KR100271144B1 - Auto Measurement Device for Lead-Flow Height of A Soldering Iron - Google Patents

Abstract

PURPOSE: An apparatus for automatically measuring a flow height of a soldering machine is provided to enable a measuring to be made by a visual display, prevent wrong operation of electronic devices due to over-contact of lead, etc. CONSTITUTION: A horizontal support member(300) is mounted on a pair of conveyer belts that are installed on an upper part of an automatic soldering machine in a length direction with a predetermined interval to be carried. A scale display member(301) has a rectangular shape of a predetermined length and is downwardly coupled with a central part of the horizontal support member(300). An elevating part(302) is coupled with the scale display member(301) to freely move up and down, electrically contacted with a surface of lead on an end part thereof, and displays lead flow height through scale of the scale display member(301). An operation display part(307) visually displays whether lead flow is excessive, short, good, etc., by selectively receiving voltage of a condenser, and enables a driver to selectively determine a lead flow measurement mode. A fixing member couples the elevating part(302) to the scale display member(301) with screws to maintain a position of the scale determined by display of the operation display part(307) and a position of the scale of the elevating part.

Description

Automatic Measurement Device for Lead-Flow Height of A Soldering Iron

The present invention relates to a soldering process of a printed circuit board (PCB) assembly of an electronic product, and more particularly, when soldering a printed circuit board assembly with an automatic soldering machine, the lead flow height of a solder bath is best for soldering. The present invention relates to an automatic device for measuring the lead flow height of a soldering machine, which automatically measures and visually displays a point, and continuously maintains the measured optimum point to stabilize soldering quality.

In general, various electronic products have a printed circuit board assembly in which various parts are soldered, and the components are inserted into the printed circuit board according to the production automation of the product and soldered to the automatic soldering machine through an automatic soldering process.

1 is a perspective view of a general automatic soldering machine as described above, and FIG. 2 is a side view of a solder bath showing a state in which soldering is automatically performed on a printed circuit board through the automatic soldering machine of FIG. 1.

1 and 2, a pair of conveyor belts 103 which are installed in the longitudinal direction on the automatic soldering machine and are transported while maintaining a constant interval, and are mounted on the conveyor belts 103 to be horizontally conveyed and various parts A flux 100 provided at the front end of the inserted printed circuit board 104 and the automatic soldering machine to be easily soldered to the bottom surface of the printed circuit board 104 which is horizontally transported by the conveyor belt 103; Soldering is performed by heating the printed circuit board 104, which is installed at the rear of the flux 100 based on the direction in which the pair of conveyor belts 103 are conveyed, and which is transferred through the conveyor belts 103, to a predetermined temperature. Pneumatic heater 101 for easily melting the flux 100 and the bottom surface of the printed circuit board 104 which is installed at the rear end of the automatic soldering machine and sequentially transferred through the conveyor belt 103 by the pneumatic It consists of a lead bath 102 for soldering lead contact.

As shown in FIG. 2, the tub 102 generates pneumatic pressure by rotation of an impeller driven by a motor (not shown) to flow molten lead to the surface of the tub through the duct 105. have.

As described above, in order to solder the various parts inserted into the printed circuit board 104 through the automatic soldering machine through the automatic soldering process, a pair of conveyor belts 103 are installed in the longitudinal direction at the top of the automatic soldering machine at regular intervals. When the printed circuit board 104 having various components (elements) inserted thereon is driven and the conveyor belt 103 is driven, the printed circuit board 104 is moved to the right side with reference to FIG. 1 together with the conveyor belt 103. Will be transferred to.

As such, when the printed circuit board 104 is transported by the conveyor belt 103 and comes to the flux 100 position of the automatic soldering machine, the flux 100 is contacted and applied to the bottom surface of the printed circuit board 104.

At this time, as is well known, the flux 100 is applied in a thick or agglomerated state without being thinly and evenly applied to the bottom surface of the printed circuit board 104, that is, the entire surface of the copper plate.

Therefore, when the printed circuit board 104 coated with the flux 100 is continuously transferred by the conveyor 103 and passes through the preheating heater 101 of the automatic soldering machine, the flux (heating) of the preheating heater 101 is heated. As the 100 is melted, the coating is made thin and evenly over the entire copper plate of the printed circuit board 104.

