JPH08323467A - Method and device for feeding solder - Google Patents

Abstract

PURPOSE: To arbitrarily control the amount of the solder to be fed to the solder feeding position of a work to which the solder is fed. CONSTITUTION: The tip part of the solder (5) is moved in the direction toward a work (10) to which the solder is fed, and brought into contact with the work (10) before or after a notch is made at a prescribed position distant from the tip part of the solder (5) formed in the wire shape where a desired amt. of the solder (5) is obtd. between its tip and the notch and the tip part of the solder (5) or the work (10) is heated. The solder (5) is fed on the solder feeding position on the work (10) in the molten state by the length from the tip part to be prescribed position, and then, the tip part of the solder (5) is moved in the separating direction from the work (10). The solder feeding method and device (1) capable of arbitrarily controlling the amount of the solder (5) to be fed on the solder feeding position of the work (10) can be realized.

Description

Detailed Description of the Invention

[0001]

[Table of Contents] The present invention will be described in the following order. Field of Industrial Application Conventional Technology Problems to be Solved by the Invention Means for Solving the Problems (FIGS. 1 to 4) Actions (FIGS. 1 to 4) Embodiments (FIGS. 1 to 4) Effects of the Invention

[0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supplying method and an apparatus therefor, and is suitable for application when supplying solder to a printed wiring board, for example.

[0003]

2. Description of the Related Art Conventionally, as a method of supplying solder to a printed wiring board, a method of supplying solder paste, a method of supplying solder to component electrodes, a method of pre-coating solder on a board land, and a solder infusion method have been proposed.

The solder paste supplying method is such that the surface mounting components are aligned and mounted so that the board lands can be bridged while the solder paste is applied on the board lands of the printed wiring board, and then the printed wiring board is mounted. This is a method in which the solder paste is melted by reflowing and the surface mount components are joined to the solder paste on the board land.

As a method of supplying solder to component electrodes, an IC is used.
(Integrated Circuit) There are a self-solder (self-QFP) to a lead, a transfer bump method, and the like. The self-solder method is a method of depositing the IC lead solder by electrolytic plating, and the entire surface of the IC lead is covered with soldering. In the transfer bump method, the solder is deposited by electrolytic plating so as to correspond to the board land, and the bare chip or T
This is a method of transferring to a CP (Tape Carrier Package) electrode.

Methods of pre-coating solder on the board land include super solder and partial peeling method. Solder pre-coating on the board land does not specify a component, and solder on a minute land which is difficult by solder paste printing. It is effective because it can be supplied.

The super solder method is a method of depositing solder on each land by a chemical reaction of a special paste.
Further, the printing precoat method is a method of forming a precoat by reflowing without mounting components after printing solder paste. The partial peeling method is a method of forming a precoat by peeling the solder used as a mask at the time of manufacturing a printed wiring board leaving only the land portion.

The solder-in-exclusion method is a method in which a solder-in-exclusion device is used. There is a solder reservoir with a mask on the bottom of the head of the soldering equipment, and the mask has an FCA (Flip of the substrate).
Chip Attach) There is a hole in the pattern that fits the terminal of the joint. When pressure is applied to the reservoir, the solder exits the holes in the mask and contacts the terminals of the substrate, forming columns of molten solder between the holes in the mask and the terminals of the substrate.

The pressure of the reservoir balances with the sum of the surface tensions of the solder columns that are about to flow between the mask and the substrate. When the pressure on the reservoir is removed, the solder column returns from the hole in the mask into the reservoir. Lastly, the solder pillars are cut in the form of staggered necks, the upper part of the solder returns into the reservoir and the lower part remains on the substrate. The pressure applied to the reservoir is controlled to be sufficient to force the solder out of the small diameter hole and not to flow between the mask and the substrate.

[0010]

By the way, in the solder paste supply method, it is difficult to control the application and amount of solder to a minute substrate land in the dispersion method, and in the printing method, due to the influence of print omission, etc. When the fine pitch (less than 0.5 [mm] pitch) is used, the variation in the amount of solder becomes large, and it is difficult to stably supply the solder to the minute board land. Therefore, as miniaturization of high-density components on the printed wiring board progresses, there has been a problem that it is not possible to cope with high precision of the amount of solder supplied to the component land.

In supplying solder to the component electrodes,
Since both the self-solder method and the transfer bump method use electrolytic plating, many process steps are required, which is complicated, and there is a problem in that a sufficient precoat thickness cannot be secured. Further, in the method of supplying solder to the parts, since the parts are specified, it is difficult to supply the solder to all the parts, and there is a problem that the versatility is not provided.

