JPH06260752A - Jet type soldering apparatus - Google Patents

Abstract

PURPOSE:To enable not only a soldered part and a molten solder jet nozzle to be easily aligned with each other but also a jet of molten solder to be easily controlled in height by a method wherein a guide which is adjustable in relative position to a jet nozzle which jets out molten solder is provided. CONSTITUTION:Molten solder 8 used for soldering a printed board 5 is stored in a solder tank 7 which is provided movable in a vertical direction, and a jet nozzle 11 which spouts out molten solder 8 stored in the solder tank 7 is provided. Furthermore, a guide 1 which is arranged adjustable in relative position to the jet nozzle 11 and capable of selectively feeding molten solder 8 spouted out from the jet nozzle 11 to the prescribed soldered part of a printed board 5 is provided. For instance, molten solder 8 stored in the solder tank 7 is spouted out through the jet nozzle 11 and attached to the terminal of a chip 6 fixed to the substrate 5 by bonding. At this point, only a required part of the board 5 is soldered through slits 2 provided to the upper part of a masking slit 1. The slits 2 are aligned by controlling the fastening position of a bolt.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet type soldering device for soldering electronic parts on a printed circuit board.

[0002]

2. Description of the Related Art In recent years, jet type soldering apparatuses have been widely used with the automation of electronic component mounting.

An example of the above-mentioned conventional jet type soldering apparatus will be described below with reference to the drawings.

FIG. 3 shows a conventional jet type soldering apparatus. In FIG. 3, 13 is a substrate, and a chip 14 is adhesively fixed to the substrate 13. Denoted at 15 is a jet port, which is provided with a slit on the upper part for supplying solder to a predetermined position. Reference numeral 16 denotes a solder bath, in which the solder 17 is stored in a molten state.

The operation of the jet type soldering apparatus having the above-mentioned structure will be described below.

The solder 17 in the solder bath 16 is jetted from the jet port 15 by the impeller 19 which rotates by receiving the power of the motor 18, and adheres to the terminal of the chip 14 on the substrate 13. Since the solder 17 passes through the slit above the ejection port 15, the substrate 13
It adheres only to the necessary areas on the top, and prevents soldering defects such as short circuits.

[0007]

However, in the above structure, since the ejection port and the slit are integrated, it is difficult to align the slit and the soldered portion on the substrate. Had.

Further, since the relative position of the slit with respect to the jet port is unchanged and the jet port itself has to be changed in order to change the size of the slit, the solder jet height which greatly affects the soldering quality. There is a problem that the adjustment range of the height is small.

In view of the above problems, the present invention provides a jet-type soldering device which can easily adjust the position of the soldering portion and the jet port and adjust the jet height.

[0010]

In order to solve the above problems, in the jet soldering apparatus of the present invention, a solder bath for storing molten solder, a jet port for jetting the solder, and a relative position adjustment with respect to the jet port are provided. It is characterized by having a structure called a masking slit provided so that

[0011]

According to the present invention, by adjusting the relative position of the masking slit to the jet port with the above-mentioned structure, the slit can be easily aligned with the predetermined soldered portion.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A jet type soldering apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a masking portion of a jet type soldering device according to an embodiment of the present invention.

In FIG. 1, reference numeral 1 is a guide portion, that is, a masking slit, and a slit 2 is provided on the upper portion. The masking slit 1 is fixed to the bracket 3 with a bolt. The bracket 3 is fixed to the mounting base 4 with bolts.

FIG. 2 shows the entire jet type soldering apparatus in this embodiment. Reference numeral 5 denotes a substrate on which a chip 6 is adhesively fixed. Reference numeral 7 denotes a solder bath in which the solder 8 is stored in a molten state. An impeller 9 for ejecting the solder 8 is provided inside the solder bath 7. The impeller 9 is rotated by a motor 10 mounted outside the solder bath 7. A jet port 11 is attached to the upper portion of the solder bath 7. Reference numeral 12 is an actuator for vertically moving the jet port 11 and the solder bath 7.

The operation of the jet type soldering device having the above-described structure will be described below with reference to FIGS. 1 and 2.

When the substrate 5 is conveyed to the upper portion of the jet port 11, the actuator 12 moves the solder bath 7 upward. The rotation of the motor 10 and the impeller 9 causes the solder 8 in the solder bath 7 to be ejected through the jet port 11 and adhere to the terminals of the chip 6 that is adhesively fixed on the substrate 5. At this time, the slits 2 provided above the masking slits 1 are used to solder only the necessary portions on the substrate 5. The soldering portion of the substrate 5 and the masking slit 1 are aligned by adjusting the fastening positions of the bolts fixing the masking slit 1 and the bracket 3.

[0018]

As described above, according to the present invention, by providing the masking slit having the adjusting mechanism which can be positioned independently of the ejection port, the masking slit and the soldered portion on the substrate can be easily positioned. The effect of becoming is obtained.

Further, by adjusting the position of the masking slit or changing the shape of the masking slit, there is an effect that the degree of freedom of soldering conditions such as jet height is expanded.

Further, since the masking slit can be removed from the jet port, the effect of facilitating maintenance such as cleaning can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a masking slit of a jet soldering device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the same device in the first embodiment.

FIG. 3A is a cross-sectional view of a conventional jet-type soldering device. FIG. 3B is a perspective view of a main part of the device.

[Explanation of symbols]

 1 Masking slit 2 Slit 7 Solder tank 8 Solder 11 Jet port

Claims (1)

[Claims] 1. A solder bath for storing molten solder for soldering to a printed circuit board, the solder bath being provided so as to be movable up and down, an ejection port for ejecting the molten solder in the solder bath, A jet-type soldering device that is provided so that its relative position can be adjusted with respect to the ejection port, and that includes a molten solder ejected from the ejection port and a guide portion that can selectively supply it to a predetermined soldering portion of the printed circuit board. .