JPH0775775B2 - Corrugated surface management device for jet soldering device and soldering device using the same - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for detecting the height of a corrugated surface of a jet solder which can be used when soldering various electronic parts to a printed wiring board, and a solder comprising the height detecting jig. The present invention relates to a mounting device.

[0002]

2. Description of the Related Art Conventionally, soldering of resistors, capacitors, jumper wires and the like to printed circuit boards for electric circuits has been automatically performed by using a jet type soldering device.

The structure and operation of a conventional soldering device of this type will be described below with reference to FIG. FIG. 4 shows a cross-sectional view of a main part of a conventional soldering device. In FIG. 4, the solder bath 20 is provided with a nozzle 21 for ejecting the molten solder 13 in a jet state in the central portion of the cross-sectional view, and a rectifying plate 22 having an adjustable angle in the vicinity of the nozzle 21 has a cantilevered support beam shape. It is installed in. Naturally, the nozzle 2
The solder 13 overflowing from 1 is circulated in a predetermined path by a discharge pump or the like having a propeller or the like. The printed wiring board 40 passes through the top of the corrugated surface 41 of the jet solder in a predetermined manner, so that various electronic components mounted on the printed wiring board 40 are soldered as desired.

[0004]

However, in the above structure, the management of the jet solder corrugated surface 41 is performed visually and is set empirically every time. Therefore, it is difficult to always stably set the optimum jet solder corrugated surface 41, and since it is not quantitatively grasped, there is no reproducibility. When many kinds of printed wiring boards 40 are switched every day, it takes time to set the optimum jet solder corrugated surface and a soldering state confirmation test, and a loss of experimental material occurs. Further, the amount of solder in the solder bath 20 decreases as the apparatus is used, and solder oxide adheres to the inner wall of the nozzle 21 to change the jet solder waveform surface due to its resistance. As a result, the soldered state of the printed wiring board 40 deteriorates and the soldering yield decreases. When the solder is replenished or the solder oxide is cleaned, the jet solder corrugated surface has to be set again, which causes a problem that setting / confirmation time and material loss occur each time.

In view of the above problems, the present invention provides a jig for detecting the height of a corrugated surface of a jet solder, and further provides a soldering apparatus which stabilizes a soldering state of a printed wiring board and realizes a high yield. .

[0006]

In order to solve the above-mentioned problems, a corrugated surface management device for a jet solder device according to the present invention discharges solder in a jet state from the upper part of the device, and at the same time jets a printed wiring board. A support frame provided on the upper part of the jet soldering device that performs soldering by passing the solder from near the top of the solder in a certain direction, and the liquid level position of the jetted solder of the jet soldering device provided on the support frame is measured. A possible pointer bolt is provided, and a plurality of pointer bolts are provided in the passing direction of the printed wiring board so that the waveform of the liquid surface of the jetted solder can be measured.

[0007]

With the above-described structure, the present invention enables short-time setting and quantitative management of the waveform surface of the jet solder without changing the external shape of the conventional soldering device. Also, the optimum jet solder corrugated surface can be grasped and recorded in advance according to the type of printed wiring board. As a result, it is possible to quickly respond to the change of the printed wiring board model, not only improve the soldering yield and the productivity of the printed wiring board, but also keep the high thermal load time for the electronic components mounted on the printed wiring board constant. A television receiver or VTR in which the quality of electronic parts is stabilized and the printed wiring board is housed in a cabinet.
It is possible to extend the life of electronic equipment such as (video tape recorder).

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings shown in FIGS. The soldering apparatus according to the embodiment of the present invention includes a jet soldering apparatus 10, a jig for detecting the height of a jet solder corrugated surface, a printed wiring board conveying conveyor (not shown), a printed wiring board preheating device (not shown), and these. It is composed of a control device (not shown) of each part.
The jet soldering device 10 has the same configuration as that shown in FIG. 4, and comprises a solder bath 20, a nozzle 21, and a device function for circulating molten solder. The nozzle 21 has an opening at the top and bottom, is located on the large diameter side below the nozzle 21 and is openably and closably arranged, and a straightening plate attached to the upper small diameter opening side of the nozzle 21 so that the angle can be adjusted. 22 is provided. The punching metal 23 has a flat plate shape, has a large number of holes through which the molten solder 13 passes, and is provided with a rotary shaft in one piece so as to be opened and closed. The molten solder 13 is in the duct 2
8 and a propeller (not shown) attached to the rotary shaft 26 and a motor (not shown) that rotationally drives the propeller, so as to recirculate the nozzle 21 in a predetermined upward direction from below.

The height detecting jig 30 for the corrugated surface 11 of the jet solder is mounted on the conveyor frame 25. The conveyor frame 25 can be easily removed by simply placing it at a predetermined position without fastening it with bolts or the like. As a matter of course, the mounting position of the height detection jig 30 is
The positioning pin and L-shaped guide plate make it easy to reproduce the mounting position. Further height detection jig 30
Has a slide base 3 on the lower surface side of the frames 1 and 2 forming a rectangle. The slide base 3 is slidable on a horizontal plane perpendicular to the direction of travel of the printed wiring board 40 and can be fixed at an arbitrary position, and is constituted by a pillar 7, a slide shaft 5, a slide base fixing screw 6, and the like.

