JPS6243661Y2 - - Google Patents

Description

[Detailed explanation of the idea]

Industrial Application Field The present invention relates to an apparatus for soldering circuit components to a board, in which a board on which a circuit component is temporarily attached is transferred and brought into contact with a pair of solder branches formed by jetting solder. The present invention relates to an apparatus for soldering circuit components to a board. BACKGROUND TECHNOLOGY A conventional device for soldering circuit components onto a board tilts a board on which circuit components are temporarily attached and transfers the circuit components in the direction of the tilt to a pair of solder branches formed by jetting solder. There is a method in which terminals of circuit components are soldered to a board by sequentially contacting a solder branch. Problems that the invention aims to solve According to this method, it is difficult to form solder icicles, peaks, bridges, etc. at the tip of the terminal, and it is possible to perform relatively good soldering, but since there are many moving components (board, various solder branches), There was a problem that it was difficult to set the value and the soldering result was unstable. An object of the present invention is to provide an apparatus for soldering circuit components to a board, which solves the above-mentioned problems. Means for Solving the Problems The present invention includes a means for spouting solder fluid and dividing it in opposite substantially horizontal directions to form a pair of solder divisions, and a circuit board on which a circuit component is temporarily attached first flows into the first solder division. The substrate is horizontally moved so as to separate the substrate from the other solder branch when the solder branch contacts the other solder branch in the same direction as the flow and the transfer velocity matches the flow velocity. The solder flow forming means includes a nozzle for spouting the solder liquid upward and a nozzle for guiding the solder liquid spouted from the nozzle. and a rear guide plate that guides the solder liquid ejected from the nozzle to form the other solder branch and whose position is adjustable in the vertical direction, By adjusting the position of the rear guide plate, the flow velocity of the one solder branch is set to a range of 7 to 16 times the flow velocity corresponding to the transfer velocity of the other solder branch, and the transfer velocity of the substrate is adjusted. The speed is set within the range of 0.8 to 3.2 m/min depending on the soldering conditions of the board. Effect: Set the flow velocity of one solder branch in the range of 7 to 16 times the flow velocity corresponding to the transfer velocity of the other solder branch, and set the board transfer velocity in the range of 0.8 to 3.2 m/min. By being set and operated in accordance with the application conditions, it is possible to achieve good soldering at the terminal portion without solder icicles, peaks, bridges, etc. The position-adjustable rear guide plate can be moved up and down.
To quickly adjust the flow speed of a branched flow of solder to a speed corresponding to the soldering conditions of a board to be soldered, without causing stagnation in the solder. Embodiment Hereinafter, one embodiment of the apparatus for soldering circuit components to a board according to the present invention will be described with reference to FIG. In the figure, reference numeral 1 denotes a solder spouting nozzle, for example, one side of the upper end of the nozzle body 2, which has a square cross section, is bent horizontally into an arc shape to form a front guide plate 2a, and an L-shaped rear part is formed on the opposite side. A guide plate 3 is attached so that its position can be adjusted in the vertical direction in the figure. A nozzle 1 emits high-temperature solder 4 stored in a predetermined container.
The solder 4 is immersed upright in the liquid, and the solder 4 is pumped into the body 2 of the nozzle 1 by means of a predetermined pump (not shown).
The water is ejected to the upper end opening of the nozzle 1 through the flow, and is further divided to the left and right in the figure to form a relatively high-speed divided flow 4a to the front guide plate 2a and a relatively low-speed divided flow 4b to the rear guide plate 3. Ru. The flow of the solder 4 is steady, and as shown in the figure, due to the jetting pressure of the solder 4 and the effects of the guide plates 2a and 3, approximately the central portion is formed into a raised smooth surface, and the divided flows 4a and 4b are formed.
The solder solder is respectively poured into the solder pool 4 below and circulated. Reference numeral 5 designates a board, on the upper surface of which a plurality of circuit components 6 are temporarily attached, each unit 6a of which is inserted through the board and protrudes in a relatively short dimension to the lower surface of the board. The substrate 5 is attached to a predetermined conveyor means (not shown) and is transported at a constant speed in the tilted direction, that is, in the direction of arrow A in the figure, while being tilted at an angle θ (θ = 4 to 7 degrees) from the horizontal direction. . When the substrate 5 is transferred from the left side in FIG. 1 to the solder branch flow 4a in a direction opposite to the flow direction thereof and approaches it,
Predetermined portions of the board 5 and circuit components 6 at normal temperature are first addressed to the left zone of the branch flow 4a (here the branch flow 4a has the highest speed) and are preheated to the soldering temperature by the high temperature branch flow 4a. Subsequently, the predetermined portion is transferred to the right in the figure and reaches the zone. As a result, the lower surface of the substrate 5 starts to come into contact with the main smooth surface of the shunt 4a, and gradually comes into contact over a predetermined length in the transport direction, and the terminals 6a are also completely immersed in the shunt 4a. The contact length and contact time of the lower surface of the substrate 5 with the solder 4 can be adjusted as appropriate by adjusting the vertical position of the rear guide plate 3 and adjusting the inclination angle θ of the substrate 5. In addition, if the substrate 5 has a through hole (not shown) that requires conduction, when the through hole reaches the right side of the zone in the figure, the speed of the branch flow 4a is slow here and the static pressure is relatively large. Therefore, the solder 4 can be blown up well into the through hole to obtain appropriate conduction. Subsequently, when the predetermined portion is further transferred to the right and reaches the zone, it is treated with another branched flow 4b instead of the branched flow 4a. However, the branched flow 4b flows in the same direction as the substrate 5 transfer direction, and moreover, in the zone, the substrate 5
It is flowing at a low speed that is approximately the same as the transport speed. Therefore, the lower surface of the substrate 5 and the protruding portions of the terminals 6a depart obliquely upward from the branch flow 4b in the zone as shown in the figure.
Since the substrate 5 gradually separates while remaining stationary relative to the flow of solder 4, it is difficult for the substrate 5 to adhere in droplets to the lower surface of the substrate 5 and the terminals 6a. Therefore, terminal 6a
is well soldered to the pattern on the bottom surface of the board 5,
There will be no icicles, peaks, bridges, etc. of the solder 4 in this part. Subsequently, the above-mentioned predetermined portion is transferred to a zone, which corresponds to the right side of the branch flow 4b, and is somewhat heated by the branch flow 4b, and is slowly cooled appropriately. The parts of the board 5 other than the above-mentioned predetermined parts are successively soldered in a similar manner and removed to the right in the figure. The relationships between various substrates A to D and their corresponding appropriate soldering conditions were obtained through numerous actual trials as shown in the following table. However, board A...circuit components have short protruding terminals,
The packaging density is small. Board B… 〃 length,
〃 Small. Board C... 〃 Short,
〃 Big. Board D... 〃 long,
〃 Big.

