JPS644095A - Apparatus for supplying solder to surface mounting part - Google Patents

Apparatus for supplying solder to surface mounting part

Info

Publication number
JPS644095A
JPS644095A JP62158853A JP15885387A JPS644095A JP S644095 A JPS644095 A JP S644095A JP 62158853 A JP62158853 A JP 62158853A JP 15885387 A JP15885387 A JP 15885387A JP S644095 A JPS644095 A JP S644095A
Authority
JP
Japan
Prior art keywords
substrate
degree
terminal
controlled
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62158853A
Other languages
Japanese (ja)
Inventor
Katsuhiko Kaneda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP62158853A priority Critical patent/JPS644095A/en
Publication of JPS644095A publication Critical patent/JPS644095A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To make it possible to supply a solder to the surface mounting parts on a substrate with a fixed height without damaging the circuit pattern by using a device having a noncontact detection section as the copying member, and moving it. CONSTITUTION:A cylinder 12 containing a cream solder and having a nozzle 13 attached to the terminal thereof is connected to a pressure device, and attached along with a copying device 14 to a connecting and holding device 15 which is movable in a Z-direction. The copying device 14 consists of a suction nozzle 18 placed slightly above a substrate 17 which is placed on an XY-table 16, and a suction device connected through a vacuum gauge, and the degree of proximity of the terminal of the suction nozzle 18 to the substrate 17 is detected by the degree of vacuum. And the detected degree of proximity to the substrate 17 is outputted to the connecting and holding device 15 as an electric signal, by which the movement in the Z-direction is controlled through feedback. In such supplying apparatus 19, the position of the connecting and holding device 15 in the Z-direction is controlled by the degree of vacuum of the terminal of the suction nozzle 18 in a noncontact manner with the substrate 17, and simultaneously, the heights of the cylinder 12 and the solder supply nozzle 13 are controlled to be constant.
JP62158853A 1987-06-26 1987-06-26 Apparatus for supplying solder to surface mounting part Pending JPS644095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62158853A JPS644095A (en) 1987-06-26 1987-06-26 Apparatus for supplying solder to surface mounting part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62158853A JPS644095A (en) 1987-06-26 1987-06-26 Apparatus for supplying solder to surface mounting part

Publications (1)

Publication Number Publication Date
JPS644095A true JPS644095A (en) 1989-01-09

Family

ID=15680839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62158853A Pending JPS644095A (en) 1987-06-26 1987-06-26 Apparatus for supplying solder to surface mounting part

Country Status (1)

Country Link
JP (1) JPS644095A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104175U (en) * 1989-01-27 1990-08-20
US5197652A (en) * 1989-10-23 1993-03-30 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus with lead pressing means

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02104175U (en) * 1989-01-27 1990-08-20
US5197652A (en) * 1989-10-23 1993-03-30 Kabushiki Kaisha Shinkawa Wire bonding method and apparatus with lead pressing means

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