FR2304247A1 - METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS - Google Patents

METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS

Info

Publication number
FR2304247A1
FR2304247A1 FR7507726A FR7507726A FR2304247A1 FR 2304247 A1 FR2304247 A1 FR 2304247A1 FR 7507726 A FR7507726 A FR 7507726A FR 7507726 A FR7507726 A FR 7507726A FR 2304247 A1 FR2304247 A1 FR 2304247A1
Authority
FR
France
Prior art keywords
electronic components
interconnecting electronic
interconnecting
components
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7507726A
Other languages
French (fr)
Other versions
FR2304247B1 (en
Inventor
Gerard Nicolas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR7507726A priority Critical patent/FR2304247A1/en
Priority to GB833676A priority patent/GB1504252A/en
Priority to DE19762610283 priority patent/DE2610283C2/en
Priority to IT2115976A priority patent/IT1057575B/en
Priority to JP51027036A priority patent/JPS6015160B2/en
Publication of FR2304247A1 publication Critical patent/FR2304247A1/en
Application granted granted Critical
Publication of FR2304247B1 publication Critical patent/FR2304247B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7507726A 1975-03-12 1975-03-12 METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS Granted FR2304247A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (en) 1975-03-12 1975-03-12 METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS
GB833676A GB1504252A (en) 1975-03-12 1976-03-02 Method and apparatus for obtaining electric interconnections of electric components on a base support
DE19762610283 DE2610283C2 (en) 1975-03-12 1976-03-11 Device for making electrical line connections on a carrier plate
IT2115976A IT1057575B (en) 1975-03-12 1976-03-12 PROCEDURE AND DEVICE FOR THE CONNECTION OF ELECTRONIC COMPONENTS
JP51027036A JPS6015160B2 (en) 1975-03-12 1976-03-12 Method and device for forming an electric circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7507726A FR2304247A1 (en) 1975-03-12 1975-03-12 METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS

Publications (2)

Publication Number Publication Date
FR2304247A1 true FR2304247A1 (en) 1976-10-08
FR2304247B1 FR2304247B1 (en) 1979-06-08

Family

ID=9152470

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7507726A Granted FR2304247A1 (en) 1975-03-12 1975-03-12 METHOD AND DEVICE FOR INTERCONNECTING ELECTRONIC COMPONENTS

Country Status (5)

Country Link
JP (1) JPS6015160B2 (en)
DE (1) DE2610283C2 (en)
FR (1) FR2304247A1 (en)
GB (1) GB1504252A (en)
IT (1) IT1057575B (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2400304A1 (en) * 1977-08-09 1979-03-09 Kollmorgen Tech Corp PERFECTED PROCESSES AND APPARATUS FOR THE REALIZATION OF WIRED CONDUCTOR CIRCUITS
FR2518863A1 (en) * 1981-12-18 1983-06-24 Kollmorgen Tech Corp METHOD FOR MANUFACTURING CIRCUIT BOARDS FOR ELECTRONIC ASSEMBLIES
FR2526624A1 (en) * 1982-05-10 1983-11-10 Kollmorgen Tech Corp HIGH SPEED WELDING METHOD FOR WIRING
FR2585210A1 (en) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp METHOD FOR MANUFACTURING PADS WITH INTERCONNECTION CIRCUITS
FR2585209A1 (en) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHOD
EP0231363A1 (en) * 1985-07-26 1987-08-12 Preleg Inc. Electrical circuit fabrication apparatus and method
EP0297018A2 (en) * 1987-05-25 1988-12-28 Circuitgraph, S.L. Device tip to mount or replace printed circuit board wiring
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558573A (en) * 1978-10-25 1980-05-01 Hitachi Ltd Manufacture of mis semiconductor device
DE3051232C2 (en) * 1979-09-28 1995-02-23 Cii Honeywell Bull Wiring machine for connection boards
DE3035090C2 (en) * 1979-09-28 1995-01-26 Cii Honeywell Bull Device for wiring substrate surfaces
FR2466936A1 (en) * 1979-09-28 1981-04-10 Cii Honeywell Bull APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE
JPS57162387A (en) * 1981-03-30 1982-10-06 Fujitsu Ltd Wire bonding device
DD216357A1 (en) * 1983-06-29 1984-12-05 Mikroelektronik Zt Forsch Tech DEVICE FOR AUTOMATIC CONTACTING AND CUTTING ELECTRICAL LADDER
DE3408338A1 (en) * 1984-03-07 1985-09-12 Siemens AG, 1000 Berlin und 8000 München METHOD AND DEVICE FOR LAYING A SWITCHING WIRE ON A CARRIER PLATE
GB8517703D0 (en) * 1985-07-12 1985-08-21 Golten D Surface mounted assemblies
US4859807A (en) * 1985-07-19 1989-08-22 Kollmorgen Technologies Corporation Wire scribed circuit boards and method of manufacture
US4642321A (en) * 1985-07-19 1987-02-10 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US4818322A (en) * 1985-07-19 1989-04-04 Kollmorgen Technologies Corporation Method for scribing conductors via laser
US4693778A (en) * 1985-07-19 1987-09-15 Kollmorgen Technologies Corporation Apparatus for making scribed circuit boards and circuit board modifications
US5340946A (en) * 1985-12-20 1994-08-23 Advanced Interconnection Technology, Inc. Heat activatable adhesive for wire scribed circuits
JPS6398920A (en) * 1986-10-15 1988-04-30 文化自動車工業株式会社 Wire harness producer
JPS6398919A (en) * 1986-10-15 1988-04-30 文化自動車工業株式会社 Wire harness producer
JPS63136420A (en) * 1986-11-28 1988-06-08 文化自動車工業株式会社 Wiring apparatus
DE102006037093B3 (en) * 2006-08-07 2008-03-13 Reinhard Ulrich Joining method and apparatus for laying thin wire
DE102007037165A1 (en) 2007-08-07 2009-02-12 Mühlbauer Ag Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate
CN114012269B (en) * 2020-07-16 2024-05-14 绵阳伟成科技有限公司 Clamping mechanism, laser skin breaking machine and skin breaking method
CN118336405B (en) * 2024-05-27 2024-09-03 中国水利水电第四工程局有限公司 Natural grounding body connecting joint and processing device thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3353263A (en) * 1964-08-17 1967-11-21 Texas Instruments Inc Successively stacking, and welding circuit conductors through insulation by using electrodes engaging one conductor
JPS5550399B1 (en) * 1970-03-05 1980-12-17