Subsequently, soldering is performed while the printed circuit board 104 assembly passes through the solder bath 102 of the automatic soldering machine. At this time, the impeller driven by the motor installed in the solder bath 102 rotates to melt the air. Lead is continuously ejected through the duct 105.

The molten lead through the duct 105 is brought into contact with the printed circuit board 104 assembly, as shown in FIG.

However, the soldering state of the printed circuit board 104 assembly may be improved according to the lead flow height H of the bath tub 102, that is, the height A from the surface of the bath tub 102 to the surface of the lead. It can go bad.

If the height adjustment of the lead flow is poor, many defects occur due to insufficient soldering or excessive soldering due to insufficient soldering or excessive soldering.

For this purpose, in order to keep the lead flow height of the lead tank 102 in the best state, the lead flow height H should be accurately measured and set.

In the general automatic soldering machine as described above, there is a device as shown in FIG. 3 as a lead flow height measuring device of a solder bath to solve the problems caused by insufficient soldering and excessive soldering.

The apparatus shown in FIG. 3 is described as an example of an apparatus for measuring lead flow height in a conventional automatic soldering machine.

The lead flow height measuring device of the lead bath measures the height of the lead flow using a common steel ruler.

In other words, in the conventional method of measuring the lead flow height of the lead bath 202 by pneumatic pressure in an automatic soldering machine, as shown in FIG. Into the lead, the surface of the lead tank 202 and the surface of the lead are visually measured through the scale of the steel ruler 200, and appropriately adjusted according to the lead flow height of the measured lead tank 202 to the conveyor 201. This solders the assembly of the printed circuit board through the flux and the preheater.

However, in the conventional automatic soldering machine as described above, the lead flow height measuring apparatus of the lead bath, as mentioned above, was difficult to measure the height of the lead flow because the lead in the bath continues to flow, and there was a visual error depending on the operator to measure. There was a difficulty in selecting the correct lead flow height.

That is, as noted above, in order to measure the lead flow height of the solder bath where soldering is best, it is difficult to find the best height of the bath due to the measurement error because it must first be read visually using a steel ruler.

In addition, since the inside of the automatic soldering machine is cramped, it is difficult to obtain accurate reference values of measurement and lead flow because it is necessary to read the scale while the steel is put in the lead bath and bowed.

Accordingly, the present invention excludes a difficult method in which the operator has to measure with the naked eye by using a steel ruler of the lead flow height device of the soldering machine in the above-described prior art, and in one aspect of the present invention, soldering to a printed circuit board assembly is performed. It is an object of the present invention to provide an automatic device for measuring the height of lead flow of a soldering machine so that the best point of the best lead flow height can be checked by visual indication without reading through a scale.

In another aspect of the present invention, the purpose of the present invention is to stably maintain the soldering quality of a printed circuit board assembly, thereby preventing malfunction of electronic products due to excessive contact of lead or non-lead.

Another aspect of the present invention is to measure the lead flow height measurement of the lead bath in parallel with the means for measuring through a scale and the means for measuring by visual indication.

In another aspect of the present invention, the position of the optimum point measured by the scale display or the optimum point measured by the time display is continuously maintained so as to be selected as a reference value in the measurement of the lead flow height afterwards. .

As another aspect of the present invention, the purpose of the present invention is to visually display the shortage and excess state of soldering to the operator when the lead flow height measurement to adjust the lead flow height of the most optimal state.

1 is a perspective view showing a typical automatic soldering machine.

FIG. 2 is a side view of a solder bath showing a state in which soldering is automatically performed on a printed circuit board through the automatic soldering machine of FIG. 1.

Figure 3 is a view showing a lead flow height measuring apparatus of a conventional solder bath in a typical automatic soldering machine.

Figure 4 is a perspective view showing the lead flow height automatic measuring device of the solder tank in the present invention automatic soldering machine.

5 is a view showing in more detail the lead flow automatic measurement circuit of the solder tank mounted to the horizontal support member of FIG.

