JPS6222298Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an apparatus for adjusting the angle of removal of a printed wiring board from a solder bath during soldering work.

One of the conventional soldering methods for printed wiring boards is a method in which the printed wiring board is slid along a surface of molten solder so that all the connecting parts are soldered at the same time.

By the way, in this soldering method, the angle at which the board is removed from the solder bath is also related to the speed at which the board is removed, but if this angle is inappropriate, problems such as bridging between the required soldering points, so-called icicles, or soldering leakage may occur. This can cause soldering defects. Therefore, when the detachment speed is changed depending on the size of the board, the number of soldering points, etc., it is necessary to adjust the substrate detachment angle appropriately to match the detachment speed.

However, in the conventional soldering method of this type, there was a problem in that there was no device that could appropriately adjust the board detachment angle, and there were many chances of defective soldering when the detachment speed changed.

This invention was made with attention to such conventional problems, and the purpose is to provide a device for adjusting the angle of substrate separation from a solder bath that can easily adjust the substrate separation angle to an appropriate one commensurate with the separation speed. It is said that

This invention will be explained below based on the drawings. 1st
Figures 3 through 3 are diagrams showing an embodiment of this invention.

First, to explain the structure, reference numeral 1 in FIG. 1 is a solder tank, which is appropriately heated during operation and stores a required amount of molten solder 2 inside. A reference guide rail 3 is provided above the solder bath 1 at an appropriate distance from the molten solder surface 2a. The board entry side (first
(left side in the figure) and the board exit side (right side in Figure 1) are connected to the board entry side rail 4 via step portions 4a and 5a, respectively.
and a board removal side rail 5 are installed. Both of these rails 4 and 5 are placed one step above the reference guide rail 3 by an appropriate height. Note that the board removal side rail 5 can be slid in the longitudinal direction of the reference guide rail 3 by appropriate means in order to adjust and maintain the soldering time constant against changes in sliding speed. Reference numeral 6 denotes a carrier, which is equipped with a hanging tool 7 and is movably disposed on each rail such as the reference guide rail 3 via rollers 8, 8. The carrier 6 suspends the printed wiring board 9 from a side portion in the direction of movement using a hanging tool 7, and slides the printed wiring board 9 on the molten solder surface 2a by an appropriate traveling drive means.

Furthermore, in this invention, as shown in FIGS. 2 and 3, a plurality of suitable boards are prepared which are removably attached to the stepped portion 5a on the board removal side and have different board removal angles A with respect to the reference guide rail 3. A detachment angle adjustment block 10 is provided.
The plurality of detachment angle adjustment blocks 10 have dimensions of a surface 10a corresponding to the reference guide rail 3 and a stepped portion 5.
The angle B corresponding to a is common to all, and the substrate separation angle A
Each one is formed differently. The detachment angle adjusting block 10 is entirely made of a magnetic material, or has a magnetic material attached to its mounting surface, and a magnet 11 is attached to the stepped portion 5a correspondingly. Due to the attraction effect of this magnet, it can be attached to and detached from the stepped portion 5a.

Next, the separation angle adjustment and operation will be explained.

The sliding speed (separation speed) is determined to be the required speed depending on the size of the printed wiring board 9 or the number of soldering points on the board 9, and the required soldering time is determined based on the change in sliding speed. In order to hold the board on the molten solder surface 2, slide the rail 5 on the board removal side as appropriate.
The sliding distance of the printed wiring board 9 with respect to a is adjusted in advance and fixed. Next, the detachment angle adjusting block 10 corresponding to the above-mentioned detachment speed is attached to the stepped portion 5a using the attraction action of the magnet 11. Thus, the substrate detachment angle A appropriately corresponds to the detachment speed.
Incidentally, after mounting, the soldering operation may be tried several times, and as a result, the detachment angle adjustment block 10 having the optimum board detachment angle A may be selected. Even in such replacement and adjustment, the replacement is easy because the attachment utilizes the attraction effect of the magnet.

When the detachment speed, etc. is changed during soldering work for printed wiring boards of different sizes, the detachment angle adjustment block 10 is selected and replaced in the same manner as described above.

Note that a magnet may be provided on the detachment angle adjusting block side, and the stepped portion may be made of or provided with a magnetic material, or magnets may be provided on both sides.

As detailed above, according to this invention, the reference guide rail, the carrier which is movable to the reference guide rail and suspends the printed wiring board and slides on the molten solder surface, and the reference guide rail are connected to each other via the stepped part. a board removal side rail that is connected to the reference guide rail and is arranged one step above the reference guide rail by an appropriate height, and a plurality of board removal side rails that are detachably arranged on the stepped part and have different board removal angles with respect to the reference guide rail. Since the detachment angle adjustment block having the required board detachment angle is selectively attached to the step, the detachment angle of the printed wiring board can be adjusted to match the detachment speed. An extremely excellent effect can be obtained for this type of device in that the occurrence of soldering defects can be significantly reduced by easily selecting and adjusting the angle to an appropriate angle.

Furthermore, with this invention, the detachment angle can be adjusted without the need for any tools by attaching the block with a magnet, so the optimum block can be adjusted in advance according to the detachment angle without the need for manual intervention. It is possible to introduce automated machines such as robots that are programmed to select and attach to the stepped portion, further automation of soldering can be achieved, further labor saving is possible, and lower costs are achieved. This invention is useful for industrial use.

[Brief explanation of the drawing]

Fig. 1 is a partially cutaway side view showing an embodiment of the apparatus for adjusting the angle of removal of a board from a solder bath according to this invention, Fig. 2 is a side view showing a removal angle adjustment block in the same embodiment, and Fig. 3 is FIG. 6 is a partial perspective view showing how the detachment angle adjustment block is mounted. 1: Solder bath, 2: Molten solder, 2a: Molten solder surface, 3: Reference guide rail, 5: Board removal side rail, 5a: Step, 6: Carrier, 7: Hanging tool, 9: Printed wiring board, 10: Detachment angle adjustment block, 11: Magnet, A: Board departure angle.

Claims (1)

[Scope of Claim for Utility Model Registration] In an apparatus for soldering the soldering surface of a printed wiring board by sliding the molten solder surface in a solder bath, a reference guide installed at an appropriate position above the molten solder surface. a rail, and is movably disposed on the reference guide rail,
A carrier that suspends the printed wiring board and slides it on the molten solder surface, and the reference guide rail are connected to each other via a step provided at the board separation point and are one step above the reference guide rail by an appropriate height. The board detachment side rail laid on the board has a different detachment angle with respect to the reference guide rail, and the angle with respect to the step is constant, and the detachment angle is adjusted by attaching it to the step with a magnet according to the detachment angle. A device for adjusting the detachment angle from a solder bath, comprising a detachment angle adjustment block.