JP2680461B2 - Discrete wiring board and its manufacturing method and manufacturing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial applications]

The present invention relates to a discrete wiring board and a manufacturing method and manufacturing apparatus thereof.

[Prior art]

As a conventional discrete printed board (also referred to as a discrete wire printed board), for example, a through hole or a land is provided as described in a magazine "Electronic Technology '88 -6 Vol. 30, No. 9, page 22". After laying the insulation coated wire on a normal printed board (also called format board) with a wire-controlled machine (commonly called NC wire machine) that has been numerically controlled, it is necessary to connect the wires in advance to the place where connection between wires is required. A through hole is provided, and the through hole forms a connection between wires and a solder connection portion for fixing mounted components. In addition, as seen in JP-A-57-83089, an insulating coated wire previously woven into a mesh is adhered to a printed board,
Those electrically connected are also known.

[Problems to be solved by the invention]

The above-mentioned conventional techniques require complicated and complicated hole making and through-hole plating techniques in any manufacturing process. For this reason, space is overloaded, which hinders high-density wiring and mounting. Also, in the case of a method of adhering the insulation coated wire to the printed board in advance, which is woven in a mesh shape, the mesh wire woven in a mesh shape has to be cut into unnecessary portions and secondarily processed into a necessary circuit pattern. It has to be done, and it has not been given sufficient consideration for implementation. Therefore, an object of the present invention is to solve such a conventional mounting problem. A first object thereof is an improved discrete wiring board, and a second object is an improved manufacturing method thereof. , And a third object is to provide the manufacturing apparatus, respectively.

[Means for Solving the Problems]

The first object of the present invention is as follows. (1) The second wiring wire row is overlapped by intersecting on the first wiring wire row, and the wires at the intersecting predetermined intersections are selectively welded. A wire assembly group formed by connecting the wire rows and the surface thereof with a thermosetting resin protective film, a printed circuit board having a predetermined connection land on the main surface, and the connection land And an electronic component that is mounted and connected to the wire assembly group, and is formed by soldering at least the connection portion of the first wiring line group of the wire assembly group and the connection terminal of the electronic component on the connection land. And (2) in a configuration in which the wire assembly group is electrically connected to and mounted on the printed circuit board, at least in a gap between the wire assembly group and the printed circuit board, thermosetting property Absence This is achieved by the discrete wiring board as described in (1) above, which is obtained by filling and hardening an edge. The second object of the present invention is as follows: (3) a step of laying a wire by a wire laying machine to form a first row of wire laying wires on a base board previously holding a thermoplastic adhesive. A step of overlapping and laying a second wiring wire row so as to intersect the first wiring wire row, and selectively welding and connecting the wires at predetermined intersections of the first and second wiring wire rows And electrically connecting, and a step of applying a thermosetting resin to the surface of the wire group assembly group where the intersections are selectively welded and then heat curing, and then the thermoplastic adhesive By a method for manufacturing a wire assembly group comprising a step of dissolving and removing the wiring wire assembly group from the base board,
(4) The thermoplastic adhesive is a conductive thermoplastic adhesive, the base board is a conductor base board, and the wires are provided at predetermined intersections of the first and second wiring wire rows. As a step of selectively welding and electrically connecting the wiring machine head to one electrode, and the conductor base board to the other electrode, the wiring wire at a predetermined intersection to be connected to each other. By the method for producing a wire assembly group according to the above (3), which comprises a step of electrically connecting and welding each other by pressing and sandwiching the two electrodes with each other, and (5) the above wire. In the step of applying a thermosetting resin to the surface of the wire group of wire arranging wires which are selectively welded at the predetermined intersections and are heat-cured, while applying the thermosetting resin. When Then, applying the resin while applying slight vibration to the base board, and applying the resin so that the resin sufficiently penetrates into the intersection area where the connection of the first and second wiring wire rows is not required. According to the method for producing a wire assembly group described in (3) or (4) above, and (6) the wire is formed of an insulating coated wire,