6 is an explanatory view showing a state in which the lead flow height is measured in an automatic soldering machine through the lead flow height measurement apparatus of FIGS. 4 and 5;

<Description of the symbols for the main parts of the drawings>

300: horizontal support member 301: scale display member

302: east of Shanghai 302a: contacted member

302b: contact member 302d: first meter reading member

302e: second meter reading member 303: fixing member

304: Conveyor Belt 305: Lead Tank

306: lead 307: operation display unit

An apparatus for automatically measuring lead height of a soldering machine according to an aspect of the present invention for achieving the above objects includes applying a flux to a printed circuit board assembly carried by a pair of conveyor belts having a predetermined interval, and preheating a heater and a bath. An automatic soldering machine which sequentially carries out a heating and soldering process through a horizontal support means, comprising: horizontal support means having a predetermined length mounted on the pair of conveyor belts; Scale display means vertically coupled downward in the center of the horizontal support means and engraved on a front surface in a predetermined unit in a longitudinal direction; It has a different length with respect to the lead tank and the vertical movement is freely coupled to the scale display means to be in electrical contact and contact with the lead surface of the lead bath, and the height of the lead flow due to the contact and contact Shanghai East Sudan to direct through; Operation display means mounted to the horizontal support means to visually display the state of the lead flow by the electrical signal according to the contact and contact of the moving means and to selectively determine the lead flow measurement mode of the scale and visual display ; And fixing means for fixing the shank movement means to the scale display means to maintain the position determined by the scale indicating means and the display of the operation display means.

In the device for automatically measuring the lead flow height of the soldering machine according to the present invention, the shank movement means includes: a contact member having a guide hole formed at the center for indicating a scale while moving up and down with the scale display means as an axis; A contact member formed on the bottom surface of the contacted member in a lengthwise direction with a scale display means and having a lower end portion inserted into a lead of a tub in accordance with vertical movement of the contacted member; And one end having a step by a predetermined length from each other and spaced apart from the contact member in the lengthwise direction to be coupled to the bottom surface of the contacted member, wherein the step is electrically contacted and avoided by the lead surface of the tub according to the vertical movement of the contacted member. It is preferable that the first and second metering members have a predetermined length in contact with each other.

In the automatic device for measuring the lead flow height of the soldering machine according to the present invention, it is preferable that one end of the first and second metering members is shorter than the length of the contact member.

In the apparatus for automatically measuring the lead flow height of the soldering machine according to the present invention, it is preferable that the lengths of the first and second metering members have different lengths based on the lead flow surface.

An apparatus for automatically measuring a lead flow height of a soldering machine according to the present invention, wherein the operation display means includes: an intermittent member attached to an upper surface of the horizontal support means to control an input electrical signal; And it is located in place of the horizontal support means to selectively turn on and off by the electrical signal input from the intermittent member as the stepped portion of the moving means contact and contact with the lead flow surface to measure and confirm the state of lead flow It is preferable that the main body consists of the first and second display elements.

As a result, when the horizontal support means is placed on the conveyor belt on the solder tank of the soldering machine, and the movable means is freely moved up and down by the action of the fixing means, the lead flow height of the solder tank is adjusted to the optimum point. In this case, any one of the second display elements set to the optimum condition turns on to indicate the optimum point, and at the optimum point position, the fixed moving means is fixed to the shank east means to maintain the optimum point of lead flow. have.

Therefore, it is possible to check and measure the optimum point of the lead flow height that is best soldered to the printed circuit board assembly by visual indication, and also to conveniently measure the lead flow height of the lead bath by the scale and the visual indication. There is an advantage provided.

And, there may be a plurality of embodiments of the present invention, hereinafter will be described in detail for the preferred embodiment. Through this preferred embodiment, it is possible to better understand the objects, features and advantages of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail through a preferred embodiment of the automatic device for measuring the lead flow height of the soldering machine according to the present invention.

4 is a perspective view showing the lead flow height automatic measuring device of the lead bath in the automatic soldering machine of the present invention, Figure 5 is a view showing in more detail the lead flow automatic measurement circuit of the lead bath attached to the horizontal support member of FIG. 6 is an explanatory view showing a state of automatically measuring the lead flow height in the automatic soldering machine through the lead flow height automatic measurement apparatus of FIGS.

