2aへはんだ液3の送出機構4を設け、ダクト
2の出口2bへ筒体5を取付け、しかも筒体5の
上縁5aをはんだ槽1の上縁1aより突出させた
噴流式はんだデイツプ装置において、筒体5へ間
隔をもつて突出筒体6を外挿するとともに突出筒
体6の上縁6aを筒体5の上縁5aより突出さ
せ、突出筒体6へ高低調節孔60を形成するとと
もに突出筒体6の上縁6aを水平に形成し、高低
調節孔60へボルト61を挿通するとともにナツ
ト62で締着して筒体5へ突出筒体6を位置調整
自在に取付けることを特徴とする噴流式はんだデ
イツプ装置。
A duct 2 is provided in the solder bath 1, a delivery mechanism 4 for the solder liquid 3 is provided to the inlet 2a of the duct 2, a cylindrical body 5 is attached to the outlet 2b of the duct 2, and the upper edge 5a of the cylindrical body 5 is connected to the solder bath 1. In a jet type solder dip device in which the protruding cylinder 6 protrudes from the upper edge 1a, the protruding cylinder 6 is inserted into the cylinder 5 at a distance, and the upper edge 6a of the protruding cylinder 6 protrudes from the upper edge 5a of the cylinder 5. Then, a height adjustment hole 60 is formed in the protruding cylinder 6, and the upper edge 6a of the protruding cylinder 6 is formed horizontally, and a bolt 61 is inserted into the height adjustment hole 60 and tightened with a nut 62. A jet solder dip device characterized in that a protruding cylindrical body 6 is attached in a position-adjustable manner.
JP5483983U 1983-04-14 1983-04-14 Jet solder dip equipment Granted JPS59162162U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5483983U JPS59162162U (en) 1983-04-14 1983-04-14 Jet solder dip equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5483983U JPS59162162U (en) 1983-04-14 1983-04-14 Jet solder dip equipment

Publications (2)

Publication Number Publication Date
JPS59162162U JPS59162162U (en) 1984-10-30
JPS6213731Y2 true JPS6213731Y2 (en) 1987-04-08

Family

ID=30185183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5483983U Granted JPS59162162U (en) 1983-04-14 1983-04-14 Jet solder dip equipment

Country Status (1)

Country Link
JP (1) JPS59162162U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269341A (en) * 2009-05-21 2010-12-02 Mitsubishi Electric Corp Soldering nozzle and soldering apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010269341A (en) * 2009-05-21 2010-12-02 Mitsubishi Electric Corp Soldering nozzle and soldering apparatus

Also Published As

Publication number Publication date
JPS59162162U (en) 1984-10-30

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