WO2019078021A1

WO2019078021A1 - Soldering apparatus and soldering method

Info

Publication number: WO2019078021A1
Application number: PCT/JP2018/037201
Authority: WO
Inventors: 浩儀山下
Original assignee: 三菱電機株式会社
Priority date: 2017-10-18
Filing date: 2018-10-04
Publication date: 2019-04-25
Also published as: JP6844021B2; CN111201104B; JPWO2019078021A1; CN111201104A

Abstract

A soldering apparatus (1) is provided with a jetting unit (12) and a measuring unit (20). The jetting unit (12) includes a nozzle (12a). The measuring unit (20) is configured so as to measure a first surface shape of a diffuse reflection region (16) formed as a part of the surface of a molten solder (14) jetted from the nozzle (12a). Consequently, more suitable soldering can be performed using measurement results of the first surface shape of the diffuse reflection region (16), said first surface shape corresponding to the surface shape of the molten solder (14).

Description

Soldering apparatus and method

The present invention relates to a soldering apparatus and a soldering method.

WO 2013/111651 (patent document 1) discloses a method of measuring the height of molten solder jetted from a nozzle. In Patent Document 1, the height of molten solder jetted from a nozzle is measured using a conductive gauge member.

International Publication No. 2013/111651

However, even if the height of the molten solder jetted from the nozzle is the same, if the surface shape of the molten solder jetted from the nozzle changes, the contact between the molten solder and the object to be soldered such as a printed circuit board The aspect of is changed. Therefore, soldering failure may occur. An object of the present invention is to provide a soldering apparatus and a soldering method that enable more appropriate soldering.

The soldering apparatus of the present invention comprises a jet part and a measuring part. The jet part includes a nozzle. The measurement unit is configured to measure a first surface shape of the diffuse reflection area formed on the surface of the molten solder jetted from the nozzle.

The soldering method of the present invention comprises forming a diffuse reflection area on the surface of molten solder jetted from a nozzle, and measuring the first surface shape of the diffuse reflection area by a measurement unit.

The first surface shape of the diffuse reflection area follows the surface shape of the molten solder jetted from the nozzle. By measuring the first surface shape of the diffuse reflection area by the measuring unit, the surface shape of the molten solder jetted from the nozzle can be measured. The soldering apparatus and the soldering method of the present invention enable more appropriate soldering by using the measurement result of the first surface shape of the diffuse reflection area corresponding to the surface shape of the molten solder jetted from the nozzle.

1 is a schematic perspective view of a soldering apparatus according to Embodiment 1; FIG. 1 is a schematic cross-sectional view of a soldering apparatus according to Embodiment 1; FIG. 1 is a schematic cross-sectional view of a soldering apparatus according to Embodiment 1; FIG. 8 is a schematic cross-sectional view of a soldering apparatus according to a modification of the first embodiment. FIG. 1 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 1; FIG. 7 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the first embodiment. FIG. 7 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the first embodiment. FIG. 2 is a schematic partial enlarged cross-sectional view of the soldering apparatus according to the first embodiment. FIG. 6 is a schematic partial enlarged perspective view showing a step of measuring a second surface shape of a nozzle using the soldering apparatus according to Embodiment 1. FIG. 2 is a control block diagram of the soldering apparatus according to the first embodiment. FIG. 8 is a diagram showing a flowchart of a soldering method according to Embodiments 1 to 5, 7 and 8; FIG. 7 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 2; FIG. 7 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to Embodiment 2; FIG. 10 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 3; FIG. 10 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to Embodiment 3; FIG. 16 is a schematic partial enlarged perspective view of a soldering apparatus according to a fourth embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the fourth embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the fourth embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the fourth embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the fourth embodiment. FIG. 16 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to Embodiment 4; FIG. 18 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 5; FIG. 18 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to Embodiment 5; FIG. 16 is a schematic partial enlarged plan view of the soldering apparatus according to the fifth embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to Embodiment 5; FIG. 21 is a schematic partial enlarged perspective view of a soldering apparatus according to a first modified example of the fifth embodiment. FIG. 21 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to a second modification of the fifth embodiment. FIG. 18 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 6; FIG. 21 is a schematic partial enlarged perspective view showing a process of forming a diffuse reflection area using the soldering apparatus according to the sixth embodiment. FIG. 21 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the sixth embodiment. FIG. 21 is a schematic partial enlarged perspective view showing a process of forming a diffuse reflection area using the soldering apparatus according to the sixth embodiment. FIG. 21 is a schematic partial enlarged cross-sectional view showing a step of forming a diffuse reflection area using the soldering apparatus according to the sixth embodiment. FIG. 16 is a diagram showing a flowchart of a soldering method according to Embodiment 6; FIG. 18 is a schematic partial enlarged perspective view of a soldering apparatus according to a seventh embodiment. FIG. 18 is a schematic partial enlarged cross-sectional view of a soldering apparatus according to a seventh embodiment. FIG. 21 is a schematic partial enlarged cross-sectional view of a diffuse reflection area forming portion included in a soldering apparatus according to a seventh embodiment. FIG. 21 is a schematic partial bottom view of a diffuse reflection area forming portion included in the soldering apparatus according to the seventh embodiment. FIG. 21 is a schematic partial enlarged cross-sectional view of a diffuse reflection area forming portion included in a soldering apparatus according to a seventh embodiment. FIG. 21 is a schematic partial bottom view of a diffuse reflection area forming portion included in the soldering apparatus according to the seventh embodiment. FIG. 21 is a schematic partial enlarged perspective view of a soldering apparatus according to Embodiment 8;

Hereinafter, embodiments of the present invention will be described. The same reference numerals are given to the same components, and the description will not be repeated.

Embodiment 1
The soldering apparatus 1 according to the first embodiment will be described with reference to FIGS. 1 to 10.

The soldering apparatus 1 mainly includes a jet portion 10 including a nozzle 12a, a diffuse reflection area forming portion 30 (see FIG. 5), and a measuring portion 20. The soldering apparatus 1 further includes the transport unit 4, the preheating unit 9, the housing 3, the display unit 41, the control unit 40 (see FIG. 10), and the memory 43 (see FIG. 10). Good.

The transport unit 4 transports the wiring board 6 above the nozzles 12 a. The transport unit 4 may be, for example, a transport conveyor. The soldering apparatus 1 brings the molten solder 14 jetted from the nozzle 12 a into contact with the back surface 6 b of the wiring substrate 6 to make the component 7 mounted on the front surface 6 a of the wiring substrate 6 the back surface 6 b of the wiring substrate 6 It may be soldered to the electrical wiring provided above. The component 7 may be, for example, an electronic component such as a capacitor or a resistor. The wiring substrate 6 may be a printed circuit board.

The molten solder 14 may be made of, for example, a tin-based solder alloy such as tin-lead or tin-silver-copper. The molten solder 14 may be made of, for example, a tin-copper alloy, a tin-silver alloy, or a solder alloy obtained by adding antimony, bismuth, nickel, germanium, or the like to these alloys.

As shown in FIGS. 1 to 3, the jet flow portion 10 includes a solder bath 10 s in which the molten solder 14 is stored, a duct 11, a nozzle portion 12, and a pump 13 p. The duct 11 is locked or fixed to the solder bath 10s. The duct 11 includes a top 11t and a bottom 11b. The duct 11 has an opening 11a at the bottom 11b. The duct 11 communicates with the solder bath 10s through the opening 11a. The pump 13p pumps the molten solder 14 stored in the solder tank 10s to the duct 11 and the nozzle 12a. The pump 13p may include an impeller 13n and a motor 13m connected to the impeller 13n. The impeller 13 n is disposed in the duct 11. The impeller 13 n may be disposed to face the opening 11 a. As the motor 13m rotates the impeller 13n, the molten solder 14 is sent out from the solder tank 10s to the duct 11 and the nozzle 12a.

As shown in FIG. 5, the nozzle unit 12 includes a nozzle 12a. The nozzle 12a protrudes in the height direction (z direction). The height direction (z direction) is a direction in which the molten solder 14 is jetted from the nozzle 12 a toward the wiring substrate 6. The molten solder 14 jets from the opening 12 b of the nozzle 12 a. The opening 12b of the nozzle 12a may have the shape of an elongated rectangle or a slit. The openings 12 b of the nozzles 12 a may extend along the width direction (y direction) intersecting with the transport direction (x direction) and the height direction (z direction) of the wiring substrate 6. The molten solder 14 flows out from the nozzle 12 a toward the upstream side (−x direction) and the downstream side (+ x direction) in the transport direction of the wiring substrate 6. The opening 12b of the nozzle 12a may have a circular shape. The nozzle 12a is covered by molten solder 14 jetted from the nozzle 12a.

As shown in FIGS. 2 and 3, the nozzle 12 a may be configured to change the relative height d of the nozzle 12 a with respect to the wiring substrate 6. The nozzle 12 a may be configured to change the relative height of the nozzle 12 a with respect to the transport unit 4. The nozzle 12 a may be configured to change the relative height of the nozzle 12 a with respect to the duct 11. The nozzle 12 a may be provided at the top 11 t of the duct 11 to move relative to the duct 11.

Specifically, the duct 11 may include a support 11 f extending in the height direction (z direction) and a bolt 11 h provided at an end of the support 11 f. The nozzle portion 12 includes a plate portion 12d having a hole 12e. The plate portion 12 d extends in a width direction (y direction) intersecting the height direction (z direction) and the transfer direction (x direction) of the wiring board 6. The bolt 11 h is inserted into the hole 12 e. By rotating the bolt 11 h, the bolt 11 h can move in the height direction (z direction) with respect to the support 11 f. The nozzle 12a (nozzle portion 12) can move in the height direction (z direction) together with the bolt 11h. Thus, the relative height d of the nozzle 12a (nozzle portion 12) to the wiring board 6 can be changed.

As shown in FIG. 4, in one modified example of the present embodiment, the elevating part 18 may be provided below the jet flow part 10. The elevating unit 18 moves the jet unit 10 in the height direction (z direction). Thus, the relative height d of the nozzle 12a to the wiring substrate 6 may be changed.

