JPH026163U - - Google Patents
Info
- Publication number
- JPH026163U JPH026163U JP8292688U JP8292688U JPH026163U JP H026163 U JPH026163 U JP H026163U JP 8292688 U JP8292688 U JP 8292688U JP 8292688 U JP8292688 U JP 8292688U JP H026163 U JPH026163 U JP H026163U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- measuring device
- caliper
- wave height
- height measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 230000005611 electricity Effects 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の噴流はんだ槽の波高測定装置
の斜視図、第２図は本考案装置を噴流はんだ槽の
上方に設置した使用状態を示す斜視図、第３図は
第２図Ａ―Ａ線断面図である。
１，１′……ブロツク、２……摺動レール、３
……保持体、４……ノギス、５……乾電池、６…
…通電表示部品（ブザー）、９……噴流はんだ、
１０……噴流はんだ槽。
Fig. 1 is a perspective view of the wave height measuring device for a jet solder tank according to the present invention, Fig. 2 is a perspective view showing the device of the present invention installed above the jet solder tank in use, and Fig. 3 is Fig. 2A- It is an A-line sectional view. 1, 1'...Block, 2...Sliding rail, 3
... Holding body, 4 ... Caliper, 5 ... Dry battery, 6 ...
...Electricity display component (buzzer), 9...Jet solder,
10...Jet solder bath.
Claims (1)
スを保持するとともに、ノギス先端が噴流してい
る溶融はんだに接触した時に通電表示部品が表示
状態となる回路を形成したことを特徴とする、噴
流はんだ槽の波高測定装置。 (2) 前記通電表示部品は、ブザー、ベル、電球
等であることを特徴とする実用新案登録請求の範
囲第(1)項記載の、噴流はんだ槽の波高測定装置
。[Scope of Claim for Utility Model Registration] (1) A circuit in which a caliper is held by a holder that slides along a vibrating rail, and an energized display component enters a display state when the tip of the caliper comes into contact with a jet of molten solder. A wave height measuring device for a jet solder bath, characterized in that (2) The wave height measuring device for a jet solder bath according to claim (1), wherein the energization display component is a buzzer, a bell, a light bulb, or the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8292688U JPH026163U (en) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8292688U JPH026163U (en) | 1988-06-24 | 1988-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH026163U true JPH026163U (en) | 1990-01-16 |
Family
ID=31307661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8292688U Pending JPH026163U (en) | 1988-06-24 | 1988-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH026163U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569121A (en) * | 1991-08-23 | 1993-03-23 | Matsushita Electric Ind Co Ltd | Method for controlling wave solder waveform surface, controlling jig and soldering device |
| KR100271144B1 (en) * | 1997-03-04 | 2001-01-15 | 윤종용 | Auto Measurement Device for Lead-Flow Height of A Soldering Iron |
| CN102421560A (en) * | 2009-05-14 | 2012-04-18 | 千住金属工业株式会社 | Jet solder bath and soldering apparatus |
| WO2013111651A1 (en) * | 2012-01-25 | 2013-08-01 | 千住金属工業株式会社 | Jet soldering height checking jig and method for handling same |
| JP6197942B1 (en) * | 2016-12-28 | 2017-09-20 | 千住金属工業株式会社 | Jet solder height confirmation jig and its handling method |
| WO2019107349A1 (en) * | 2017-11-29 | 2019-06-06 | 千住金属工業株式会社 | Tool for confirming jetting solder height, and method for handling said tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195768A (en) * | 1984-10-17 | 1986-05-14 | Kojima Press Co Ltd | Method for adjusting ejection height of solder in solder tank |
-
1988
- 1988-06-24 JP JP8292688U patent/JPH026163U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6195768A (en) * | 1984-10-17 | 1986-05-14 | Kojima Press Co Ltd | Method for adjusting ejection height of solder in solder tank |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569121A (en) * | 1991-08-23 | 1993-03-23 | Matsushita Electric Ind Co Ltd | Method for controlling wave solder waveform surface, controlling jig and soldering device |
| KR100271144B1 (en) * | 1997-03-04 | 2001-01-15 | 윤종용 | Auto Measurement Device for Lead-Flow Height of A Soldering Iron |
| CN102421560A (en) * | 2009-05-14 | 2012-04-18 | 千住金属工业株式会社 | Jet solder bath and soldering apparatus |
| CN102421560B (en) * | 2009-05-14 | 2015-04-22 | 千住金属工业株式会社 | Jet solder bath and soldering apparatus |
| WO2013111651A1 (en) * | 2012-01-25 | 2013-08-01 | 千住金属工業株式会社 | Jet soldering height checking jig and method for handling same |
| JP2013151004A (en) * | 2012-01-25 | 2013-08-08 | Senju Metal Ind Co Ltd | Jet soldering height checking jig and method for handling same |
| JP6197942B1 (en) * | 2016-12-28 | 2017-09-20 | 千住金属工業株式会社 | Jet solder height confirmation jig and its handling method |
| WO2018123261A1 (en) * | 2016-12-28 | 2018-07-05 | 千住金属工業株式会社 | Jet solder height confirmation jig and method for handling same |
| WO2019107349A1 (en) * | 2017-11-29 | 2019-06-06 | 千住金属工業株式会社 | Tool for confirming jetting solder height, and method for handling said tool |
| US10894294B2 (en) | 2017-11-29 | 2021-01-19 | Senju Metal Industry Co., Ltd. | Jet solder level confirmation jig and method of handling the same |
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