JPS625818Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a local soldering device used for soldering electronic components to a printed circuit board and for removing electronic components soldered to the printed circuit board.

FIG. 1 is a perspective view of a conventional local soldering device. A solder tank is housed in the housing 1, and the solder in the solder tank is ejected from a nozzle 3 by the force of a solder jetting motor 4, forming a solder wave front suitable for soldering electronic components to a printed circuit board. do. The printed circuit board is supported by more than a dozen small cylindrical support caps 5 made of heat-resistant resin on a table 2 fixed on top of the housing 1, and is fixed by sliding in a straight line. It is fixed by a locking mechanism 7 that can be used. For positioning the soldering position, a position indicating mechanism 6 that rotates around a single axis is used at the top of the device.

If the soldering area of the component to be attached to the printed circuit board is large, use the nozzle 3 with a large opening area, and if the soldering area of the component is small, use the nozzle 3 with a small opening area. A wave crest must be formed.

In this case, if the force of the solder jetting motor 4 is constant, the height of the solder wave crest will be lower in the case of a nozzle with a large opening area, and the height of the solder wave crest will be lower in the case of a nozzle with a small opening area. Therefore, in order to properly solder the printed circuit board on the fixed table 2 as in the conventional device, the ejection force by the ejection motor 4 is adjusted each time the nozzle is changed to reduce the solder wave crest. The relative position between the solder jet motor 4 and the top surface of the table must be adjusted, and the specific method for adjusting the jet force is to loosen the mounting screw of the solder jet motor 4,
Adjustments are made by changing the position of the propelling vane in the solder bath attached to the motor shaft, and the amount of change in the position of the propelling vane and the amount of change in solder wave height are not proportional. There is a drawback that the adjustment takes a long time due to the delicate nature of the adjustment and the complexity of the adjustment required to move the solder jetting motor 4 at the position shown in FIG. Adjustment of the height of the solder wave front is necessary not only when replacing the nozzle, but also when the height of the lead wire used to solder parts attached to the printed circuit board changes. Further, as shown in FIG. 1, a table 2 is provided around the nozzle 3 with an escape hole 23 for allowing the ejected solder to flow back into the solder bath. The size of the escape hole 23 satisfies the first condition, which is a size that does not obstruct the re-inflow of the spouted solder into the solder bath, and the second condition, which is not larger than the minimum size of various printed circuit boards to be soldered. It is sufficient to have an area that satisfies the first condition, and is generally made to the minimum size that satisfies the first condition. Nozzle 3 is
The nozzle 3 is fixed to the solder bath with screws by the nozzle mounting flange at the bottom, but since this nozzle mounting flange is larger than the relief hole 23, when replacing the nozzle, the table 2 fixed to the housing with screws is required. The disadvantage is that it must be removed. As described above, the conventional apparatus has the drawbacks of delicate and complicated adjustment of the relative position between the solder wave front and the top surface of the table, and complicated nozzle replacement.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks of conventional devices and to provide a local soldering device that is easy to handle and has a short adjustment time and high work efficiency.

The device of the present invention includes a solder tank having a nozzle capable of forming a solder wave head for soldering, a table having an opening for the solder wave head to protrude, and a table for placing a printed circuit board, etc., and the table. The solder wave head is supported along the periphery of the table and includes means for adjusting the relative position of the solder wave front and the top surface of the table. The table is also configured to support a sub-table having an escape hole for reflowing the solder jet.

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a perspective view of an embodiment of the local soldering device according to the present invention. A solder bath is housed in the housing 12, and the solder in the solder bath is ejected from the nozzle 11 by the force of a solder jetting motor (housed in the housing 12 and not shown).
To form a solder wave front suitable for soldering electronic components to a printed circuit board. The printed circuit board is in the housing 12
It is placed on table 9 above. A suitable heat insulating material is used inside the table 9 to block the heat of the soldering bath, and a heat-resistant elastic table mat 9-1 is attached to the surface, so that the printed circuit board can be held down by hand. It is designed for fixed support. This table 9 is so constructed that it can be moved up and down by turning a handle 8, and the relative position between the solder wave crest and the top surface of the table can be adjusted very easily and smoothly. The details of the structure will be explained using FIG. 3.

