MY109790A - Apparatus for detecting a solder wave surface. - Google Patents

Apparatus for detecting a solder wave surface.

Info

Publication number
MY109790A
MY109790A MYPI92001492A MYPI19921492A MY109790A MY 109790 A MY109790 A MY 109790A MY PI92001492 A MYPI92001492 A MY PI92001492A MY PI19921492 A MYPI19921492 A MY PI19921492A MY 109790 A MY109790 A MY 109790A
Authority
MY
Malaysia
Prior art keywords
wave surface
solder wave
detecting
solder
soldering
Prior art date
Application number
MYPI92001492A
Inventor
Morita Yasuhiro
Kiyama Kazuyuki
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of MY109790A publication Critical patent/MY109790A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

AN APPARATUS (30) FOR DETECTING A SOLDER WAVE SURFACE (11) HAS AT LEAST THREE SUBSTANTIALLY PERPENDICULAR PINS WITH A PREDETERMINED INTERVALS THEREBETWEEN SO AS TO DESPOSE LOWER POINTS (8A) OF THE PINS (8) AT POSITIONS OF A DESIGNED IDEAL WAVE SURFACE OF THE SOLDER WAVE FLOW-SOLDERING.THE APPARATUS (30) FOR DETECTING THE SOLDER WAVE SURFACE (11) IS DISPOSED ON AN APPARATUS FOR FLOW SOLDERING TO EXAMINE AND CONTROL THE SOLDER WAVE SURFACE (11). (FIG.1)
MYPI92001492A 1991-08-23 1992-08-19 Apparatus for detecting a solder wave surface. MY109790A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3212014A JPH0775775B2 (en) 1991-08-23 1991-08-23 Corrugated surface management device for jet soldering device and soldering device using the same

Publications (1)

Publication Number Publication Date
MY109790A true MY109790A (en) 1997-06-30

Family

ID=16615456

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI92001492A MY109790A (en) 1991-08-23 1992-08-19 Apparatus for detecting a solder wave surface.

Country Status (5)

Country Link
JP (1) JPH0775775B2 (en)
KR (1) KR960013706B1 (en)
CN (1) CN1043002C (en)
MY (1) MY109790A (en)
TW (1) TW221974B (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4554748B2 (en) * 1999-12-07 2010-09-29 株式会社タムラ製作所 Brazing method and apparatus
JP2003025063A (en) * 2001-07-09 2003-01-28 Nihon Dennetsu Keiki Co Ltd Soldering method and soldering device
CN102421560B (en) * 2009-05-14 2015-04-22 千住金属工业株式会社 Jet solder bath and soldering apparatus
CN101628353B (en) * 2009-08-07 2011-09-07 台达电子（东莞）有限公司 Method for detecting parameters of tinning furnace
CN102744485A (en) * 2012-07-23 2012-10-24 宝电电子(张家港)有限公司 Transformer soldering device
CH706925A1 (en) * 2012-09-10 2014-03-14 Kirsten Soldering Ag Soldering system comprises a solder pump comprising solder nozzle having wave plate for soldering components, which are mounted on printed circuit board, which is transported through soldering system in horizontal transport direction
CN104148770B (en) * 2014-09-02 2017-01-18 安徽省和翰光电科技有限公司 Clamping device for automatic tin dipping machine
CN104296791B (en) * 2014-10-08 2017-01-18 深圳市双赢伟业科技股份有限公司 Printed circuit board test probe clamping device
CN104613844B (en) 2015-02-05 2019-03-12 合肥鑫晟光电科技有限公司 Thickness measuring device
CN110167706B (en) * 2017-01-12 2021-05-25 三菱电机株式会社 Solder jet inspection device and solder jet inspection method
CN107335888B (en) * 2017-05-19 2020-08-28 深圳市阿拉玎光电自动化有限公司 Wave crest height correcting device and method for wave crest soldering
WO2019078021A1 (en) * 2017-10-18 2019-04-25 三菱電機株式会社 Soldering apparatus and soldering method
CN108465901B (en) * 2018-05-19 2024-03-12 东莞市合易自动化科技有限公司 Device and method for detecting tin wave form
JP7212286B2 (en) * 2018-07-31 2023-01-25 オムロン株式会社 Information processing device, management system, control program, and control method for information processing device
CN113091683A (en) * 2019-12-23 2021-07-09 昆山华复精密金属有限公司 Detection apparatus for product surface radian
CN111473726B (en) * 2020-05-11 2021-11-16 绍兴上虞通风机有限公司 Detection device and detection method for detecting fan blades by using standard fan blades

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6051939B2 (en) * 1981-06-02 1985-11-16 権士 近藤 Jet solder bath
JPH01104446A (en) * 1987-10-14 1989-04-21 Ishikawajima Harima Heavy Ind Co Ltd Method for starting operation of twin roll type continuous casting machine
JPH026163U (en) * 1988-06-24 1990-01-16
JPH0276663U (en) * 1988-11-25 1990-06-12
JP3070853U (en) * 2000-02-08 2000-08-15 株式会社渡辺製作所 Connection device for ISDN line

Also Published As

Publication number Publication date
KR960013706B1 (en) 1996-10-10
CN1043002C (en) 1999-04-14
CN1070306A (en) 1993-03-24
KR930004013A (en) 1993-03-22
JPH0569121A (en) 1993-03-23
TW221974B (en) 1994-04-01
JPH0775775B2 (en) 1995-08-16

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