JPS5899861U - bonding tools - Google Patents
bonding toolsInfo
- Publication number
- JPS5899861U JPS5899861U JP19647081U JP19647081U JPS5899861U JP S5899861 U JPS5899861 U JP S5899861U JP 19647081 U JP19647081 U JP 19647081U JP 19647081 U JP19647081 U JP 19647081U JP S5899861 U JPS5899861 U JP S5899861U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- bonding tools
- arm
- printed circuit
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は電子部品の実装の状態を示す外観図、第２図は
従来技術の実装の一例を示す模式図、第３図は本考案に
かかるボンディングツールの組立状態を示す外観斜視図
、第４図は実装の状態を示す模式図である。
１・・・電子部品、２・・・フラットリード、３，１７
゜１７ａ・・・プリント基板、４・・・配線パターン、
５゜１４．１４ａ・・・ボンディングチップ、６．１１
・・・水平固定軸、１２，１２３・・・フローティング
アーム、１３．１３２・・・アーム、１５ａ・・・第１
の軸、１５ｂ・・・第２の軸、１６ａ・・・第１の軸受
、１６ｂ・・・第２の軸受。FIG. 1 is an external view showing the mounting state of electronic components, FIG. 2 is a schematic diagram showing an example of mounting in the prior art, FIG. 3 is an external perspective view showing the assembled state of the bonding tool according to the present invention, and FIG. FIG. 4 is a schematic diagram showing the state of implementation. 1...Electronic component, 2...Flat lead, 3,17
゜17a...Printed circuit board, 4...Wiring pattern,
5゜14.14a...Bonding chip, 6.11
...Horizontal fixed axis, 12,123...Floating arm, 13.132...Arm, 15a...1st
15b... second shaft, 16a... first bearing, 16b... second bearing.
Claims (1)
際に使用するボンディングツールにして、上下に垂直移
動する水平固定軸と先端にチップを固定してなるアーム
との間にフローティングアームを滑動可能に介装したこ
とを特徴とするボンディングツール。A bonding tool used when mounting flat leads of electronic components on printed circuit boards, with a floating arm slidably interposed between a horizontal fixed shaft that moves vertically and an arm with a chip fixed to the tip. A bonding tool characterized by the fact that it is equipped with a
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19647081U JPS5899861U (en) | 1981-12-26 | 1981-12-26 | bonding tools |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19647081U JPS5899861U (en) | 1981-12-26 | 1981-12-26 | bonding tools |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5899861U true JPS5899861U (en) | 1983-07-07 |
Family
ID=30109711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19647081U Pending JPS5899861U (en) | 1981-12-26 | 1981-12-26 | bonding tools |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5899861U (en) |
-
1981
- 1981-12-26 JP JP19647081U patent/JPS5899861U/en active Pending
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