JPH0646613Y2 - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPH0646613Y2 JPH0646613Y2 JP1989008578U JP857889U JPH0646613Y2 JP H0646613 Y2 JPH0646613 Y2 JP H0646613Y2 JP 1989008578 U JP1989008578 U JP 1989008578U JP 857889 U JP857889 U JP 857889U JP H0646613 Y2 JPH0646613 Y2 JP H0646613Y2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- cream solder
- connection terminal
- nozzle
- conductive foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 ＜産業上の利用分野＞ 本考案は、印刷基板に電子部品を半田付けにより装着す
る装着装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a mounting device for mounting an electronic component on a printed board by soldering.
近時、フラット状本体部の側面から等間隔で導出された
多数の接続端子を有する電子部品が多用されている。こ
の様な電子部品を第２図（イ）に、またこの電子部品が
装着される印刷基板を同図（ロ）に示す。（イ）図にお
いて、10は電子部品、11は接続端子群である。接続端子
群11は電子部品10の本体部側面の四方から導出され、夫
々Ｌ字状に折り曲げられている。（ロ）図において、20
は印刷基板、21はこの印刷基板に形成された導電箔群で
ある。この導電箔群は電子部品10の接続端子群11に対応
してロ字状に形成されている。Recently, an electronic component having a large number of connection terminals led out from the side surface of the flat body portion at equal intervals has been widely used. Such an electronic component is shown in FIG. 2 (a), and a printed board on which the electronic component is mounted is shown in FIG. 2 (b). (A) In the figure, 10 is an electronic component and 11 is a connection terminal group. The connection terminal group 11 is led out from the four sides of the side surface of the main body of the electronic component 10 and is bent into an L shape. (B) In the figure, 20
Is a printed board, and 21 is a conductive foil group formed on the printed board. This conductive foil group is formed in a square shape corresponding to the connection terminal group 11 of the electronic component 10.
上記の様な電子部品10はその接続端子群11が印刷基板21
に形成した導電箔群21に半田付けにより装着される。In the electronic component 10 as described above, the connection terminal group 11 is the printed board 21.
It is mounted on the conductive foil group 21 formed in step 1 by soldering.
＜従来の技術＞ 従来、その装着手段としてクリーム半田を用い、そのク
リーム半田を先ず印刷基板20の導電箔群21に四辺に渡っ
て連続的に塗布する。なお、周知のようにクリーム半田
は極く小さい半田粒よりなり、その半田粒がフラックス
等の液状物質の中に浮懸しているものである。そして、
各導電箔21に電子部品10の所定の接続端子群11が位置す
るように、塗布したクリーム半田の上に接続端子群11を
載置する。しかる後、接続端子群11の上から加熱してク
リーム半田を溶融させる。これが固化することにより、
電子部品10が印刷基板20に装着される。<Prior Art> Conventionally, cream solder is used as the mounting means, and the cream solder is first continuously applied to the conductive foil group 21 of the printed board 20 over the four sides. As is well known, cream solder is composed of extremely small solder particles, and the solder particles are suspended in a liquid substance such as flux. And
The connection terminal group 11 is placed on the applied cream solder so that the predetermined connection terminal group 11 of the electronic component 10 is located on each conductive foil 21. Then, the cream solder is melted by heating from above the connection terminal group 11. By solidifying this,
The electronic component 10 is mounted on the printed board 20.
この様な電子部品の印刷基板への装着は従来より行なわ
れているが、クリーム半田を導電箔群21と接続端子群11
との間に塗布する関係上、そのクリーム半田の為に接続
端子群11に「浮き」が生じ、半田付けの信頼性が欠ける
という問題がある。Although mounting of such electronic components on the printed circuit board has been conventionally performed, cream solder is used for the conductive foil group 21 and the connection terminal group 11.
There is a problem in that, because of the cream solder, "floating" occurs in the connection terminal group 11 due to the cream solder, and the reliability of soldering is poor.