According to the present embodiment, a horizontal support member 300 mounted on a pair of conveyor belts 304 installed and transported in the longitudinal direction at regular intervals on the upper part of the automatic soldering machine, and the horizontal support member 300 Vertically coupled downwardly in the center portion, the front and rear movements are freely coupled to the rectangular display member 301 having a predetermined length engraved in millimeters (mm) and the rectangular display member 301 in the front One end portion is electrically contacted and contacted with the surface of the lead 306 of the lead tank 305, and due to the contact and the contacted, the east and east parts 302 which indicate the height of the lead flow through the scale of the graduation display member 301. And, it is mounted in place of the horizontal support member 300 to selectively input the voltage of the battery 308 in accordance with the contact and the contact of the shanghai East 302 to visualize the excess, insufficient state and good state of the lead flow On the operation display unit 307 to selectively determine the lead flow measurement mode of the scale and visual display, the position point of the scale indicated by the shanghai east 302 and the display of the operation display unit 307. In order to maintain the position of the scale determined by the shangdongbu 302 is composed of a fixing member 303 for screwing and fixing to the scale display member 301.

In the above, the shanghai eastern part 302 has a constant length and height, and the rectangular contact member having a guide hole 302c formed at the center for indicating the scale by moving the rectangular mark display member 301 up and down on the axis. 302a and the bottom surface of the contacted member 302a are formed in the longitudinal direction with the scale display member 301, and the lower end portion of the lead 306 of the tub 305 is moved up and down by the contacted member 302a. The contact member 302b, which is a conductor having a predetermined length inserted into the predetermined depth therein, and one end thereof has a step by a predetermined length, and is spaced apart from the contact member 302b in the longitudinal direction to the bottom surface of the contacted member 302a. The other end is inserted and coupled, the first and second meter reading member is a conductor having a predetermined length that the step is electrically selected and contacted with the lead surface of the lead tank 305 in accordance with the vertical movement of the contact member 302a 302d and 302e.

In addition, the manipulation display unit 307 is mounted on the upper surface of the horizontal support member 300 to control the voltage of the storage battery 308 and the upper surface of the horizontal support member 300. Is attached to the first and second meter reading members 302d and 302e through wirings L1 and L2 so that the first and second meter reading members 302d and 302e have a lead flow surface. The first and second display elements 307b and 307c selectively turn on and off by the voltage of the storage battery 308 selected and input by the intermittent member 307a as they are in contact with and in contact with each other.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying FIGS. 4 to 6.

The apparatus for automatically measuring the lead flow height of the soldering machine of the present invention uses the scale display member 301 and the shanghai eastern portion 302 to measure the lead flow height of the lead bath 305 by reading the scale and to operate it. It is possible to measure and confirm the lead flow height through the first and second display elements 307b and 307c of the display unit 307 and the first and second metering members 302d and 302e of the shanghai eastern part 302. It is divided into the second embodiment.

First, the process of measuring the flow height of the lead 306 of the lead bath 305 through the first embodiment of the automatic device for measuring the lead flow height of the soldering machine of the present invention, the operator to the horizontal support member 300 of the automatic soldering machine A bolt that is mounted on the pair of conveyor belts 304 which is located on the upper part of the tub 305 and is fixed as shown in FIG. 6 to fix the contacted member 302a and the graduation display member 301 of the east-east 302 of Shanghai. When the fixing member 303 is released, the contact member 302a through which the guide hole 302c penetrates at the center and the contact member 302b and the first and second conductors having a predetermined length on the bottom surface thereof. The metering members 302d and 302e move freely up and down with the axis of the rectangular scale display member 301 as the axis.

As such, the contact member 302b and the first and second meter reading members 302d and 302e of the conductor are moved up and down through the contacted member 302a of the shanghai eastern portion 302 of the contact member 302b. As shown in FIG. 6, the tip is inserted into the lead 306 of the lead bath 305 to a predetermined depth, and as shown in FIG. 4, the scale of the graduation display member 301 indicated by the contacted member 302a is measured. . Of course, the intermittent member 307a of the operation display unit 307 to be described later is left in an open (OFF) state.

If it is determined that the value measured above is the most suitable point for soldering, the fixing member 303, such as the bolt, is rotated in the opposite direction to the above to fix the contacted member 302a to the graduation display member 301 and print. It maintains the optimum point (reference point) that is most suitable for soldering the circuit board assembly.

As such, if the reference point is secured, the lead flow height is precisely set by pneumatic pressure according to the motor and the impeller located in the lower part of the tub 305 according to the lead flow height of the tub 305 without moving and adjusting the Shanghai East 302 up and down. It can be adjusted to fit the reference point.