In the method of pre-coating the solder on the substrate land, the super solder method requires the use of a special paste, or the variation in the solder becomes large, so that the bumps cannot be easily formed. It was Further, in the printing precoating method, it is difficult to supply solder with high accuracy, although printing for exclusive use of precoating (thinner than the screen used at the time of mounting and having good printability) is used. Further, in the partial peeling method, there is a problem that the process of forming the solder precoat is complicated because it is necessary to use electrolytic plating.

In the solder ingestion method, a dedicated mask has to be prepared, so that the cost is high, and the apparatus itself is expensive, which is still insufficient for practical use.

The present invention has been made in view of the above points, and proposes a solder supply method and apparatus capable of arbitrarily controlling the amount of solder supplied to a solder supply target position of a solder supply target. It is a thing.

[0015]

In order to solve such a problem, in the present invention, before or after making a cut from a tip portion of a wire-shaped solder into a predetermined position having the same volume as a desired amount, The solder is supplied from the tip of the solder to a predetermined position by moving the tip toward the solder supply target and contacting the solder supply target to heat the solder tip or the solder supply target. The object is supplied in a molten state onto the solder supply position, and the tip of the solder is moved in a direction away from the solder supply object.

Further, in the present invention, before or after making a cut from the tip of the wire-shaped solder to a predetermined position having the same volume as the desired amount by the cutting means, the solder is moved by the moving means. By moving the tip in the direction of approaching the solder supply target and contacting the solder supply target, and heating the solder tip or the solder supply target by the heating means, a predetermined position from the solder tip The solder is supplied in a molten state onto the solder supply position of the solder supply target, and the tip of the solder is moved by the moving means in a direction away from the solder supply target.

[0017]

[Operation] Before or after making a cut from the wire-shaped solder tip to a predetermined position having the same volume as the desired amount, the solder tip is moved in the direction of approaching the solder supply target and the solder supply target is moved. By heating the tip of the solder or the object to be solder-supplied by touching the object, the solder is supplied in a molten state from the tip to a predetermined position on the solder-supply position of the object to be solder-supplied, and then the tip of the solder. The part is moved in a direction away from the solder supply target. Accordingly, the amount of solder supplied onto the solder supply target position of the solder supply target can be arbitrarily controlled.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In FIG. 1, reference numeral 1 denotes a solder supply apparatus according to an embodiment of the present invention as a whole, which is constituted by a drive unit 2 and a head portion 3 attached to the lower surface thereof, and which is controlled by a control unit 4. Based on this, it is possible to supply a desired amount of the solder alloy 5 formed in a wire shape. Inside the drive unit 2, a solder alloy wire feeding device 6
(Hereinafter referred to as a wire delivery device 6) is provided, and the wire delivery device 6 is configured to deliver a desired amount of the solder alloy wire 5 to the outside through the head portion 3 under the control of the control device 4. Has been done.

The head portion 3 is disposed on the outside of the solder positioning tube 7 for positioning the solder alloy wire 5 delivered from the wire delivery device 6 so as to deliver the solder alloy wire 5 in a predetermined direction. It is configured by a solder cutting jig 8 (8A, 8B) for making a cut in the solder alloy wire 5 delivered through the positioning tube 7.

As shown in FIG. 1 (A) and the sectional view (B) of the head portion 3 taken along the line AA 'in FIG. 1 (A), the solder positioning tube 7 has a columnar shape with one pointed tip. A cylindrical hollow portion 7A is formed in the central portion in the direction indicated by arrow Z. The diameter of the hollow portion 7A is larger than the diameter of the substantially cylindrical solder alloy wire 5 having a uniform diameter, and the solder alloy wire 5 fed from the wire feeding device 6 is fed to the outside through the hollow portion 7A. Has been done. As a result, the solder alloy wire 5 delivered from the wire delivery device 6 is positioned in a fixed direction.

As shown in FIG. 1 (A), the solder cutting jig 8 is composed of cutting portions 8A, 8B having a substantially L-shaped cross section, and FIGS. 1 (A) and 1 (B). As shown in FIG. 5, the cutting portions 8A and 8B are respectively provided with the claw portions 8A 'and 8B'.
Are arranged so as to face each other around the solder positioning tube 7.

The solder cutting jig 8 is driven by the driving device 2 under the control of the control device 4, and the cutting portion 8 is cut.
A and 8B can move from a predetermined position (position shown in FIG. 1A) toward each other (cutting portion 8A is a direction indicated by arrow X, cutting portion 8B is opposite to this direction) and can move to a predetermined position (original position). Position) so that you can return to. As a result, the solder cutting jig 8 can make cuts in the solder alloy wire 5 delivered in the direction indicated by the arrow Z through the solder positioning tube 7 by the claw portions 8A 'and 8B'. It is done like this.