＜考案が解決しようとする課題＞ 本考案はこの様な問題点を解決する為になされたもの
で、その目的は導電箔群と接続端子群との密着性がよ
く、半田付けの信頼性の高い装着装置を提供することを
目的としたものである。<Problems to be solved by the invention> The present invention was made in order to solve such problems, and its purpose is to provide good adhesion between the conductive foil group and the connection terminal group and to improve the reliability of soldering. The purpose is to provide a high mounting device.
＜課題を解決する為の手段＞ 本考案は上記の目的を達成するために、先に電子部品を
導電箔群上に載置し、しかる後クリーム半田収容部材の
ノズルから吐出するクリーム半田を電子部品の接続端子
上に塗布し、この塗布したクリーム半田を前記ランプに
よって作られるスポット光で溶融させることにより電子
部品を印刷基板に装着するように構成したものである。
以下、実施例に付いて詳細に説明する。<Means for Solving the Problems> In order to achieve the above object, the present invention first mounts an electronic component on a conductive foil group, and then electronically applies cream solder discharged from a nozzle of a cream solder containing member. The electronic component is mounted on the printed circuit board by applying it on the connection terminal of the component and melting the applied cream solder with the spot light produced by the lamp.
Hereinafter, examples will be described in detail.
＜実施例＞ 第１図は本考案に係る取付装置の一実施例の構成図で、
（イ）は正面図、（ロ）は側面図である。両図におい
て、30はクリーム半田を収容する収容部材で、クリーム
半田31はその一端にノズル32を有する円筒状の容器33に
適量収容されている。容器33の他端からはこの容器内に
エアにより圧力が加えられている。このように、エアに
より圧力が加えられると、容器33の内部に収容されたク
リーム半田31はノズル32より所定量外部に吐出される。
34は容器32を所定の温度に保つための保温器である。<Embodiment> FIG. 1 is a block diagram of an embodiment of a mounting device according to the present invention.
(A) is a front view and (B) is a side view. In both figures, 30 is a housing member for housing the cream solder, and the cream solder 31 is contained in an appropriate amount in a cylindrical container 33 having a nozzle 32 at one end thereof. From the other end of the container 33, pressure is applied by air into the container. Thus, when pressure is applied by the air, the cream solder 31 contained in the container 33 is discharged from the nozzle 32 to the outside by a predetermined amount.
Reference numeral 34 is a warmer for keeping the container 32 at a predetermined temperature.
40は加熱部材である。加熱部材40において、41はハロゲ
ンランプ、42はこのランプを保持する保持部材である。
ハロゲンランプ43の光はレンズによって集光されるよう
になっており、そのスポット光43の温度は230度程度に
なる。50は部品取出し部（図示せず）に配置された前記
電子部品10をエアにより吸着し、所定の場所に配置され
た印刷基板20の導電箔群21上に運ぶエアーシリンダであ
る。このエアーシリンダ及びクリーム半田収容部材30は
上下方向に移動可能となっている。40 is a heating member. In the heating member 40, 41 is a halogen lamp and 42 is a holding member for holding this lamp.
The light of the halogen lamp 43 is focused by the lens, and the temperature of the spot light 43 is about 230 degrees. Reference numeral 50 is an air cylinder that adsorbs the electronic component 10 placed in a component take-out portion (not shown) with air and carries it onto the conductive foil group 21 of the printed board 20 placed in a predetermined place. The air cylinder and cream solder accommodating member 30 are movable in the vertical direction.
60はキャリッジである。クリーム半田収容部材30とエア
ーシリンダ50は取付板61を介して、また加熱部材40は取
付板62を介して夫々キャリッジ60に取付けられている。
キャリッジ60にはその長さ方向に送り軸63,案内軸64,65
が設けられている。キャリッジ60は図外のマイクロ・プ
ロセッサにより制御される送り軸63を介してＸ及びＹの
方向に自由に移動できるようになっている。この様な装
置の動作を説明すると次のごとくなる。60 is a carriage. The cream solder accommodating member 30 and the air cylinder 50 are attached to the carriage 60 via the attaching plate 61, and the heating member 40 is attached to the carriage 60 via the attaching plate 62.
