JP2011155045A - Multiwire board and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multiwire board, wherein since there is no need for increasing the number of layers of a wiring layer, while coping with increase in the density of a power supply wiring pattern, is able to attain increased density as a whole, and reduce the man-hours and material cost, and to provide a method for manufacturing the multiwire board. <P>SOLUTION: The multiwire board and the method for manufacturing the same includes: an internal layer having an internal layer pattern formed by circuit processing of a metal foil of an insulating substrate with the metal foil; a wiring layer laminated on the internal layer and having an insulating layer and an adhesive layer; and a wiring pattern formed by wiring an insulating coating wire in the adhesive layer of the wiring layer; and in the multiwire board, the wiring layer has a plurality types of wiring patterns, with different wire diameters being mixed in the same adhesive layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a multi-wire wiring board having a high-density power wiring pattern and a method for manufacturing the same.

  In recent years, with increasing functionality of electronic devices, printed wiring boards are also strongly required to improve wiring density. One of the wiring boards that satisfy this requirement is a multi-wire wiring board in which a necessary wiring pattern is formed with an insulation-coated wire. In this multi-wire wiring board, since copper wire is covered with insulation, cross wiring in the same layer is possible, so the number of layers can be reduced and the overall density can be increased. Is.

  In the conventional multi-wire circuit board, the power supply layer and the ground layer are formed with a wiring pattern formed by processing a copper foil or the like in the same manner as a general printed circuit board. It was common to form with a wire (patent document 1).

JP 2006-294683 A

  On the other hand, with the increase in the density of electronic components mounted on the multi-wire wiring board, the wiring pattern of the power supply layer (hereinafter referred to as “power supply pattern”) has also been increased in density. In a wiring pattern formed by processing a circuit, it is difficult to form a power supply pattern. For this reason, it is necessary to cope with the increase in the density of the power supply pattern in the same layer by forming the power supply pattern using the insulation-coated wire.

  However, in addition to the wiring pattern of the signal layer (hereinafter referred to as “signal pattern”), if the power supply pattern is also formed of an insulating coated wire, there is a problem that an extra wiring layer is required as compared with the conventional case. That is, since the mechanical characteristics of the insulated wire vary depending on the diameter of the insulated wire, in order to ensure the positional accuracy and the wiring property of the wired wire, the alignment method and the wired condition of the insulated wire are required. It is necessary to change the wiring device itself. For this reason, when a wiring pattern is formed using insulation-coated wires having different diameters for one multi-wire wiring board, it is an idea based on the prior art to provide a different wiring layer for each diameter.

  The diameter of the insulated wire used for the power supply pattern is larger than the diameter of the insulated wire used for the signal pattern, and the diameters of both are generally different. For this reason, when both the power supply pattern and the signal pattern are formed of an insulation-coated wire, according to the prior art, both of them are not provided in the same wiring layer, but bothered for the signal pattern. Additional layers will be provided. Therefore, there is a problem that even if an attempt is made to increase the density of the power supply pattern, the number of wiring layers increases, so that the effect of increasing the density as a whole is small and the number of man-hours and material costs increase.

  The present invention has been made in view of the above-described problems, and it is not necessary to increase the number of wiring layers while corresponding to the increase in the density of the power supply pattern. An object of the present invention is to provide a multi-wire wiring board capable of suppressing man-hours and material costs and a manufacturing method thereof.