The bent positioning tube 7 and the solder cutting jig 8 are driven by the driving device 2 under the control of the control device 4 to be integrated from a predetermined position (the position shown in FIG. 1A). It is possible to descend in the direction indicated by arrow Z and return to the original position (predetermined position). As will be described later, a state in which the solder positioning tube 7 and the solder cutting jig 8 are integrally held and lowered in the arrow Z direction to melt the solder alloy wire 5 on the land 10 provided on the substrate 9 , The wire feeding device 6 supports the solder alloy wire 5 so as not to be pushed back in the direction opposite to the Z direction.

As shown in FIG. 1A, a substrate 9 is arranged below the head portion 3, and the substrate 9 is a solder alloy wire fed from a wire feeding device 6 through a solder positioning tube 7. 5 is positioned so that the land 5 is supplied to a predetermined position of the land 10. A flux 11 is applied on the land 10 of the substrate 9.

In this solder supply device 1, the control device 4 sets the cutting position of the solder alloy wire 5 by the solder cutting jig 8 so that the volume becomes equal to the volume of a predetermined amount of solder precoat formed on the land 10. In consideration of this, the amount of the solder alloy wire 5 supplied from the wire feeding device 6 to the land 10 is controlled. That is, in this solder supply device 1, the solder alloy wire 5
From the tip of the wire feeding device 6 to the indentation by the solder cutting jig 8 at a predetermined position equal to the volume of the solder precoat formed on the land 10 in a predetermined amount. 5 is transmitted.

The method of supplying solder by the solder supply device 1 will be described below with reference to FIGS. 2 and 3. First, as shown in FIG. 2A, the head portion 3 is moved in the Z direction (land 1).
2 (B) after the solder alloy wire 5 is delivered from the wire delivery device 6 so as to have the same volume as the volume of the solder precoat formed on the land 10, after being lowered to a predetermined position in the direction of approaching 0). As shown in FIG. 2, the cutting portions 8A and 8B of the solder cutting jig 8 are moved toward each other so as to sandwich the solder alloy wire 5 and make a notch.
As shown in (C), the cutting portions 6A and 6B are moved in directions away from each other.

Next, as shown in FIG. 2D, the head portion 3 is lowered in the Z direction until the tip of the solder alloy wire 5 comes into contact with the land 10, and then a laser (not shown) is used. By heating the land 10 and further lowering the head portion 3 in the Z direction to melt the solder alloy wire 5 on the land 10 as shown in FIG. 2 (E), solder precoating is started. In this case, even if the solder alloy wire 5 is pressed against the land 10 as described above, the wire feeding device 6
Is supported, the solder alloy wire 5 is not pushed back in the direction opposite to the Z direction (the direction away from the land 10).

Next, as shown in FIG. 3A, when the solder alloy wire 5 is melted on the land 10 to the cut position, the head portion 3 is opposite to the Z direction as shown in FIG. 3B. Raise in the direction. At this time, the solder alloy wire 5
Since the notched portion has very low tensile strength, the solder alloy wire 5 can be easily cut from the solder precoat 12. This completes the formation of the solder precoat 12 on the land 10.

In the above structure, the solder alloy wire 5
Heating the land 10 by making a notch from the tip to a predetermined position having the same volume as the desired amount, and then moving the tip of the solder alloy wire 5 toward the land 10 to bring it into contact with the land 10. The solder alloy wire 5 from the tip of the solder alloy wire 5 to a predetermined position.
0 in a molten state and then the solder alloy wire 5 is moved in a direction away from the land 10 to form a solder precoat 12 on the land 10.

Therefore, in this solder supply apparatus 1, since the amount of the solder alloy 5 supplied onto the land 10 can be arbitrarily controlled, as shown in FIG. 4, the substrate 9 and the chip provided with the bump 13 are provided. It is possible to keep the distance h between the substrate 14 and the substrate 14 constant, and the reliability of the connection between the substrate 9 and the chip 14 can be significantly improved.

According to the above configuration, the solder alloy wire 5
From the tip of the solder, the solder cutting jig 8 is used to make a notch at a predetermined position where the volume of the desired amount of solder precoat 12 formed on the land 10 is the same.
Since the solder alloy wire 5 is melted on the land 10 from the tip of the to a predetermined position, the amount of the solder precoat 12 formed on the land 10 can be arbitrarily controlled.
The yield of the solder precoat 12 and the connection yield of the substrate 9 and the chip 14 at the time of manufacturing the substrate can be remarkably improved, and the solder can be stably supplied to a minute substrate land, thus increasing the solder. It is possible to realize the solder supply device 1 that can supply with accuracy.