As shown in FIG. 5, the nozzle unit 12 may include a guide plate 12 c. The guide plate 12 c extends from the nozzle 12 a along the transport direction (x direction) of the wiring board 6. The guide plate 12 c guides the molten solder 14 jetted from the nozzle 12 a along the transport direction (x direction) of the wiring board 6. The guide plate 12c may be configured to change the mounting position (relative height to the top of the nozzle 12a) with respect to the nozzle 12a. The guide plate 12 c may be configured to change the length of the wiring substrate 6 in the transport direction (x direction).

As shown in FIGS. 2 and 3, the jet portion 10 may further include a first heater 13 h in the solder bath 10 s. The first heater 13 h heats the molten solder 14 to keep the solder in a molten state.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIG. 6, the solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by the molten solder 14 jetted from the nozzle 12 a coming into contact with this gas. The native oxide of the solder may have a thickness of about 2 nm to about 3 nm. The solder oxide film 15 may be, for example, a tin oxide film.

As shown in FIGS. 5 to 7, the diffuse reflection area forming unit 30 is configured to form the diffuse reflection area 16 on the surface of the molten solder 14 jetted from the nozzle 12 a. The diffuse reflection area forming unit 30 may be configured to selectively form the diffuse reflection area 16 on a part of the surface of the molten solder 14 jetted from the nozzle 12a.

The diffuse reflection area forming unit 30 may include a member 31 and a driving unit 32 configured to move the member 31. The member 31 is configured to move relative to the nozzle 12a. The member 31 may be connected to the drive unit 32 via the connection unit 33. The member 31 may be, for example, a plate member. The drive unit 32 may be, for example, a motor.

The driving unit 32 is configured to move the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. Specifically, the drive unit 32 moves the member 31 in the height direction (z direction). As shown in FIG. 6, the member 31 penetrates the solder oxide film 15 formed on the surface of the molten solder 14, and a part of the member 31 is immersed in the molten solder 14. Subsequently, as illustrated in FIG. 7, the driving unit 32 moves the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. . Specifically, the drive unit 32 has a width crossing in the height direction (z direction) and the direction in which the molten solder 14 flows out from the nozzle 12 a (x direction) while immersing at least a part of the member 31 in the molten solder 14 The member 31 may be moved along the direction (y direction).

The solder oxide film 15 is folded and a diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 includes a diffuse reflection film 15 a made of a solder oxide film, and the diffuse reflection area forming portion 30 is a diffuse reflection film forming portion. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15.

The diffuse reflection area 16 may extend in a straight line or a curve on the surface of the molten solder 14. In particular, the diffuse reflection area 16 may extend along the direction in which the molten solder 14 flows out of the nozzle 12a. The diffuse reflection area 16 may extend from the nozzle 12 a toward at least one of the upstream direction (−x direction) and the downstream direction (+ x direction) of the transport direction of the wiring substrate 6.

As shown in FIG. 8, the measurement unit 20 is configured to measure the first surface shape of the diffuse reflection area 16. In the present specification, the surface shape also includes the position of the surface. The measuring unit 20 may be an optical measuring unit. Specifically, the measurement unit 20 is configured to detect the light source unit 21 configured to irradiate the light 22 to the diffuse reflection area 16 and the light 22 diffusely reflected by the diffuse reflection area 16. And the light detection unit 23 may be included. The measuring unit 20 may be, for example, a laser displacement meter, or specifically, a two-dimensional laser displacement meter.

The light source unit 21 may be, for example, a semiconductor laser. The light source unit 21 may emit the light 22 to be scanned. Specifically, the light 22 emitted from the light source unit 21 may be scanned along the transport direction (x direction) and the width direction (y direction) of the wiring board 6.

The light 22 emitted from the light source unit 21 is diffusely reflected in the diffuse reflection area 16. The diffuse reflection region 16 has a larger ratio of diffuse reflection and a smaller ratio of specular reflection than the solder oxide film 15 in the region adjacent to the diffuse reflection region 16. The ratio of diffuse reflection on the surface means the ratio of light reflected in a direction different from the incident direction to the light incident perpendicularly on the surface. The ratio of specular reflection on the surface means the ratio of light reflected in the incident direction of the light to light incident perpendicularly on the surface.

The light detection unit 23 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16. The light detection unit 23 may be, for example, a CMOS position sensor. The measurement unit 20 may measure the first surface shape of the diffuse reflection area 16 by triangulation. Specifically, information on the surface angle and distance of the diffuse reflection area 16 with respect to the light detection unit 23 can be obtained by detecting the light 22 diffusely reflected by the diffuse reflection area 16 by the light detection unit 23. Based on this information, the first surface shape of the diffuse reflection area 16 can be measured.

The diffuse reflection area 16 (diffuse reflection film 15 a) floats on the surface of the molten solder 14. The first surface shape of the diffuse reflection area 16 (diffuse reflection film 15 a) follows the surface shape of the molten solder 14. The first surface shape of the diffuse reflection area 16 (diffuse reflection film 15 a) can be regarded as substantially equivalent to the surface shape of the molten solder 14. The surface shape of the molten solder 14 can be measured by measuring the first surface shape of the diffuse reflection area 16 (diffuse reflection film 15 a) using the measurement unit 20.

The surface of the molten solder 14 jetted from the nozzle 12a is constantly fluctuating. Therefore, it is difficult to accurately measure the surface shape of the molten solder 14 jetted from the nozzle 12 a by receiving light specularly reflected by the solder oxide film 15 not including the diffuse reflection area 16 by the light detection unit 23. is there. On the other hand, in the present embodiment, the measurement unit 20 detects the light 22 diffusely reflected by the diffuse reflection area 16 (diffuse reflection film 15a). Even if the surface of the molten solder 14 jetted from the nozzle 12 a shakes, the light 22 diffusely reflected by the diffuse reflection area 16 can be stably received by the light detection unit 23. With the light 22 diffusely reflected in the diffuse reflection area 16, the shape of the surface of the molten solder 14 jetted can be measured accurately and easily.

By observing the diffuse reflection area 16 (diffuse reflection film 15a), the measurement unit 20 can be easily positioned with respect to the molten solder 14 jetted from the nozzle 12a. Even if the molten solder 14 is jetted, the diffuse reflection area 16 (diffuse reflection film 15a) hardly moves. The reason is that the solder oxide film 15 functions as a wall for the molten solder 14 which can be regarded as a viscous fluid, since the viscous fluid generally has a substantially zero flow rate in the vicinity of the wall. Therefore, the first surface shape of the diffuse reflection area 16 corresponding to the shape of the surface of the molten solder 14 can be measured accurately and easily.

When the wiring substrate 6 is conveyed above the nozzles 12 a to solder the component 7 to the wiring substrate 6, the diffuse reflection film 15 a is pushed to the wiring substrate 6. Therefore, the diffuse reflection film 15 a does not adversely affect the soldering of the component 7 to the wiring substrate 6. The drive unit 32 pulls up the member 31 from the molten solder 14 before, for example, the first surface shape of the diffuse reflection area 16 is measured by the measurement unit 20. The driving unit 32 may pull up the member 31 from the molten solder 14 after the first surface shape of the diffuse reflection area 16 is measured.

As shown in FIG. 9, the measurement unit 20 may be configured to further measure the second surface shape of the nozzle 12a. The position and shape of the nozzle 12a may be measured by the measuring unit 20 before the molten solder 14 jets from the nozzle 12a. Therefore, the nozzle 12a having an appropriate shape can be accurately positioned with respect to the wiring substrate 6.

As shown in FIG. 10, the control unit 40 is configured to control the jet unit 10 based on the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20. In the present specification, controlling the jet flow portion 10 includes the number of rotations of the motor 13m connected to the pump 13p, the temperature of the first heater 13h, the relative height of the nozzle 12a with respect to the wiring board 6, and the nozzle 12a. This means adjusting at least one of the relative height of the guide plate 12c to the top and the length of the guide plate 12c.

Specifically, the memory 43 stores first shape reference data on a first target surface shape of the molten solder 14 jetted from the nozzle 12a. The control unit 40 is configured to compare the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 with the first shape reference data. The control unit 40 is configured to control the jet flow unit 10 based on the comparison result between the first surface shape of the diffuse reflection area 16 and the first shape reference data. Control part 40 may control jet part 10 so that the 1st surface shape of diffuse reflection field 16 obtained by measurement part 20 may be in agreement with the 1st shape standard data.

The control unit 40 may be configured to control the nozzle 12 a based on the second surface shape of the nozzle 12 a obtained by the measurement unit 20. In the present specification, controlling the nozzle 12a is at least one of the relative height of the nozzle 12a to the wiring substrate 6, the relative height of the guide plate 12c to the top of the nozzle 12a, and the length of the guide plate 12c. Means to adjust one.

Specifically, the memory 43 stores second shape reference data on a second target surface shape of the nozzle 12a. The control unit 40 is configured to compare the second surface shape of the nozzle 12 a obtained by the measurement unit 20 with the second shape reference data. The control unit 40 is configured to control the nozzle 12 a based on the comparison result between the second surface shape of the nozzle 12 a and the second shape reference data. Control part 40 may control nozzle 12a so that the 2nd surface shape of nozzle 12a obtained by measurement part 20 may be in agreement with the 2nd shape standard data of nozzle 12a. The memory 43 may further store data on the type of the wiring board 6.

As shown in FIGS. 1 and 4, the preheating unit 9 is disposed on the upstream side (−x direction) in the transport direction (x direction) of the wiring board 6 with respect to the nozzle 12a. Prior to the soldering in the jet portion 10, the preheating unit 9 heats the wiring substrate 6. The preheating unit 9 includes a second heater 9 h and a temperature sensor 9 s. The wiring substrate 6 is heated in the preliminary heating unit 9 while being conveyed by the conveyance unit 4 in the preliminary heating unit 9. The second heater 9 h heats the wiring board 6 transported into the preheating unit 9. The temperature sensor 9 s detects the temperature in the preheating unit 9. As shown in FIG. 10, the preheating unit 9 may be connected to the control unit 40. The control unit 40 may control the preheating unit 9. The control unit 40 may receive the output of the temperature sensor 9s and control the second heater 9h based on the output of the temperature sensor 9s.

As shown in FIG. 1, the housing 3 accommodates the jet flow portion 10, the measurement portion 20, and the preheating portion 9. A part of the transport unit 4 and the control unit 40 are also accommodated in the housing 3. The control unit 40 may control the transport unit 4. For example, the control unit 40 may control the transfer speed of the wiring board 6 by the transfer unit 4.

