JPH03155465A - Method for adjusting jet stream of jet type soldering device - Google Patents
Method for adjusting jet stream of jet type soldering deviceInfo
- Publication number
- JPH03155465A JPH03155465A JP29340189A JP29340189A JPH03155465A JP H03155465 A JPH03155465 A JP H03155465A JP 29340189 A JP29340189 A JP 29340189A JP 29340189 A JP29340189 A JP 29340189A JP H03155465 A JPH03155465 A JP H03155465A
- Authority
- JP
- Japan
- Prior art keywords
- jet
- glass plate
- contact area
- contact
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims description 12
- 239000011521 glass Substances 0.000 claims abstract description 24
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 238000003384 imaging method Methods 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、噴流式ハンダ付装置において、溶融ハンダ
の噴流を調整する調整方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for adjusting a jet of molten solder in a jet soldering device.
電子回路装置は、一般に導電パターンを形成したプリン
ト配線板に各種電子部品を実装し、これら電子部品の電
極と前記導電パターンとを接続して構成されている
上記接続はハンダ付けによって行われるのが通例で、量
産する場合には、例えば第３図に示す様な噴流式ハンダ
付装置が使用される。Electronic circuit devices are generally constructed by mounting various electronic components on a printed wiring board on which a conductive pattern is formed, and connecting the electrodes of these electronic components to the conductive pattern.The above connections are made by soldering. Usually, for mass production, a jet soldering device as shown in FIG. 3, for example, is used.
上記噴流式ハンダ付装置は、ヒータ（２）を備えた溶融
ハンダ槽（１）に噴流ノズル（３）をその開口端が静止
ハンダ面より上方へ突出するように設け、溶融ハンダ槽
（１）内の溶融ハンダ（４）をポンプ（５）にて循環さ
せて噴流ノズル（３）から噴流させるようにしたもので
、リード付部品（６）やチップ部品（７）等の各種電子
部品を実装したプリント配線板（８）を−点鎖線で示す
軌跡に沿って送り、噴流ノズル（３）から溢れる溶融ハ
ンダ（４）の噴流（４ａ）に当ててハンダ付けを行う。The jet-type soldering device described above includes a jet nozzle (3) provided in a molten solder tank (1) equipped with a heater (2) such that its open end protrudes upward from a static soldering surface. The molten solder (4) inside is circulated by a pump (5) and jetted out from a jet nozzle (3) to mount various electronic components such as leaded parts (6) and chip parts (7). The printed wiring board (8) is sent along the trajectory shown by the - dotted chain line, and soldered by being exposed to the jet (4a) of the molten solder (4) overflowing from the jet nozzle (3).
上記噴流式ハンダ付装置は、プリント配線板（８）と溶
融ハンダ（４）の噴流（４ａ）とを−定範囲内で確実に
接触させ、かつ噴流（４ａ）がプリント配線板（８）の
上面を越えないようにしなければならない。そのため、
噴流の高さが一定になるようにポンプ（５）の駆動モー
タ（図示せず）の回転を調整しなければならない。The above-mentioned jet soldering device ensures that the printed wiring board (8) and the jet (4a) of the molten solder (4) are brought into contact within a certain range, and that the jet (4a) is connected to the printed wiring board (8). It must not go beyond the top surface. Therefore,
The rotation of the drive motor (not shown) of the pump (5) must be adjusted so that the height of the jet is constant.
上記調整時、噴流（４ａ）の状態を目視で見ただけでは
正常か否か確認するのが困難で、従来実開昭６３−１８
０１５７号公報にて開示された方法で噴流（４ａ）の状
態を確認している。これは第４図及び第５図に示す様に
、透明なガラス板（９）をプリント配線板（８）と同じ
経路で流し、ガラス板（９）と噴流（４ａ）との接触面
積を上面から目視して確認するものである。During the above adjustment, it is difficult to confirm whether the jet flow (4a) is normal or not just by visually observing it, and conventionally
The state of the jet stream (4a) was confirmed using the method disclosed in Publication No. 0157. As shown in Figures 4 and 5, a transparent glass plate (9) is flowed along the same path as the printed wiring board (8), and the contact area between the glass plate (9) and the jet (4a) is This should be confirmed visually.
上記方法であれば、ガラス板（９）と噴流（４ａ）との
接触状態を直接確認するので有効であるが、作業者の目
視に頼っているため、調整が非常に難しかった。即ち、
噴流（４ａ）はポンプ（５）の吐出圧の変動やその他の
要因によって刻々と変化するので、判断が難しく、熟練
を要し、また作業者によって判断が異なり、常に一定に
調整できなかった。このように作業者に面倒な作業を強
いることになり、調整作業の自動化が望まれていた。The above method is effective because it directly confirms the contact state between the glass plate (9) and the jet (4a), but it is very difficult to make adjustments because it relies on the operator's visual observation. That is,
Since the jet flow (4a) changes from moment to moment due to fluctuations in the discharge pressure of the pump (5) and other factors, it is difficult to judge, requires skill, and the judgment differs depending on the operator, making it impossible to always adjust it to a constant level. In this way, the operator is forced to perform troublesome work, and it has been desired to automate the adjustment work.
