JPH077022Y2 - Spare soldering device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A preliminary soldering device for automatically preliminarily soldering leads of a surface-mounting type electronic component in a solder bath, and to fully automate preliminary soldering of component leads by a solder dipping method. For the purpose, a horizontal table was movably provided in the vicinity of the wave in the solder bath, a U-shaped copying surface was formed on the table so that preliminary soldering could be performed twice by reciprocating the table, and parts were provided above the table. The support arm to which the clamp is attached is installed so as to move up and down along the copying surface, the support arm is provided with its drive means, and the drive means for rotating the component lead row of the clamp downward, and reciprocating to the table. A drive means for setting each working position on the road is provided.

[Industrial application field]

The present invention relates to a pre-soldering device for automatically pre-soldering the leads of a surface-mounted electronic component in a solder bath.

In recent years, with the high-density mounting of components on printed boards,
Many of the components themselves are planar mounting types in which the pin interval is narrowed and leads are provided in two or four directions. When soldering and mounting components of this type on the board, one or both of the board conductor and the component leads are pre-soldered, and the pre-soldered leads are placed on the board conductors for thermal pulse. A solder reflow method is used in which solder is melted and connected in a reflow furnace.

Here, the preliminary solder is supplied to the component leads by a solder dipping method in which the leads are mainly dipped in a molten solder bath to attach the solder.

[Conventional technology]

Therefore, the preliminary soldering of the component lead has been conventionally performed as shown in FIGS. 3 (a) and 3 (b). That is, the lead pitch is small due to the improvement in the integration density of parts, and a large number of leads are provided in a plurality of directions. Therefore, defects such as solder bridges are likely to occur during pre-soldering, which makes automation difficult and Relies on the manual work of. Therefore,
Claws 2a, 2b at the tip of the clamp 1 held in the hand as shown in (a)
Insert the part A between them and the lead row B in a protruding state. On the other hand, the solder bath C is of the wave method. While the solder liquid D is being circulated, a part of the solder liquid D is sprayed to form a wave E, the solder liquid surface temperature is made uniform, and the decomposed gas of the flux is easily released. It is designed to maintain adhesion. As a result, as shown in (b), the lead row B of the component A of the clamp 1 is lowered from the position P ₁ immediately above the wave E to the position P ₂ of the liquid surface of the wave E, and immersed in a parallel state of a predetermined angle. Then, hold it until the solder gets wet, then wave E
The component A is horizontally moved to the position P ₃ in the direction of the overflow portion F along the flow of the solder. In this way, the preliminary solder G is attached to each of the leads B ₁ , B ₂ , ... Of the lead row B so that the solder bridge or the like is not generated while cutting the solder at the overflow portion F.

[Problems to be solved by the device]

By the way, in the above-mentioned conventional one, since it is a manual work of a human being in an environment where various gases are generated at a high temperature, workability is poor. Also, the component lead row B for the wave E
Requires skill to handle. Further, as shown in the figure, when the lead row B is in two directions, the same work needs to be repeated twice. Therefore, although it is simple, there are many work lines and delicate preliminary soldering work is mechanized and free. Is desired.

The present invention has been made in view of the above point, and an object of the present invention is to provide a preliminary soldering device that can completely automate preliminary soldering by a solder dipping method for component leads.

[Means for Solving the Problems]

In order to achieve the above object, the preliminary soldering apparatus of the present invention has, for example, a circular horizontal table rotatably mounted on the apparatus main body at substantially the same height as that near the wave of the solder bath, and the table is placed on the table. A U-shaped copying surface having two high places and a low place therebetween is formed so that the preliminary soldering process is performed twice by the reciprocating movement.

Further, a support arm to which a clamp for holding a component is detachably attached above the table is installed so as to move along the copying surface.

On the other hand, a drive means for moving the support arm, a drive means for rotating the component lead row of the clamp downward, and a drive means for setting each working position of the reciprocating path on the table are provided.
By the operation of the table, the support arm and the clamp by each driving means, the lead rows in the two directions of the component are moved along the U of the reciprocating path in the wave of the solder bath.

[Action]

Based on the above configuration, the copying surface of the table is set to the forward working position with respect to the wave of the solder bath, and the downward arm of the clamp and one direction of the component together with the supporting arm is moved forward in a U-shape. Pre-soldered to the lead row. Then, the copying surface of the table is set to the return pass working position, the lead row in the other direction of the component is directed downward, and the lead row is moved in the same U-shape to be pre-soldered to the lead row. The lead rows in the two directions are automatically pre-soldered.

〔Example〕

 An embodiment of the present invention will be described below with reference to the drawings.

In FIG. 1, reference numeral 10 denotes an apparatus main body near the wave E of the solder bath C, and a circular horizontal table 11 is rotatably mounted at substantially the same height as the wave E of the apparatus main body 10. The table 11 has a fan-shaped member having a height 12a and a slope 12b.
Similarly, a fan-shaped member 13 having a height 13a and a slope 13b is adjustably attached by a fastener 14 at a predetermined distance.
The upper surface 12a, the sloped surface 12b, the lower surface 11a of the table 11 itself, the sloped surface 13b of the member 13, and the higher surface 13a form a copying surface 15 in a U shape on the circumference.