The carriage 60 has a feed shaft 63, guide shafts 64, 65 in its length direction.
Is provided. The carriage 60 is freely movable in the X and Y directions via a feed shaft 63 controlled by a microprocessor (not shown). The operation of such a device will be described below.
エアーシリンダ50により部品取出し部に配置された第２
図（イ）に示す電子部品10をエアにより吸着し、この電
子部品をマイクロ・プロセッサの制御の基に移動するキ
ャリッジ60により予め所定の場所に配置された第２図
（ロ）に示す印刷基板20上に運び、接続端子11が所定の
導電箔21に位置するようにこの電子部品を印刷基板20上
に載せる。印刷基板20の下部には強力な磁石が配置され
ており、これにより電子部品10は印刷基板20に吸引され
る。その結果、接続端子群11は導電箔群21に密着する。The second placed by the air cylinder 50 in the parts pick-up section
The printed circuit board shown in FIG. 2B, which is arranged in advance at a predetermined location by a carriage 60 which sucks the electronic component 10 shown in FIG. 1A by air and moves the electronic component under the control of a microprocessor. This electronic component is carried on the printed board 20 so that the connection terminal 11 is located on a predetermined conductive foil 21. A strong magnet is arranged below the printed circuit board 20, so that the electronic component 10 is attracted to the printed circuit board 20. As a result, the connection terminal group 11 comes into close contact with the conductive foil group 21.
次に、このように磁石により吸引されている電子部品10
の接続端子群11の一隅にノズル32が位置するようにクリ
ーム半田収容部材30をキャリッジ60によりマイクロ・プ
ロセッサの制御の基に移動させた後、ノズル32が接続端
子群11上を，すなわちロ字状になるように一定の速度で
移動させる。この時、クリーム半田収容部材30にエアに
より圧力を加えて容器33内のクリーム半田31をノズル32
より所定量連続して吐出させる。すなわち、接続端子群
11に必要な半田量が一様に接続端子11に塗布されるよう
にノズル31を走査する。次に、クリーム半田が塗布され
ている電子部品10の接続端子群11の一隅にハロゲンラン
プ41のスポット光43が位置するようにランプ保持部材40
をキャリッジ60により移した後、半田付けの条件が満た
されるように所定の温度に制御されたスポット光を接続
端子群11に塗布されたクリーム半田上を，すなわちロ字
状になるように一定の速度で移動させる。スポット光が
当たった部分のクリーム半田は溶融し、スポット光が移
動し終わった所の溶融半田は順次固化し、これにより電
子部品10は印刷基板20に装着される。Next, the electronic component 10 thus attracted by the magnet
After the cream solder accommodating member 30 is moved by the carriage 60 under the control of the microprocessor so that the nozzle 32 is located at one corner of the connecting terminal group 11, the nozzle 32 moves on the connecting terminal group 11, that is, the square shape. Move at a constant speed so that At this time, pressure is applied to the cream solder accommodating member 30 by the air so that the cream solder 31 in the container 33 is ejected from the nozzle 32.
A predetermined amount is continuously discharged. That is, the connection terminal group
The nozzle 31 is scanned so that the solder amount required for 11 is uniformly applied to the connection terminal 11. Next, the lamp holding member 40 is placed so that the spot light 43 of the halogen lamp 41 is positioned at one corner of the connection terminal group 11 of the electronic component 10 to which the cream solder is applied.
After the carriage 60 is moved by the carriage 60, spot light whose temperature is controlled to a predetermined temperature so that the soldering condition is satisfied is applied on the cream solder applied to the connection terminal group 11, that is, a constant shape so as to form a square shape. Move at speed. The cream solder in the portion exposed to the spotlight is melted, and the molten solder in the place where the spotlight has finished moving is sequentially solidified, whereby the electronic component 10 is mounted on the printed board 20.