As shown in FIG. 1, the display unit 41 is provided on the housing 3. As shown in FIG. 10, the display unit 41 is connected to the control unit 40. The control unit 40 controls the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20, the second surface shape of the nozzle 12a, the number of rotations of the motor 13m connected to the pump 13p, and the first heater 13h. Temperature, temperature of second heater 9 h, relative height of nozzle 12 a to wiring board 6, relative height of guide plate 12 c to top of nozzle 12 a, length of guide plate 12 c, type of wiring board 6 And, data including the transport speed of the wiring board 6 in the transport unit 4 is output to the display unit 41. The display unit 41 displays these data.

The soldering method of the present embodiment will be described with reference to FIGS. 5 to 11.
The soldering method of the present embodiment includes forming a diffuse reflection area 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11). The diffuse reflection area 16 may be selectively formed on a part of the surface of the molten solder 14 jetted from the nozzle 12a.

As shown in FIG. 5 to FIG. 7, forming the diffuse reflection area 16 (S11) involves immersing the member 31 along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14 It may include moving in one direction. Specifically, the drive unit 32 moves the member 31 in the height direction (z direction). As shown in FIG. 6, the member 31 penetrates the solder oxide film 15 formed on the surface of the molten solder 14, and a part of the member 31 is immersed in the molten solder 14. Subsequently, as illustrated in FIG. 7, the driving unit 32 moves the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. . Specifically, the drive unit 32 may move the member 31 along the width direction (y direction) while immersing at least a part of the member 31 in the molten solder 14.

The solder oxide film 15 is folded and a diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 may include a diffuse reflection film 15a composed of a solder oxide film. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15.

The soldering method of the present embodiment includes measuring the first surface shape of the diffuse reflection area 16 by the measuring unit 20 (S12). As shown in FIG. 8, in the measurement of the first surface shape of the diffuse reflection area 16 (S 12), the diffuse reflection area 16 is irradiated with light 22 and the light diffusely reflected by the diffuse reflection area 16 And C. 22 may be included.

The diffuse reflection area 16 (diffuse reflection film 15 a) floats on the surface of the molten solder 14. The first surface shape of the diffuse reflection area 16 follows the surface shape of the molten solder 14. The first surface shape of the diffuse reflection area 16 (diffuse reflection film 15 a) can be regarded as substantially equivalent to the surface shape of the molten solder 14. By measuring the first surface shape of the diffuse reflection area 16 (diffuse reflection film 15a) using the measurement unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be measured. After the measurement unit 20 measures the first surface shape of the diffuse reflection area 16, the drive unit 32 may pull up the member 31 from the molten solder 14.

The soldering method of the present embodiment further includes controlling the jet portion 10 including the nozzle 12 a based on the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 (S 13, S 14). It is also good. Controlling the jet portion 10 (S13, S14) compares the first surface shape of the diffuse reflection area 16 with the first shape reference data on the first target surface shape of the molten solder 14 jetted from the nozzle 12a. (S13), and controlling the jet part 10 based on the comparison result between the first surface shape of the diffuse reflection area 16 and the first shape reference data (S14). The first shape reference data on the first target surface shape of the molten solder 14 jetted from the nozzle 12a is, for example, past data on the surface shape of the molten solder 14 jetted from the nozzle 12a immediately after cleaning the nozzle 12a described later. It may be

Specifically, the memory 43 stores first shape reference data on a first target surface shape of the molten solder 14 jetted from the nozzle 12a. The control unit 40 compares the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 with the first shape reference data stored in the memory 43. The control unit 40 controls the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection area 16 and the first shape reference data.

Specifically, the control unit 40 controls the jetted portion so that the first surface shape of the diffuse reflection area 16 obtained by the measuring unit 20 matches the first shape reference data of the molten solder 14 jetted from the nozzle 12a. 10 may be controlled. If the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 does not match the first shape reference data of the molten solder 14 jetted from the nozzle 12a (in the case of NG1 in FIG. 11), the jetted portion 10 Are controlled (S14), and then it is confirmed whether the first surface shape of the diffuse reflection area 16 matches the first shape reference data by the steps (S11) to (S13). Steps (S11) to (S14) are repeated until the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 matches the first shape reference data of the molten solder 14 jetted from the nozzle 12a.

After matching the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 to the first shape reference data, the component 7 is soldered to the wiring substrate 6 by the molten solder 14 jetted from the nozzle 12 a ( S30). Specifically, the wiring board 6 is transported by the transport unit 4 to the upper side of the nozzle 12 a. The component 7 mounted on the front surface 6 a of the wiring substrate 6 is provided on the back surface 6 b of the wiring substrate 6 by bringing the molten solder 14 jetted from the nozzle 12 a into contact with the back surface 6 b of the wiring substrate 6. Soldered to electrical wiring.

When the soldering apparatus 1 is used many times, solder oxide is deposited in the opening 12b of the nozzle 12a. The deposited solder oxide inhibits the flow of the molten solder 14 in the opening 12b of the nozzle 12a and causes a soldering failure. In order to remove the deposited solder oxide, the nozzle 12 a is removed from the soldering apparatus 1 and disassembled and cleaned. After cleaning the nozzle 12 a, the nozzle 12 a is assembled again and attached to the soldering apparatus 1. When assembling the nozzle 12a, an assembly error may occur. When the nozzle 12 a is attached to the soldering apparatus 1, an attachment error may occur. Due to these errors, the surface shape of the molten solder 14 jetted from the nozzle 12a after cleaning may differ from the surface shape of the molten solder 14 jetted from the nozzle 12a before cleaning. These errors can cause solder defects after cleaning the nozzle 12a.

As shown in FIG. 11, in the soldering method of the present embodiment, the second surface shape of the nozzle 12 a is measured by the measuring unit 20 (S 21) so that these errors do not occur (S 21), and the measuring unit And controlling the nozzle 12a based on the second surface shape of the nozzle 12a obtained by the step S20 (S22, S23).

In the step (S21) of measuring the second surface shape of the nozzle 12a by the measuring unit 20, as shown in FIG. 9, the second surface shape of the nozzle 12a is not jetted from the nozzle 12a. It may be measured by the measurement unit 20. The nozzle 12a is made of, for example, stainless steel whose surface is nitrided. The nozzle 12 a has a larger percentage of diffuse reflection on the surface and a smaller percentage of specular reflection on the surface than the solder oxide film 15. Therefore, the second surface shape of the nozzle 12a can be measured directly by the measuring unit 20.

Controlling the nozzle 12a (S22, S23) compares the second surface shape of the nozzle 12a with second shape reference data on the second target surface shape of the nozzle 12a (S22), and Controlling the nozzle 12a based on a comparison result between the second surface shape of the second surface 12a and the second shape reference data (S23). The second shape reference data regarding the second target surface shape of the nozzle 12a may be, for example, past data regarding the second surface shape of the nozzle 12a immediately after cleaning the nozzle 12a.

Specifically, the memory 43 stores second shape reference data on a second target surface shape of the nozzle 12a. The control unit 40 compares the second surface shape of the nozzle 12 a obtained by the measurement unit 20 with the second shape reference data stored in the memory 43. The control unit 40 controls the nozzle 12a based on the comparison result between the second surface shape of the nozzle 12a and the second shape reference data.

Specifically, the control unit 40 may control the nozzle 12a such that the second surface shape of the nozzle 12a obtained by the measurement unit 20 matches the second shape reference data of the nozzle 12a. If the second surface shape of the nozzle 12a obtained by the measurement unit 20 does not match the second shape reference data of the nozzle 12a (in the case of NG3 in FIG. 11), the nozzle 12a is controlled (S23), and Whether or not the second surface shape of the nozzle 12a matches the second shape reference data is confirmed by the step (S21) and the step (S22). Steps (S21) to (S23) are repeated until the second surface shape of the nozzle 12a obtained by the measurement unit 20 matches the second shape reference data of the nozzle 12a. After matching the second surface shape of the nozzle 12a obtained by the measurement unit 20 with the second shape reference data of the nozzle 12a, the molten solder 14 is jetted from the nozzle 12a to diffuse reflection on the surface of the molten solder 14 A region 16 is formed (S11).

As shown in FIG. 11, the case where the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 can not be matched with the first shape reference data only by the steps (S11) to (S14) In the case of NG2 of FIG. 11), the nozzle 12a is controlled again from step (S21) to step (S23), and then the first surface of the diffuse reflection area 16 from step (S11) to step (S14) The shape may be matched to the first shape reference data.

Also when the type of the wiring board 6 is changed, the same process as in the case of disassembling and cleaning the nozzle 12a may be performed. Specifically, when the type of wiring board 6 is changed, the steps (S21) to (S23) are performed. The nozzle 12 a is controlled such that the second surface shape of the nozzle 12 a obtained by the measurement unit 20 matches the second shape reference data corresponding to the different types of wiring boards 6. Subsequently, steps (S11) to (S14) are performed. The nozzle 12 a is controlled such that the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 matches the first shape reference data corresponding to the different types of wiring boards 6. The control unit 40 reads out the type of the wiring board 6 from the memory 43, and the first shape reference data and the second shape reference data corresponding to the different types of wiring board 6 are read. It may be replaced by shape reference data of Thus, even if the type of wiring board 6 is changed, the occurrence of soldering defects can be suppressed.

The step (S13) of comparing the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 with the first shape reference data may be performed by the method exemplified below. In the first example, data of the first surface shape of the diffuse reflection area 16 is used to generate characteristic part data (for example, the highest position of the first surface shape of the diffuse reflection area 16) using an electronic computer. Extract data etc.) The data of the characteristic portion may be compared with the first shape reference data of the characteristic portion using a computer. In the second example, in step (S13), the first surface shape of the diffuse reflection area 16 and the first shape reference data may be displayed on the display unit 41, and these may be visually compared. Similarly, also in the step (S22) of comparing the second surface shape of the nozzle 12a obtained by the measuring unit 20 with the second shape reference data, these may be compared by an electric computer or visually.

In the soldering apparatus 1 and the soldering method according to one modification of the present embodiment, the diffuse reflection area 16 (diffuse reflection film according to the present embodiment) (diffuse reflection film according to the third embodiment) 15a) may be formed.