The present invention relates to the following.
(1) An inner layer having an inner layer pattern formed by processing a metal foil of an insulating substrate with a metal foil, a wiring layer laminated on the inner layer and having an insulating layer and an adhesive layer, and the wiring layer A multi-wire wiring board having a wiring pattern formed by wiring an insulating coated wire on an adhesive layer, wherein the wiring layer is the same adhesive layer, and a plurality of types of wiring patterns having different wire diameters A multi-wire wiring board having a mixture.
(2) In the above (1), two types of wiring patterns having different wire diameters are mixedly provided in the same adhesive layer, and one of the wiring patterns is a signal pattern. A multi-wire wiring board in which the wiring pattern of the other wire diameter is a power supply pattern.
(3) a step of forming an inner layer having an inner layer pattern formed by processing a metal foil of an insulating substrate with a metal foil, and a step of forming a wiring layer having an insulating layer and an adhesive layer on the inner layer; And a step of forming a wiring layer by arranging a plurality of types of wiring patterns having different wire diameters in the same adhesive layer of the wiring layer with reference to the inner layer pattern provided in the inner layer. And a method for manufacturing a multi-wire wiring board.

  According to the present invention, since it is not necessary to increase the number of wiring layers while supporting the higher density of the power supply pattern, it is possible to increase the density as a whole, and the man-hours and material costs are suppressed. It is possible to provide a multi-wire wiring board that can be used and a method for manufacturing the same.

It is the longitudinal cross-sectional view which showed an example of the structure of the multi-wire wiring board which shows embodiment of this invention. It is the longitudinal cross-sectional view which showed an example of the manufacturing method of the multi-wire wiring board which shows embodiment of this invention.

  As shown in FIG. 1, the multi-wire wiring board 17 of the present invention is laminated on an inner layer 3 having an inner layer pattern 2 formed by processing a metal foil of an insulating substrate 1 with a metal foil, and the inner layer 3. A multi-wire wiring board comprising: a wiring layer 8 having an insulating layer 4 and an adhesive layer 5; and wiring patterns 6, 7 formed by wiring an insulating coated wire on the adhesive layer 5 of the wiring layer 8. 17, the wiring layer 8 includes a plurality of types of wiring patterns 6 and 7 having different wire diameters in the same adhesive layer 5. In other words, in addition to the inner layer 3 having the inner layer pattern 2 formed by processing the metal foil of the insulating substrate 1 with metal foil, the wiring pattern 6 formed by wiring the insulating coated wire, and the wiring pattern 6 And a wiring layer 8 having a wiring pattern (hereinafter referred to as “wiring pattern 7 having different wire diameters”) formed by wiring at least one type of insulation-coated wires having different wire diameters. .

  Further, as shown in FIG. 2, the method for manufacturing the multi-wire wiring board 17 of the present invention includes a step of forming an inner layer 3 having an inner layer pattern 2 formed by circuit processing of the metal foil of the insulating substrate 1 with metal foil ( 2 (a) and (b)), a step (FIG. 2 (c)) of forming a wiring layer having an insulating layer 4 and an adhesive layer 5 on the inner layer 3, and the inner layer 3 are provided. Step of forming the wiring layer 8 by arranging a plurality of types of wiring patterns 6 and 7 having different wire diameters in the same adhesive layer 5 of the wiring layer with the inner layer pattern 2 as a reference. (FIG. 2D).

  For the inner layer 3, an insulating substrate 1 with a metal foil can be used. For example, a glass epoxy substrate with a copper foil, a glass polyimide substrate, or the like that is used for manufacturing a general printed wiring board can be used.

  The inner layer pattern 2 is formed by processing the metal foil of the insulating substrate 1 with metal foil. The circuit processing of the metal foil for forming the inner layer pattern 2 can be performed by a method used in the manufacture of a general printed wiring board, such as a so-called subtract method, semi-additive method, and additive method.

