JPS6213731Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention relates to a jet-type solder dip device.
In particular, a height-adjustable protruding cylindrical body is attached to the outer periphery of the cylinder for spouting solder liquid in the device, and the protruding cylindrical body supports the printed wiring board, thereby preventing the printed wiring board from being accidentally dipped into the solder bath. Moreover, the soldering is performed reliably using an appropriate amount of solder liquid.
A jet soldering dip is provided with a delivery mechanism 4 for the solder liquid 3 to the inlet 2a of the duct 2, a cylindrical body 5 attached to the outlet 2b of the duct 2, and an upper edge 5a of the cylindrical body 5 protruding from the upper edge 1a of the solder bath 1. In the device, the cylindrical body 5
The protruding cylindrical body 6 is externally inserted with a gap therebetween, and the upper edge 6a of the protruding cylindrical body 6 is made to protrude from the upper edge 5a of the cylindrical body 5. A height adjustment hole 60 is formed in the protruding cylindrical body 6, and the protruding cylindrical body 6 is formed horizontally, and a bolt 61 is inserted into a height adjustment hole 60 and tightened with a nut 62 to attach the protruding cylindrical body 6 to the cylindrical body 5 in a position adjustable manner. be.

Conventionally, various methods are known for attaching various circuit components to a printed wiring board and soldering the terminals of these components. Among these methods, the method of soldering by briefly dipping into molten solder liquid in a solder bath is efficient and quick, and is the most commonly used method. However, according to this conventional method, after the soldering operation, flux and the like adhering to the circuit section must be washed off with chlorocene. However, among various circuit parts, such as connectors and various switches, the constituent materials of some parts deteriorate when washed with chlorocene, and these parts cannot be assembled at the same time as other parts, dipped, etc.
It cannot be washed away. Therefore,
These special parts are called retrofitting and are installed after the soldering work and cleaning work of other parts have been completed, and each lead wire is soldered with a soldering iron.

In addition, there are relatively many occasions when parts that have already been soldered must be removed due to design changes or other reasons. In that case, a soldering iron with an air suction device is used to melt each lead wire of the soldered parts while soldering. The parts are removed by suction.

In order to efficiently perform such retrofitting work and component removal work without using a soldering iron, we have developed a jet-type soldering dip device that immerses only a small part in the molten solder solution and does not melt other soldered parts. has recently come into use.

What is shown in FIG. 3 is the watertight space 7 at the bottom of the solder bath 1.
Attach the heater 8 inside, fix the duct 2 above the heater 8, and move it in front of the entrance 2a of the duct 2.
A stirring blade 40 serves as a mechanism 4 for delivering the solder liquid 3.
The cylindrical body 5 is provided to protrude toward the outlet 2b of the duct 2, and the upper edge 5a of the cylinder 5 is connected to the solder bath 1.
It is made to protrude from the upper edge 1a of the. Then, the solder is melted by a heater 8 to form a solder liquid 3, and a stirring blade 40 is generated by a motor (not shown).
is rotated to send the solder liquid 3 into the duct 2, where the solder liquid 3 travels inside the duct 2 as shown by the arrow, and a part of it is spouted out from the cylindrical body 5 and circulates as shown by the arrow. Therefore, the printed wiring board P is held by hand and advanced into the upper part of the cylindrical body 5, and the soldering part is applied to the top of the spouting solder liquid 3 to solder only the inner area of the cylindrical body 5. However, according to this method, the printed wiring board P is held in the hands and entered, making it difficult to support it horizontally.If the printed wiring board is tilted even slightly, other parts will fall into the solder liquid 3 as shown by the chain line. There are drawbacks that can be overlooked. Note that this point also applies when the soldered portion is later removed. The amount of solder to be soldered is determined by the distance between the printed wiring board P and the upper edge 5a of the cylindrical body 5, but this requires manual intuition, requires skill, and causes the printed wiring board to tilt. In this case, the important parts to be soldered will be short of solder, which is extremely inconvenient.

This invention solves these disadvantages, and the structure of an embodiment will be explained in detail next. In addition,
The same members as those shown in FIG. 3 are designated by the same reference numerals, and their description will be omitted. In this embodiment, the length of the cylindrical body 5 in the conventional example described above is 10 mm ~
A cylindrical protruding body 6 is inserted at a small interval such as 20 mm, and the upper edge 6a of the protruding body 6 is made to protrude from the upper edge 5a of the cylinder 5. The protruding body 6 is made of stainless steel. A steel plate is formed by rolling it, and diagonally elongated height adjustment holes 60 are bored in the protruding cylinder 6 at three equally spaced positions at the same height, and holes are also formed in the cylinder 5 so as to face each height adjustment hole 60. Drill the bolt insertion hole 51 in a perfect circle shape, insert the bolt 61 with the stepped portion 61' into the height adjustment hole 60 and the bolt insertion hole 51, screw it into the nut 62 fixed to the cylinder body 5, and make the cylinder protrude into the cylinder body 5. The bodies 6 are attached concentrically.