As a step of selectively energizing and welding the wires at predetermined intersections of the first and second laying wire rows to electrically connect them, cloth at predetermined intersections to be connected to each other prior to the energizing welding. The method for manufacturing a wire assembly group according to the above (4), which comprises adding a step of removing the insulating coating of the wire wire in advance, and (7) the above (3) to (6). Subsequent to the final step in the method for producing a wire assembly group, a step of preparing a printed circuit board having predetermined connection lands on its main surface in advance and forming a solder paste on the connection lands, and the printed circuit board The connection portion of at least the first wiring wire row of the wire assembly group is aligned on the connection land of, and this and the connection terminal of the electronic component are soldered to the connection land. And (8) a method for manufacturing a discrete wiring board, the method comprising the steps of mounting and connecting the wire assembly group and an electronic component, and (8) the wire assembly group on the connection land of the printed circuit board. Of the printed wiring board and the wire assembly after the step of mounting and connecting the wire assembly wire group and the electronic component by soldering at least the connection portion of the first wiring line array and the connection terminal of the electronic component. This is achieved by the method for producing a discrete wiring board according to the above (7), which further comprises a step of filling and curing an insulating material made of a thermosetting resin in a gap formed by the wire group. The third object of the present invention is as follows. (9) The wire fed by the wire feeding means is held by the supporting means in advance while being guided by the head which can be vertically moved up and down and which is positioned by the numerical control means. A wire arranging group manufacturing apparatus including a wire arranging machine for arranging a wire at a predetermined route position on a base board coated with a thermoplastic adhesive material by a heating and pressure bonding means of the head. When the second wiring wire rows are overlapped with each other by intersecting on the rows and the wires at the predetermined intersecting intersections are selectively welded and connected to each other, these two wires are supported by the supporting means of the head and the base board. An apparatus for producing a wire assembly group comprising means for locally welding and connecting in a state of being pressed and clamped, and (10) insulation coating of wire on the head. When the wire to be laid is an insulation-coated wire, a means for locally removing it is provided, and at the intersection, these two wire insulation coatings are mechanically peeled off, for example, by a cutter, or by laser light. The above-mentioned (9), which has been removed in advance by means such as burning to enable wiring while welding and connecting.
According to the wire assembly group manufacturing apparatus described above, (11) the head is provided with means for insulating and covering a bare wire, and when the wire to be laid is a bare wire, these two wires are provided at the intersection. The bare wire is sandwiched by the head except for the portion where the wire is welded and connected, and a thermosetting or ultraviolet curable resin is supplied from the head,
(2) A state of being pressed and clamped by the manufacturing apparatus for a wire assembly group according to the above (9), which is configured so that the wiring can be performed while insulatingly coating by the curing means, and (12) by the supporting means of the head and the base board. As a means for locally connecting by welding, the head and the base board are each made of a conductor and used as electrodes, and power supply means is connected to both of these electrodes to selectively energize wires at predetermined intersecting intersections. This is achieved by the manufacturing apparatus for a wire braid group according to the above (10) or (11), which is constructed by welding connection.