FIG. 3 is a partially cutaway right side view of a part of the casing 12, table 9, etc. of the apparatus shown in FIG. Third
In the figure, a stopper 14 is fixed to the shaft 19 of the handle 8, and the stopper 14 is in contact with the top A16 via a bearing 15. Approximately half of the tip of shaft 19 is unthreaded, and frame A
16 and is engaged with the piece B18 with a screw.

Mounting stand 21, frame A16, table support frame 2
0 and frame B18 are connected by a link assembly 17A composed of four link arms. At a symmetrical position with respect to the shaft 19 of the handle 8 is another link assembly 17B of identical construction, which is not shown in FIG. 3 as it overlaps exactly.

The mount 21 is fixed to the housing 12, and the table 9 is supported by the table support frame 20. The table 9 simply rests on the table support frame 20 by its own weight. By rotating the handle 8, the pieces B18 and A1 are moved by the action of the screw.
6 changes, link assemblies 17A, 17B
This is converted into a vertical movement of the table 9.

Next, in the present invention, the table 9, which has the relief hole 23 for reflowing the solder jet, is only supported by the table support frame 20 as described above, and is not fixed using screws or the like. When replacing the nozzle 11, the nozzle 11 can be replaced easily and easily by simply removing the table 9, so that the replacement work can be significantly shortened. escape hole 23
As mentioned above, it is sufficient that the size is as small as possible without interfering with the reflow of the ejected solder into the solder bath.
The optimal escape hole 23 differs depending on the type of nozzle. Therefore, it is necessary to prepare several types of tables having escape holes 23 of different sizes. Furthermore, in the present invention, as shown in FIG. 2, a sub-table 10 is provided on the table 9, and the escape hole 23 for the solder ejection and re-inflow is provided in the sub-table 10 without being directly drilled in the table 9.
As shown in FIG. 3, the sub-table 10 is made so that it is simply supported by the table 9 without being fixed using screws or the like.
If the size of the nozzle is larger than the size of the mounting flange of the nozzle 11, the nozzle can be easily replaced by simply removing the sub-table 10 without removing the large table 9, and the size of the escape hole 23 can be changed easily. To deal with the differences, it is sufficient to prepare several types of small sub-tables instead of a large table, which improves work efficiency.
Helps save material.

Table 9 when using sub-table 10
It is obvious that it may be fixed to the table support frame with screws or the like. Furthermore, in the present invention, the table up/down mechanism consisting of the handle 8, the link assemblies 17A, 17B, the table support frame 20, the mounting base 21, etc. is provided along the periphery of the table, avoiding the center of the table 9. It can accommodate a large solder bath, making it possible to solder parts with a large soldering area.

As described above, the present invention involves moving the table of the local soldering device up and down to adjust the relative position between the solder wave front and the top surface of the table, and supporting the table and sub-table without using screws or the like. , the effect of shortening the replacement time and adjustment time when replacing the nozzle, shortening the adjustment time of the device due to differences in the length of lead wires to be soldered to parts attached to the printed circuit board, and increasing the efficiency of local soldering work. There is.

[Brief explanation of the drawing]

Figure 1 is a perspective view of a conventional local soldering device;
FIG. 2 is a perspective view of one embodiment of the local soldering apparatus according to the present invention, and FIG. 3 is a partially cutaway right side view of a portion of the apparatus of FIG. In the figure, 1... Housing, 2... Table, 3
... Nozzle, 4 ... Solder jetting motor, 5 ...
Supporting cap, 6...Position indicating mechanism, 7...Lock mechanism, 8...Handle, 9...Table, 9
-1... Table mat, 10... Sub-table, 11... Nozzle, 12... Housing, 13... Position indicating mechanism, 14... Stopper, 15... Bearing, 16... Top A, 17 A... link assembly,
18...Frame B, 19...Shaft, 20...Table support frame base, 21...Mounting stand, 22...Solder tank, 23...Escape hole.

Claims (1)

[Claims for Utility Model Registration] (1) A solder bath having a nozzle capable of forming a solder wave head for soldering, and a solder bath having an opening for the solder wave head to protrude, and a solder bath for installing a printed circuit board, etc. A local soldering device comprising: a table; and means for supporting the table along the periphery of the table and adjusting the relative position of the solder wave front and the top surface of the table. (2) The local soldering device according to claim (1), wherein the table supports a sub-table having escape holes for re-flowing solder jets.