  The wiring layer 8 can be formed by forming the adhesive layer 5 for fixing the insulating coated wire on the insulating layer 4. As the insulating layer 4, a prepreg used in a general printed wiring board can be used, and can be formed on the inner layer 3 by heating and pressing. As the adhesive layer 5, those generally used in multi-wire wiring boards can be used. For example, the varnish which combined the phenoxy resin, the epoxy resin, the cationic photoinitiator, and the tin compound is mentioned. Examples of the method for forming the adhesive layer 5 include a method of directly applying and drying on the insulating layer 4 by spray coating, roll coating, screen printing or the like. Another method for forming the adhesive layer 5 is to roll coat on a carrier film such as polypropylene or polyethylene terephthalate, coat and dry to form a dry film, and then hot roll laminate or laminate press on the insulating layer 4. In this case, the thickness of the adhesive layer 5 can be made uniform, which is preferable for improving the characteristic impedance. An example of such a dry film is AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.). Thereby, the wiring board 9 having the wiring layer 8 in which the insulating layer 4 and the adhesive layer 5 are formed on the inner layer 3 is formed.

  In the multi-wire wiring board 17 of the present invention, the wiring layer 8 includes a plurality of types of wiring patterns 6 and 7 having different wire diameters mixed in the same adhesive layer 5. That is, the same adhesive layer 5 has at least a wiring pattern 6 and a wiring pattern 7 having a different wire diameter. For this reason, a plurality of types of wiring patterns 6 and 7 having different wire diameters are formed on the same adhesive layer 5, the wiring pattern having any wire diameter is a signal pattern, and the cloth having any other wire diameter is formed. If the line pattern is a power pattern, even if the power pattern is formed of an insulation-coated wire, it is not necessary to additionally provide a wiring layer for the signal pattern as in the prior art. Therefore, it is possible to increase the density of the power supply pattern, and it is not necessary to increase the number of wiring layers, so that it is possible to increase the density as a whole and to reduce the man-hours and material costs. . In addition, two types of wiring patterns 6 and 7 having different wire diameters are provided in the same adhesive layer 5, and the wiring pattern 6 having one of the wire diameters of the wiring patterns 6 and 7 is a signal pattern. The same applies when the wiring pattern 7 having the other wire diameter is a power supply pattern.

  The wiring pattern 6 can be formed by melt-bonding an insulation-coated wire to the adhesive layer 5 on the insulating layer 4 while applying ultrasonic waves and a load using a dedicated wiring machine. In the wire wiring process for forming the wiring pattern 6, the wiring of the guide pattern is performed based on the inner layer pattern 2 arranged outside the product of the inner layer 3 before the wiring pattern 6 in the product is wired. Do. Next, the deviation amount between the wiring pattern 6 of the guide pattern and the inner layer pattern 2 is read, and alignment (position correction) is performed so as to be the minimum within the allowable value. Preferably, alignment is performed so that the amount of deviation between the wiring pattern 6 and the inner layer pattern 2 is 50 μm or less. Thereafter, by arranging the wiring pattern 6 in the product, the wiring pattern 6 having a small deviation from the inner layer pattern 2 can be formed.

  Next, for the wiring pattern 7 with different wire diameters, the wiring board 9 is removed from the wiring machine on which the wiring pattern 6 is formed, and another wiring machine equipped with an insulation-coated wire with a different wire diameter is used. Then, it can be formed in the same adhesive layer 5 as the wiring pattern 6 by melting and adhering to the adhesive layer 5 on the insulating layer 4 while applying ultrasonic waves and a load. In the wiring process for forming the wiring pattern 7 having different wire diameters, the wiring pattern 7 having different wire diameters in the product is arranged at a place different from the time when the wiring pattern 6 is formed before wiring. The guide pattern is laid out with the inner layer pattern 2 as a reference. Next, a deviation amount between the wiring pattern 7 having a different wire diameter, which is a guide pattern, and the inner layer pattern 2 is read, and alignment (position correction) is performed so as to be a minimum within an allowable value. Thereafter, by arranging the wiring patterns 7 having different wire diameters in the product, it is possible to form the wiring patterns 7 having different wire diameters with little deviation from the inner layer pattern 2. When wiring the wiring patterns 7 having different wire diameters, the guide holes for inserting the pins for fixing the wiring board 9 to the wiring machine should be different from those used when the wiring pattern 6 is formed. preferable. In the above description, the wiring pattern 7 having a different wire diameter is described by using a wiring machine different from the wiring machine in which the wiring pattern 6 is formed. However, the wiring pattern 6 is formed. In the same way, even when an insulated wire having a different wire diameter is mounted using the same wiring machine, the wiring pattern 7 having a different wire diameter is applied to the same adhesive layer 5 as the wiring pattern 6 is formed. Can be formed.