The effects of the soldering apparatus 1 and the soldering method of the present embodiment will be described.
The soldering apparatus 1 of the present embodiment includes a jet portion 10 and a measuring portion 20. The jet part 10 includes a nozzle 12a. The measurement unit 20 is configured to measure a first surface shape of the diffuse reflection area 16 formed on the surface of the molten solder 14 jetted from the nozzle 12a. The first surface shape of the diffuse reflection area 16 follows the surface shape of the molten solder 14 jetted from the nozzle 12a. By measuring the first surface shape of the diffuse reflection area 16 by the measuring unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be easily measured. The soldering apparatus 1 of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

The soldering apparatus 1 of the present embodiment may further include a diffuse reflection area forming unit 30 configured to form the diffuse reflection area 16 on the surface of the molten solder 14. Therefore, the diffuse reflection area 16 can be easily formed on the surface of the molten solder 14. The soldering apparatus 1 of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1 of the present embodiment, the diffuse reflection area forming unit 30 may include a member 31 and a drive unit 32. The driving unit 32 may be configured to move the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. Therefore, the diffuse reflection area 16 can be easily formed on the surface of the molten solder 14. The soldering apparatus 1 of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

The soldering apparatus 1 of the present embodiment may further include a control unit 40. The control unit 40 may be configured to control the jet unit 10 based on the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20. The soldering apparatus 1 of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

The soldering apparatus 1 of the present embodiment may further include a memory 43 in which first shape reference data on a first target surface shape of the molten solder 14 jetted from the nozzle 12 a is stored. The control unit 40 may be configured to compare the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 with the first shape reference data. The control unit 40 may be configured to control the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection area 16 and the first shape reference data. The soldering apparatus 1 of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1 of the present embodiment, the measuring unit 20 may be configured to further measure the second surface shape of the nozzle 12a. The control unit 40 may be configured to control the nozzle 12 a based on the second surface shape of the nozzle 12 a obtained by the measurement unit 20. The soldering apparatus 1 of the present embodiment enables more appropriate (better) soldering using the measurement result of the second surface shape of the nozzle 12 a.

In the soldering method of the present embodiment, the diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12 a (S 11), and the first surface shape of the diffuse reflection area 16 is measured by the measuring unit 20. And (S12) measuring. The first surface shape of the diffuse reflection area 16 follows the surface shape of the molten solder 14 jetted from the nozzle 12a. By measuring the first surface shape of the diffuse reflection area 16 by the measurement unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be measured. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S12) moves the member 31 along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. May be included. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. Therefore, the diffuse reflection area 16 can be easily formed on the surface of the molten solder 14. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

The soldering method of the present embodiment further includes controlling the jet portion 10 including the nozzle 12 a (S 13, S 14) based on the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20. It is also good. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method according to the present embodiment, controlling the jet portion 10 (S13, S14) includes the first surface shape of the diffuse reflection area 16 and the first target surface shape of the molten solder 14 jetted from the nozzle 12a. Comparing the first shape reference data with respect to (S13), and controlling the jet portion 10 based on the comparison result between the first surface shape of the diffuse reflection area 16 and the first shape reference data And (S14) may be included. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, the measurement unit 20 measures the second surface shape of the nozzle 12a (S21), and the nozzle based on the second surface shape of the nozzle 12a obtained by the measurement unit 20. And 12a may be further included (S22, S23). The soldering method of the present embodiment enables more appropriate (better) soldering using the measurement result of the second surface shape of the nozzle 12a.

Second Embodiment
A soldering apparatus 1b according to a second embodiment will be described with reference to FIGS. 12 and 13. The soldering apparatus 1b of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

The soldering apparatus 1 b includes a measuring unit 20 b in place of the measuring unit 20 of the first embodiment. The measurement unit 20b includes a light source unit 21b and a light detection unit 23b. The light source unit 21 b is configured to irradiate the diffuse reflection area 16 with the light 22 b. The light source unit 21 b may emit light 22 b having an elongated rectangular shape or a cross-sectional shape of a slit. The light source unit 21 b may be, for example, a laser marker. The light detection unit 23 b is configured to detect the light 22 b diffusely reflected by the diffuse reflection area 16. The light detection unit 23 b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection area 16. The imaging unit may be, for example, a CCD camera. The first surface shape of the diffuse reflection area 16 can be easily measured by detecting the light 22 b diffused and reflected by the diffuse reflection area 16 by the light detection unit 23 b.

The soldering method of the present embodiment will be described with reference to FIGS. 11 to 13. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

The soldering method of the present embodiment includes measuring the first surface shape of the diffuse reflection area 16 by the measuring unit 20b (S12). Measuring the first surface shape of the diffuse reflection area 16 (S12) includes irradiating the diffuse reflection area 16 with the light 22b and detecting the light 22b diffusely reflected by the diffuse reflection area 16. . The measurement unit 20b includes a light detection unit 23b. The light detection unit 23 b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection area 16. Detecting the diffusely reflected light 22 b includes acquiring an image of the first surface shape of the diffuse reflection area 16 by the imaging unit.

According to the soldering method of the present embodiment, the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20 b and the first shape reference data on the first target surface shape of the molten solder 14 jetted from the nozzle 12 a (S13). Specifically, the control unit 40 stores, in the memory 43, an image of a first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. It may be compared with data (first reference image). Specifically, the image of the first surface shape of the diffuse reflection area 16 and the first shape reference data (first reference image) are superimposed to calculate the area corresponding to the difference between these images. Based on this area, the image of the first surface shape of the diffuse reflection area 16 obtained by the measurement unit 20b may be compared with the first shape reference data (first reference image).

The soldering method of the present embodiment may include measuring the second surface shape of the nozzle 12a by the measuring unit 20b (S21). The measurement unit 20b includes a light detection unit 23b that is an imaging unit configured to acquire an image of a second surface shape of the nozzle 12a.

The soldering method of the present embodiment is to compare the second surface shape of the nozzle 12a obtained by the measurement unit 20b with the second shape reference data on the second target surface shape of the nozzle 12a (S22). Equipped with Specifically, the control unit 40 may compare the image of the second surface shape of the nozzle 12a with the second shape reference data (second reference image) stored in the memory 43. Specifically, the image of the second surface shape of the nozzle 12a and the second shape reference data (second reference image) are superimposed to calculate the area corresponding to the difference between these images. Based on this area, the image of the second surface shape of the nozzle 12a obtained by the measurement unit 20b may be compared with the second shape reference data (second reference image).

The effects of the soldering apparatus 1b and the soldering method of the present embodiment will be described. The soldering apparatus 1b and the soldering method of the present embodiment have the following effects similar to the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1b according to the present embodiment, the measurement unit 20b detects the light source unit 21b configured to irradiate the diffuse reflection area 16 with the light 22b and the light 22b diffused and reflected by the diffuse reflection area 16 And a light detection unit 23 b configured to The light detection unit 23 b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection area 16. In the soldering method of the present embodiment, measuring the first surface shape of the diffuse reflection area 16 (S12) comprises irradiating the diffuse reflection area 16 with the light 22b, and diffuse reflection by the diffuse reflection area 16. And detecting the light 22b. Detecting the diffusely reflected light 22 b includes acquiring an image of the first surface shape of the diffuse reflection area 16 by the imaging unit. The soldering apparatus 1b and the soldering method of the present embodiment are more appropriate using the measurement results of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a ( Enable better soldering.

Third Embodiment
A soldering apparatus 1c according to the third embodiment will be described with reference to FIGS. 14 and 15. The soldering apparatus 1c of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

As shown in FIG. 14, the soldering apparatus 1 c includes a diffuse reflection area forming unit 30 c instead of the diffuse reflection area forming unit 30 of the first embodiment. The diffuse reflection area forming unit 30 c includes a gas spraying unit 35 configured to spray the gas 34 containing oxygen toward the surface of the molten solder 14. The gas spray unit 35 may be configured to selectively spray a gas 34 containing oxygen onto a part of the surface of the molten solder 14. The gas 34 containing oxygen may be, for example, air. The jet nozzle of the gas spray unit 35 may have, for example, an elongated shape extending along the direction (x direction) in which the molten solder 14 flows out from the nozzle 12a, or may have a circular shape. The gas spray unit 35 is configured to move relative to the nozzle 12a.

The portion of the surface of the molten solder 14 to which the gas 34 is blown is oxidized more preferentially than the other portions. The gas 34 promotes the oxidation of the molten solder 14. As shown in FIG. 15, a diffuse reflection area 16 is selectively formed on a portion of the surface of the molten solder 14 to which the gas 34 is blown. The diffuse reflection area 16 may include a diffuse reflection film 15 c made of a solder oxide film, and the diffuse reflection area formation portion 30 c may be a diffuse reflection film formation portion. The diffuse reflection film 15 c is a thick solder oxide film thicker than the solder oxide film 15 in the area adjacent to the diffuse reflection area 16 (diffuse reflection film 15 c).

When the solder oxide thick film is irradiated with the light 22 emitted from the light source unit 21b, interference fringes of the light 22 are formed in the solder oxide thick film, and a larger proportion of the light 22 is diffusely reflected. Thus, the solder oxide thick film functions as the diffuse reflection film 15c. The thickness of the diffuse reflection film 15c (solder oxide thick film) may be twice or more of the thickness of the solder oxide film 15 adjacent to the diffuse reflection film 15c (solder oxide thick film), or three times or more. It may be five times or more, or ten times or more. The thickness of the diffuse reflection film 15c (solder oxide thick film) may be 0.10 times or more of the wavelength of the light 22, may be 0.12 times or more, and is 0.15 times or more. It may be 0.18 times or more, or 0.20 times or more.

The soldering method of the present embodiment will be described with reference to FIGS. 11, 14 and 15. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11) is one of the surfaces of the molten solder 14 as shown in FIG. Selectively blowing a gas 34 containing oxygen into the part. The gas 34 promotes the oxidation of the molten solder 14. As shown in FIG. 15, a diffuse reflection area 16 is selectively formed on a portion of the surface of the molten solder 14 to which the gas 34 is blown. The diffuse reflection area 16 includes a diffuse reflection film 15 c composed of a solder oxide film. The diffuse reflection film 15 c is a thick solder oxide film thicker than the solder oxide film 15 in the area adjacent to the diffuse reflection area 16. In the solder oxide thick film, interference fringes of the light 22 are formed, and a larger proportion of the light 22 is diffused and reflected, so the solder oxide thick film functions as the diffuse reflection film 15 c.