A support arm 19 is attached to a shaft 17 penetrating the center of the table 11 by a joint 18 so as to be movable up and down.
The roller 19 is in contact with the roller 20 on the copying surface 15 via a lever 21 and rotates along the copying surface 15. A shaft 22 is rotatably attached to the arm 19, and a clamp 1 for holding the component A is detachably attached to one end of the shaft 22.
A reversing motor 23 is provided at the other end of the. An arm driving motor 24 is provided on the shaft 17. Further, a motor 26 is connected to the table 11 via a link 25, and one of the slopes 12b is set to the forward work position where the slope 12b is set to the approximate center of the wave E, and the other slope 13b is set to the approximate center of the wave E to the return work. The table 11 is adapted to rotate to the position.

With the above configuration, the clamp 1 including the component A is attached to the shaft 22 of the support arm 19 during the preliminary soldering work, and the table 11 is set to the forward work position. In this state, the motor 24 causes the shaft 17, the joint 18, the support arm 19, and the roller 20 to follow the copying surface.
It makes forward rotation so as to roll from 15 high places 12a. Then,
A downward lead row B in one direction of the component A of the clamp 1 is guided above the wave E by the high place 12a, and descends to the quiet center of the solder flow of the wave E by the slope 12b and is immersed in the solder. Then, after a predetermined time, the lead row B moves horizontally in a state of being immersed in solder by the roller 20 rolling in the low place 11a, and while being cut off the solder at the overflow portion F, it goes out of the wave E and is pre-soldered. On the other hand, after the roller 20 goes out of the wave E and rises to the height 13a via the slope 13b of the copying surface 15, the part A returns to the original height and prepares for the next time. In this way, the component lead row B moves while drawing a locus like the solid line in FIG. 2, and the preliminary soldering in the outward path is completed.

Then, after the above work is completed, the motor 23 reverses the lead row B'in the other direction of the component A so as to face downward.
In addition, the table 11 and high places can be
The support arm 19 on 13a rotates together and is set to the return path working position, and in this state, the support arm 19 rotates back. Then, in this case as well, the reverse operation of the copying surface 15 causes the same operation as described above, and the lead row B'moves while drawing a trajectory as shown by the broken line in FIG. Ends.

In this way, the reciprocating movement of the support arm 19 of the clamp 1 including the component A automatically pre-solders the lead rows B and B'in two directions.

Although the embodiment in which the table 11 and the support arm 19 are rotationally moved has been described above, a configuration in which they are linearly moved may be used. Also,
It can also be applied to lead parts in four directions.

[Effect of device]

As described above, according to the present invention, pre-soldering is completely automated by mechanically moving the clamp side provided with components, and pre-soldering of lead rows in two directions is performed by reciprocating movement. Therefore, workability is good.

The trace of movement of the component lead row is accurately set by the copying surface, the preliminary soldering work can be ensured, the constituent members can be easily changed by movement or replacement, and the reciprocating conditions can be different.

Since the copying surface is U-shaped and the component leads are immersed in the approximate center of the wave, a solder bridge is unlikely to occur.

The configuration in which the table and the support arm are rotationally moved as in the embodiment is preferable because the size is reduced and the drive system is simplified.

[Brief description of drawings]

1 is a perspective view showing an embodiment of a pre-soldering device of the present invention, FIG. 2 is a view showing a movement trajectory of a component lead row, and FIG. 3 (a) is a perspective view showing a conventional pre-soldering state,
(B) is the same side view. In the figure, 1 is a clamp, 11 is a table, 15 is a copying surface, 19 is a support arm, 23, 24 and 26 are motors, 25 is a link, A is a part,
B and B'denotes lead rows, C a solder bath, and E a wave.

Claims (2)

[Scope of utility model registration request] 1. A horizontal table (11) is movably provided in the vicinity of a wave (E) of a solder bath (C), and a U-shaped portion is provided on the table (11) so that preliminary soldering can be performed twice by reciprocating the table. Forming a copying surface (15) and mounting a support arm (19) above the table (11) to which the clamp (1) having the component (A) is attached.
5) It is installed so as to move up and down along with, and the driving means (24) for the support arm (19) and the component lead row (B, B ') of the clamp (1) are rotated downward. A pre-soldering device comprising means (23) and drive means (25, 26) for setting the table (11) at each work position of the reciprocating path. 2. The table (11) is rotatably provided in a circular shape, the copying surface (15) is formed on the circumference of the circular table (11), and the support arm (19) is a table. The pre-soldering device according to claim 1, wherein the pre-soldering device is installed so as to move up and down along the copying surface (15) while rotating around the center of the (11).