JPH024784Y2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to an apparatus for automatically and continuously soldering lead wires of circuit components temporarily installed on a printed circuit board to pattern wiring.

<Conventional technology> A conventional automatic soldering device using a solder bath vibrates a diaphragm and moves it through the solder bath, thereby separating the lead wires of the circuit components protruding from the bottom surface of the printed circuit board and the solder bath. The aim was to actively seek contact with the public.

<Problem that the invention aims to solve> An essential requirement for soldering is that flux (a liquid agent made by dissolving pine resin in alcohol) must be applied to the relevant parts of the two metals to be soldered in advance. Since affinity cannot be obtained, in all cases the flux is locally applied in advance to the surface on which the solder metal is to be placed.

Therefore, these fluxes vaporize at the temperature at which the solder metal fuses, forming a pool between the printed circuit board and the solder bath surface, and do not completely scatter, forming bubbles and adhering to the soldered parts. In order to eliminate this problem, a vibrating device is used to vibrate the solder bath, but this is still insufficient, and soldering defects due to flux gas accumulation are caused. The current situation was that it could not be completely eradicated.

The present invention addresses the drawbacks of the conventional automatic soldering apparatus using a solder bath and provides an apparatus that has a simple structure and can perform soldering more effectively.

<Means for solving the problem> A diaphragm is inserted into the solder bath and applied to the solder at the edge facing the direction of movement of the diaphragm, which vibrates the solder.
The plow board is fixed.

<Function> The diaphragm is vibrated and moved in the solder bath, and the moving action is used to plow the solder bath surface upward in a wavy manner with the slope of the plow plate, thereby removing air bubbles attached to the bottom surface of the printed circuit board. To eliminate soldering defects caused by gas accumulation by driving the gas accumulation forward in the direction of movement of the plow board and scattering it to the outside at the end of the printed circuit board.

<Example> Hereinafter, the present invention will be explained in detail with reference to an example shown in the drawings.

A solder tank 2 is installed between a pair of frames facing left and right, and a heating plate 3 is installed on the bottom surface of the solder tank 2 to melt the solder in the solder tank 2. A freely movable vibration device is attached to the upper part.

That is, the vibration device includes the left and right frames 1,
The shock absorbers 16, 16 are supported by the slide fittings 21 on the two guide rods 15, 15 extending between the pillars 11, 12 erected on the support arm 21, and the shock absorbers 16, 16 are provided at the tips of the support arms 22 extending from the slide fittings 21. A vibrating device 17 is suspended and held at the bottom of the vibrating device 17 through the
The central part of a horizontal rod 20 supported by two support rods 19, 19 hanging down via a spring from a support piece 18 protruding from the body of the vibrating device 17 is connected and fixed to the output shaft end of the vibration device 17. A diaphragm 9 that is inserted into the solder bath 7 of the solder tank 2 is installed horizontally at the lower ends of the hanging rods 10, 10 hanging down from both ends of the horizontal rod 20, and one side edge of the diaphragm 9 is installed horizontally. along the plow plate 1 with a moderate inclination in the direction perpendicular to the traveling direction of the diaphragm 9.
0 is attached.

In order to reciprocate the vibrating device 17 in a certain direction, a screw rod 23 that is disposed between the guide rods 15, 15 and threadedly engaged with the slide fitting 21 is horizontally installed parallel to the guide rods 15, 15. One end of the screw rod 23 is connected via a relay device 14 to a prime mover 13 mounted on the one support column 11 and capable of forward or reverse rotation.

On the other hand, a chain conveyor 6 guided by two sets of guides 5, 5 having guide grooves 4 inclined toward the solder bath surface is attached to the left and right upper parts of the solder bath 2, and a chain conveyor 6 is attached to both sides. It is constructed so that a printed circuit board suspended between a pair of chain conveyors 6, 6 is guided onto the solder bath surface.

The present invention is constructed as described above, and its operation is to guide the printed circuit board supported and supplied between the chain conveyors 6 and 6 to the upper surface of the solder bath 7 by the guide 5, and then to operate the vibration device 17. The diaphragm 9 is vibrated in a certain direction via the horizontal rod 20 and the hanging rod 10, and the motor 13 is driven to rotate the screw rod 23, thereby starting to move the diaphragm 9 in a predetermined direction.

Therefore, the solder bath 7 is in contact with the lead wires and pattern wiring of the circuit components protruding from the lower surface of the printed circuit board, and the solder bath surface is moved while the soldering operation is carried out.

As the diaphragm 9 moves, the plow plate 10 also vibrates and moves, and the slope of the plow plate 10 pushes up the solder bath surface to make the contact between the solder and the lead wire of the circuit component more positive. As well as
By this operation, the bubble-like gas accumulation adhering to the lower surface of the printed circuit board is expelled in one direction, thereby eliminating soldering defects caused by the gas.

Therefore, even if the bottom surface of the printed circuit board is uneven, the part of the solder bath surface through which the plow board passes will be higher, and the front surface of the plow board in the direction of movement will be open to the printed circuit board, which will prevent gas from flowing. cannot be contained and is completely pushed out.

<Effects of the invention> Since the present invention is configured as described above, it is possible to completely eliminate gas accumulation on the underside of the printed circuit board, especially at the base of the lead wires of circuit components, during automatic soldering work. There is no occurrence of soldering defects due to

Furthermore, since the solder bath surface is pushed up by the slope of the plow board, even if the bottom surface of the printed circuit board is uneven, the solder can be spread to a sufficiently narrow area and solder can be reliably formed, resulting in an extremely simple structure. This is a highly practical idea with excellent effects.

[Brief explanation of drawings]

Figure 1 is a front view of the vibrating soldering device of the present invention;
FIG. 2 is a side view of the same as above. 2... Solder tank, 3... Heating plate, 9... Vibration plate,
10... Plow board, 17... Vibration device.

Claims (1)

[Scope of utility model registration request] A vibration device that moves horizontally along the solder bath is installed above the solder bath with a heating plate on the bottom surface, and the vibration that infiltrates into the solder bath via an appropriate interlocking frame is installed at the lower end of the output shaft of the vibration device. At the same time as fixing the plate, a plow plate is attached to one side edge facing the direction of movement of the diaphragm, and vibration is applied to the solder while moving against the direction of movement of the printed circuit board moving on the top surface of the solder bath. A vibrating soldering device characterized in that the device is configured to push up the printed circuit board toward the lower surface thereof.