JPS6210953U - - Google Patents
Info
- Publication number
- JPS6210953U JPS6210953U JP4161786U JP4161786U JPS6210953U JP S6210953 U JPS6210953 U JP S6210953U JP 4161786 U JP4161786 U JP 4161786U JP 4161786 U JP4161786 U JP 4161786U JP S6210953 U JPS6210953 U JP S6210953U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- board
- flow
- guide plate
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 1
Description
第１図及び第２図は夫々本考案になる回路部品
の基板への半田付け装置の１実施例及び他の実施
例の縦断面図、第３図及び第４図は夫々上記半田
付け装置の側面図及び正面図である。
１，７……ノズル、２ａ，７ａ……前方ガイド
板、３，７ｂ……後方ガイド板、４……半田、４
ａ〜４ｄ……半田分流、５，９……基板、６，８
……回路部品、６ａ，９ａ……端子、１１……チ
エーン、１２……基板保持ブロツク、１５……ス
ライド板、１６……ガイド板、１６ａ……ガイド
面、１７ａ，１７ｂ……調整具。
1 and 2 are longitudinal cross-sectional views of one embodiment and another embodiment of the soldering apparatus for circuit components to a board according to the present invention, respectively, and FIGS. 3 and 4 respectively show the above-mentioned soldering apparatus. They are a side view and a front view. 1, 7... Nozzle, 2a, 7a... Front guide plate, 3, 7b... Rear guide plate, 4... Solder, 4
a to 4d... Solder branch, 5, 9... Board, 6, 8
...Circuit parts, 6a, 9a...Terminal, 11...Chain, 12...Board holding block, 15...Slide plate, 16...Guide plate, 16a...Guide surface, 17a, 17b...Adjustment tool.
Claims (1)
せ１対の半田分流を形成する手段と、回路部品を
仮取付けした基板がまず一の半田分流に流れと対
向する分向に接触した後他の半田分流に流れと同
一方向に接触し該移送速度が該流れ速度に一致す
る時点で該基板を該他の半田分流から離間するよ
うに、該基板を水平方向に対し、所定角度傾けた
状態で該傾けた方向へ移送する手段とよりなり、
該半田分流形成手段を、該半田液を上方に噴出さ
せるノズルと、該ノズルより噴出した半田液を案
内して上記一の半田分流を形成する前方ガイド板
と、該ノズルより噴出した半田液を案内して上記
他の半田分流を形成すると共に上下方向に位置調
整可能な後方ガイド板とよりなる構成とし、該後
方ガイド板の位置を調整することにより、該一の
半田分流の流れ速度を該他の半田分流の該移送速
度に一致する流れ速度の７〜１６倍の範囲で且つ
該基板の移送速度を０．８〜３．２ｍ／分の範囲
で、夫々該基板の半田付条件に対応させて設定し
て使用される回路部品の基板への半田付け装置。 A means for spouting solder liquid and dividing it in opposing substantially horizontal directions to form a pair of solder divisions, and a means for forming a pair of solder divisions by spouting solder liquid and dividing the solder liquid in opposing substantially horizontal directions; The substrate is tilted at a predetermined angle with respect to the horizontal direction so that the board is separated from the other solder branches when the solder branch comes into contact with the solder branch in the same direction as the flow and the transfer speed matches the flow velocity. a means for transferring in the tilted direction;
The solder flow forming means includes a nozzle for spouting the solder liquid upward, a front guide plate for guiding the solder liquid spouted from the nozzle to form the first solder flow, and a front guide plate for guiding the solder liquid spouted from the nozzle to form the first solder flow. The configuration includes a rear guide plate that guides the other solder branches and is adjustable in position in the vertical direction, and by adjusting the position of the rear guide plate, the flow velocity of the one solder branch can be adjusted to the desired value. The transfer speed of the board is within the range of 7 to 16 times the transfer speed of the other solder branches, and the transfer speed of the board is within the range of 0.8 to 3.2 m/min, each corresponding to the soldering conditions of the board. A device used to solder circuit components onto a board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161786U JPS6243661Y2 (en) | 1986-03-20 | 1986-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4161786U JPS6243661Y2 (en) | 1986-03-20 | 1986-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6210953U true JPS6210953U (en) | 1987-01-23 |
| JPS6243661Y2 JPS6243661Y2 (en) | 1987-11-13 |
Family
ID=30856781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4161786U Expired JPS6243661Y2 (en) | 1986-03-20 | 1986-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6243661Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073786A (en) * | 2005-09-08 | 2007-03-22 | Tamura Seisakusho Co Ltd | Soldering method |
-
1986
- 1986-03-20 JP JP4161786U patent/JPS6243661Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007073786A (en) * | 2005-09-08 | 2007-03-22 | Tamura Seisakusho Co Ltd | Soldering method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6243661Y2 (en) | 1987-11-13 |
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