In the soldering apparatus 1c and the soldering method according to a modification of the present embodiment, the measuring unit 20 may be replaced with the measuring unit 20b according to the second embodiment. In a soldering apparatus 1c and a soldering method according to another modification of the present embodiment, the diffuse reflection area 16 (the diffuse reflection area according to the present embodiment (diffuse reflection) using the diffuse reflection area forming portion 30 disclosed in the first embodiment. A membrane 15c) may be formed.

The effects of the soldering apparatus 1c and the soldering method of the present embodiment will be described. The soldering apparatus 1c and the soldering method of the present embodiment have the following effects similar to the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1c of the present embodiment, the diffuse reflection area forming unit 30c includes a gas spraying unit 35 configured to spray a gas 34 containing oxygen toward the surface of the molten solder 14. In the soldering method of the present embodiment, forming the diffuse reflection area 16 includes spraying a gas 34 containing oxygen selectively on a part of the surface of the molten solder 14. The diffuse reflection area 16 includes a diffuse reflection film 15 c composed of a solder oxide film (solder oxide thick film). Therefore, the diffuse reflection area 16 can be easily formed. The soldering apparatus 1c and the soldering method of the present embodiment are more appropriate by using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a ( Enable better soldering.

Fourth Embodiment
A soldering apparatus 1 d according to a fourth embodiment will be described with reference to FIGS. 16 to 21. The soldering apparatus 1d of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

The soldering apparatus 1 d includes a diffuse reflection area formation part 30 d in place of the diffuse reflection area formation part 30 of the first embodiment. The diffuse reflection area forming unit 30 d includes a member 31 d and a vibrator 32 d. The vibrator 32 d is configured to vibrate the member 31 d along the surface of the molten solder 14 while immersing at least a part of the member 31 d in the molten solder 14. The vibrator 32d vibrates the member 31d, for example, in the width direction (y direction). The vibrator 32d may be, for example, a piezoelectric element made of a ceramic material such as zirconate titanate, barium titanate or titanate, or may be formed of an electromagnetic motor, an electrostatic motor or an ultrasonic motor. It may be a vibrating motor.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIGS. 16 and 17, the solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by the molten solder 14 jetted from the nozzle 12 a coming into contact with this gas.

As shown in FIG. 18 to FIG. 20, while immersing at least a part of the member 31 d in the molten solder 14, the member 32 d is vibrated along the surface of the molten solder 14 using the vibrator 32 d. The solder oxide film 15 is folded and a diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 is formed on both sides in the width direction (y direction) of the member 31 d. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film, and the diffuse reflection area formation portion 30d is a diffuse reflection film formation portion. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. Therefore, the diffuse reflection film 15 a is likely to diffuse and reflect more light 22 (see FIG. 16) than the solder oxide film 15. The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16.

As shown in FIGS. 18 to 20, as the number of vibrations of the member 31d increases, the width of the diffuse reflection film 15a also increases. The width of the diffuse reflection film 15a is the length of the diffuse reflection film 15a in the width direction (y direction). The diffuse reflection film 15a having a wide area can be obtained without the diffuse reflection film 15a being formed into small pieces. The first surface shape (surface shape of the molten solder 14) of the diffuse reflection area 16 can be stably measured over a wide area.

The member 31 d is made of a material that is difficult to melt in the molten solder 14 such as SUS316 or titanium. The member 31 d may be a bar member extending along the transport direction (x direction) of the wiring substrate 6. The member 31 d is configured to be in contact with the back surface 6 b of the wiring substrate 6 when the wiring substrate 6 is transported above the nozzle 12 a. The back surface 6 b is the surface of the wiring substrate 6 facing the molten solder 14. Specifically, the member 31 d extends above the nozzle 12 a. The member 31 d is disposed in the transport path of the wiring substrate 6 in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. The width of the transport path of the wiring substrate 6 is the same as the width of the wiring substrate 6. The width of the wiring substrate 6 is the length of the wiring substrate 6 in the width direction (y direction). The width of the transport path of the wiring substrate 6 is the length of the transport path of the wiring substrate 6 in the width direction (y direction).

The side surface 6 c of the wiring substrate 6 is gripped by the arm 4 a of the transport unit 4, but the front surface 6 a and the back surface 6 b of the wiring substrate 6 are not gripped by the arm 4 a of the transport unit 4. The back surface 6 b of the wiring substrate 6 is in contact with the molten solder 14, whereas the front surface 6 a of the wiring substrate 6 is not in contact with the molten solder 14. The temperature of the back surface 6 b of the wiring substrate 6 is higher than the temperature of the front surface 6 a of the wiring substrate 6. Due to the temperature difference between the front surface 6a and the back surface 6b of the wiring board 6, the wiring board 6 tries to warp so as to protrude toward the nozzle 12a. The member 31 d can be in contact with the back surface 6 b of the wiring substrate 6 to prevent the wiring substrate 6 from warping.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 16 to 21. FIG. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11) is, as shown in FIG. 16 to FIG. While immersing a part in the molten solder 14, vibrating the member 31d along the surface of the molten solder 14 is included.

A solder oxide film 15 (solder natural oxide film) is formed on the surface of the molten solder 14. When the member 31d is vibrated along the surface of the molten solder 14 while immersing at least a part of the member 31d in the molten solder 14, the solder oxide film 15 folds over and is jetted from the nozzle 12a on the surface of the molten solder 14 , And the diffuse reflection area 16 is formed. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. Therefore, the diffuse reflection film 15 a is likely to diffuse and reflect more light 22 (see FIG. 16) than the solder oxide film 15.

The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 measures the first surface shape of the diffuse reflection area 16 (S12). When the wiring board 6 is not in contact with the member 31d, the diffuse reflection area 16 is formed (S11), and the first surface shape of the diffuse reflection area 16 is measured (S12).

In the soldering method of the present embodiment, in the step of soldering component 7 to wiring board 6 by molten solder 14 jetted from nozzle 12a (S30), wiring 6 is performed while the back surface 6b of wiring board 6 is in contact with member 31d. The substrate 6 is transported. The member 31 d can prevent the wiring board 6 from warping.

The effects of the soldering apparatus 1 d and the soldering method of the present embodiment will be described. The soldering apparatus 1 d and the soldering method of the present embodiment have the following effects similar to those of the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1 d of the present embodiment, the diffuse reflection area forming unit 30 d includes a member 31 d and a vibrator 32 d. The vibrator 32 d is configured to vibrate the member 31 d along the surface of the molten solder 14 while immersing at least a part of the member 31 d in the molten solder 14. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1d of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1d of the present embodiment, the member 31d extends along the transport direction (x direction) of the object (wiring substrate 6) to be soldered. The member 31 d is configured to be in contact with the back surface 6 b of the object (wiring substrate 6). The back surface 6 b is a surface of the target (wiring substrate 6) to be soldered that faces the molten solder 14. The member 31 d can be in contact with the back surface 6 b of the object to be soldered (wiring substrate 6) to prevent the object to be soldered (wiring substrate 6) from warping. The soldering apparatus 1d of the present embodiment enables more appropriate (better) soldering.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 vibrates the member 31 d along the surface of the molten solder 14 while immersing at least a part of the member 31 d in the molten solder 14. Including. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, the member 31 d extends along the transport direction (x direction) of the object (wiring substrate 6) to be soldered. The object (wiring substrate 6) to be soldered is transported while the back surface 6b of the object (wiring substrate 6) to be soldered contacts the member 31d. The back surface 6 b is a surface of the target (wiring substrate 6) to be soldered that faces the molten solder 14. The member 31 d can prevent the object to be soldered (wiring board 6) from warping. The soldering method of the present embodiment enables more appropriate (better) soldering.

Embodiment 5
A soldering apparatus 1e according to the fifth embodiment will be described with reference to FIGS. 22 to 27. The soldering apparatus 1e of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

The soldering apparatus 1 e includes a diffuse reflection area forming unit 30 e in place of the diffuse reflection area forming unit 30 of the first embodiment. The diffuse reflection area forming unit 30 e includes two stationary members 36. The stationary member 36 is attached to, for example, the transport unit 4. One stationary member 36 is located downstream of the center line 12m (see FIG. 23) of the opening 12b of the nozzle 12a in the transfer direction (x direction) of the wiring board 6 in the transfer direction (x direction) of the wiring board 6 Is located in The other stationary member 36 is disposed upstream of the center line 12m of the opening 12b of the nozzle 12a in the transport direction (x direction) of the wiring board 6. The stationary member 36 is disposed above the nozzle 12 a such that a portion of the stationary member 36 is immersed in the molten solder 14. The remaining portion of the stationary member 36 is exposed from the molten solder 14.

The stationary member 36 is disposed outside the transport path of the wiring substrate 6 in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. Therefore, the stationary member 36 is prevented from interfering with the soldering. The stationary member 36 is made of a material that does not easily dissolve in the molten solder 14 such as SUS316 or titanium. The stationary member 36 has, for example, a rectangular shape in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. The stationary member 36 may have a polygonal shape or a circular shape in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. It may have a streamlined shape.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIGS. 22 to 25, a solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by the molten solder 14 contacting the gas.

The solder oxide film 15 is folded around the stationary member 36 to form the diffuse reflection area 16 on the surface of the molten solder 14 jetted from the nozzle 12a. The reason that the diffuse reflection area 16 is formed is that when the molten solder 14 flows along the stationary member 36, the molten solder 14 contacts the stationary member 36, and the flow of the molten solder 14 is disturbed around the stationary member 36 and is stationary. It is presumed that the flow velocity of the molten solder 14 is reduced around the member 36. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film, and the diffuse reflection area formation portion 30e is a diffuse reflection film formation portion. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. Therefore, the diffuse reflection film 15a is likely to diffuse and reflect more light 22 (see FIG. 22) than the solder oxide film 15. The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 22 to 27. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method according to the present embodiment, forming the diffuse reflection area 16 (S11) on the surface of the molten solder 14 jetted from the nozzle 12a is performed along the stationary member 36 disposed above the nozzle 12a. Including flowing molten solder 14. A part of the stationary member 36 is immersed in the molten solder 14. By flowing the molten solder 14 along the stationary member 36, the solder oxide film 15 is folded around the stationary member 36, and the diffuse reflection area 16 is formed on the surface of the molten solder 14 spouted from the nozzle 12a. . The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. Therefore, the diffuse reflection film 15 a is likely to diffuse and reflect more light 22 (see FIG. 16) than the solder oxide film 15.