  In order to obtain a multi-wire wiring board, subsequently, as shown in FIG. 2 (e), an insulating layer 10 and a wiring board 9 on which a wiring pattern 6 and a wiring pattern 7 having different wire diameters are formed. The metal foils 11 are overlapped, heated and pressed, and the metal foil 11 is processed by etching or the like in the same way as when forming the inner layer pattern 2 to form the shield layer 13 having the shield layer pattern 12. As the insulating layer 10, a prepreg used in a general printed wiring board can be used, and as the metal foil 11, a copper foil used in a general printed wiring board can be used. Here, the shield layer 13 is paired with the inner layer 3 and sandwiches the wiring pattern 6 and the wiring pattern 7. The substrate in which the shield layer 13 is formed on the wiring substrate 9 on which the wiring pattern 6 and the wiring pattern 7 are formed is referred to as a shield substrate 14. Several layers of the shield substrate 14 are stacked and bonded in a multilayered manner.

  After that, as shown in FIG. 1, the multi-wire wiring board 17 is completed by performing surface treatment after forming a surface layer through holes and plating processes in the same manner as a general printed wiring board. .

  As described above, the power supply pattern and the signal pattern can be provided in the same adhesive layer 5 by embedding a plurality of types of insulation-coated wires having different wire diameters in the same adhesive layer 5. Thus, since it is not necessary to additionally provide the wiring layer 8 for the signal pattern, the number of wiring layers can be reduced, and the multi-wire wiring board 17 having excellent electrical characteristics can be provided at low cost. be able to.

  Hereinafter, the present invention will be described based on examples, but the present invention is not limited to the examples.

Example 1
As shown in FIGS. 2 (a) and 2 (b), double-sided copper-clad laminate MCL-I-671 (product name, manufactured by Hitachi Chemical Co., Ltd.) using glass cloth polyimide resin as the insulating substrate 1 with metal foil. ) To form an inner layer pattern 2 by an ordinary etching method, thereby producing an inner layer 3. At this time, alignment guide patterns were simultaneously formed at the four corners of the inner layer pattern 2. Next, a glass cloth polyimide resin prepreg GIA-671N (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a finished thickness of 55 μm was pressed and cured on both surfaces of the substrate to form an insulating layer 4.

  Next, as shown in FIG. 2 (c), AS-U01 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 80 μm as the adhesive layer 5 for fixing the wire is fed to both sides of the substrate at a roll temperature of 100 ° C. The adhesive layer 5 was formed by hot roll laminating at a speed of 0.4 m / min to form the wiring layer 8, and a wiring board 9 having the wiring layer 8 was produced.

  Subsequently, as shown in FIG. 2 (d), the insulated wire HAW (Hitachi Chemical Co., Ltd.) having a polyimide coating layer with a wire diameter of 0.065 mm is provided on the wiring board 9 from which the AS-U01 release-treated PET film has been peeled off. A signal pattern was laid out on an insulation-coated wire manufactured by a company (trade name) using a wiring machine while applying ultrasonic heating to form a wiring pattern 6. At this time, the wiring pattern 6 is formed at positions corresponding to the alignment guide patterns formed at the four corners of the inner layer pattern 2 before the wiring of the product pattern, and alignment with the guide pattern of the inner layer pattern 2 is performed. It was.