And, the process of measuring the lead flow height of the lead bath 305 through the second embodiment of the present invention described above, as in the first embodiment, the automatic lead flow height measuring apparatus of the present invention is a conveyor belt ( When placed on 304, the contact member 302b of the east-east shanghai 302 is inserted into the lead of the solder tank 305 to a predetermined depth, and the first and second meter reading members 302d and 302e of the solder tank 305 Depending on the lead 306 flow height, it may or may not be in electrical contact with the contact member 302b through the lead 306.

In this case, as shown in FIG. 5, the first and second meter reading members 302d and 302e are shorter than the length of the contact member 302b, and the first meter reading member 302d is smaller than the second meter reading member 302e. It is long.

In other words, the first metering member 302d is short by a predetermined height (H2: 0.5mm) from the end of the contact member 302b with respect to the lead surface of the lead tank 305, and the second metering member 302e is It is short by the predetermined height (H1: 0.5 mm) from the end of the first meter reading member 302d.

As a result, the second meter reading member 302e is set to be about 1 mm shorter than the contact member 302b.

This refers to the thickness of the printed circuit board to be soldered and the optimum point at the time of soldering the assembly of the printed circuit board with reference to the lead surface of the lead bath 305 from the conveyor belt 304.

Here, the case where the end of the first metering member 302d is set as the most optimal point (reference point) for soldering a state in which the end of the first metering member 302d contacts the surface of the lead 306 of the tub 305 is referred to as the second metering member 302e. It is assumed that the case where the end portion of the contact surface of the lead 306 is set to be excessively overflowed.

In addition, it is assumed that the contacted member 302a is fixed to the scale display member 301 by the fixing member 303 according to the optimum point and the excessive position point setting.

In this state in which the optimum point and the overflow overflow are set, the operator operates the intermittent member 307a of the operation display unit 307 mounted on the upper surface of the horizontal support member 300 to measure the height of the lead flow. When the movable terminal a is switched to the fixed terminal b side, the first and second display elements 307b and 307c are connected to the first and second meter reading members 302d and 302e and the solder pot ( On or off depending on whether or not the contact with the lead 306 of the 305, it is to visually indicate whether the lead flow height is normal or bad.

That is, when the first metering member 302d, which is the conductor, comes into contact with the surface of the lead 306, the lead 306 is electrically contacted with the contact member 302b of the shanghai eastern part 302, which is the conductor. A closed circuit is made.

When the closed circuit is made as described above, the power supplied from the storage battery 308 is connected to the movable terminal a, the fixed terminal b, the resistor R2, and the first display element 307b of the intermittent member 307a. The first display element 307b described above is turned on to turn on the lead 306 of the lead bath 305 because the first display element 302d and the contact member 302b are connected to the ground through the first metering member 302d and the contact member 302b. The operator will be informed of the optimum flow height. Of course, at this time, the second display element 307c is turned off according to the non-contact between the second meter reading element 302e and the lead 306.

If the first display element 307b is turned off while the movable terminal a of the intermittent member 307a is switched to the fixed terminal b side, the lead 306 of the lead bath 305 is turned off. Since the first probe member 302d does not come into contact with the lead flow surface of the lead tank 305 due to insufficient flow, the worker judges that the soldering is insufficient and causes the lead flow of the lead tank 305 by pneumatic pressure by the motor and the impeller. By adjusting, the surface of lead is adjusted to be in contact with the end portion of the first metering member 302d described above.

Further, in the above state, the first display element 307b and the second display element 307c are in a state in which the intermittent member 307a of the operation display unit 307 is switched to the fixed terminal b side thereof. At the same time, since the lead flow of the lead tank 305 is excessive at this time, the surface of the lead 306 is brought into contact with the end of the first metering member 302d as well as the end of the second metering member 302e. As is well known, the power supply of the storage battery 308 is connected to the intermittent members 307a, the resistors R1, R2, the first and second display elements 307b, 307c, and the wirings L1, L2. Since the closed circuit is bypassed by the lead of the lead bath 305 through the connected first and second meter reading members 302d and 302e, two first and second display elements 307b and 307c are formed. ) Lights up at the same time.

As such, when the first and second display elements 307b and 307c are turned on at the same time, the operator determines that the solder is excessive and adjusts the motor and the impeller to lower the height of the lead flow.

In this way, in order to measure the flow height of the lead 306 of the lead bath 305 again through the automatic device for measuring the lead flow height of the soldering machine again in the state where the optimum point is determined, the operator moves the conveyor belt to the horizontal support member 300 described above. When placed on the 304, the defective and good condition is visually displayed by the contact with the first and second meter reading members 302d and 302e and the non-contact with the lead flow of the lead bath 305.