＜本考案の効果＞ 以上説明したように、本考案においては先に電子部品を
導電箔群上に載置し、しかる後クリーム半田収容部材の
ノズルから吐出するクリーム半田を電子部品の接続端子
上に塗布し、この塗布したクリーム半田をランプによっ
て作られるスポット光で溶融させることにより電子部品
を印刷基板に装着するように構成したので、従来のよう
にクリーム半田の為に接続端子群に「浮き」が生じ、半
田付けの信頼性が欠けると言う問題の無い装着装置を得
ることができる。<Effects of the Present Invention> As described above, in the present invention, the electronic component is first placed on the conductive foil group, and then the cream solder discharged from the nozzle of the cream solder accommodating member is connected to the connection terminal of the electronic component. The solder paste is applied to the printed circuit board to melt the applied solder paste on the printed circuit board so that the electronic components can be mounted on the printed circuit board. It is possible to obtain a mounting device that does not have the problem that soldering reliability is lacking.
第１図は本考案に係る装着装置の一実施例の構成図で、
（イ）は正面図、（ロ）は側面図、第２図（イ）は電子
部品を，また同図（ロ）はこの電子部品が装着される印
刷基板の構成説明図である。 10…電子部品、20…印刷基板、30…クリーム半田収容
部、40…ランプ保持部、50…エアシリンダ、60…キャリ
ッジ。FIG. 1 is a block diagram of an embodiment of a mounting device according to the present invention.
2A is a front view, FIG. 2B is a side view, FIG. 2A is an electronic component, and FIG. 2B is a configuration explanatory view of a printed board on which the electronic component is mounted. 10 ... Electronic parts, 20 ... Printed circuit board, 30 ... Cream solder accommodating section, 40 ... Lamp holding section, 50 ... Air cylinder, 60 ... Carriage.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭59−64162（ＪＰ，Ａ) 特開 昭64−4095（ＪＰ，Ａ) 特開 昭63−203275（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-59-64162 (JP, A) JP-A-64-4095 (JP, A) JP-A-63-203275 (JP, A)
Claims (1)
て、Ｘ−Ｙ方向に移動可能なキャリッジに夫々取付けら
れ一端にノズルを有しクリーム半田が収容された収容部
材と加熱用のランプを保持する保持部材とを備え、前記
電子部品の接続端子を印刷基板の導電箔上に載置し、前
記クリーム半田収容部材のノズルから吐出するクリーム
半田を前記電子部品の接続端子上に塗布し、この塗布し
たクリーム半田を前記ランプによって作られるスポット
光により溶融することにより電子部品を印刷基板に装着
するように構成した電子部品の装着装置。1. When mounting an electronic component on a printed board, a holding member for holding cream solder and a holding member for holding cream solder, each of which is attached to a carriage movable in XY directions and has a nozzle at one end, are held. A holding member, the connection terminal of the electronic component is placed on the conductive foil of the printed board, the cream solder discharged from the nozzle of the cream solder housing member is applied to the connection terminal of the electronic component, and this application An electronic component mounting apparatus configured to mount the electronic component on a printed circuit board by melting the cream solder by the spot light generated by the lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008578U JPH0646613Y2 (en) | 1989-01-27 | 1989-01-27 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989008578U JPH0646613Y2 (en) | 1989-01-27 | 1989-01-27 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104175U JPH02104175U (en) | 1990-08-20 |
| JPH0646613Y2 true JPH0646613Y2 (en) | 1994-11-30 |
Family
ID=31214583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989008578U Expired - Lifetime JPH0646613Y2 (en) | 1989-01-27 | 1989-01-27 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0646613Y2 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5964162A (en) * | 1982-10-05 | 1984-04-12 | Senjiyu Kinzoku Kogyo Kk | Method and device for soldering |
| JPS63203275A (en) * | 1987-02-19 | 1988-08-23 | Matsushita Electric Ind Co Ltd | Creamy solder coating equipment |
| JPS644095A (en) * | 1987-06-26 | 1989-01-09 | Toshiba Corp | Apparatus for supplying solder to surface mounting part |
-
1989
- 1989-01-27 JP JP1989008578U patent/JPH0646613Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104175U (en) | 1990-08-20 |
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