[Action]

One of the features of the present invention resides in the configuration of the wire assembly group, in which the wire is formed by the numerically controlled NC wiring machine while forming the connection terminal corresponding to the connection land pattern of the printed circuit board by a known method. It is embedded in resin and wired. Therefore, the wire braid group of the present invention has a structure in which two-dimensionally wired ones are stacked, not woven like the conventional mesh wire, and at the lower intersection, on the circuit. Only spots where necessary are locally connected by spot welding. Therefore, the wire rows laid above and below are fixed to each other at this connection point, but this alone is unstable, so the whole is covered with a thermosetting resin protective film, and the top and bottom The wire array of (1) is integrally and stably held without causing displacement, and since this type of protective film is an insulator, it contributes to the improvement of reliability of this wire assembly group. In the method of manufacturing the wire assembly group, the base board holding the thermoplastic adhesive material has the following important roles and functions, but ultimately it does not remain as a component of the discrete wiring board. That is, the adhesive has a function of temporarily fixing the wire at the time of wiring on the base board. Guided by the head of the wire maker, the wire is embedded in the adhesive by heating and pressing the head, preferably leaving about half the wire diameter. In addition, if a conductor such as metal powder is dispersed in the adhesive to give conductivity and the base board is also composed of a conductor such as a metal plate, one electrode of this base board is used for welding connection by energizing wire intersections. With the other electrode as the head of the wire laying machine, it is possible to connect the wire rows while laying the wire. At the time of this connection, the conductive adhesive acts to increase the reliability of the power supply to the two wires pressed by the base board and the head. The adhesive is dissolved and removed when the wire assembly group is separated from the base board after the protective film is formed by the thermosetting resin. That is, the thermosetting resin coated with insulation is left as a constituent element of the wire assembly group, but the adhesive is removed only by provisionally fixing it during wire wiring. The thickness of this adhesive retained on the base board is determined so as not to interfere with the welding at the intersection of the wires and also taking into account the subsequent thermosetting resin coating. That is, the thickness is set so that a part of the surface is exposed without completely embedding the wire, preferably about half the wire diameter. With this, the connecting portions at the wire intersections can be satisfactorily brought into contact with each other by being pressed by the head, and welding can be performed easily and reliably. In addition, by coating the exposed wire with a thermosetting resin, we ensure good insulation between the wires on the intersections that do not require welding.
This thermosetting resin can be mechanically reinforced by integrating the entire wire assembly group, so it is reliable when it is separated from the base board and when it is mounted on the printed circuit board. Enables highly flexible work. The connection between the wire rows will be described in more detail. First, the wire is connected by NC wiring using, for example, Ag-plated oxygen-free copper wire so that the wire is stably welded. At the place where the connection is required, the wires are crossed, the metal plate as the base plate is positioned as the lower electrode on the lower side, and the upper electrode has only the size necessary for NC controlled spot welding. In order to connect the wires by arranging the microelectrodes that also serve as the wiring head and performing spot welding, and then separating the lower electrode from the wires, in order to insulate the portions of the wires that do not need to be connected. , The whole surface of the wire is coated with insulation, and the connection between the mounted electronic components and the wire assembly group thus obtained is made by a printed circuit board (format).
Connection is made by solder reflow technology on the upper surface mounting pattern (land). In addition, the above-mentioned operation example is an example, but using an insulating coated wire as a wire, removing the insulating coating only at a position where a wire-to-wire connection is required, that is, a welded connection, and when welding, The same as above. [Embodiment] Embodiment 1 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing the manufacturing process of the present invention, and FIGS. 1 (a) to (g) show the respective steps of the manufacturing process in order of process. In FIG. 1 (a), reference numeral 1 is a metal base plate coated with a thermoplastic adhesive material 2. The metal base plate has a diameter of 0.16 mm.
About Ag-plated oxygen-free copper wire (wire) 3, 3 ',
It shows a state in which wiring has been completed at a predetermined position by an NC-controlled wiring machine so as to intersect the lower double. The wires 3 and 3'constitute first and second laying wire rows, respectively, but at the wire 3 '(first wire row) below the intersections 4 and 4', their diameters are about The half is embedded in the adhesive layer 2, so that the wire is applied to a thickness such that the wire comes into contact with the surface of the metal base plate 1, and the wire is also fixed. In FIG. 1 (b), the NC is arranged so that the upper electrode 5, which also functions as a wire-guiding head for spot welding, can be sequentially positioned only on a predetermined intersection 4 to be electrically connected at the wire intersection. A controlled electrode 5 is placed on the intersection 4 and spot welded between the wires. In the step of FIG. 1 (c), an insulating coating 6 for insulating the wire is applied to the entire surface of the wire other than the welding points connected in the step of FIG. 1 (b). In this case, there is no need to connect between wires 4 '
The insulating coating material 6 should be a liquid type with a relatively small surface tension so that the insulating coating material can sufficiently penetrate into (wire intersections), and when the coating material is applied, a slight vibration should be applied to the entire metal base plate 1. I am doing it. As the insulating coating material 6, a heat-resistant thermosetting resin insulating material such as epoxy resin or phenol resin is used. In FIG. 1 (d), the coating material applied in the stage of FIG. 1 (c) is solidified, and then the metal base plate 1 with the adhesive is removed. In this method, since the adhesive layer 2 is thermoplastic, first, the adhesive layer 2 is heated and a group of wires (referred to as a wire braid group) can be removed from the adhesive-attached metal base plate 1. After doing so, separate the wire assembly group 30 and then the wire assembly group 30
The thermoplastic adhesive material 2 attached on the wire surface is completely removed and washed chemically using a solvent. In this way, the wire assembly group 30 which constitutes the signal circuit to be mounted later on the printed circuit board was completed. On the other hand, as shown in FIG. 1 (e), using a copper clad laminate, a format board (so-called printed circuit board) 8 prepared by etching power supply / ground wiring patterns 7, 7 ', etc. in advance is prepared. After the solder paste 11 is printed in advance on the lead mounting position portion 10 of the surface mounting electronic component 9 to be finally mounted on the format board 8, it is prepared in FIG. 1 (d) above. After the aligned wire assembly group 30 is aligned, it is mounted at a predetermined position. FIG. 1 (f) shows a so-called solder flow in which the solder paste 11 is melted in this state of being aligned and mounted.