As such, the lead flow height of the lead bath 305 may be measured through the first embodiment, or the lead flow height of the lead bath 305 may be measured through the second embodiment.

However, while the first embodiment described above needs to measure through a scale outside the automatic soldering machine when measuring the lead flow of the lead bath 305, in the second embodiment, the first and second display elements 307b are used. ), There is an advantage that can be measured by visual display by lighting of 307c.

As a result, the first embodiment is sufficient to cure the problem of the method of measuring the lead flow height according to the method as shown in FIG. 3 presented in the prior art, but the lead flow height in the automatic soldering machine should be read through the scale of the graduation display member 301. On the other hand, according to the second embodiment, the operator can immediately check the good and bad states of the lead flow height by turning off or turning off the first and second display elements 307b and 307c while performing other tasks. It has

As described above, the present invention makes the measurement method very easy by measuring by a scale or visual indication outside the automatic soldering machine without bowing the height of the lead flow flowing in the solder tank 305, and furthermore, in the first embodiment, As the position of the optimum point measured by the scale display or the position of the optimum point measured by the time display of the second embodiment is continuously maintained, it is selected as a reference value in the measurement of the lead flow height, so that the measurement time becomes very fast. Able to know.

As described above, in the present embodiment, the optimum point of the lead flow height that is best soldered to the printed circuit board assembly can be checked and measured by visual display, and the lead flow height of the lead bath 305 is displayed in scale and time. Measurement by the intermittent member 307a of the operation display unit 307 can be measured in parallel, so that when soldering the printed circuit board assembly, the soldering quality is stably maintained to prevent malfunction of the electronic product.

In addition, although specific embodiments of the present invention have been described and illustrated above, it is obvious that the present invention may be variously modified and implemented by those skilled in the art.

Such modified embodiments should not be individually understood from the technical spirit or the prospect of the present invention, and such modified embodiments should fall within the appended claims of the present invention.

According to the present invention, the solder flow in the automatic soldering process can be optimally set to the optimum height of the solder flow, and the soldering quality of the printed circuit board assembly can be stably maintained when soldering the printed circuit board assembly. This prevents errors in the operation of the electronics due to excessive lead contact or non-lead, while providing the convenience of confirming the lead flow height of the lead bath by a scale or visual indication outside the automatic soldering machine. There is an effect that can be measured.

Claims (4)

In an automatic soldering machine which applies flux to a printed circuit board assembly carried by a pair of conveyor belts at regular intervals, and sequentially performs heating and soldering processes through a preheating heater and a lead bath, Horizontal support means having a predetermined length mounted on the pair of conveyor belts; Graduation display means vertically coupled downward to a central portion of the horizontal support means; A contact member which has a constant height and length and freely moves up and down with the scale display means as an axis; A contact member which is formed on the bottom surface of the contacted member in the longitudinal direction with a scale display means and is inserted into the lead of the solder tank at a predetermined depth according to the vertical movement of the contacted member; The lead surface of the lead bath has a different length with respect to the lead bath and is coupled to the bottom of the contacted member spaced apart from the contact member in the longitudinal direction, and has a different length according to the vertical movement of the contacted member. First and second meter reading members having a predetermined length in electrical contact and tooth contact therewith; And Automatically mounted lead flow height of the soldering machine comprising an operation display means attached to the horizontal support means for measuring and confirming the state of the lead flow by the electrical signal according to the contact and contact of the first and second meter reading member Measuring device. The method of claim 1, wherein the operation display means, An intermittent member attached to an upper surface of the horizontal support means to control an input electrical signal; As the stepped portion of the horizontal moving means is in contact with the lead flow surface and is in contact with the lead flow surface, the point flow is selectively turned off and turned off by the electrical signal input from the intermittent member to measure and confirm the state of the lead flow. An apparatus for automatically measuring the lead flow height of a soldering machine, wherein the main portion is composed of first and second display elements. The apparatus of claim 1, wherein the lengths of the first and second metering members are different from each other based on a lead tank and are shorter than the length of the contact member. 4. The apparatus of claim 3, wherein the first metering member is 0.5 mm shorter than the contact member and 0.5 mm longer than the second metering member based on the lead tank.

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