[Table] According to the above table, it can be seen that the longer the lead wire of the circuit component and the higher the mounting density, the smaller the board transfer speed and solder flow speed tend to be. It has been found that, according to the various conditions described above, even in the case of the above-mentioned embodiment and the case of the long protruding terminal 6a described later, icicles, peaks, and bridging of the solder 4 can be virtually completely prevented and good soldering can be achieved. It has also been found that under the above various conditions, good soldering can be achieved regardless of the density of the circuit components 6 on the board 5. According to the above-mentioned appropriate conditions, the transfer speed of the board 5 and the flow speed of the solder 4 on the board delivery side are 0.8 to 3.2 m/min, respectively, and the flow speed of the solder 4 on the board entry side is approximately 7 to 16 times the above flow speed. It can be seen that it is. According to the above device, the solder 4 is a steady flow, and the divided flows 4a and 4b are poured from points close to the solder 4 liquid level by the guide plates 2a and 3, so that the solder liquid is hardly disturbed. This eliminates the need for oil, and the substrate 5 is free from oil contamination and requires no cleaning work, making maintenance of the entire device easier. Moreover, when the guide plate 3 is adjusted and raised upward, the solder 4 will flow more easily in the direction of the guide plate 2a, and the solder 4 will flow into the divided flow 4a.
The flow velocity of the branch stream 4b increases, and the flow velocity of the branch stream 4b decreases. When the guide plate 3 is adjusted and lowered, the solder 4 is attached to the guide plate 3.
The flow rate of the branch stream 4b increases and the flow rate of the branch stream 4a decreases. In this way, by adjusting the height position of the guide plate 3, the divided flows 4a, 4b
The flow rate of the branched flow can be set variably over the above-mentioned range, and the flow rate of the branched flow is set to the optimum flow rate for the board to be soldered. Also, by moving the guide plate 3 up and down, the shunt 4
Although the height of the liquid level in a and 4b changes, the divided flows 4a and 4b
4b does not become stagnant, and the solder liquid does not become inhomogeneous due to stagnation. That is, the adjustment of the flow velocity of the branched flows 4a and 4b does not impair the quality of the solder 4 in any way, and the quality of soldering remains unchanged even after the above adjustment. In the above embodiment, the protruding length of the terminal 6a was short, but an embodiment in which the protruding length of the terminal 6a is long is shown in FIG. In the figure, the nozzle 7 has a front guide plate 7a and a long rear guide plate 7b. Therefore, the solder 4 is ejected upward from the nozzle 7 and is divided into branch streams 4c and 4d, but the depth of the branch streams 4c and 4d increases by moving above the guide plate 7b. Therefore, when the board 9 having the circuit component 8 protruding downward with the long terminal 8a is transferred and brought into contact with the shunt 4c in the same manner as in the above embodiment, the terminal 8a
a is sufficiently accommodated within the depth of the branches 4c and 4d,
It is separated from the branch stream 4d whose flow velocity is the same as the transfer velocity. The effect is similar to that of the above embodiment. By adjusting the position of the guide plate 7b,
The depth of the branch streams 4c and 4d can be easily varied. Next, an apparatus for performing the above soldering method will be explained with reference to FIGS. 3 and 4. In Figures 3 and 4,
The same parts as in FIG. 1 are given the same reference numerals. In the figure, 1
1 is a chain, which is stretched parallel to the solder 4 liquid level.
It is driven by a predetermined driving means (not shown) above the nozzle 1 in FIG. 3 in the direction of arrow B at a predetermined speed.
Reference numeral 12 designates a board holding block, in which a pair of right and left rods 14 are screwed and fixed to the lower surface of one holding plate 13, and a slide plate 15 is attached to the lower end of each pair of rods 14.
It is held movably. That is, each slide plate 1
The rods 5 are normally positioned horizontally by being loosely fitted into the pair of rods 14 through a pair of elongated holes 15a provided on the left and right sides in FIG. Further, the board 5 to be soldered is integrally attached and fixed between the support arms 15b of each slide plate 15, and similarly positioned horizontally. The substrate block 12 is fixed by bolting the center part of the holding plate 13 to the chain 11, and in this manner, a plurality of blocks 12 are attached to the chain 1 at equal pitches.