11 ', the format board 8, the wire assembly group 30, and the electronic component 9 are integrated. Further, in order to completely fix the wire assembly group 30 to the format board 8, as shown in FIG. 1 (g), the same process as the process shown in FIG. 1 (c) is applied to the entire surface. . In the above, bare wires are used as the wires 3 and 3 ', and a liquid insulating coating material is used as an insulating method on the wire of the welding machine as shown in FIG. The case where there is a case is explained based on the representative example. Example 2 In FIG. 2, a bare wire is used in the same manner as in Example 1 above, but as a method of insulation, a liquid insulating coating resin is applied to the necessary portion on the bare wire immediately after wiring in the head part of the wire laying machine. It shows another embodiment in which the coating material applied on the bare wire is cured (two-component curing / ultraviolet curing type) by instantaneous curing at the same time as supplying and coating. That is, in this embodiment, a method for manufacturing a wire assembly group in which a bare wire is subjected to an insulation coating treatment while wiring is performed, and a welding connection of the first and second wire rows can also be performed at a required intersection, It shows an example of the device configuration. FIG. 2 (a) is a schematic view of a main part of a wire laying machine using a bare wire and having a welding function and an insulating coating function after welding. In this figure, the first wire row 3'is already wired on the metal base plate 1 on which the thermoplastic adhesive 2 is formed, which is held by the supporting means (not shown) in advance, and the second wire row 3'is arranged on it. The wire row 3 of FIG.
The wiring machine has a head portion 12 which is numerically controlled by a well-known means, but here has a head structure having a function peculiar to this embodiment. That is, the head structure of the present embodiment can be roughly classified into three types of functions, and is composed of a head unit that can be lowered and raised. The first head portion includes a rotatable stylus 13 and a wire cutter 14, and guides and lays the wire 3 in accordance with an instructed program. The stylus 13 has a heating means, and the wire 3 is pressed against the base plate 1 to embed the adhesive material while melting it. The wire 3 is cut by the cutter 14 descending as required. Reference numeral 16 is an insulating coating material supply head with a curing function which constitutes a second head described later. 15 is the third
The upper electrode for welding is constituted by the head of the above, and at a predetermined wire intersection 4 to be connected, the two wires 3, 3 ′ are pressed toward the base plate 1 side and energized to make a point connection. There is. Next, the step of insulatingly coating the wire 3 will be described with reference to FIG. This figure is an enlarged perspective view of the portion A of FIG. 1 (a), which is an example of using a two-component curing type insulating coating. That is, two resin supply passages in the insulating coating material supply head 16 with a curing function, that is, one is a liquid insulating coating resin supply passage 18 and the other is on the bare wires 3 and 3 ′ immediately after wiring. , 18 to harden the resin instantly. After passing through these two passages, the bare wires 3, 3'from the respective resin injection ports 20, 21.