The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 measures the first surface shape of the diffuse reflection area 16 (S12).

In the soldering method according to the present embodiment, the stationary member 36 is disposed outside the transport path of the wiring substrate 6 in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. . Therefore, the stationary member 36 is prevented from interfering with the soldering.

Referring to FIG. 26, in the first modification of the present embodiment, the diffuse reflection area forming portion 30e may include one stationary member 36. The diffuse reflection area forming unit 30 e may include three or more stationary members 36.

Referring to FIG. 27, in the second modified example of the present embodiment, stationary member 36 has a shape that is bent so that the central portion of stationary member 36 protrudes toward nozzle 12a. Since the surface of the molten solder 14 can be kept in contact with the stationary member 36 even if the height (position in the z direction) of the surface of the molten solder 14 changes, the diffuse reflection area 16 is stabilized around the stationary member 36 Can be formed.

In the third modification of the present embodiment, a diffuse reflection film 15c (FIG. 15) which is a solder oxide thick film may be formed around the stationary member 36, and the diffuse reflection region 16 is a solder oxide thick film. A certain diffuse reflection film 15c (FIG. 15) may be included.

The effects of the soldering apparatus 1 e and the soldering method of the present embodiment will be described. The soldering apparatus 1 e and the soldering method of the present embodiment have the following effects similar to the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1 e according to the present embodiment, the diffuse reflection area forming unit 30 e includes a stationary member 36. The stationary member 36 is disposed above the nozzle 12 a so that a part of the stationary member 36 is immersed in the molten solder 14. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1e of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering method according to the present embodiment, forming the diffuse reflection area 16 (S11) includes flowing the molten solder 14 along the stationary member 36 disposed above the nozzle 12a. A part of the stationary member 36 is immersed in the molten solder 14. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering apparatus 1e and the soldering method according to the present embodiment, the stationary member 36 is a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object (wiring substrate 6) to be soldered. It is arrange | positioned on the outer side of the conveyance path of a target object (wiring board 6). Therefore, the stationary member 36 is prevented from interfering with the soldering. The soldering apparatus 1e and the soldering method of the present embodiment are more appropriate by using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a ( Enable better soldering.

In the soldering apparatus 1e and the soldering method according to the present embodiment, the stationary member 36 has a shape bent so that the central portion of the stationary member 36 protrudes toward the nozzle 12a. Since the surface of the molten solder 14 can be kept in contact with the stationary member 36 even if the height (position in the z direction) of the surface of the molten solder 14 changes, the diffuse reflection area 16 is stabilized around the stationary member 36 Can be formed. The soldering apparatus 1e and the soldering method of the present embodiment are more appropriate by using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a ( Enable better soldering.

Sixth Embodiment
A soldering apparatus 1f according to a sixth embodiment will be described with reference to FIGS. 28 to 32. The soldering apparatus 1f of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

In the soldering apparatus 1 f, the diffuse reflection area forming unit 30 of the first embodiment is omitted. The measurement unit 20 is disposed on the downstream side (+ x direction) of the transport direction (x direction) of the wiring substrate 6 with respect to the nozzle 12 a.

Referring to FIGS. 28 to 30, diffuse reflection region 16 is formed by contact of a portion of wiring substrate 6 (for example, back surface 6b or front side surface 6f of wiring substrate 6) with molten solder 14 jetted from nozzle 12a. It is formed. The front side surface 6 f of the wiring substrate 6 is a side surface of the wiring substrate 6 on the side of the wiring substrate 6 in the transport direction. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film.

Specifically, the molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by the molten solder 14 contacting the gas.

A part of the wiring substrate 6 contacts the surface of the molten solder 14 while the wiring substrate 6 is transferred by the transfer unit 4. Therefore, the solder oxide film 15 is folded and a diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. The diffuse reflection film 15 a diffuses and reflects more light 22 (see FIG. 22) more easily than the solder oxide film 15. The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16. Since the measurement unit 20 is disposed downstream of the nozzle 12 a in the transport direction (x direction) of the wiring board 6, the first surface shape of the diffuse reflection area 16 is not disturbed by the wiring board 6. It can be measured.

Referring to FIGS. 29, 31 and 32, in the diffuse reflection area 16s, at least a part of the wiring board 6 (for example, the back surface 6b or the front side surface 6f of the wiring substrate 6) It is formed by contacting. The diffuse reflection area 16 s includes a diffuse reflection film 46 constituted by the residue of the flux adhering to the wiring substrate 6.

Specifically, as shown in FIG. 29, the back surface 6 b or the front side surface 6 f of the wiring substrate 6 comes in contact with the front surface of the molten solder 14 while the wiring substrate 6 is transported by the transport unit 4. As shown in FIGS. 31 and 32, the residue of the flux adhering to the wiring substrate 6 dissolves a part of the solder oxide film 15 and remains on the surface of the molten solder 14. A diffuse reflection area 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 s includes a diffuse reflection film 46 constituted by the residue of the flux adhering to the wiring substrate 6. Since the diffuse reflection film 46 formed of the residue of the flux is thicker than the solder oxide film 15, the diffuse reflection film 46 diffuses and reflects more light 22 (see FIG. 31) more easily than the solder oxide film 15.

The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16s. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16s. Using the measurement result of the first surface shape of the diffuse reflection area 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, another wiring board 6s (consecutively carried by the carrying portion 4 following the wiring board 6s ( The parts 7 mounted in FIG. 31) are soldered better (better).

The soldering method of this embodiment will be described with reference to FIGS. 28 to 33. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method according to the present embodiment, forming the diffuse reflection area 16 (S11) is a part of the wiring board 6 on the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b or front side of the wiring substrate 6). 6f) contacting. The measurement unit 20 is disposed downstream of the nozzle 12 a in the conveyance direction (x direction) of the wiring substrate 6. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film.

A solder oxide film 15 (solder natural oxide film) is formed on the surface of the molten solder 14. A part of the wiring substrate 6 contacts the surface of the molten solder 14 while the wiring substrate 6 is transferred by the transfer unit 4. Therefore, the solder oxide film 15 is folded and a diffuse reflection area 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15 a is, for example, a wrinkled solder oxide film formed by gathering together a part of the solder oxide film 15. The diffuse reflection film 15 a diffuses and reflects more light 22 (see FIG. 22) more easily than the solder oxide film 15.

The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16. Thus, the measurement unit 20 measures the first surface shape of the diffuse reflection area 16 (S12). Since the measurement unit 20 is disposed downstream of the nozzle 12 a in the transport direction (x direction) of the wiring board 6, the first surface shape of the diffuse reflection area 16 is not disturbed by the wiring board 6. It can be measured.

In the soldering method according to the present embodiment, the diffuse reflection area 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a (S31), and the first surface shape of the diffuse reflection area 16s is measured by the measuring unit 20. The method further comprises measuring (S32) and controlling the jet part 10 including the nozzle 12a (S33, S34). Controlling the jet portion 10 (S33, S34) compares the first surface shape of the diffuse reflection area 16s with the first shape reference data on the first target surface shape of the molten solder 14 jetted from the nozzle 12a. And (S34) controlling the jet portion 10 based on the comparison result between the first surface shape of the diffuse reflection area 16s and the first shape reference data.

Specifically, as shown in FIG. 29, the wiring board 6 is transported by the transport unit 4, and a part of the wiring board 6 (for example, the back surface 6 b or the front side surface 6 f of the wiring substrate 6) Contact As shown in FIGS. 31 and 32, the residue of the flux adhering to the wiring substrate 6 dissolves a part of the solder oxide film 15 and remains on the surface of the molten solder 14. A diffuse reflection area 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a (S31). That is, forming the diffuse reflection area 16s (S31) includes bringing at least a part of the wiring board 6 into contact with the molten solder 14 jetted from the nozzle 12a. The diffuse reflection area 16 s includes a diffuse reflection film 46 constituted by the residue of the flux adhering to the wiring substrate 6. Since the diffuse reflection film 46 formed of the residue of the flux is thicker than the solder oxide film 15, the diffuse reflection film 46 diffuses and reflects more light 22 (see FIG. 31) more easily than the solder oxide film 15.

The measurement unit 20 detects the light 22 diffusely reflected in the diffuse reflection area 16s. Thus, the measurement unit 20 measures the first surface shape of the diffuse reflection area 16s (S32).

Comparing the first surface shape of the diffuse reflection area 16 s with the first shape reference data on the first target surface shape of the molten solder jetted from the nozzle 12 a (S 33) And the first shape reference data relating to the first target surface shape of the molten solder 14 jetted from the nozzle 12a (S13). The control of the jet portion 10 based on the comparison result between the first surface shape of the diffuse reflection area 16s and the first shape reference data (S34) corresponds to the first surface shape of the diffuse reflection area 16 and the first surface shape It is the same as controlling the jet part 10 based on the comparison result with the shape reference data of 1 (S14).

Soldering the component 7 to another wiring substrate 6s by the molten solder 14 jetted from the nozzle 12a (S40) solders the component 7 to the wiring substrate 6 by the molten solder 14 jetted from the nozzle 12a (S40) The same as S30). Another wiring board 6s is carried by the carrying unit 4 subsequently to the wiring board 6s. Using the measurement result of the first surface shape of the diffuse reflection area 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, the component 7 mounted on another wiring board 6s is more appropriately (better To be soldered).

In the present embodiment, the first surface shape of the diffuse reflection area 16 and the first surface shape of the diffuse reflection area 16s are measured using the same measurement unit 20, but the first surface of the diffuse reflection area 16s The shape may be measured using a measuring unit (not shown) other than the measuring unit 20. This other measurement unit has the same configuration as the measurement unit 20, but may not be disposed downstream of the nozzle 12a in the conveyance direction (x direction) of the wiring substrate 6.