この発明は、噴流の調整作業を自動的に行う方法を提−
供しようとするものである。This invention provides a method for automatically adjusting jet flow.
This is what we are trying to provide.
この発明における調整方法は、噴流式ハンダ付装置の噴
流ノズルからポンプにて噴出させられる溶融ハンダの噴
流に対して、透明な耐熱ガラス板をハンダ付けと同じ状
態で接触させ、上方から撮像カメラにて透明ガラス板を
撮像し、そのデータを基に画像処理装置にて、透明ガラ
ス板と噴流との接触面積を求め、この接触面積が一定範
囲になるようにポンプ駆動用モータを制御するようにし
たものである。The adjustment method in this invention involves bringing a transparent heat-resistant glass plate into contact with a jet of molten solder spouted by a pump from a jet nozzle of a jet-type soldering device in the same state as soldering, and exposing the plate to an imaging camera from above. The system takes an image of the transparent glass plate, uses that data to determine the contact area between the transparent glass plate and the jet using an image processing device, and controls the pump drive motor so that this contact area falls within a certain range. This is what I did.
上記調整方法は、撮像カメラにて撮像さた透明ガラス板
と噴流との接触面積を、画像処理装置にて求め、この接
触面積が一定範囲内になるように噴流を調整するので、
誤差が少なく安定した調整を行える。In the above adjustment method, the contact area between the jet and the transparent glass plate imaged by the imaging camera is determined by the image processing device, and the jet is adjusted so that this contact area is within a certain range.
Stable adjustments can be made with few errors.
以下、この発明の実施例を第１図及び第２図を参照して
説明する。Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.
この発明における調整方法は、第１図に示す様に、噴流
式ハンダ付装置の噴流ノズル（３）上に透明な耐熱ガラ
ス板（１１）を配置させ、該耐熱ガラス板（１１）と噴
流ノズル（３）から噴出されている溶融ハンダ（４）の
噴流と接触させる。前記耐熱ガラス板（１１）は噴流ノ
ズル（３）に対してプリント配線板（８）と同じ状態に
配置させる。そして上方から撮像カメラ、例えばＣＯＤ
カメラ（１２）にて耐熱ガラス板（１１）と噴流ノズル
（３）との接触部（Ａ）を撮像し、そのデータを画像処
理装置（１３）へ伝達する。画像処理装置（１３）では
、ＣＯＤカメラ（１２）からのデータに基づいて耐熱ガ
ラス（１１）と噴流（４ａ）との接触面積（Ｓ）を求め
る。そして、求めた接触面積（Ｓ）を予め与えられてい
る正常な値と比較して良否の判定を行う。判定の結果、
不良となった場合は、モータ駆動回路（１４）を介して
ポンプ（５）を駆動しているモータ（１５）の回転数を
制御して、噴流（４ａ）の高さを調整する。この調整時
、一定時間内に数回画像処理装置（１３）にて耐熱ガラ
ス（１１）と噴流（４ａ）との接触面積を求め、これが
一定範囲内に入ると、調整を終る。As shown in FIG. 1, the adjustment method in this invention is to arrange a transparent heat-resistant glass plate (11) on a jet nozzle (3) of a jet-type soldering device, and connect the heat-resistant glass plate (11) and the jet nozzle. (3) is brought into contact with the jet of molten solder (4) being spouted from the solder (4). The heat-resistant glass plate (11) is placed in the same position as the printed wiring board (8) with respect to the jet nozzle (3). And an imaging camera from above, for example COD
A camera (12) images the contact portion (A) between the heat-resistant glass plate (11) and the jet nozzle (3), and the data is transmitted to the image processing device (13). The image processing device (13) calculates the contact area (S) between the heat-resistant glass (11) and the jet (4a) based on data from the COD camera (12). Then, the determined contact area (S) is compared with a normal value given in advance to determine whether it is good or bad. As a result of the judgment,
If the pump is defective, the height of the jet (4a) is adjusted by controlling the rotation speed of the motor (15) that drives the pump (5) via the motor drive circuit (14). During this adjustment, the image processing device (13) calculates the contact area between the heat-resistant glass (11) and the jet stream (4a) several times within a certain period of time, and when this falls within a certain range, the adjustment ends.
上記耐熱ガラス（１１）と噴流（４ａ）との接触部（Ａ
）は第２図に示す様になっており、接触面積（Ｓ）は＠
（Ｗ）と長さ（Ｌ）の積で求まる。この場合、幅（Ｗ）
は一定となっており、長さ（Ｌ）のみが変化する。従っ
て、上記画像処理装置（１３）では、長さ（Ｌ）によっ
て判定する。向、この判定は、一定時間内で数回画像処
理を行い、各処理毎の長さ（Ｌ）の平均値で行ったり、
或いは長さ（Ｌ）の最小値（Ｌｍｉｎ）で行ったり、或
いは最小値（Ｌａｔｉｎ）と最大（Ｌｍａｘ）との差で
行ったりする。The contact area (A) between the heat-resistant glass (11) and the jet (4a)
) is shown in Figure 2, and the contact area (S) is @
It is found by multiplying (W) and length (L). In this case, the width (W)
is constant, and only the length (L) changes. Therefore, the image processing device (13) makes the determination based on the length (L). For this purpose, this judgment can be made by performing image processing several times within a certain period of time and using the average value of the length (L) for each process.