The two resins supplied above cause a chemical reaction by being mixed with each other, and instantaneously cure on the bare wire to form an insulating coating film. In addition, the timing of supplying each resin and the control of the supply amount are structured to be performed by pre-programmed NC control. On the other hand, FIG. 2 (c) shows a head configuration in the case of using an ultraviolet curing type resin insulating coating material, and only one of the resin supply passages 18 is required, and ultraviolet light for curing is not necessary. , Through the optical cable of 22, from the ultraviolet irradiation port of 23,
The structure is such that the resin supplied from 20 injection ports can be irradiated. The timing of this resin and UV irradiation, and the supply amount (irradiation amount) are the same as the previously programmed NC.
It has a structure that is controlled. Example 3 FIG. 3 uses a bare wire, and at the intersection of two bare wires,
It is a principal part sectional view which shows the state at the time of laying using the laying machine which was able to lay in the positional relationship which the air gap 40 exists between the two bare wires beforehand. That is, when the wire 3 is laid so as to intersect with 3 ', the wire itself is pulled so that 3 and 3'are relatively in contact with the intersection 4 to be finally electrically connected. Wiring is made in the state, and conversely, when wiring 3 at the intersection 4'which is finally to be electrically insulated, the wire is vertical at the position 4 '. Wiring is made while molding in a shape that draws a semicircle in the direction,
The NC wire machine is a pre-programmed mechanism so that an air gap 40 is formed. After that, if the entire surface is coated with a thermosetting resin insulating material, since an air gap is formed at the intersection 4 ', the resin liquid easily penetrates and a good insulating coating can be realized. Separation of the wire assembly group 30 from the base plate 1 is similar to the step of FIG. 1 (d) shown in the first embodiment,
The subsequent mounting process on the printed circuit board is also shown in FIG.
A discrete wiring board was realized in the same manner as in FIG. 1 (g). When forming the wire assembly group 30 shown in FIG. 3, it is possible to separate the wire assembly group from the base plate 1 by omitting the subsequent insulating coating with the air gap formed at the intersection 4 '. is there. However, as described above, it is preferable that the insulating coating is performed and then the separation is performed in order to ensure high reliability during the separation and mounting work. Example 4 FIG. 4 and FIG. 5 show an example in which an insulating coated wire is used. As a means for locally removing the coating, in order to locally peel the coating on the head portion of the wire laying machine. 3 is a perspective view showing the structure of the main part of the head of the wire laying machine when the wire laying machine having the cutter function or the stripper function by the heat of the laser light is used. That is, FIG. 4 shows that a cutter 24 for mechanically stripping the insulation coating 6'of the insulation coating wire is arranged at the head portion of the wire laying machine, and a welding connection is required at the intersection of the wires 3, 3 '. The welding head [Fig. 2 (a)]
The same as the electrode 15 of the above]. The structure of the cutter 24 is such that the insulating coating portion 6'is cut, sandwiched and peeled off as shown in the figure. On the other hand, in the case of using the laser light irradiation head 25 of FIG.
When it comes to the place where the insulation coating 6'of the wire should be removed,
Laser light is irradiated and locally erased by heating. In any of the above heads, the insulating coating head in the head portion 12 of FIG. 2 (a) described in the second embodiment is used.