Further, according to the above configuration, the solder precoat 12 is formed for each land 10 by using the solder alloy 5 formed in a wire shape, so that the pitch of the land 10 and the position of the land 10 are not affected. Moreover, since the solder alloy can be supplied to any pattern shape and the solder alloy can be supplied in a simple process, the usefulness of the solder supply device 1 can be further improved. Further, according to the above-described configuration, since the wire-formed solder alloy 5 is supplied onto the land 10 from the wire delivery device 6 via the solder positioning tube 7, it is necessary to supply the solder alloy 5. Since the space can be minimized, the solder alloy 5 can be easily supplied even when components are mounted on the substrate 9, and the solder alloy 5 can be supplied to the substrate 9 during rework.

Further, according to the above configuration, the solder alloy wire 5 delivered from the wire delivery device 6 is supplied onto the land 10 through the solder positioning tube 7, so that the solder alloy 5 is placed at a predetermined position on the land 10. Can be accurately supplied. Further, according to the above configuration, in the case of flip-chip mounting, the solder composition can be freely selected, so that various bump compositions can be dealt with.

In the above-described embodiment, after making a notch from the tip of the solder alloy wire 5 to a predetermined position having the same volume as the desired amount, the tip of the solder alloy wire 5 is moved in the direction of approaching the land 10. Then, the land 10 is brought into contact with the land 10, and the land 10 is heated to supply the solder alloy wire 5 in a molten state from the tip of the solder alloy wire 5 to a predetermined position.
By moving in a direction away from the land 10
The case where the desired amount of the solder precoat 12 is formed has been described above, but the present invention is not limited to this, and the wire feeding device 6 while melting the solder alloy wire 5 on the land 10.
The solder alloy wire 5 is sent from the solder alloy wire 5, and when the volume of the solder precoat 12 formed on the land 10 reaches a desired amount, a cut is made in the solder alloy wire 5, and the head portion 3
By moving the solder in a direction away from the land 10, even if a desired amount of the solder precoat 12 is formed on the land 10, the same effect as that of the above-described embodiment can be obtained.
This is particularly effective when the amount of the solder precoat 12 formed on the land 10 is very small or when the diameter of the solder alloy wire 5 used is very small (for flip chip or TCP).

In the above embodiment, the case where the solder cutting jig 8 having the cutting portions 8A and 8B is used as a cutting means for making a cut in the solder alloy wire 5 or cutting the solder alloy wire 5 has been described. The present invention is not limited to this, and a solder cutting jig 8 having one or three or more cutting portions may be used as the cutting means. Further, according to the above-described embodiment, the case where the solder cutting jig 8 is used as a cutting means for making a cut in the solder alloy wire 5 or cutting the solder alloy wire 5 has been described, but the present invention is not limited to this. If it is possible to make a cut or cut the solder alloy wire 5 with a laser or the like,
Other cutting means may be used.

In the above embodiment, the solder positioning tube 7 is used as the moving means for moving the tip of the solder alloy wire 5 toward the land 10 or away from the land 10. The present invention is not limited to this, and the solder alloy wire 5 may be connected to the land 10.
Other moving means may be used as long as it can be moved in the direction of moving closer to the land or in the direction of moving away from the land 10.

Further, in the above-described embodiment, the land 10
Although the case where the laser is used as the heating means for heating the is described above, the present invention is not limited to this, and a light beam such as xenon or a halogen lamp, or infrared rays may be used as the heating means.

In the above embodiment, the case where the solder alloy wire 5 is melted on the land 10 by heating the land 10 with a laser is described, but the present invention is not limited to this, and the laser is not limited thereto. The solder alloy wire 5 may be melted on the land 10 by heating the tip of the solder alloy wire 5 by using the above method, or the entire substrate 9 may be heated by hot air.

In the above embodiment, the solder alloy wire 5 is cut by the solder cutting jig 8 and the solder alloy wire 5 is melted on the land 10 up to the cut portion. The case where the tip portion of the solder alloy wire 5 is cut from the solder precoat 12 by raising it has been described, but the present invention is not limited to this.
When the head portion 3 is lowered without making a cut in the solder alloy wire 5 to melt the solder alloy wire 5 on the land 10 and the amount of the solder precoat 12 formed on the land 10 reaches a desired amount, the head portion 3 3 may be stopped and the solder alloy jig 5 may be used to cut the solder alloy wire 5 from the solder precoat 12.

