JPH0335484Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an automatic soldering device that automatically solders narrow-pitch terminals.

[Conventional technology]

Because the adjacent pitches of connectors and IC terminals are narrow, it is not possible to solder them in a dip bath, and conventionally it was necessary to solder each point by hand, as shown in Figure 4a. In the figure, 1 is a printed circuit board, 2 is a pattern land, 3 is an electronic component terminal such as a connector, 4 is solder before melting, 5 is attached solder, and 6 is a soldering iron.

The reason why it is difficult to automatically solder the above-mentioned terminals in a dip tank is that it is impossible to prevent the occurrence of bridges in which solder adheres between adjacent terminals. This bridging also occurs during manual work.
This is 7 in Figure 4b. However, if done manually, by sliding the soldering iron 6 again into sliding contact with the bridge 7 and moving it, the middle part of the bridge 7 can be remelted and cut.

[Problem that the invention attempts to solve]

The present invention makes it possible to automatically solder a plurality of adjacent terminals without creating bridges by sequentially soldering the soldering iron or the board while moving the soldering iron or the board in the direction in which the terminals are arranged.

[Means for solving problems]

The present invention includes a board fixing base that supports a printed circuit board from which terminal rows of electronic components protrude; A soldering iron, which has a flat plate shape with an acute angle formed by the axial direction of the soldering iron tip, and which brings the inclined sides into contact so that the inclined sides are parallel to the arrangement direction of the terminal row, and the soldering iron. A solder feeder that supplies solder to the tip of the soldering iron, and one of the soldering iron or the board fixing base in the arrangement direction of the terminal row with the inclined side of the soldering iron tip in contact with the terminal row. The device is characterized by comprising a mechanism for moving it along the inclined side and toward the other end side of the inclined side.

[Effect]

In particular, the tip of the iron tip has a flat plate shape with an inclined side that is inclined with respect to the axial direction of the iron tip, and an acute angle is formed by one end of the inclined side and the axial direction of the iron tip, The soldering iron or Since one of the board fixing bases is moved along the arrangement direction of the terminal row and toward the other end of the inclined side, the tip of the soldering iron and the solder can cut easily. When the soldering iron slides into contact with the terminal row and moves, each terminal is sequentially soldered and the bridge is cut at the same time during the movement process.

Therefore, narrow pitch terminals of connectors, ICs, etc. can be automatically soldered without causing defects such as bridging.

〔Example〕

FIG. 1 is a block diagram showing an embodiment of the present invention, and a
is a front view of the whole, and b is a side view of the substrate fixing base portion. In the figure, reference numeral 10 denotes a substrate fixing base, to which the rotation of a motor 11 is transmitted via a gear 12 and a rack 13, causing horizontal movement in the direction of the arrow. The substrate 1 is fixed on this base 10, and has the terminals 3 projecting upward as shown in FIG. 8 is an electronic component such as a connector.

The soldering iron (tip) 6 is a slide cylinder 20
The position is adjusted so that the tip contacts the terminal 3 and the pattern 2. Solder 4 is supplied from a solder feeder 30 through a tube 31 to the tip of a soldering iron 6 at an appropriate feed rate. In this example, the positions of the tips of the soldering iron 6 and solder 4 are fixed, and the base 1
By moving the soldering iron 6, the tip of the soldering iron 6 is brought into sliding contact with the row of terminals 3 with the solder 4. FIG. 2 is an enlarged view of this part.

As shown in FIG. 2, the tip of the soldering iron 6 is on a flat plate with an inclined side that is inclined with respect to the axial direction of the soldering iron tip.

If the tip of the soldering iron 6 contacts the terminals 3 in sequence with the solder 4, each terminal can be soldered quickly. Furthermore, even if a bridge were to form between the terminals, since the soldering iron 6 was nearby, the solder would melt due to its heat, and the solder would easily break off from the tip of the soldering iron 6, so the surface tension would cause each terminal to attracted to. Therefore, soldering defects such as bridging do not occur.

The substrates 1 can be placed on the base 10 one by one manually, but this can be automated by using the substrate transfer device shown in FIG. FIG. 1A is a plan view of the conveyance section, where 40 is a conveyor that guides and transfers the substrate 1 in the direction of the arrow, and 41 is a motor serving as a driving source. The position of the board 1 is changed in the order of →, and connectors etc. are inserted on the front side. As a result, the terminals will face downwards, so the terminals should face upwards at the soldering position when the front and back sides are turned over. 42 is a substrate positioning stopper.

Figure b is a side view of the substrate reversing unit, and figure c is a front view. The substrate 1 conveyed by the conveyor 40 and positioned by the stopper 42 is pushed upward by the cylinder 50 and removed from the conveyor 40. and,
When the connector 8 is inserted into the connector guide 51 and the board 1 is supported by the positioning pins 52, the high rotor 53 rotates 180 degrees to reverse the front and back of the board 1. 54 is a cylinder for unloading the substrate.

[Effect of idea]

As described above, the present invention has the advantage that it is possible to automatically solder a row of terminals with a narrow pitch, such as a connector, without causing defects such as bridging.

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing one embodiment of the present invention;
The figure is an enlarged view of the main part, FIG. 3 is a configuration diagram of a substrate transfer device, and FIG. 4 is an explanatory diagram of a conventional soldering method. In the figure, 1 is a printed circuit board, 2 is a pattern land, 3 is a terminal, 4 is solder, 6 is a soldering iron, 8 is an electronic component, 10 is a board fixing base, 11 is a motor,
20 is a slide cylinder, and 30 is a solder feeder.

Claims (1)

[Scope of utility model registration request] A board fixing base supports a printed circuit board from which terminal rows of electronic components protrude, and the tip of the iron tip has an inclined side that is inclined with respect to the axial direction of the iron tip, and one end of the inclined side and the tip of the soldering iron tip are connected to each other. A soldering iron that has a flat plate shape with an acute angle formed in the axial direction, and that contacts the sloped sides so that the sloped sides are parallel to the arrangement direction of the terminal row, and the tip of the soldering iron. a solder feeder for supplying solder to the soldering iron, and one of the soldering iron or the board fixing base along the arrangement direction of the terminal row with the inclined side of the soldering iron tip in contact with the terminal row; An automatic soldering device comprising: a mechanism for moving the inclined side toward the other end side.