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2400304A1 (en) * 1977-08-09 1979-03-09 Kollmorgen Tech Corp PERFECTED PROCESSES AND APPARATUS FOR THE REALIZATION OF WIRED CONDUCTOR CIRCUITS
FR2518863A1 (en) * 1981-12-18 1983-06-24 Kollmorgen Tech Corp METHOD FOR MANUFACTURING CIRCUIT BOARDS FOR ELECTRONIC ASSEMBLIES
FR2526624A1 (en) * 1982-05-10 1983-11-10 Kollmorgen Tech Corp HIGH SPEED WELDING METHOD FOR WIRING
EP0217019A2 (en) * 1985-07-19 1987-04-08 Advanced Interconnection Technology, Inc. Method of manufacturing interconnection circuit boards
FR2585209A1 (en) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp WIRE TRACK CIRCUIT BOARDS AND THEIR MANUFACTURING METHOD
EP0212227A2 (en) * 1985-07-19 1987-03-04 Advanced Interconnection Technology, Inc. Process for the manufacture of wire scribed circuit boards and articles produced thereby
FR2585210A1 (en) * 1985-07-19 1987-01-23 Kollmorgen Tech Corp METHOD FOR MANUFACTURING PADS WITH INTERCONNECTION CIRCUITS
EP0212227A3 (en) * 1985-07-19 1987-05-13 Kollmorgen Technologies Corporation Process for the manufacture of wire scribed circuit boards and articles produced thereby
EP0217019A3 (en) * 1985-07-19 1988-08-10 Kollmorgen Technologies Corporation Method of manufacturing interconnection circuit boards
EP0231363A1 (en) * 1985-07-26 1987-08-12 Preleg Inc. Electrical circuit fabrication apparatus and method
EP0231363A4 (en) * 1985-07-26 1988-08-23 Preleg Inc Electrical circuit fabrication apparatus and method.
US4918260A (en) * 1985-07-26 1990-04-17 Preleg, Inc. Adhesive-coated wire and method and printed circuit board using same
US4864723A (en) * 1986-07-01 1989-09-12 Preleg, Inc. Electrical circuit modification method
EP0297018A2 (en) * 1987-05-25 1988-12-28 Circuitgraph, S.L. Device tip to mount or replace printed circuit board wiring
EP0297018A3 (en) * 1987-05-25 1990-05-30 Circuitgraph, S.L. Device tip to mount or replace printed circuit board wiring

Also Published As

Publication number Publication date
GB1504252A (en) 1978-03-15
IT1057575B (en) 1982-03-30
DE2610283A1 (en) 1976-09-23
DE2610283C2 (en) 1986-05-07
FR2304247B1 (en) 1979-06-08
JPS51115659A (en) 1976-10-12
JPS6015160B2 (en) 1985-04-17

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Legal Events

Date Code Title Description
ST Notification of lapse