JP2002261134A - Marking apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a marking apparatus where the distance between a wafer surface and a core or a pot tip can be adjusted so as to be constant for each adjustment of the apparatus. SOLUTION: In a marker 2, when ink in the inkpot is jetted, the core 11 projects outside the pot tip 12. By bringing the projecting core into contact with the surface of a semiconductor wafer 8, the position at which the core starts contact is electrically measured by a measuring apparatus 9, and thus the contact starting position of the core can be obtained. Further, by vertically moving the wafer surface or a marker installation position by a fixed quantity from the position, the distance between the core and the wafer surface can be adjusted so as to be constant.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a marking device for marking a specific portion of a semiconductor wafer.

[0002]

2. Description of the Related Art Electrical measurement is performed on circuits of a large number of semiconductor elements formed on a semiconductor wafer. As a result, defective products and good products are determined, and bad products are marked with bad marks by a marking device provided with a marker. In the next step, by recognizing the bad mark, a non-defective product and a defective product can be determined, and only the non-defective product can be assembled. Conventionally, when a bad mark is formed on a wafer with this marker, a marker having a structure as shown in FIG. 1 and a marking device having a block diagram as shown in FIG. 2 have been used.

FIG. 1 shows a conventional example of the above-described marking apparatus.
This will be described with reference to FIG. First, the marking device 1
As shown in FIG. 1, a marker 2 connected to a control device 3 which is a control unit of a marking device, a chuck 5 having a vacuum hole 4 for fixing a semiconductor wafer, and a vacuum device 6 for performing the vacuum, It is constituted by a stage drive section 7 for driving the chuck.

As shown in FIG. 2, the marker 2 has an ink fountain 11 for storing marking ink,
A tubular tub tip 12 inserted at the lower center of the ink fountain 11, a core 13 for pushing out the ink stored in the ink fountain 11 through the tubular tub tip 12, and a shaft 14 connected to the core 13 , A marker mounting portion 16 that supports the marker 1 and moves up and down, a screw 19 that can adjust the position of the marker mounting portion 16 in the vertical direction, and receives the screw 19 to replace the marker. It is composed of a supporting body 20 for supporting.
In addition, in order to adjust the vertical position of the marker for making a bad mark by the above-mentioned marking device in which a current for driving the plunger-type solenoid 15 is supplied from the control device 3 to the marker 2 from FIG. First, the semiconductor wafer 8 is placed on the chuck 5, and the vacuum device 6 sucks the semiconductor wafer 8 through the vacuum hole 4 to fix the semiconductor wafer 8. The control device 3 sends a signal to the chuck driving unit 7 in response to the bad mark attachment instruction. In response, the chuck driving unit 7 moves the semiconductor wafer 8 to an arbitrary position for making a bad mark. The marker 2 applies a current for driving the plunger type solenoid 15 of the control device 3 to move the center 13 connected to the shaft 14 downward. The core 13 pushes out the ink stored in the ink fountain 11 from the fountain tip 12, and makes a bad mark on an arbitrary position of the semiconductor wafer 8. The position of the marker 2 in the vertical direction is adjusted in order to make a bad mark on the surface of the semiconductor wafer 8. The procedure is as follows. Adjust coarsely according to 19.

Then, the vertical position of the crucible tip 12 is
9 is rotated and finely adjusted, a bad mark is attached to an arbitrary position in the wafer, and the shape of the bad mark is confirmed. Here, if the bad mark has no shape or is not circular, the above-mentioned steps (1) to (4) are repeated to adjust the appropriate distance between the center and the wafer surface again, so that the shape of the bad mark is repeated. The adjustment method by repeating such operations wastes time, and the adjusted distance varies every time the position is adjusted. Further, even if a slight variation occurs, the shape of the bad mark does not change greatly. In the worst case, the core is in contact with the wafer surface at the moment of the mark, and the circuit is damaged. In addition, it also causes ink to be scattered for non-defective products.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems in the marking device. That is, an object of the present invention is to provide a marking device capable of adjusting a constant distance by an easy operation so that there is no variation every time the distance between the center of the marker and the wafer surface is adjusted.

[0007]

SUMMARY OF THE INVENTION A marking device according to the present invention is proposed to solve the above-mentioned problems, and is a marking device for marking a specific portion of a semiconductor wafer. A marking device having a structure in which a chuck is connected to a terminal of a measuring instrument by a cable.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The marking device of the present invention can measure electrical characteristics such as contact resistance when the tip or center of the marker is brought into contact with the wafer surface by adding a measuring device 9 to the conventional marking device. . First, one end of the cable 21 is connected to the measuring instrument 9.
, And the other end is connected to the drive shaft 14. The drive shaft 14 is connected to the core 13 by the connecting portion 10 and is electrically connected therebetween. One end of the other cable 22 is connected to another terminal of the measuring instrument 9, and the other end is connected to a chuck on which the semiconductor wafer 8 is placed. That is, an environment in which the measuring device 9 can electrically measure the contact resistance between the tip of the core 13 and the wafer surface is realized.

The operation method of this device is as follows.
A current or voltage is applied to the terminal, and a control signal is sent from the marking device so that the core 13 protrudes from the crucible tip 12. In this state, the screw 19 is rotated to move the marker in the vertical direction, so that the semiconductor wafer 8 and the core 13 are brought into contact with each other, so that the resistance value indicated by the measuring instrument 9 starts to decrease from infinity to the marker. Find the vertical position of. This position is set as the contact start position between the center and the wafer surface, and the screw 19 is rotated from the position by a predetermined fixed angle so as to keep a fixed distance from the wafer surface.

[0010]

As is clear from the above description, the marking apparatus of the present invention electrically measures the contact resistance between the core and the wafer surface, and starts the contact between the core and the wafer surface. Finding the position, and then adjusting the worm gear etc. to keep the distance between the center and the wafer surface constant for each adjustment work, prevent contact between the center and the wafer surface due to incorrect adjustment, Can be eliminated, and variations in mark shape when the same marker is used can be reduced.

[Brief description of the drawings]

FIG. 1 is a diagram showing a conventional marking device.

FIG. 2 is a diagram showing a conventional marking device.

FIG. 3 is a diagram showing a marking device according to an embodiment of the present invention.

FIG. 4 is a diagram showing a marking device according to an embodiment of the present invention.

[Brief description of reference numerals]

 2 Marker 3 Control device 4 Vacuum hole 5 Chuck 6 Vacuum device 7 Chuck drive unit 8 Semiconductor wafer 9 Measuring device

Claims (3)

[Claims] 1. A marking device for marking a specific portion of a semiconductor wafer, wherein a center of the marking device and one electrode of a measuring device are electrically connected by a cable, a chuck for holding a wafer, and the measuring device. A marking device that can electrically measure the contact between the wafer surface and the core by connecting a cable to the other electrode with a cable. 2. An electrical connection between the tip of the pot of the marking device and one electrode of the measuring device by a cable, and further, a connection between a chuck for holding a wafer and the tester to the other electrode by a cable. A marking device capable of electrically measuring the contact between the wafer surface and the tip of the pot. 3. A part of a marker that can be brought into contact with the center of the marking device and one electrode of a tester are electrically connected by a cable, and a chuck for holding a wafer and the tester are connected to the other electrode. A marking device that can electrically measure contact between a wafer surface and one part of the marker by connecting with a cable.