Attached to 1. Reference numeral 16 denotes a pair of guide plates, which are fixed between a pair of front and rear adjustment tools 17a and 17b on the left and right sides of the nozzle 1, respectively, so as to be able to adjust the inclination angle. That is, each guide plate 16 has a guide surface 16a on the upper surface and holes 1 at both ends.
6b, and a long hole 16c, as shown in FIG.
Bolts 18a and 18b provided on the adjusters 17a and 17b are inserted into the elongated holes 16c and 6b, respectively, and tightened to be fixed between the adjusters 17a and 17b. Note that the guide plate 16 has a hole 1 due to the function of the elongated hole 16c.
6b as a fulcrum, the inclination angle θ can be adjusted as appropriate, but in this case, the pair of guide plates 16 are
The right side in the figure is lifted and set symmetrically so that the angle θ=4 to 7 degrees. Therefore, as the chain 11 moves in the direction of arrow B in FIG. It comes into contact with each guide surface 16a of the guide plate 16 and gradually rides on it, moves upward relative to the rod 14 as a pair, and is eventually completely placed on the guide surface 16a. Therefore, from now on, as the chain 11 travels in the direction of arrow B, 1
The pair of guide plates 16 and the substrate 5 integrated therewith are guided by the guide surface 16a at an angle θ with respect to the horizontal.
It will be transferred in the direction of arrow A, which is tilted by a certain amount.
Therefore, during this tilted transfer, the substrate 5 successively comes into contact with the branched flows 4c and 4d of the solder 4, as shown in FIG. 1, and is properly soldered. When the board 5 completes soldering and passes through the guide surface 16a, the slide plate 15 can be further guided by another guide surface (not shown) to return to the lower end position of the rod 14, thereby preventing the return shock. Can be removed. The same applies to the case where the substrate 9 shown in FIG. 2 is used instead of the substrate 5. According to the above-mentioned apparatus, the substrate 5 with respect to the solder 4 liquid level
Since the transfer inclination angle θ is obtained by the interaction between the slide plate 15 and the guide plate 16 regardless of the running direction of the chain 11, it is easy to change the angle θ, the accuracy is high, and the work cost can be reduced. . Effects of the Invention As described above, according to the apparatus for soldering circuit components to a board according to the present invention, the flow velocity of one solder branch is 7 to 16 times the flow velocity of the other solder branch, which corresponds to the board transfer velocity. and the substrate transfer speed is 0.8
~3.2 m/min, and is set in accordance with the soldering conditions of the board, so for example, the longer the protruding dimension of the terminal of the above circuit component from the bottom surface, the faster the mounting speed of the circuit component. The higher the density,
The flow speed of the first solder branch flow and the transfer speed of the board become smaller within the above ranges, and the shorter the protrusion dimension and the lower the mounting density, the lower the flow speed of the first solder branch flow. The flow speed and the transfer speed are set to the above values according to the protruding length of the terminal of the circuit component of the board and the density of the circuit component so that the transfer speed of the board is on the larger side within the above range. It is convenient to set the settings within the range of 1 to 1000, because it is possible to obtain the optimal soldering conditions in any case, and it is possible to perform good soldering without icicles, peaks, or bridges of solder on the terminal area, and to improve the appearance and performance. Moreover, since the flow velocity of the branch flow can be varied by adjusting the height position of the rear guide plate, stagnation of solder does not occur due to adjustment, and the solder maintains its initial quality, and the flow velocity of the branch flow can be changed by adjusting the rear guide plate height position. High-quality soldering can be achieved even when the flow velocity of the split flow is changed, and as the rear guide plate is adjusted, the flow velocity of the branch flow changes accordingly, making it possible to quickly adjust the flow velocity to the desired flow rate. It is something.