It may be installed instead of 16. Fifth Embodiment FIG. 6 is a sectional view of the essential parts of a discrete wiring board after the wire assembly group 30 and the electronic component 9 are mounted and mounted on the format board 8. That is, on both surfaces of the format board (printed board) on which the power supply and ground circuits 7 and 7'are formed, the wire assembly group 30 forming the signal circuit and the leads 9'of the electronic component 9 are soldered 11 '(after reflow). It is connected and fixed by soldering. The wire rows 3 and 3'constituting the wire assembly group 30 are
When electrically connected at each intersection, 3 and 3'are connected by welding to form an intersection 4. On the other hand, when electrically insulating 3 and 3 ', 3 and 3'form an electrically insulated intersection 4'by an insulating coating or an air gap. Further, a wire protective film is formed at the same time as insulation by the insulating coating material 6 on the entire surface of the bare wire other than these intersections. When mounting the electronic component 9 on the discrete wire printed board thus formed, a solder paste was used as a means for collectively connecting the format board 8, the wire 3 and the lead 9'of the electronic component. By the surface mounting method by the reflow method, the above three members are integrally connected. In the embodiment shown in FIG. 6, the through-hole plating 17 is used as a means for electrically connecting both sides of the format board 8. The gap 41 between the format board 8 and the wire assembly group 30 is preferably filled with the insulating coating material 6. [Advantages of the Invention] According to the present invention, unlike ordinary discrete printed boards, it is not necessary to perform drilling and through-hole plating at the connection-necessary points between the wires, which enables ultra-high-density wire wiring at the same time. , Because the manufacturing process is simple,
An inexpensive discrete printed board can be provided. In addition, both bare wire and insulating coated wire can be used as the wire, and a wire laying machine equipped with a head part suitable for it can easily produce a wire assembly group suitable for a signal circuit, and realizes high-density mounting. Will contribute to the practical application of.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing each step of a manufacturing process of a wire assembly group, which is a typical manufacturing process of a printed board of the present invention, and a mounting step on a printed board, and FIG. 2 uses a bare wire. FIG. 3 is a diagram showing a main structure of a head portion in a wiring machine having a curing function and an insulating coating material supply head as an insulation method after intersection welding, and FIG. FIG. 4 is a state diagram when wiring is performed using a wiring machine in which wiring can be performed in such a positional relationship that an air gap exists in advance between the two bare wires.
FIG. 5 shows the configuration of the head part as a method of locally removing the coating when using an insulating coated wire. The head has a cutter function, and a laser irradiation head having a stopper function by the heat of laser light. Perspective views showing the respective structures of
FIG. 6 is a sectional view showing a state after completion of the discrete printed board according to the present invention. <Explanation of reference symbols> 1 ... Metal base plate with thermoplastic adhesive 2 ... Thermoplastic conductive adhesive 3, 3 '... Wire (Ag plated oxygen-free copper wire) 4, 4' ... Wire intersection 5 ... ... upper electrode for welding, 6 ... Insulation coating 6 '... insulation coating 7, 7' ... power / ground wiring pattern 8 ... format board (printed circuit board) 9 ... electronic parts, 9 '... electronic parts Lead 10 ... Lead mounting position 11 ... Solder paste 11 '... Solder after reflow 12 ... Wiring machine head, 13 ... Stylus 14 ... Wire cutter, 15 ... Welding upper electrode 16 ... … Insulation coating material supply head with curing function 17 …… Through hole 18 …… Liquid insulation coating resin supply passage 19 …… Curing agent supply passage for liquid insulation coating resin 20 …… Liquid insulation coating resin injection port 21… Curing agent injection port for liquid insulation coating resin 22 …… Optical cable passage for curing liquid insulation coating resin 23 …… UV irradiation port for curing liquid insulation coating resin 24 …… Stripper with wire strip function 25 …… Laser light irradiation with wire strip function head

Claims (12)

(57) [Claims] Claim: What is claimed is: 1. A second wiring wire row is superposed on a first wiring wire row so as to overlap with each other, and the wires at predetermined intersecting intersections are selectively welded together, and the wire rows are also connected to each other. And a wire assembly group formed by coating the surface thereof with a thermosetting resin protective film, a printed circuit board having a predetermined connection land on its main surface, and an electronic component mounted and connected on the connection land. A discrete wiring board having a connecting portion of at least a first wiring wire row of the wire assembly group and a connecting terminal of the electronic component on the connecting land by soldering. 2. In a structure in which the wire assembly line group is electrically connected to and mounted on the printed circuit board, at least in a gap between the wire assembly wire group and the printed circuit board,
