JPS6258822B2 - - Google Patents

Description

Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to an apparatus and a soldering method for soldering jumper wires onto a printed wiring board, and more particularly to an apparatus and a soldering method for automatically soldering and cutting jumper wires. This relates to a method of soldering.

(b) Background of the Technology In recent years, as electronic devices have become smaller and lighter, the components mounted on them have also become smaller, forcing these components to be mounted at high density on limited printed wiring boards. However, there are limits to the patterns that can be formed on printed wiring boards. Therefore, if wiring is insufficient or needs to be improved, jumper wiring must be performed on the printed wiring board.
Since this jumper wiring is difficult to work and has very low work efficiency, there is a strong demand for the development of a jumper wiring soldering apparatus and a soldering method that can automatically perform jumper wiring.

(c) Prior art and problems Figure 1 is a perspective view for explaining the conventional jumper wire soldering method, in which 1 is a printed wiring board, 2 is a through hole, 3 is a mounting component, 4 is a connecting terminal, and 5 is a perspective view for explaining a conventional jumper wire soldering method. is the jumper wire.

When performing jumper wiring for modification after mounting part 3, it is difficult to manually solder from the mounting surface, so first melt the solder in the through hole and apply the molten solder with an octopus soldering iron, etc. suck it up. Then, the coating on the end of the jumper wire 5, for example, a PVC wire, is removed, and the end of the jumper wire 5 is inserted into the through hole from which the solder has been removed, and then soldered. However, the work of sucking up the molten solder with the octopus soldering iron requires skill and has problems such as poor work efficiency. Because the urethane coating has a high melting point (approximately 340°C), the soldering iron had to be in contact with the soldering iron for a long time, which had a negative effect on the product.

(d) Purpose of the Invention In view of the above conventional problems, the present invention aims to provide a soldering device that can automatically solder jumper wires and a method for soldering jumper wires using the soldering device. This is the purpose.

(e) Structure of the Invention In order to achieve the above-mentioned object, the present invention includes a solder paste dispenser that can freely raise and lower the soldering of jumper wires, a jumper wire supply hole, and an optical fiber insertion hole for irradiating laser light. Using a jumper wire soldering device attached to a movable mounting base equipped with a welder and a cutter that can be raised and lowered, solder paste is applied to the land to which the jumper wire made of urethane wire is connected, and the solder paste is applied. A jumper wire is placed on top and soldered using a laser beam.
This is achieved by cutting the jumper wire after the connection between predetermined lands is completed.

(f) Embodiments of the Invention Examples of the jumper wire soldering apparatus and soldering method according to the present invention will be described in detail below with reference to the drawings.

In Figure 2, a is a front view of a soldering device and b is a perspective view of a jumper wire soldering method for explaining one embodiment of the present invention, and parts equivalent to those in the previous figure are given the same reference numerals. 6 is a solder paste metering dispenser having a solder paste discharging hole 61; 7
are jumper wire supply hole 71 and optical fiber insertion hole 7
2 and a welding device 8 provided with a microlens 73;
is an optical fiber, 9 is a cutter, 10 is a mounting base, 11
1 is a jumper wire drum, and 12 is a solder paste supply pipe.

A solder paste metering dispenser 6 having a solder paste discharging hole 61 that moves up and down in the directions of arrows A and B on a rotatable mounting base 10, a jumper wire supply hole 71, and an insertion hole 72 for an optical fiber 8 for laser beam irradiation. , a microlens 7 is placed at the tip of the optical fiber insertion hole 72.
3 and a cutter 9 that moves up and down in the directions of arrows C to D to cut the jumper wire 5 are attached. Then, the solder paste supply pipe 12 is inserted into the solder paste discharging hole 61 of the solder paste quantitative dispensing device 6, and the jumper wire 5 such as urethane wire is inserted into the jumper wire insertion hole 71, and the optical fiber 74 is inserted into the optical fiber insertion hole 72. With the through hole 2 inserted, first connect the through hole 2.
After the solder paste metering dispenser 6 is lowered and brought into contact with the land and the solder paste is extruded from the solder paste supply pipe 12 and deposited in a fixed amount, the mounting base 10 is moved in the direction of the arrow E with the solder paste metering dispenser 6 raised.
The welder 7 is set on the land of the through hole 2 to which the solder paste has been applied, and the jumper wire 5 is supplied and placed on the solder paste from the jumper wire drum 11, and is instantly heated to a high temperature. The urethane wire is soldered by irradiating it with a laser beam. After the soldering is completed, move the jumper wire soldering device to the land of the through hole 2' that connects to the land 2, and proceed to the jumper wire 5 in the same order as described above.
is welded to the land of through hole 2'. When the cutter 9 is lowered to the X mark on the jumper wire 5 and the jumper wire 5 is cut, the jumper connection between the land of the through hole 2 and the land of the through hole 2' is completed. In this case, a force indicated by arrow F is applied to the drum 11 around which the jumper wire 5 is wound, so that after the jumper wire 5 is cut, its end returns to a predetermined position.

(g) Effects of the invention As is clear from the above explanation, the jumper wire soldering device and soldering method according to the present invention greatly improve work efficiency compared to the conventional manual soldering method. Since automation is possible, it greatly contributes to improving quality.

[Brief explanation of the drawing]

FIG. 1 is a perspective view for explaining a conventional jumper wire soldering method, and FIG. 2 is a soldering device for explaining an embodiment of a jumper wire soldering device and a soldering method according to the present invention. 1 is a front view, and b is a perspective view of the jumper wire soldering method. In the figure, 1 is a printed wiring board, 2 and 2' are through holes, 3 is a mounting component, 4 is a connection terminal, and 5
is jumper wire, 6 is solder paste metering dispenser,
7 is a welder, 8 is an optical fiber, 9 is a cutter, 10
is the mounting base, 11 is the jumper wire drum, 12 is the solder paste supply pipe, 61 is the solder paste discharge hole,
71 is a jumper wire supply hole, 72 is an optical fiber insertion hole, and 73 is a microlens.

Claims (1)

[Scope of Claims] 1. Equipped with a solder paste dispenser that can be moved up and down for soldering jumper wires, a welder that has a jumper wire supply hole, an optical fiber insertion hole for irradiating laser light, and a cutter that can be moved up and down. A jumper wire soldering device characterized in that it is attached to a movable mounting base. 2. In a method of soldering jumper wires onto a printed wiring board, a solder paste is applied to the lands to which the jumper wires are connected, and the jumper wires are placed on the solder paste and soldered with a laser beam to form a predetermined shape. A method for soldering jumper wires, characterized in that the jumper wire is cut after the connection between lands is completed. 3. The jumper wire soldering method according to claim 2, wherein the jumper wire is a urethane wire.