A printed wiring board 40 is mounted on the slide base 3.
A plurality of pointer bolts 8 arranged at predetermined intervals in the advancing direction are arranged so that they can be slightly independently moved in the vertical direction, that is, toward the jet solder corrugated surface 11. In the embodiment, the pointer bolts 8 are arranged at the top portion and the end portion of the corrugated surface 11 of the jet solder and in the middle thereof.

Next, a method of soldering a printed wiring board on which various electronic parts are mounted by using the above-mentioned soldering device will be described. In this case, various desired electronic components are mounted in advance on the printed wiring board. First, a method for setting the jet solder corrugated surface 11 will be described. Printed wiring board 4 to be soldered in height detection jig 30
The height of the jet solder corrugated surface of each pointer bolt 8 (that is, the protruding dimension of the pointer bolt 8 from the lower surface of the slide table 3) of each pointer bolt 8 obtained in the preliminary experiment according to 0 is set at each of three positions, and the nut 9 is used to guide the pointer bolt Fix 8 Next, the height detection jig 30 of the wave solder wave corrugated surface in which the pointer bolt 8 is set to a predetermined value is arranged at a predetermined position above the jet soldering device 10. After that, the drive motor of the solder recirculation device is set to a predetermined rotation speed, and the jet solder corrugated surface 11 in that case is observed from the side surface of the soldering device. In order to draw the best jet solder waveform curve such that the jet solder waveform surface 11 contacts the tips of the pointer bolts 8 set at three locations, the slide base 3 is slid by a predetermined amount in the horizontal direction, and again the jet solder waveform surface is drawn. And confirm whether or not the desired jet solder waveform curve can be set. However, if the jet solder waveform deviates above or below the ideal curve as shown by the alternate long and short dash line in FIG. 2, the straightening vane 22 is angle-adjusted via the straightening vane angle adjusting bolt 24, and the amount of solder is adjusted. The target jet solder corrugated surface 11 is set by adjusting the number of revolutions of the propeller shaft in accordance with the degree. If necessary, the above-mentioned jet solder waveform confirmation operation is repeated at predetermined intervals in the horizontal direction, and by confirming that the jet solder waveform surface 11 is a predetermined curve over the entire width direction of the printed wiring board 40, the jet solder waveform surface advance Management and preparation are complete.

Next, as described above, the printed wiring board 40 is sequentially conveyed by the conveyor while the jet solder corrugated surface 11 is set to the optimum waveform, so that the printed wiring board 40 is melted for a predetermined predetermined time. It is dipped to obtain a stable soldering condition of quality.

In the above embodiment, the pointer bolts 8 are set before the height detecting jig 30 is mounted on the soldering device, but the height detecting jig 30 is set on the soldering device. It goes without saying that it may be carried out after mounting on.

As described above, the soldering apparatus of the present invention is provided with a jig for detecting the height of the jet solder corrugated surface using a pointer bolt having a low cost and a simple structure, and manages the best jet solder corrugated surface.
It is something to maintain.

[0015]

As described above, the soldering apparatus of the present invention not only stabilizes the quality, improves the yield, and improves the productivity, but also can easily switch the model of the printed wiring board, so that a variety of products can be manufactured. Many effects can be obtained, such as being able to handle small-scale production.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part of a soldering device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of a main part from a side view of FIG. 1 viewed from the direction of cutting lines S1 to S1.

3 is a perspective view of a solder recirculation device and a nozzle that constitute the soldering device of FIG.

FIG. 4 is a sectional view of a main part of a conventional soldering device.

[Explanation of symbols]

 1, 2 frame 3 slide base 4 bearing 5 slide shaft 6 slide base fixing screw 7 post 8 pointer bolt 9 nut 10 jet soldering device 11 jet solder waveform surface 12 jet solder waveform section 13 solder 20 solder bath 21 nozzle 22 straightening plate 23 Punching metal 25 Conveyor frame 26 Rotating shaft 27 Bearing 28 Duct 29 Opening 30 Height detection jig 40 Printed wiring board

Claims (3)

[Claims] 1. A support provided on an upper portion of a jet soldering device for soldering by ejecting solder from the upper part of the device in a jet state and passing the printed wiring board from near the top of the solder in the jet state in a certain direction. A frame and a pointer bolt provided on the support frame and capable of measuring the liquid surface position of the jetted solder of the jet soldering device, so that the waveform of the liquid surface of the jetted solder can be measured. A corrugated surface management device for a jet soldering device, in which a plurality of wiring soldering devices are provided in the passing direction of a printed wiring board. 2. The corrugated surface management device for a jet soldering device according to claim 1, wherein the pointer bolt is movable in a direction orthogonal to the passing direction of the printed wiring board. 3. A soldering device comprising the corrugated surface management device of the jet soldering device according to claim 1 or 2, and the jetting soldering device.