JPS6141461U - automatic soldering robot - Google Patents
automatic soldering robotInfo
- Publication number
- JPS6141461U JPS6141461U JP12290084U JP12290084U JPS6141461U JP S6141461 U JPS6141461 U JP S6141461U JP 12290084 U JP12290084 U JP 12290084U JP 12290084 U JP12290084 U JP 12290084U JP S6141461 U JPS6141461 U JP S6141461U
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- soldering
- robot
- automatic soldering
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第３図は従来の自動はんだ付けロボットの一例を示す構
造図、第１、第２図はそれぞれ本考案による自動はんだ
付けロボットの一実施例を示す構造図である。
１・・・・・・ロボット本体、２・・・・・・電気はん
だゴテ、３，ト・・・・・エアシリンダ、４・・・・・
・制御器、５・・・・・・ロボット筐体、６・・・・・
・プリント基板、７・・・・・・温度センサ、９・・・
・・・Ｘ−Ｙテーブル、１０・・・・・・回転機構部。FIG. 3 is a structural diagram showing an example of a conventional automatic soldering robot, and FIGS. 1 and 2 are structural diagrams each showing an embodiment of an automatic soldering robot according to the present invention. 1...Robot body, 2...Electric soldering iron, 3...Air cylinder, 4...
・Controller, 5...Robot housing, 6...
・Printed circuit board, 7...Temperature sensor, 9...
...X-Y table, 10...Rotation mechanism section.
Claims (1)
んだ付け点に）はんだ付けするロボットにおいて、この
ロボットに予めプログラムされたシーケンス制御によっ
て移動する温度センサを備え、この温度センサで前記プ
リント基板のはんだ付け点に接続されているパターンラ
ンド又は部品リードの温度を測定し、前記温度センサの
出力情報ではんだ付け動作時間を制御することを特徴と
する自動はんだ付けロボット。A robot that solders electronic components mounted at a predetermined position on a printed circuit board (to a predetermined soldering point) is equipped with a temperature sensor that moves according to a preprogrammed sequence control, and this temperature sensor is used to solder electronic components mounted on a printed circuit board at a predetermined soldering point. An automatic soldering robot characterized by measuring the temperature of a pattern land or a component lead connected to a soldering point, and controlling the soldering operation time based on the output information of the temperature sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12290084U JPS6141461U (en) | 1984-08-13 | 1984-08-13 | automatic soldering robot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12290084U JPS6141461U (en) | 1984-08-13 | 1984-08-13 | automatic soldering robot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6141461U true JPS6141461U (en) | 1986-03-17 |
Family
ID=30681654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12290084U Pending JPS6141461U (en) | 1984-08-13 | 1984-08-13 | automatic soldering robot |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6141461U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6313663A (en) * | 1986-07-04 | 1988-01-20 | Nippon Abionikusu Kk | Reflow soldering device |
| JPS6384761A (en) * | 1986-09-26 | 1988-04-15 | Aisin Seiki Co Ltd | Automatic brazing device |
| JPS6356969U (en) * | 1986-10-02 | 1988-04-16 | ||
| JPS6475168A (en) * | 1987-09-14 | 1989-03-20 | Shibaura Eng Works Ltd | Soldering robot |
| JP2015112634A (en) * | 2013-12-13 | 2015-06-22 | 信号器材株式会社 | Clamp jig for rail bond weld |
| JP2018067698A (en) * | 2016-10-23 | 2018-04-26 | 株式会社アンド | Soldering evaluation method and device therefor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5118091A (en) * | 1975-02-04 | 1976-02-13 | Daihatsu Diesel Mfg | Hakuyosuishinhoho oyobi sonosochi |
| JPS56146831A (en) * | 1980-04-14 | 1981-11-14 | Hitachi Ltd | Temperature controlling method for continuous heat treatment apparatus |
-
1984
- 1984-08-13 JP JP12290084U patent/JPS6141461U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5118091A (en) * | 1975-02-04 | 1976-02-13 | Daihatsu Diesel Mfg | Hakuyosuishinhoho oyobi sonosochi |
| JPS56146831A (en) * | 1980-04-14 | 1981-11-14 | Hitachi Ltd | Temperature controlling method for continuous heat treatment apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6313663A (en) * | 1986-07-04 | 1988-01-20 | Nippon Abionikusu Kk | Reflow soldering device |
| JPS6384761A (en) * | 1986-09-26 | 1988-04-15 | Aisin Seiki Co Ltd | Automatic brazing device |
| JPS6356969U (en) * | 1986-10-02 | 1988-04-16 | ||
| JPS6475168A (en) * | 1987-09-14 | 1989-03-20 | Shibaura Eng Works Ltd | Soldering robot |
| JP2015112634A (en) * | 2013-12-13 | 2015-06-22 | 信号器材株式会社 | Clamp jig for rail bond weld |
| JP2018067698A (en) * | 2016-10-23 | 2018-04-26 | 株式会社アンド | Soldering evaluation method and device therefor |
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