[Brief explanation of the drawing]

1 and 2 are longitudinal cross-sectional views of one embodiment and another embodiment of the soldering apparatus for circuit components to a board according to the present invention, respectively, and FIGS. 3 and 4 respectively show the above-mentioned soldering apparatus. They are a side view and a front view. 1, 7... Nozzle, 2a, 7a... Front guide plate, 3, 7b... Rear guide plate, 4... Solder, 4
a to 4d... Solder branch, 5, 9... Board, 6, 8
...Circuit parts, 6a, 9a...Terminal, 11...Chain, 12...Board holding block, 15...Slide plate, 16...Guide plate, 16a...Guide surface, 17a, 17b...Adjustment tool.

Claims (1)

[Scope of utility model registration request] A means for spouting solder fluid and dividing it in opposite substantially horizontal directions to form a pair of solder divisions, and a means for forming a pair of solder divisions by spouting solder liquid and dividing the solder liquid in opposite substantially horizontal directions; The substrate is tilted at a predetermined angle with respect to the horizontal direction so that the substrate is separated from the other solder branches when the branch comes into contact with the solder branch in the same direction as the flow and the transfer speed matches the flow velocity. It becomes a means of transferring in the tilted direction,
The solder flow forming means includes a nozzle that spouts the solder fluid upward, a front guide plate that guides the solder fluid spouted from the nozzle to form the first solder shunt, and a front guide plate that guides the solder fluid spouted from the nozzle to form the solder fluid spouted from the nozzle. The configuration includes a rear guide plate that guides the other solder branches and is adjustable in position in the vertical direction, and by adjusting the position of the rear guide plate, the flow velocity of the one solder branch can be adjusted as desired. The transfer speed of the board is set in a range of 7 to 16 times the flow speed corresponding to the transfer speed of the other solder branches, and the transfer speed of the board is set in a range of 0.8 to 3.2 m/min, each corresponding to the soldering conditions of the board. Equipment used to solder circuit components to boards.