Further, in the above-mentioned embodiment, the case where the solder supply device 1 according to the present invention is applied to the board 9 on which no component is mounted has been described, but the present invention is not limited to this, and the component is mounted. Even if the solder supply device 1 is applied to the substrate 9, the same effect as that of the above-described embodiment can be obtained. Further, in the above-described embodiment, the case where the columnar solder alloy wire 5 is used as the solder to be supplied onto the solder supply position of the solder supply target has been described, but the present invention is not limited to this, and the wire-shaped wire may be used. However, other shapes of solder may be used.

In the above embodiment, the case where the solder positioning tube 7 and the solder cutting jig 8 are integrally held and moved in the direction approaching the land 10 or in the direction separating from the land 10 has been described. The invention is not limited to this, and the solder positioning tube 7 and the solder cutting jig 8 may be separately movable. Further, in the above-described embodiment, the case where the solder positioning tube 7 is used as the positioning means for positioning the solder alloy wire 5 so that the tip of the solder alloy wire 5 is supplied onto the predetermined position on the land 10 has been described. However, the present invention is not limited to this, and other positioning means may be used as long as the tip portion of the solder alloy wire 5 can be supplied to a predetermined position on the land 10.

[0043]

As described above, according to the present invention, the tip of the solder is supplied to the solder before or after the incision is made from the tip of the wire-shaped solder to a predetermined position having the same volume as the desired amount. Solder supply of solder from the tip of solder to a predetermined position by heating the tip of the solder or the object to be soldered in a state where it is moved toward the object and in contact with the object to be soldered It is supplied to the position in a molten state, and then the tip of the solder is moved in a direction away from the solder supply target, so that the amount of solder supplied to the solder supply target position of the solder supply target can be controlled arbitrarily. It is possible to realize a possible solder supply method.

[Brief description of drawings]

FIG. 1 is a partial sectional view showing a configuration of a solder supply device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram for explaining the operation of the solder supply device.

FIG. 3 is a schematic diagram for explaining the operation of the solder supply device.

FIG. 4 is a schematic diagram for explaining the effect obtained by a solder supply device.

[Explanation of symbols]

1 ... Solder supply device, 2 ... Drive device, 3 ... Head section, 4 ... Control device, 5 ... Solder alloy wire, 6 ...
Solder alloy wire delivery device, 7 ... Solder positioning tube,
8 ... Solder cutting jig, 8A, 8B ... Cutting part, 8
A ', 8B' ... claws, 9 ... substrate, 10 ... land,
11 …… Flux, 12 …… Solder precoat, 13
...... Bump, 14 ...... Chip.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H05K 3/34 507 7128-4E H05K 3/34 507E

Claims (6)

[Claims] 1. A solder supply method for supplying a desired amount of solder onto a solder supply position of an object to be solder-supplied, wherein the solder is formed in a predetermined position from the tip of the wire-shaped solder to the same volume as the desired amount. Before or after making a cut, the tip of the solder is moved in the direction of approaching the solder supply target and brought into contact with the solder supply target, and the tip of the solder or the solder supply target is heated. Thus, the solder is supplied from the tip to the predetermined position in a molten state on the solder supply position of the solder supply target, and the tip of the solder is moved in a direction away from the solder supply target. A solder supply method characterized by the above. 2. The tip of the solder is positioned so that the tip of the solder formed in the wire shape is supplied to the solder supply target position of the solder supply target. 1. The solder supply method according to 1. 3. The solder supply method according to claim 1, wherein the tip of the solder or the solder supply target is heated by a laser. 4. A solder supply device for supplying a desired amount of solder onto a solder supply position of a solder supply target, wherein a tip end portion of the solder formed in a wire shape is moved to a predetermined position having the same volume as the desired amount. A cutting means for making a notch or cutting the solder at a predetermined position having the same volume as the desired amount, and moving in a direction in which the tip of the solder is brought closer to the solder supply target or away from the solder supply target. And a heating means for heating the solder tip or the solder supply target by heating the solder tip or the solder supply target in a state where the solder tip is melted onto the solder supply position of the solder supply target. The heating means, before or after making the notch in the solder, by heating the tip of the solder or the solder supply target A direction in which the solder is supplied in a state of being melted on the solder supply position of the solder supply target from the tip to the predetermined position, and the moving means separates from the tip of the solder and the solder supply target. A solder supply device characterized in that the solder supply device is moved to. 5. The moving means comprises positioning means for positioning the tip of the solder so that the tip of the solder is supplied onto the solder supply position of the solder supply object. The solder supply device according to claim 4. 6. The solder supply apparatus according to claim 4, wherein the heating means is a laser.