The effects of the soldering apparatus 1 f and the soldering method of the present embodiment will be described. The soldering apparatus 1 f and the soldering method of the present embodiment have the following effects similar to the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1f according to the present embodiment, the diffuse reflection area 16 is a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b or the front surface 6f of the wiring board 6). It is formed by contacting. The measurement unit 20 is disposed downstream of the nozzle 12 a in the transport direction (x direction) of the target (wiring substrate 6) to be soldered. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1f of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1f of the present embodiment, the diffuse reflection area 16s is at least a part of an object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b or the front side surface 6f of the wiring substrate 6) Are formed by contact. The diffuse reflection area 16s includes a diffuse reflection film 46 constituted by the residue of the flux adhering to the object to be soldered (wiring substrate 6). The soldering apparatus 1f of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S11) is a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b of the wiring substrate 6) Or including contacting the front side 6f). The measurement unit 20 is disposed downstream of the nozzle 12 a in the transport direction (x direction) of the target (wiring substrate 6) to be soldered. The diffuse reflection area 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, forming the diffuse reflection area 16s (S31) is performed by at least a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface of the wiring substrate 6) 6b) or contacting the front side 6f). The diffuse reflection area 16s includes a diffuse reflection film 46 constituted by the residue of the flux adhering to the object to be soldered (wiring substrate 6). The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

Embodiment 7
A soldering apparatus 1g according to a seventh embodiment will be described with reference to FIGS. 34 to 39. The soldering apparatus 1g of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

In the soldering apparatus 1g, the diffuse reflection area forming unit 30g includes a cylindrical member 37 provided in the nozzle 12a. The cylindrical member 37 is disposed such that the diffuse reflection area 16 is formed inside the cylindrical member 37. Specifically, the cylindrical member 37 has an inflow port 37i and an upper end opening 37j. The molten solder 14 jetted from the nozzle 12 a flows from the inflow port 37 i to the inside of the cylindrical member 37. The molten solder 14 jetted from the nozzle 12 a also flows to the outside of the cylindrical member 37. The upper end opening 37 j of the cylindrical member 37 is exposed from the molten solder 14. The cylindrical member 37 is made of a material that does not easily dissolve in the molten solder 14 such as SUS316 or titanium.

The surface of the molten solder 14 jetted from the nozzle 12a is constantly fluctuating. The inside of the cylindrical member 37 is surrounded by the cylindrical member 37. Therefore, the fluctuation of the surface of the molten solder 14 inside the cylindrical member 37 is smaller than the fluctuation of the surface of the molten solder 14 outside the cylindrical member 37. Further, the molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 outside the cylindrical member 37, but the solder oxide film is thicker than the solder oxide film 15 on the surface of the molten solder 14 inside the cylindrical member 37. A film is formed. When the solder oxide thick film is irradiated with the light 22 emitted from the measurement unit 20, interference fringes of the light 22 are formed in the solder oxide thick film, and a larger proportion of the light 22 is diffusely reflected. Thus, the solder oxide thick film functions as the diffuse reflection film 15c. The diffuse reflection area 16 includes a diffuse reflection film 15 c which is a solder oxide thick film.

The measuring unit 20 causes the light 22 to be incident from the upper end opening 37 j of the cylindrical member 37 and detects the light 22 diffused and reflected in the diffuse reflection area 16. Thus, the measurement unit 20 can measure the first surface shape of the diffuse reflection area 16.

In the soldering apparatus 1g, the cylindrical member 37 is disposed outside the transport path of the wiring substrate 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring substrate 6. Therefore, the cylindrical member 37 is prevented from interfering with the soldering. The cylindrical member 37 is disposed, for example, in the opening 12 b of the nozzle 12 a. A plurality of cylindrical members 37 may be provided in the soldering apparatus 1g. The plurality of cylindrical members 37 may be disposed along the direction (x direction) in which the molten solder 14 flows out of the nozzle 12 a. The plurality of cylindrical members 37 may be disposed along the width direction (y direction) intersecting the direction (x direction) in which the molten solder 14 flows out from the nozzle 12 a. The cylindrical member 37 is, for example, a cylindrical member. The cylindrical member 37 may be a rectangular cylindrical member or an elliptical cylindrical member.

Referring to FIGS. 36 and 37, the diffuse reflection area forming unit 30 g may further include a flow pressure reducing member 38 that reduces the flow pressure of the molten solder 14. The flow pressure reducing member 38 is provided at the inlet 37 i of the cylindrical member 37. The flow pressure reducing member 38 is configured to apply a pressure loss to the molten solder 14 flowing into the inside of the cylindrical member 37 to reduce the flow pressure of the molten solder 14. Therefore, the flow pressure reducing member 38 reduces the fluctuation of the surface of the molten solder 14 inside the cylindrical member 37. Diffuse reflection film 15c which is a solder oxide thick film can be formed in a shorter time and more reliably. The flow pressure reducing member 38 is made of a material that does not easily dissolve in the molten solder 14 such as SUS316 or titanium.

As shown in FIGS. 36 and 37, the flow pressure reducing member 38 may be formed of a plate member 39b (for example, a plate member having a punching metal structure) having a plurality of micro through holes 39a through which the molten solder 14 flows. Good. As shown in FIGS. 38 and 39, the flow pressure reducing member 38 may be composed of a plurality of plate members 39d. The plurality of plate members 39 d are arranged in a staggered manner along the longitudinal direction (z direction) of the cylindrical member 37 inside the cylindrical member 37. Each of the plurality of plate members 39d has a size smaller than the inner diameter of the cylindrical member 37, and a gap through which the molten solder 14 flows is formed between each of the plurality of plate members 39d and the inner wall of the cylindrical member 37. It is done.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 34 to 39. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S11) includes flowing the molten solder 14 into the inside of the cylindrical member 37 provided in the nozzle 12a. The cylindrical member 37 is disposed such that the diffuse reflection area 16 is formed inside the cylindrical member 37. Specifically, the cylindrical member 37 has an inflow port 37i and an upper end opening 37j. The molten solder 14 jetted from the nozzle 12 a flows from the inflow port 37 i to the inside of the cylindrical member 37. The molten solder 14 jetted from the nozzle 12 a also flows to the outside of the cylindrical member 37. The upper end opening 37 j of the cylindrical member 37 is exposed from the molten solder 14.

The surface of the molten solder 14 jetted from the nozzle 12a is constantly fluctuating. The inside of the cylindrical member 37 is surrounded by the cylindrical member 37. Therefore, the fluctuation of the surface of the molten solder 14 inside the cylindrical member 37 is smaller than the fluctuation of the surface of the molten solder 14 outside the cylindrical member 37. The molten solder 14 jetted from the nozzle 12a is exposed to a gas (for example, air) containing oxygen. Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 outside the cylindrical member 37, but the solder oxide film is thicker than the solder oxide film 15 on the surface of the molten solder 14 inside the cylindrical member 37. A film is formed. The diffuse reflection area 16 includes a diffuse reflection film 15 c which is a solder oxide thick film.

In the soldering method of the present embodiment, the cylindrical member 37 is disposed outside the transport path of the wiring substrate 6 in a plan view from the direction (z direction) in which the nozzle 12 a protrudes toward the wiring substrate 6. Therefore, the cylindrical member 37 is prevented from interfering with the soldering.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S11) further reduces the flow pressure of the molten solder 14 flowing into the cylindrical member 37 using the flow pressure reduction member 38. Including. The flow pressure reducing member 38 reduces the flow pressure of the molten solder 14 flowing into the inside of the cylindrical member 37. The flow pressure reducing member 38 reduces the fluctuation of the surface of the molten solder 14 inside the cylindrical member 37. Diffuse reflection film 15c which is a solder oxide thick film can be formed in a shorter time and more reliably.

The effects of the soldering apparatus 1g and the soldering method of the present embodiment will be described. The soldering apparatus 1g and the soldering method of the present embodiment have the following effects similar to the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1g of the present embodiment, the diffuse reflection area forming unit 30g includes a cylindrical member 37 provided in the nozzle 12a. The cylindrical member 37 is disposed such that the diffuse reflection area 16 is formed inside the cylindrical member 37. The diffuse reflection area 16 includes a diffuse reflection film 15 c composed of a solder oxide film (solder oxide thick film). The soldering apparatus 1g of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1g of the present embodiment, the cylindrical member 37 is an object to be soldered in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object to be soldered (wiring substrate 6) It is arrange | positioned on the outer side of the conveyance path of a thing (wiring board 6). Therefore, the cylindrical member 37 is prevented from interfering with the soldering. The soldering apparatus 1g of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering apparatus 1g of the present embodiment, the diffuse reflection area forming unit 30g further includes a flow pressure reducing member 38 that reduces the flow pressure of the molten solder 14. The cylindrical member 37 has an inlet 37i into which the molten solder 14 flows. The flow pressure reducing member 38 is provided at the inlet 37i. Therefore, the diffuse reflection film 15c can be formed in a shorter time and more reliably. The soldering apparatus 1g of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S11) includes flowing the molten solder 14 into the inside of the cylindrical member 37 provided in the nozzle 12a. The cylindrical member 37 is disposed such that the diffuse reflection area 16 is formed inside the cylindrical member 37. The diffuse reflection area 16 includes a diffuse reflection film 15 c composed of a solder oxide film (solder oxide thick film). The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, the cylindrical member 37 is an object to be soldered in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object to be soldered (wiring substrate 6) It is arrange | positioned on the outer side of the conveyance path of (wiring board 6). Therefore, the cylindrical member 37 is prevented from interfering with the soldering. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

In the soldering method of the present embodiment, forming the diffuse reflection area 16 (S11) further includes reducing the flow pressure of the molten solder 14 flowing into the cylindrical member 37. Therefore, the diffuse reflection film 15c can be formed in a shorter time and more reliably. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

Eighth Embodiment
A soldering apparatus 1h according to an eighth embodiment will be described with reference to FIG. The soldering apparatus 1h of the present embodiment has the same configuration as that of the soldering apparatus 1 of the first embodiment, and exhibits the same effect, but mainly differs in the following points.

The soldering apparatus 1 h further includes a blower 50. The blower unit 50 is configured to blow air toward the measurement unit 20. The blower 50 may blow air in parallel with the transport path of the wiring substrate 6. The blower unit 50 is, for example, an axial flow fan, a centrifugal fan, a mixed flow fan, or a cross flow fan. Due to the radiant heat from the molten solder 14, the temperature of the measurement unit 20 may rise excessively, and the measurement unit 20 may fail or malfunction. The blower unit 50 cools the measurement unit 20 by blowing air toward the measurement unit 20 to prevent the measurement unit 20 from malfunctioning or malfunctioning. Furthermore, the blower unit 50 prevents the dust of the residue of the flux and the dust of the solder oxide that are scattered in the housing 3 from adhering to the measurement unit 20. Therefore, the first surface shape of the diffuse reflection area 16 can be accurately and stably measured using the measurement unit 20. The soldering apparatus 1h of the present embodiment is more appropriate (better) using the measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Enable soldering.

