JPS6239888Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic soldering device, particularly to an automatic soldering device using a plane dipping method.

In recent years, chip parts have become popular and are replacing discrete parts.

In addition, in order to realize high-density mounting on printed wiring boards, lands on chip components are
It has become common to not provide holes for removing flux gas.

However, conventional automatic soldering devices using a flat surface dipping method solder printed wiring boards by immersing them in solder in a solder bath.

In this conventional device, the printed wiring board is attached to the flat solder surface at a certain angle.
The immersed and soldered printed wiring board is pulled up from the solder surface at a certain angle.

In this case, when the back side of the printed wiring board is coming into contact with the surface of the solder in the solder bath, the printed wiring board will either stop for a while or
Or it only progresses in one direction.

For this reason, flux gas cannot be dissipated and remains, especially in chip parts whose lands do not have openings or in places where a large number of such chip parts are crowded together. This has caused soldering defects on printed wiring boards.

The object of the present invention is to provide a new automatic soldering device that eliminates the above-mentioned drawbacks.

Next, one embodiment of the present invention will be described with reference to the accompanying drawings.

In the flat immersion automatic soldering apparatus of the present invention shown in FIG. 1, a printed wiring board 2 placed on a carrier 1 is guided by a guide rail 3 and enters a solder bath 4. When the pattern surface 5 of the printed wiring board 2 is uniformly immersed in the surface of the solder in the solder bath 4, the guide rail 3 rotates the printed wiring board 2 horizontally by 180° or 360° as shown in FIG. Configure it as follows.

FIG. 3 shows a device 6 for rotating the guide rail 3.
An example is shown below.

In this guide rail rotation device 6, legs 8 are provided at the four corners of a flat plate 7, and on the outside 9 that is in contact with the flat plate 7, a motor 10, a chain 11 on the upper part of the motor 10, and a chain gear meshing with the chain 11. A fixture 13 supporting 12 is attached. The chain 11 is further adapted to mesh with a chain gear 12 provided on the plane plate 7. A guide rail 3 is installed at the bottom of the chain 11 and chain gear 12 provided on the square plane plate 7.
A supporting member 14 is attached. The flat plate 7, its legs 8, and the support member 14 are configured to come into contact with the solder surface when the carrier 1 of the printed wiring board 2 is placed on the guide rail 3 while being raised on the solder bath 4. . A carrier detection sensor 15 is attached to a predetermined position on the guide rail 3.

In this guide rail rotation device 6, when the carrier detection sensor 15 detects that the carrier 1 of the printed wiring board 2 is placed on the guide rail 3, the motor 10 rotates, and the chain meshes with the chain gear 12 accordingly. The vertical chain gear 12 on which the gear 11 rotates also starts rotating. As a result, the entire guide rail 3 rotates. Guide rail 3
When the motor 10 rotates by 180 degrees or 360 degrees, the rotation of the motor 10 is automatically stopped by a micro switch (not shown) or the like.

In this way, the printed wiring board 2 is rotated 180° or 360° while being in contact with the surface of the solder in the solder bath 4.
Flux gas filling the gap between the pattern surface 5 of the printed wiring board 2 and the surface of the solder in the solder bath 4 is dissipated.

Note that the flat plate 7 in the guide rail rotating device 6 is not limited to a square shape, but may be rectangular or the like.

Also, the rotation angle of the pattern surface 5 on the printed wiring board 2 may vary depending on the state of the flux gas.
It is not limited to 180° or 360°.

According to the present invention, (1) By rotating the printed wiring board, flux gas can be removed, and the performance of soldering to the printed wiring board is improved.

(2) Since there is no need to provide holes for flux gas removal, which were provided in printed wiring boards, it is possible to reduce the manufacturing cost of printed wiring boards, and at the same time realize high-density mounting of printed wiring boards. It has the effect of being possible.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is an operational diagram of the printed wiring board in this embodiment, and Fig. 3 is a guide rail rotating device used in this embodiment. FIG. 1: Printed wiring board carrier, 2: Printed wiring board, 3: Guide rail, 4: Solder bath, 5:
Printed wiring board pattern, 6: Guide rail rotation device.

Claims (1)

[Scope of utility model registration request] A plane immersion type soldering device equipped with a guide rail for guiding a carrier on which a printed wiring board is placed into a soldering bath, wherein the guide rail is configured to be rotatable in a horizontal direction with respect to the soldering surface, and the printed wiring board An automatic soldering device comprising: a device for rotationally driving the guide rail when the guide rail is immersed in the solder bath.