  Next, as shown in FIG. 2 (d), the wiring board 9 is taken out from the wiring machine on which a wiring pattern having a wire diameter of 0.065 mm is formed, and a wire diameter of 0.065 mm is formed by another wiring machine. A power supply pattern is laid out using an insulated wire HAW (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a polyimide coating layer with a wire diameter of 0.080 mm on the same adhesive layer 5 as a cloth having different wire diameters. A line pattern 7 was formed. For alignment, alignment with the inner layer pattern 2 was performed by using a guide pattern arranged at a position different from that when the signal wiring pattern having a wire diameter of 0.065 mm was formed. Next, the wiring patterns 6 and 7 of the signal pattern and the power supply pattern were also formed on the adhesive layer 5 on the opposite surface side by the same procedure.

Then, the light irradiation of 500 mJ / cm < ² > was performed on both surfaces with the high pressure mercury lamp following the wiring. Subsequently, the wiring board 9 after wiring was heated and pressed under the conditions of 130 ° C., 30 minutes, 20 kgf / cm ² using silicon rubber as a cushioning material. Subsequently, the adhesive layer 5 was cured by irradiating both surfaces with light of 3 J / cm ² with a high-pressure mercury lamp.

  Next, as shown in FIG. 2 (e), two glass cloth polyimide resin prepregs (made by Hitachi Chemical Co., Ltd., GIA-671) having a finished thickness of 55 μm, and 18 μm-thick copper foils are arranged on both sides thereof. And pressed and cured.

  Subsequently, after drilling holes in the necessary locations, pre-treatment such as hole cleaning is performed, and further, immersed in an electroless copper plating solution and plated with through holes to a thickness of 25 μm, and then a circuit is formed on the surface. Thus, a multi-wire wiring board (not shown) was completed.

  As in the prior art, in the multi-wire wiring board in which the signal pattern and the power supply pattern are arranged in different layers, four wiring layers 8 are required. On the other hand, when the two types of insulation-coated wires having different wire diameters were embedded in the same adhesive layer 5 as in this example, the wiring layer 8 could be reduced to two layers. In addition, it was possible to provide a multi-wire wiring board capable of suppressing the cost index from the conventional value of 100 to 80.

  DESCRIPTION OF SYMBOLS 1 ... Insulating substrate with metal foil, 2 ... Inner layer pattern, 3 ... Inner layer, 4 ... Insulating layer, 5 ... Adhesive layer, 6 ... Wiring pattern or wiring pattern of one wire diameter, 7 ... Wiring with different wire diameters Pattern or other wire diameter wiring pattern, 8 ... wiring layer, 9 ... wiring substrate, 10 ... insulating layer, 11 ... metal foil, 12 ... shield layer pattern, 13 ... shield layer, 14 ... shield substrate, 15 ... Multilayer material, 16 ... Multilayer material, 17 ... Multi-wire circuit board

Claims (3)

An inner layer having an inner layer pattern formed by processing a metal foil of an insulating substrate with a metal foil, a wiring layer laminated on the inner layer and having an insulating layer and an adhesive layer, and an adhesive layer of the wiring layer In a multi-wire wiring board having a wiring pattern formed by wiring an insulating coated wire,
The multi-wire wiring board in which the wiring layer has a plurality of types of wiring patterns having different wire diameters mixed in the same adhesive layer. In claim 1,
Two types of wiring patterns with different wire diameters are provided in the same adhesive layer,
Among the wiring patterns, a multi-wire wiring board in which one wiring diameter wiring pattern is a signal pattern and the other wiring diameter wiring pattern is a power supply pattern. Forming an inner layer having an inner layer pattern formed by processing a metal foil of an insulating substrate with a metal foil; and
Forming a wiring layer having an insulating layer and an adhesive layer on the inner layer;
A step of forming a wiring layer by arranging a plurality of types of wiring patterns having different wire diameters in a mixed manner in the same adhesive layer of the wiring layer with reference to the inner layer pattern provided in the inner layer; ,
The manufacturing method of the multi-wire wiring board which has this.

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