Alternatively, the minimum value (Lmin) of the length (L) is used, or the difference between the minimum value (Latin) and the maximum (Lmax) is used.
この発明によれば、噴流式ハンダ付装置の噴流の高さを
自動調整できるので、作業者を面倒な作業から開放でき
る。また耐熱ガラス板を噴流に接触させることにより、
実際のハンダ付は時と同じ状態で判断でき、しかも画像
処理装置にて耐熱ガラスと噴流との接触面積を測定して
いるので、誤差がほとんどなく、安定した調整を行える
。According to this invention, since the height of the jet of the jet soldering device can be automatically adjusted, the operator can be freed from troublesome work. In addition, by bringing a heat-resistant glass plate into contact with the jet,
Actual soldering can be determined under the same conditions as before, and since the contact area between the heat-resistant glass and the jet is measured using an image processing device, stable adjustments can be made with almost no errors.
第１図は本発明の調整方法を実施する装置例を示す概略
図、第２図は撮像カメラで撮像した像を示す図面、第３
図は噴流式ハンダ付装置を示す断面図、第４図は従来の
調整方法を示す平面図、第５図はその断面図である。
（３）〜・噴流ノズル２、（４） −溶融ハンダ、（４
ａ）・−噴流、 （１１：ｌ−耐熱ガラス板、（
１２） −撮像カメラ、（１３）−画像処理装置。FIG. 1 is a schematic diagram showing an example of an apparatus for carrying out the adjustment method of the present invention, FIG. 2 is a diagram showing an image taken by an imaging camera, and FIG.
The figure is a sectional view showing a jet soldering device, FIG. 4 is a plan view showing a conventional adjustment method, and FIG. 5 is a sectional view thereof. (3) ~・Jet nozzle 2, (4) - Molten solder, (4
a)・-jet, (11: l-heat-resistant glass plate, (
12) - Imaging camera, (13) - Image processing device.
Claims (1)
噴出させられる溶融ハンダの噴流に対して、透明な耐熱
ガラス板をハンダ付けと同じ状態で接触させ、上方から
撮像カメラにて透明ガラス板を撮像し、そのデータを基
に画像処理装置にて、透明ガラス板と噴流との接触面積
を求め、この接触面積が一定範囲になるようにポンプ駆
動用モータを制御するようにしたことを特徴とする噴流
式ハンダ付装置の噴流調整方法。(1) A transparent heat-resistant glass plate is brought into contact with the jet of molten solder spouted by a pump from the jet nozzle of a jet soldering device in the same condition as soldering, and an imaging camera is used to capture the transparent glass plate from above. is imaged, and based on that data, an image processing device determines the contact area between the transparent glass plate and the jet, and the pump drive motor is controlled so that this contact area is within a certain range. A jet flow adjustment method for a jet type soldering device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29340189A JPH03155465A (en) | 1989-11-10 | 1989-11-10 | Method for adjusting jet stream of jet type soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29340189A JPH03155465A (en) | 1989-11-10 | 1989-11-10 | Method for adjusting jet stream of jet type soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03155465A true JPH03155465A (en) | 1991-07-03 |
Family
ID=17794291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29340189A Pending JPH03155465A (en) | 1989-11-10 | 1989-11-10 | Method for adjusting jet stream of jet type soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03155465A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330721A (en) * | 1995-04-11 | 1996-12-13 | Vlt Corp | Soldering system and method |
| WO2020026932A1 (en) * | 2018-07-31 | 2020-02-06 | オムロン株式会社 | Information processing device, management system, control program, and method for controlling information processing device |
| JPWO2020027208A1 (en) * | 2018-07-31 | 2021-08-02 | オムロン株式会社 | Information processing device, management system, control program and control method of information processing device |
-
1989
- 1989-11-10 JP JP29340189A patent/JPH03155465A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330721A (en) * | 1995-04-11 | 1996-12-13 | Vlt Corp | Soldering system and method |
| US5941444A (en) * | 1995-04-11 | 1999-08-24 | Vtl Corporation | Soldering |
| US6186388B1 (en) | 1995-04-11 | 2001-02-13 | Vlt Corporation | Soldering |
| WO2020026932A1 (en) * | 2018-07-31 | 2020-02-06 | オムロン株式会社 | Information processing device, management system, control program, and method for controlling information processing device |
| JP2020019040A (en) * | 2018-07-31 | 2020-02-06 | オムロン株式会社 | Information processor, management system, control program, and method for controlling information processor |
| JPWO2020027208A1 (en) * | 2018-07-31 | 2021-08-02 | オムロン株式会社 | Information processing device, management system, control program and control method of information processing device |
| EP3831524A4 (en) * | 2018-07-31 | 2022-05-18 | OMRON Corporation | Information processing device, management system, control program, and method for controlling information processing device |
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