JPS644095A - Apparatus for supplying solder to surface mounting part - Google Patents
Apparatus for supplying solder to surface mounting partInfo
- Publication number
- JPS644095A JPS644095A JP62158853A JP15885387A JPS644095A JP S644095 A JPS644095 A JP S644095A JP 62158853 A JP62158853 A JP 62158853A JP 15885387 A JP15885387 A JP 15885387A JP S644095 A JPS644095 A JP S644095A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- degree
- terminal
- controlled
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
PURPOSE:To make it possible to supply a solder to the surface mounting parts on a substrate with a fixed height without damaging the circuit pattern by using a device having a noncontact detection section as the copying member, and moving it. CONSTITUTION:A cylinder 12 containing a cream solder and having a nozzle 13 attached to the terminal thereof is connected to a pressure device, and attached along with a copying device 14 to a connecting and holding device 15 which is movable in a Z-direction. The copying device 14 consists of a suction nozzle 18 placed slightly above a substrate 17 which is placed on an XY-table 16, and a suction device connected through a vacuum gauge, and the degree of proximity of the terminal of the suction nozzle 18 to the substrate 17 is detected by the degree of vacuum. And the detected degree of proximity to the substrate 17 is outputted to the connecting and holding device 15 as an electric signal, by which the movement in the Z-direction is controlled through feedback. In such supplying apparatus 19, the position of the connecting and holding device 15 in the Z-direction is controlled by the degree of vacuum of the terminal of the suction nozzle 18 in a noncontact manner with the substrate 17, and simultaneously, the heights of the cylinder 12 and the solder supply nozzle 13 are controlled to be constant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158853A JPS644095A (en) | 1987-06-26 | 1987-06-26 | Apparatus for supplying solder to surface mounting part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62158853A JPS644095A (en) | 1987-06-26 | 1987-06-26 | Apparatus for supplying solder to surface mounting part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS644095A true JPS644095A (en) | 1989-01-09 |
Family
ID=15680839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62158853A Pending JPS644095A (en) | 1987-06-26 | 1987-06-26 | Apparatus for supplying solder to surface mounting part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS644095A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104175U (en) * | 1989-01-27 | 1990-08-20 | ||
| US5197652A (en) * | 1989-10-23 | 1993-03-30 | Kabushiki Kaisha Shinkawa | Wire bonding method and apparatus with lead pressing means |
-
1987
- 1987-06-26 JP JP62158853A patent/JPS644095A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02104175U (en) * | 1989-01-27 | 1990-08-20 | ||
| US5197652A (en) * | 1989-10-23 | 1993-03-30 | Kabushiki Kaisha Shinkawa | Wire bonding method and apparatus with lead pressing means |
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