GB1504252A - Method and apparatus for obtaining electric interconnections of electric components on a base support - Google Patents
Method and apparatus for obtaining electric interconnections of electric components on a base supportInfo
- Publication number
- GB1504252A GB1504252A GB833676A GB833676A GB1504252A GB 1504252 A GB1504252 A GB 1504252A GB 833676 A GB833676 A GB 833676A GB 833676 A GB833676 A GB 833676A GB 1504252 A GB1504252 A GB 1504252A
- Authority
- GB
- United Kingdom
- Prior art keywords
- wire
- bit
- studs
- solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/06—Wiring by machine
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
1504252 Making connections; soldering COMMISSARIAT A L'ENERGIE ATOMIQUE 2 March 1976 [12 March 1975] 08336/76 Headings B3A and B3R [Also in Division H1] In fabricating an electrical interconnection circuit for a component assembly (Fig. 1), an insulant support 2 is provided with printed circuit tracks and insulated studs defined by etching, and is coated with adhesive resin 4 except for studs 6, conductive pads 8 and metallized through holes 10 and for a connector 14 of etched conductive tracks 14, ground line 12, and supply line 13. The studs 6 and through holes 10 serve for the attachment of discrete components, e.g. relays, capacitors, or resistors, and selected zones are interconnected by insulated wires bonded to the adhesive resin. Manufacture is effected (Fig. 2) by apparatus for heating, stripping, turning, soldering and off-cutting of the insulant interconnecting wires, and comprises a central barrel 20 electrically connected over rotary contacts, e.g. 22 to a rotatable frame 24 driven by motor 26 over pinion 28 and supported on bearings 30, 32. Wires 34 of the barrel supply electric currents to the contacts, insulated wire is fed from drum 36, and strip solder from a storage drum through tube 29 to a position opposite a stripping and tinning bit 42 of Nickel or nickel coated copper which is displaceable between an engaged and disengaged position relative to the wire (Fig. 4). A blower directs air over a tube, to the bit 41 when in the disengaged position 42 to remove oxidized solder into container 80. Arm 44 of the rotatable frame 24 is spring loaded to impress a grooved antiadhesive laying wheel 48 on the substrate 50, and the frame also carries a further channel shaped, e.g. tungsten soldering bit 51 and a cut-off knife 52 magnetically displaceable, to solder a wire 40 to stud, e.g. 53 and to offcut the surplus wire. Arm 44 and knife 52 are electromagnetically displaceable by devices 55, 57. In operation, a digital automatic control system operates the process elements synchronically so that motor 26 orients the frame 24 in the required direction of displacement of the wire, the latter is heated by coil 38 prior to soldering, the bit 4 strips the insulation from wire 40 and applies a required quantity of solder through tube 29 to the required point thereon. When the latter is located over the stud, displacement of the circuit board by table 50 movable in XY co-ordinate directions is arrested, after which bit 5 is applied to form a soldered joint, and knife 52 cuts off the surplus wire. Motor 26 then rotates the frame and the table is activated to present the insulated wire to a further stud, while wheel 48 presses the wire into the adhesive resin layer 4 (Fig. 3 not shown), the rotary head being retracted during transferance. The completed circuit assembly (Fig. 7) comprises an epoxy-glass support 2 coated with adhesive thermosetting resin 4 and having through holes coated with a copper layer 54 and lead-tin layer 106. Studs are interconnected by soldered insulated wire 40 at joints 108, 110, while resistors or capacitors may be interconnected e.g. at 112 between through holes on either or both faces. Alternatively a laser beam may be employed to solder the insulated wires to the connection studs, replacing the soldering bit 51. Tinning and stripping are then unnecessary, and the laser may also be pulsed for cutting. The substrate may be pre-formed by drilling, electrodeposition of copper, turning, and etching, and the adhesive resin may be cured by irradiation.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7507726A FR2304247A1 (en) | 1975-03-12 | 1975-03-12 | METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1504252A true GB1504252A (en) | 1978-03-15 |
Family
ID=9152470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB833676A Expired GB1504252A (en) | 1975-03-12 | 1976-03-02 | Method and apparatus for obtaining electric interconnections of electric components on a base support |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS6015160B2 (en) |
DE (1) | DE2610283C2 (en) |
FR (1) | FR2304247A1 (en) |
GB (1) | GB1504252A (en) |
IT (1) | IT1057575B (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2120152A (en) * | 1982-05-10 | 1983-11-30 | Kollmorgen Tech Corp | Rapid soldering of wire to terminal pads |
GB2142259A (en) * | 1983-06-29 | 1985-01-16 | Mikroelektronik Zt Forsch Tech | A cable laying machine |
GB2177640A (en) * | 1985-07-12 | 1987-01-28 | Electronic Components Ltd | Assembly of surface-mounted components |