The discrete wiring board according to claim 1, which is obtained by filling and curing a thermosetting insulating material. 3. A step of laying a first wiring line on a base board holding a thermoplastic adhesive in advance by a wire laying machine, and then intersecting the first wiring line. And then wire-laying the second wire arranging wires on top of each other, and the step of selectively welding and electrically connecting the wires at predetermined intersections of the first and second wire arranging wires. And a step of applying a thermosetting resin to the surface of the wire group assembly wire group where the intersections are selectively welded and heat-curing, after which the thermoplastic adhesive is dissolved and removed from the base board. A method of manufacturing a wire assembly group, comprising a step of separating the wire assembly wire assembly group. 4. The thermoplastic adhesive material is a conductive thermoplastic adhesive material, the base board is a conductor base board, and the wires are provided at predetermined intersections of the first and second wiring wire rows. As a step of selectively welding and electrically connecting the wiring machine head to one electrode, and the conductor base board to the other electrode, the wiring wire at a predetermined intersection to be connected to each other. The method for producing a wire assembly group according to claim 3, further comprising a step of electrically connecting the two to each other by pressing and sandwiching them with each other to carry out current welding. 5. In the step of applying a thermosetting resin to the surface of a wire group assembly group in which the wire is a bare wire and the predetermined intersections are selectively welded and connected, and heat curing is performed, When the thermosetting resin is applied, the base board is applied with slight vibration so that the resin sufficiently penetrates into the intersection area where the connection of the first and second wiring wire rows is not required. The method for producing a wire assembly group according to claim 3 or 4, further comprising the step of applying the wire assembly. 6. A step of electrically connecting the wires at a predetermined intersection of the first and second wiring wire rows by selectively energizing and welding the wires while forming the wires with insulation covered wires, The method for manufacturing a wire assembly group according to claim 4, further comprising a step of previously removing an insulating coating of the wiring wires at predetermined intersections to be connected to each other prior to the electric welding. 7. Subsequent to the final step in the method for manufacturing a wire assembly group according to any one of claims 3 to 6, a printed circuit board having a predetermined connection land on its main surface is prepared in advance, A step of forming a solder paste on the connection land, and aligning at least the connection portion of the first wiring line row of the wire assembly group on the connection land of the printed circuit board; A method of manufacturing a discrete wiring board, comprising the step of mounting and connecting the wire assembly group and an electronic component by soldering a connection terminal to the connection land. 8. The wire assembly group is formed by solder-connecting at least the connection portion of the first wiring line row of the wire assembly group and the connection terminal of the electronic component on the connection land of the printed circuit board. The step of adding and curing an insulating material made of a thermosetting resin in a gap formed by the printed circuit board and the wire assembly group after the step of mounting and connecting electronic components. Of manufacturing discrete wiring boards. 9. A wire fed by a wire feeding means is guided by a head which can be vertically moved up and down and which is positioned by a numerical control means, and is held by a supporting means and coated with a thermoplastic adhesive material in advance. In a wire assembly group manufacturing apparatus equipped with a wire arranging machine for arranging at a predetermined route position on the base board by the heating and pressure bonding means of the head, the wire arranging group crosses over the first wire arranging wire row
When the wires of the wirings are overlapped and the wires at the predetermined intersecting intersections are selectively welded and connected to each other, these two wires are locally pressed while being sandwiched by the supporting means of the head and the base board. An apparatus for producing a wire braid group comprising means for welding connection. 10. The head is provided with means for locally removing the insulation coating of the insulation coating wire, and when the wire to be laid is an insulation coating wire, insulation of these two wires at the intersection is provided. The manufacturing apparatus of the wire assembly group according to claim 9, wherein the coating is removed in advance and wiring can be performed while welding and connecting. 11. A head is provided with means for insulating and covering a bare wire, and when the wire to be laid is a bare wire, except for a portion where these two wires are welded and connected at the intersection, the bare wire is bare. 10. The wire assembly group manufacturing apparatus according to claim 9, wherein the wire can be laid while insulatingly covering the wire. 12. A means for locally connecting by welding while being pressed and sandwiched by the supporting means of the head and the base board,
10. The head and the base board are each made of a conductor to serve as an electrode, and a power supply means is connected to both of these electrodes, so that the wires at predetermined intersecting intersections are selectively energized and welded. Alternatively, the apparatus for producing a wire assembly group according to item 11.