The soldering method of this embodiment will be described with reference to FIGS. 11 and 40. The soldering method of the present embodiment includes the same steps as those of the soldering method of the first embodiment, and exhibits the same effect, but differs in the following points.

The soldering method of the present embodiment further includes blowing air toward the measuring unit 20 using the air blowing unit 50. The first surface shape of the diffuse reflection area 16 may be measured (S12) using the measuring unit 20 while blowing air toward the measuring unit 20. By blowing air toward the measurement unit 20, the measurement unit 20 is cooled, and the measurement unit 20 is prevented from malfunctioning or malfunctioning. It is possible to prevent the dust of the residue of the flux and the dust of the solder oxide which are scattered in the housing 3 from adhering to the measurement unit 20. Therefore, the first surface shape of the diffuse reflection area 16 can be accurately and stably measured using the measurement unit 20. The soldering method of the present embodiment uses a measurement result of the first surface shape of the diffuse reflection area 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, and more appropriate (better) solder Make it possible.

It should be understood that Embodiment 1-8 disclosed this time is illustrative in all points and not restrictive. As long as there is no contradiction, at least two of the embodiments 1-8 disclosed herein may be combined. For example, the blower 50 of the eighth embodiment may be further provided to the soldering apparatus 1b-1g of the second embodiment. The measurement unit 20 of Embodiment 3-8 may be replaced with the measurement unit 20b of Embodiment 2. The scope of the present invention is shown not by the above description but by the scope of claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of claims.

1, 1b, 1c, 1d, 1e, 1f, 1h Soldering device, 3 housings, 4 transport parts, 4a arms, 6, 6s wiring board, 6a front side, 6b back side, 6c side, 6f Front side, 7 parts, 9 preheating unit, 9h second heater, 9s temperature sensor, 10 jets, 10s solder tank, 11 duct, 11a opening, 11b bottom, 11f post, 11h bolt, 11t top, 12 nozzle , 12a nozzle, 12b opening, 12c guide plate, 12d plate portion, 12m center line, 12e hole, 13h first heater, 13m motor, 13n impeller, 13p pump, 14 molten solder, 15 solder oxide film, 15a, 15c, 46 Diffuse reflective film, 16, 16s diffuse reflective area, 18 lifter, 20, 20b measuring part 21 and 21b Light source unit 22, 22b light, 23, 23b Light detection unit 30, 30c, 30d, 30e and 30g Diffuse reflection area forming unit 31, 31d member, 32 driving unit, 32d vibrator, 33 connection unit, 34 gas, 35 gas spraying unit, 36 stationary member, 37 cylindrical member, 37i inlet, 37j upper end opening, 38 flow pressure reducing member, 39a minute through hole, 39b, 39d plate member, 40 control unit, 41 display unit, 43 Memory, 50 blowers.

Claims

A jet part including a nozzle,
A measuring unit configured to measure a first surface shape of a diffuse reflection area formed on a surface of molten solder jetted from the nozzle.
The soldering apparatus according to claim 1, further comprising a diffuse reflection area forming unit configured to form the diffuse reflection area on the surface of the molten solder.
The diffuse reflection area forming unit includes a member and a driving unit,
The driving unit is configured to move the member in one direction along the surface of the molten solder while immersing at least a part of the member in the molten solder,
The soldering apparatus according to claim 2, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The diffuse reflection area forming portion includes a member and a vibrator,
The vibrator is configured to vibrate the member along the surface of the molten solder while immersing at least a part of the member in the molten solder,
The soldering apparatus according to claim 2, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The member extends along the transport direction of the object to be soldered,
The said member is comprised so that the back surface of the said object to be soldered may be contacted, The said back surface is a surface of the said object to be soldered which opposes the said molten solder. Soldering equipment.
The diffuse reflection area forming portion includes a gas spraying portion configured to selectively spray a gas containing oxygen onto a part of the surface of the molten solder,
The soldering apparatus according to claim 2, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The diffuse reflection area forming unit includes a stationary member,
The stationary member is disposed above the nozzle such that a portion of the stationary member is immersed in the molten solder;
The soldering apparatus according to claim 2, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The solder according to claim 7, wherein the stationary member is disposed outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle protrudes toward the object to be soldered. Attachment device.
The soldering apparatus according to claim 7 or 8, wherein the stationary member has a bent shape such that a central portion of the stationary member protrudes toward the nozzle.
The diffuse reflection area forming unit includes a cylindrical member provided in the nozzle,
The cylinder member is disposed such that the diffuse reflection area is formed inside the cylinder member,
The soldering apparatus according to claim 2, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The solder according to claim 10, wherein the cylindrical member is disposed outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle projects toward the object to be soldered. Attachment device.
The diffuse reflection area forming unit further includes a flow pressure reducing member for reducing the flow pressure of the molten solder,
The cylindrical member has an inlet through which the molten solder flows,
The soldering apparatus according to claim 10, wherein the flow pressure reducing member is provided at the inlet.
The diffuse reflection area is formed by contact of a part of an object to be soldered to the molten solder jetted from the nozzle;
The measurement unit is disposed downstream of the nozzle in the transport direction of the object to be soldered,
The soldering apparatus according to claim 1, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The diffuse reflection area is formed by contacting at least a part of an object to be soldered to the molten solder jetted from the nozzle,
The soldering apparatus according to claim 1, wherein the diffusive reflection area includes a diffusive reflection film constituted by a residue of flux adhering to the object to be soldered.
The measurement unit includes a light source unit configured to irradiate light to the diffuse reflection area, and a light detection unit configured to detect the light diffusely reflected by the diffuse reflection area. ,
The soldering according to any one of claims 1 to 14, wherein the light detection unit is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection area. apparatus.
The soldering apparatus according to any one of claims 1 to 15, further comprising a blower configured to blow air toward the measurement unit.
Further comprising a control unit,
The said control part is comprised so that the said jet-stream part may be controlled based on the said 1st surface shape of the said diffuse reflection area | region obtained by the said measurement part. The soldering apparatus described in the paragraph.
The memory further includes first shape reference data related to a first target surface shape of the molten solder jetted from the nozzle.
The control unit is configured to compare the first surface shape of the diffuse reflection area obtained by the measurement unit with the first shape reference data.
The control unit is configured to control the jet flow portion based on a comparison result between the first surface shape of the diffuse reflection area and the first shape reference data. Soldering device as described.
The measuring unit is configured to further measure a second surface shape of the nozzle;
The soldering apparatus according to claim 17, wherein the control unit is configured to control the nozzle based on the second surface shape of the nozzle obtained by the measurement unit.
Forming a diffuse reflection area on the surface of the molten solder jetted from the nozzle;
Measuring the first surface shape of the diffuse reflection area by a measurement unit.
Forming the diffusive reflection area includes moving the member in one direction along the surface of the molten solder while immersing at least a portion of the member in the molten solder,
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
Forming the diffuse reflection area includes vibrating the member along the surface of the molten solder while immersing at least a portion of the member in the molten solder,
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The member extends along the transport direction of the object to be soldered,
The object to be soldered is transported while the back surface of the object to be soldered is in contact with the member, and the back surface is the surface of the object to be soldered that faces the molten solder. The soldering method according to claim 22.
Forming the diffusive reflection area includes spraying a gas containing oxygen selectively on a part of the surface of the molten solder,
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
Forming the diffuse reflection area may include flowing the molten solder along a stationary member disposed above the nozzle,
A part of the stationary member is immersed in the molten solder;
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The solder according to claim 25, wherein the stationary member is disposed outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle projects toward the object to be soldered. How to attach.
The soldering method according to claim 25 or 26, wherein the stationary member has a bent shape such that a central portion of the stationary member protrudes toward the nozzle.
Forming the diffusive reflection area includes flowing the molten solder into a cylindrical member provided in the nozzle,
The cylinder member is disposed such that the diffuse reflection area is formed inside the cylinder member,
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
The solder according to claim 28, wherein the cylindrical member is disposed outside the transport path of the object to be soldered in a plan view from the direction in which the nozzle projects toward the object to be soldered. How to attach.
30. The soldering method according to claim 28, wherein forming the diffuse reflection area further includes reducing flow pressure of the molten solder flowing into the cylindrical member.
Forming the diffuse reflection area includes contacting a part of an object to be soldered to the molten solder jetted from the nozzle;
The measurement unit is disposed downstream of the nozzle in the transport direction of the object to be soldered,
The soldering method according to claim 20, wherein the diffuse reflection area includes a diffuse reflection film formed of a solder oxide film.
Forming the diffuse reflection area includes contacting at least a part of an object to be soldered to the molten solder jetted from the nozzle;
21. The soldering method according to claim 20, wherein the diffusive reflection area includes a diffusive reflection film constituted by a residue of flux adhering to the object to be soldered.
Measuring the first surface shape of the diffuse reflection area includes irradiating the diffuse reflection area with light, and detecting the light diffusely reflected by the diffuse reflection area,
33. The soldering according to any one of claims 20 to 32, wherein detecting the diffusely reflected light includes imaging the first surface shape of the diffuse reflection area by an imaging unit. Method.
34. The soldering method according to any one of claims 20 to 33, further comprising blowing air toward the measurement unit.
The control method according to any one of claims 20 to 34, further comprising controlling a jet portion including the nozzle based on the first surface shape of the diffuse reflection area obtained by the measurement unit. Soldering method.
Controlling the jet flow portion comprises comparing the first surface shape of the diffuse reflection area with first shape reference data on a first target surface shape of the molten solder jetted from the nozzle; 36. The soldering method according to claim 35, comprising: controlling the jet portion based on a comparison result between the first surface shape of the diffuse reflection area and the first shape reference data.
Measuring a second surface shape of the nozzle by the measurement unit;
37. The soldering method according to claim 35, further comprising: controlling the nozzle based on the second surface shape of the nozzle obtained by the measurement unit.