Also, a flange 52 integrally formed on the lower end of the cylinder 5
A plurality of screw holes 53, 22 are screwed into the top plate 21 of the duct 2, and each screw hole 53, 22 is screwed into the top plate 21 of the duct 2.
The cylindrical body 5 is fixed to the duct 2 by screwing the bolt 54 thereon. The reason why the shaft of the bolt 54 is made long as shown in the first diagram is to enable screw operation from outside the solder bath 1 even after the solder liquid 3 has been poured, when replacing the cylindrical body 5 with a different diameter. It is. Further, in the case of this embodiment, the delivery mechanism 4 for the solder liquid 3 includes a stirring blade 40 and a motor 4 that drives the stirring blade 40.
1, the motor 41 is connected to a timer 42, and the timer 42 has a button 43 for constant operation and a button 44 for operation for a predetermined period of time, for example 3 seconds, and then turned off. Furthermore, a temperature sensor 80 is provided in the solder bath 1 to detect the temperature of the solder liquid 3.
is connected to a temperature controller 81, and the temperature controller 81 controls turning on and off of the heater 8 according to the set temperature.

In addition, in order to attach the protruding cylinder 6 to the cylinder 5 in this embodiment while adjusting the position, first, the solder bath 1 is
On the outside, loosen each bolt 61 a little and rotate the protruding cylinder 6 a little. Bolt 6 is stationary here
1, since the height adjustment hole 60 moves up or down diagonally, the protruding cylinder 6 also moves up or down while rotating. Therefore, the protruding cylinder 6 is made to protrude by a predetermined distance m (2 mm to 7 mm) from the upper edge 5a of the cylinder 5, the upper surface 6a is made horizontal, and each bolt 61 is tightened.
The protruding cylindrical body 6 is fixed. Further, in order to fix the cylinder 5 to the duct 2, the flange 52 is placed around the outlet 2b of the duct 2, and the bolts 54 are screwed into the screw holes 53 and 22 to fix it.

Next, the usage and operation of this embodiment will be explained. First, the printed wiring board P is placed on the upper edge 6a of the protruding cylinder 6 so that the terminals 9a of the parts 9 to be soldered are positioned on the cylinder 5, and by pressing lightly, the printed wiring board P is supported horizontally. Moreover, since the distance m between the printed wiring board P and the upper edge 5a of the cylindrical body 5 is constant, the terminals 9a are reliably soldered by an appropriate amount of the solder liquid 3 spouted up. Furthermore, when the button 44 is pressed, the motor 41 is driven only for a predetermined period of time, so that a certain amount of solder liquid 3 is always spouted up, and soldering is performed reliably with the optimum amount of solder. Note that if you want to give priority to speed over spouting a certain amount of solder liquid, you can press the button 43 to constantly jet the solder liquid and replace the printed wiring boards P one after another. The same effect also applies when removing soldered circuit components from a printed wiring board.

Note that if the distance between the cylindrical body 5 and the protruding cylindrical body 6 is made small, such as 10 mm to 20 mm, as in the embodiment, even if the parts on the printed wiring board are located at the corners, the printed wiring board can be moved to the protruding cylindrical body. It can be placed securely on top.

In this way, in this invention, the protruding cylinder is attached to the cylinder by being inserted at a distance, and the upper edge of the protruding cylinder is formed horizontally, so the printed wiring board is supported horizontally and soldering can be performed reliably. At the same time, there is no inconvenience such as the printed wiring board itself tilting and sticking into the tank, and the upper edge of the protruding cylinder is made to protrude from the upper edge of the cylinder, and the bolts can be inserted into the height adjustment hole formed in the protruding cylinder. The protruding cylindrical body is attached to the cylindrical body by inserting it through it and tightening it with a nut, so that the position of the protruding cylindrical body can be adjusted freely.
The distance between the printed wiring board and the cylindrical body can be adjusted according to each component, and the optimum amount of solder can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal sectional view of an embodiment of this invention, FIG. 2 is a perspective view of the main parts, and FIG. 3 is an explanatory diagram of a conventional example. 1...Solder bath, 1a...Top edge, 2...Duct, 2a...Inlet, 2b...Outlet, 3...Solder liquid, 4...Delivery mechanism, 5...Cylinder, 5a...Top edge , 6...Protruding cylindrical body, 6a...Upper edge, 60...Height adjustment hole, 61...Bolt, 62...Nut.

Claims (1)

[Scope of utility model registration request] A duct 2 is provided in the solder bath 1, a delivery mechanism 4 for the solder liquid 3 is provided to the inlet 2a of the duct 2, a cylindrical body 5 is attached to the outlet 2b of the duct 2, and the upper edge 5a of the cylindrical body 5 is connected to the solder bath 1. In a jet type solder dip device in which the protruding cylinder 6 protrudes from the upper edge 1a, the protruding cylinder 6 is inserted into the cylinder 5 at a distance, and the upper edge 6a of the protruding cylinder 6 protrudes from the upper edge 5a of the cylinder 5. Then, a height adjustment hole 60 is formed in the protruding cylinder 6, and the upper edge 6a of the protruding cylinder 6 is formed horizontally, and a bolt 61 is inserted into the height adjustment hole 60 and tightened with a nut 62. A jet solder dip device characterized in that a protruding cylindrical body 6 is attached in a position-adjustable manner.