US4642321A (en) * | 1985-07-19 | 1987-02-10 | Kollmorgen Technologies Corporation | Heat activatable adhesive for wire scribed circuits |
GB2180175A (en) * | 1985-07-19 | 1987-03-25 | Kollmorgen Tech Corp | Apparatus for making scribed circuit boards |
US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
US5340946A (en) * | 1985-12-20 | 1994-08-23 | Advanced Interconnection Technology, Inc. | Heat activatable adhesive for wire scribed circuits |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ZA775455B (en) * | 1977-08-09 | 1978-07-26 | Kollmorgen Tech Corp | Improved methods and apparatus for making scribed circuit boards |
JPS5558573A (en) * | 1978-10-25 | 1980-05-01 | Hitachi Ltd | Manufacture of mis semiconductor device |
DE3051232C2 (en) * | 1979-09-28 | 1995-02-23 | Cii Honeywell Bull | Wiring machine for connection boards |
DE3035090C2 (en) * | 1979-09-28 | 1995-01-26 | Cii Honeywell Bull | Device for wiring substrate surfaces |
FR2466936A1 (en) * | 1979-09-28 | 1981-04-10 | Cii Honeywell Bull | APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE |
JPS57162387A (en) * | 1981-03-30 | 1982-10-06 | Fujitsu Ltd | Wire bonding device |
US4450623A (en) * | 1981-12-18 | 1984-05-29 | Kollmorgen Technologies Corporation | Process for the manufacture of circuit boards |
DE3408338A1 (en) * | 1984-03-07 | 1985-09-12 | Siemens AG, 1000 Berlin und 8000 München | METHOD AND DEVICE FOR LAYING A SWITCHING WIRE ON A CARRIER PLATE |
FR2585210B1 (en) * | 1985-07-19 | 1994-05-06 | Kollmorgen Technologies Corp | METHOD FOR MANUFACTURING WAFERS WITH INTERCONNECTION CIRCUITS |
CA1260157A (en) * | 1985-07-26 | 1989-09-26 | Preleg, Inc. | Electrical circuit fabrication apparatus and method |
JPS6398919A (en) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | Wire harness producer |
JPS6398920A (en) * | 1986-10-15 | 1988-04-30 | 文化自動車工業株式会社 | Wire harness producer |
JPS63136420A (en) * | 1986-11-28 | 1988-06-08 | 文化自動車工業株式会社 | Wiring apparatus |
ES2004620A6 (en) * | 1987-05-25 | 1989-01-16 | C G Sistemas Electronicos S A | Device tip to mount or replace printed circuit board wiring. |
DE102006037093B3 (en) * | 2006-08-07 | 2008-03-13 | Reinhard Ulrich | Joining method and apparatus for laying thin wire |
DE102007037165A1 (en) | 2007-08-07 | 2009-02-12 | Mühlbauer Ag | Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate |
CN114012269B (en) * | 2020-07-16 | 2024-05-14 | 绵阳伟成科技有限公司 | Clamping mechanism, laser skin breaking machine and skin breaking method |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3353263A (en) * | 1964-08-17 | 1967-11-21 | Texas Instruments Inc | Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor |
JPS5550399B1 (en) * | 1970-03-05 | 1980-12-17 |
-
1975
- 1975-03-12 FR FR7507726A patent/FR2304247A1/en active Granted
-
1976
- 1976-03-02 GB GB833676A patent/GB1504252A/en not_active Expired
- 1976-03-11 DE DE19762610283 patent/DE2610283C2/en not_active Expired
- 1976-03-12 JP JP51027036A patent/JPS6015160B2/en not_active Expired
- 1976-03-12 IT IT2115976A patent/IT1057575B/en active
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2120152A (en) * | 1982-05-10 | 1983-11-30 | Kollmorgen Tech Corp | Rapid soldering of wire to terminal pads |
GB2142259A (en) * | 1983-06-29 | 1985-01-16 | Mikroelektronik Zt Forsch Tech | A cable laying machine |
GB2177640A (en) * | 1985-07-12 | 1987-01-28 | Electronic Components Ltd | Assembly of surface-mounted components |
US4711026A (en) * | 1985-07-19 | 1987-12-08 | Kollmorgen Technologies Corporation | Method of making wires scribed circuit boards |
GB2180175A (en) * | 1985-07-19 | 1987-03-25 | Kollmorgen Tech Corp | Apparatus for making scribed circuit boards |
US4693778A (en) * | 1985-07-19 | 1987-09-15 | Kollmorgen Technologies Corporation | Apparatus for making scribed circuit boards and circuit board modifications |
US4642321A (en) * | 1985-07-19 | 1987-02-10 | Kollmorgen Technologies Corporation | Heat activatable adhesive for wire scribed circuits |
US4818322A (en) * | 1985-07-19 | 1989-04-04 | Kollmorgen Technologies Corporation | Method for scribing conductors via laser |
GB2180175B (en) * | 1985-07-19 | 1989-07-19 | Kollmorgen Tech Corp | Apparatus for making scribed circuit boards and circuit board modifications |
US4859807A (en) * | 1985-07-19 | 1989-08-22 | Kollmorgen Technologies Corporation | Wire scribed circuit boards and method of manufacture |
US4918260A (en) * | 1985-07-26 | 1990-04-17 | Preleg, Inc. | Adhesive-coated wire and method and printed circuit board using same |
US5340946A (en) * | 1985-12-20 | 1994-08-23 | Advanced Interconnection Technology, Inc. | Heat activatable adhesive for wire scribed circuits |
US4864723A (en) * | 1986-07-01 | 1989-09-12 | Preleg, Inc. | Electrical circuit modification method |
Also Published As
Publication number | Publication date |
---|---|
JPS51115659A (en) | 1976-10-12 |
DE2610283C2 (en) | 1986-05-07 |
FR2304247A1 (en) | 1976-10-08 |
JPS6015160B2 (en) | 1985-04-17 |
IT1057575B (en) | 1982-03-30 |
FR2304247B1 (en) | 1979-06-08 |
DE2610283A1 (en) | 1976-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |