JP6844021B2 - Soldering equipment, soldering method and manufacturing method of wiring board with parts - Google Patents

Description

The present invention relates to a soldering apparatus and a soldering method.

International Publication No. 2013/111651 (Patent Document 1) discloses a method for measuring the height of molten solder jetted from a nozzle. In Patent Document 1, the height of the molten solder jetted from the nozzle is measured by using a conductive gauge member.

International Publication No. 2013/111651

However, even if the height of the molten solder jetted from the nozzle is the same, if the surface shape of the molten solder jetted from the nozzle changes, the contact between the molten solder and the object to be soldered such as a printed circuit board The aspect of is changed. Therefore, soldering defects may occur. An object of the present invention is to provide a soldering apparatus and a soldering method that enable more appropriate soldering.

The soldering apparatus of the present invention includes a jet unit and a measuring unit. The jet section includes a nozzle. The measuring unit is configured to measure the first surface shape of the diffuse reflection region formed on the surface of the molten solder jetted from the nozzle.

The soldering method of the present invention includes forming a diffuse reflection region on the surface of the molten solder jetted from a nozzle, and measuring the first surface shape of the diffuse reflection region by a measuring unit.

The first surface shape of the diffuse reflection region follows the surface shape of the molten solder jetted from the nozzle. By measuring the first surface shape of the diffuse reflection region by the measuring unit, the surface shape of the molten solder jetted from the nozzle can be measured. The soldering apparatus and soldering method of the present invention enable more appropriate soldering by using the measurement result of the first surface shape of the diffuse reflection region corresponding to the surface shape of the molten solder jetted from the nozzle.

It is the schematic perspective view of the soldering apparatus which concerns on Embodiment 1. FIG. It is the schematic sectional drawing of the soldering apparatus which concerns on Embodiment 1. FIG. It is the schematic sectional drawing of the soldering apparatus which concerns on Embodiment 1. FIG. It is schematic sectional drawing of the soldering apparatus which concerns on one modification of Embodiment 1. FIG. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 1. FIG. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the first embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the first embodiment. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 1. FIG. It is a schematic partial enlarged perspective view which shows the process of measuring the 2nd surface shape of a nozzle by using the soldering apparatus which concerns on Embodiment 1. FIG. It is a control block diagram of the soldering apparatus which concerns on Embodiment 1. FIG. It is a figure which shows the flowchart of the soldering method which concerns on Embodiment 1, Embodiment 5, Embodiment 7, and Embodiment 8. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 2. FIG. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 2. FIG. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 3. FIG. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 3. FIG. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 4. FIG. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the fourth embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the fourth embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the fourth embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the fourth embodiment. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 4. FIG. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 5. FIG. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 5. FIG. It is a schematic partial enlarged plan view of the soldering apparatus which concerns on Embodiment 5. FIG. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 5. FIG. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on 1st modification of Embodiment 5. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on the 2nd modification of Embodiment 5. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 6. FIG. 5 is a schematic partially enlarged perspective view showing a step of forming a diffuse reflection region using the soldering apparatus according to the sixth embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the sixth embodiment. FIG. 5 is a schematic partially enlarged perspective view showing a step of forming a diffuse reflection region using the soldering apparatus according to the sixth embodiment. FIG. 5 is a schematic partially enlarged cross-sectional view showing a step of forming a diffuse reflection region using the soldering apparatus according to the sixth embodiment. It is a figure which shows the flowchart of the soldering method which concerns on Embodiment 6. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on Embodiment 7. FIG. It is a schematic partial enlarged sectional view of the soldering apparatus which concerns on Embodiment 7. FIG. FIG. 5 is a schematic partial enlarged cross-sectional view of a diffuse reflection region forming portion included in the soldering apparatus according to the seventh embodiment. FIG. 5 is an enlarged bottom view of a schematic portion of a diffuse reflection region forming portion included in the soldering apparatus according to the seventh embodiment. FIG. 5 is a schematic partial enlarged cross-sectional view of a diffuse reflection region forming portion included in the soldering apparatus according to the seventh embodiment. FIG. 5 is an enlarged bottom view of a schematic portion of a diffuse reflection region forming portion included in the soldering apparatus according to the seventh embodiment. It is a schematic partial enlarged perspective view of the soldering apparatus which concerns on embodiment 8.

Hereinafter, embodiments of the present invention will be described. The same reference number will be assigned to the same configuration, and the description will not be repeated.

Embodiment 1.
The soldering apparatus 1 according to the first embodiment will be described with reference to FIGS. 1 to 10.

The soldering apparatus 1 mainly includes a jet unit 10 including a nozzle 12a, a diffuse reflection region forming unit 30 (see FIG. 5), and a measuring unit 20. The soldering device 1 may further include a transport unit 4, a preheating unit 9, a housing 3, a display unit 41, a control unit 40 (see FIG. 10), and a memory 43 (see FIG. 10). Good.

The transport unit 4 transports the wiring board 6 above the nozzle 12a. The transport unit 4 may be, for example, a conveyor. In the soldering device 1, the molten solder 14 ejected from the nozzle 12a is brought into contact with the back surface 6b of the wiring board 6, and the component 7 mounted on the front surface 6a of the wiring board 6 is attached to the back surface 6b of the wiring board 6. It may be soldered to the electrical wiring provided above. The component 7 may be an electronic component such as a capacitor or a resistor, for example. The wiring board 6 may be a printed circuit board.

The molten solder 14 may be composed of a tin-based solder alloy such as tin-lead or tin-silver-copper. The molten solder 14 may be composed of, for example, a tin-copper alloy, a tin-silver alloy, or a solder alloy obtained by adding antimony, bismuth, nickel, germanium, or the like to these alloys.

As shown in FIGS. 1 to 3, the jet portion 10 includes a solder tank 10s in which the molten solder 14 is stored, a duct 11, a nozzle portion 12, and a pump 13p. The duct 11 is locked or fixed to the solder tank 10s. The duct 11 includes a top portion 11t and a bottom portion 11b. The duct 11 has an opening 11a at the bottom 11b. The duct 11 communicates with the solder tank 10s through the opening 11a. The pump 13p sends the molten solder 14 stored in the solder tank 10s to the duct 11 and the nozzle 12a. The pump 13p may include an impeller 13n and a motor 13m connected to the impeller 13n. The impeller 13n is arranged in the duct 11. The impeller 13n may be arranged so as to face the opening 11a. When the motor 13m rotates the impeller 13n, the molten solder 14 is sent out from the solder tank 10s to the duct 11 and the nozzle 12a.

As shown in FIG. 5, the nozzle portion 12 includes the nozzle 12a. The nozzle 12a projects in the height direction (z direction). The height direction (z direction) is the direction in which the molten solder 14 is ejected from the nozzle 12a toward the wiring board 6. The molten solder 14 is jetted from the opening 12b of the nozzle 12a. The opening 12b of the nozzle 12a may have the shape of an elongated rectangle or slit. The opening 12b of the nozzle 12a may extend along the width direction (y direction) intersecting the transport direction (x direction) and the height direction (z direction) of the wiring board 6. The molten solder 14 flows out from the nozzle 12a toward the upstream side (−x direction) and the downstream side (+ x direction) of the wiring board 6 in the transport direction. The opening 12b of the nozzle 12a may have a circular shape. The nozzle 12a is covered with the molten solder 14 jetted from the nozzle 12a.

As shown in FIGS. 2 and 3, the nozzle 12a may be configured such that the relative height d of the nozzle 12a with respect to the wiring board 6 changes. The nozzle 12a may be configured so that the relative height of the nozzle 12a with respect to the conveying portion 4 changes. The nozzle 12a may be configured such that the relative height of the nozzle 12a with respect to the duct 11 changes. The nozzle 12a may be provided on the top 11t of the duct 11 so as to move with respect to the duct 11.

Specifically, the duct 11 may include a support column 11f extending in the height direction (z direction) and a bolt 11h provided at an end portion of the support column 11f. The nozzle portion 12 includes a plate portion 12d having a hole 12e. The plate portion 12d extends in the width direction (y direction) intersecting the height direction (z direction) and the transport direction (x direction) of the wiring board 6. The bolt 11h is inserted into the hole 12e. By rotating the bolt 11h, the bolt 11h can move in the height direction (z direction) with respect to the support column 11f. The nozzle 12a (nozzle portion 12) can move in the height direction (z direction) together with the bolt 11h. In this way, the relative height d of the nozzle 12a (nozzle portion 12) with respect to the wiring board 6 can be changed.

As shown in FIG. 4, in one modification of the present embodiment, the elevating part 18 may be provided below the jet part 10. The elevating part 18 moves the jet part 10 in the height direction (z direction). In this way, the relative height d of the nozzle 12a with respect to the wiring board 6 may be changed.

As shown in FIG. 5, the nozzle portion 12 may include a guide plate 12c. The guide plate 12c extends from the nozzle 12a along the transport direction (x direction) of the wiring board 6. The guide plate 12c guides the molten solder 14 jetted from the nozzle 12a along the transport direction (x direction) of the wiring board 6. The guide plate 12c may be configured so that the mounting position with respect to the nozzle 12a (the height relative to the top of the nozzle 12a) changes. The guide plate 12c may be configured so that the length of the wiring board 6 in the transport direction (x direction) changes.

As shown in FIGS. 2 and 3, the jet portion 10 may further include a first heater 13h in the solder bath 10s. The first heater 13h heats the molten solder 14 to keep the solder in a molten state.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIG. 6, a solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by contacting the molten solder 14 jetted from the nozzle 12a with this gas. The natural oxide film of the solder may have a thickness of about 2 nm to about 3 nm. The solder oxide film 15 may be, for example, a tin oxide film.

As shown in FIGS. 5 to 7, the diffuse reflection region forming portion 30 is configured to form a diffuse reflection region 16 on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region forming portion 30 may be configured to selectively form the diffuse reflection region 16 on a part of the surface of the molten solder 14 jetted from the nozzle 12a.

The diffuse reflection region forming unit 30 may include a member 31 and a driving unit 32 configured to move the member 31. The member 31 is configured to move with respect to the nozzle 12a. The member 31 may be connected to the drive unit 32 via the connecting unit 33. The member 31 may be, for example, a plate member. The drive unit 32 may be, for example, a motor.

The drive unit 32 is configured to move the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. Specifically, the drive unit 32 moves the member 31 in the height direction (z direction). As shown in FIG. 6, the member 31 penetrates the solder oxide film 15 formed on the surface of the molten solder 14, and a part of the member 31 is immersed in the molten solder 14. Subsequently, as shown in FIG. 7, the drive unit 32 moves the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. .. Specifically, the drive unit 32 has a width at which at least a part of the member 31 is immersed in the molten solder 14 and intersects in the height direction (z direction) and the direction in which the molten solder 14 flows out from the nozzle 12a (x direction). The member 31 may be moved along the direction (y direction).

The solder oxide film 15 is folded over, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film, and the diffuse reflection region forming portion 30 is a diffuse reflection film forming portion. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15.

The diffuse reflection region 16 may extend linearly or curvedly on the surface of the molten solder 14. Specifically, the diffuse reflection region 16 may extend along the direction in which the molten solder 14 flows out from the nozzle 12a. The diffuse reflection region 16 may extend from the nozzle 12a toward at least one of the upstream direction (−x direction) and the downstream direction (+ x direction) of the wiring board 6 in the transport direction.

As shown in FIG. 8, the measuring unit 20 is configured to measure the first surface shape of the diffuse reflection region 16. In the present specification, the surface shape also includes the position of the surface. The measuring unit 20 may be an optical measuring unit. Specifically, the measuring unit 20 is configured to detect the light source unit 21 configured to irradiate the diffuse reflection region 16 with light 22 and the light 22 diffusely reflected by the diffuse reflection region 16. The light detection unit 23 may be included. The measuring unit 20 may be, for example, a laser displacement meter, or specifically a two-dimensional laser displacement meter.

The light source unit 21 may be, for example, a semiconductor laser. The light source unit 21 may emit the light 22 to be scanned. Specifically, the light 22 emitted from the light source unit 21 may be scanned along the transport direction (x direction) and the width direction (y direction) of the wiring board 6.

The light 22 emitted from the light source unit 21 is diffusely reflected in the diffuse reflection region 16. The diffuse reflection region 16 has a larger ratio of diffuse reflection and a smaller ratio of specular reflection than the solder oxide film 15 in the region adjacent to the diffuse reflection region 16. The ratio of diffuse reflection on the surface means the ratio of light reflected in a direction different from the incident direction to the light vertically incident on the surface. The ratio of specular reflection of a surface means the ratio of light reflected in the incident direction of the light to the light vertically incident on the surface.

The light detection unit 23 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16. The photodetector 23 may be, for example, a CMOS position sensor. The measuring unit 20 may measure the first surface shape of the diffuse reflection region 16 by a triangulation method. Specifically, by detecting the light 22 diffusely reflected in the diffuse reflection region 16 by the light detection unit 23, information on the angle and distance of the surface of the diffuse reflection region 16 with respect to the light detection unit 23 can be obtained. Based on this information, the first surface shape of the diffuse reflection region 16 can be measured.

The diffuse reflection region 16 (diffuse reflection film 15a) is suspended on the surface of the molten solder 14. The first surface shape of the diffuse reflection region 16 (diffuse reflection film 15a) follows the surface shape of the molten solder 14. The first surface shape of the diffuse reflection region 16 (diffuse reflection film 15a) can be regarded as substantially equivalent to the surface shape of the molten solder 14. The surface shape of the molten solder 14 can be measured by measuring the first surface shape of the diffuse reflection region 16 (diffuse reflection film 15a) using the measuring unit 20.

The surface of the molten solder 14 jetting from the nozzle 12a is constantly swaying. Therefore, it is difficult to accurately measure the surface shape of the molten solder 14 jetted from the nozzle 12a by receiving the light mirror-reflected by the solder oxide film 15 that does not include the diffuse reflection region 16 by the light detection unit 23. is there. On the other hand, in the present embodiment, the measuring unit 20 detects the light 22 that is diffusely reflected in the diffuse reflection region 16 (diffuse reflection film 15a). Even if the surface of the molten solder 14 jetted from the nozzle 12a fluctuates, the light 22 diffusely reflected in the diffuse reflection region 16 can be stably received by the photodetector 23. The surface shape of the molten solder 14 jetted by the diffusely reflected light 22 in the diffuse reflection region 16 can be accurately and easily measured.

By observing the diffuse reflection region 16 (diffuse reflection film 15a), the measuring unit 20 can be easily positioned with respect to the molten solder 14 jetted from the nozzle 12a. Even if the molten solder 14 is jetted, the diffuse reflection region 16 (diffuse reflection film 15a) hardly moves. This is because the solder oxide film 15 functions as a wall with respect to the molten solder 14 which can be regarded as a viscous fluid, and the viscous fluid generally has a flow velocity of substantially zero in the vicinity of the wall. Therefore, the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 can be measured accurately and easily.

When the wiring board 6 is conveyed above the nozzle 12a in order to solder the component 7 to the wiring board 6, the diffuse reflection film 15a is swept away by the wiring board 6. Therefore, the diffuse reflection film 15a does not adversely affect the soldering of the component 7 to the wiring board 6. The drive unit 32 pulls up the member 31 from the molten solder 14 before, for example, the measuring unit 20 measures the first surface shape of the diffuse reflection region 16. The drive unit 32 may pull up the member 31 from the molten solder 14 after the first surface shape of the diffuse reflection region 16 is measured.

As shown in FIG. 9, the measuring unit 20 may be configured to further measure the second surface shape of the nozzle 12a. The position and shape of the nozzle 12a can be measured by the measuring unit 20 before the molten solder 14 is jetted from the nozzle 12a. Therefore, the nozzle 12a having an appropriate shape can be accurately positioned with respect to the wiring board 6.

As shown in FIG. 10, the control unit 40 is configured to control the jet unit 10 based on the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20. In the present specification, controlling the jet unit 10 means the rotation speed of the motor 13m connected to the pump 13p, the temperature of the first heater 13h, the relative height of the nozzle 12a with respect to the wiring substrate 6, and the nozzle 12a. It means adjusting at least one of the relative height of the guide plate 12c with respect to the top and the length of the guide plate 12c.

Specifically, the memory 43 stores the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a. The control unit 40 is configured to compare the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20 with the first shape reference data. The control unit 40 is configured to control the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection region 16 and the first shape reference data. The control unit 40 may control the jet unit 10 so that the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20 matches the first shape reference data.

The control unit 40 may be configured to control the nozzle 12a based on the second surface shape of the nozzle 12a obtained by the measurement unit 20. In the present specification, controlling the nozzle 12a means at least one of the relative height of the nozzle 12a with respect to the wiring board 6, the relative height of the guide plate 12c with respect to the top of the nozzle 12a, and the length of the guide plate 12c. Means to adjust one.

Specifically, the memory 43 stores the second shape reference data regarding the second target surface shape of the nozzle 12a. The control unit 40 is configured to compare the second surface shape of the nozzle 12a obtained by the measurement unit 20 with the second shape reference data. The control unit 40 is configured to control the nozzle 12a based on the comparison result between the second surface shape of the nozzle 12a and the second shape reference data. The control unit 40 may control the nozzle 12a so that the second surface shape of the nozzle 12a obtained by the measurement unit 20 matches the second shape reference data of the nozzle 12a. Data regarding the type of the wiring board 6 may be further stored in the memory 43.

As shown in FIGS. 1 and 4, the preheating unit 9 is arranged on the upstream side (−x direction) of the wiring board 6 in the transport direction (x direction) with respect to the nozzle 12a. Prior to soldering in the jet section 10, the preheating section 9 heats the wiring board 6. The preheating unit 9 includes a second heater 9h and a temperature sensor 9s. The wiring board 6 is heated in the preheating section 9 while being conveyed in the preheating section 9 by the transport section 4. The second heater 9h heats the wiring board 6 conveyed into the preheating unit 9. The temperature sensor 9s detects the temperature inside the preheating unit 9. As shown in FIG. 10, the preheating unit 9 may be connected to the control unit 40. The control unit 40 may control the preheating unit 9. The control unit 40 may receive the output of the temperature sensor 9s and control the second heater 9h based on the output of the temperature sensor 9s.

As shown in FIG. 1, the housing 3 houses a jet unit 10, a measuring unit 20, and a preheating unit 9. A part of the transport unit 4 and the control unit 40 are also housed in the housing 3. The control unit 40 may control the transport unit 4. For example, the control unit 40 may control the transfer speed of the wiring board 6 by the transfer unit 4.

As shown in FIG. 1, the display unit 41 is provided on the housing 3. As shown in FIG. 10, the display unit 41 is connected to the control unit 40. The control unit 40 has a first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20, a second surface shape of the nozzle 12a, a rotation speed of the motor 13m connected to the pump 13p, and a first heater 13h. Temperature, temperature of second heater 9h, relative height of nozzle 12a with respect to wiring board 6, relative height of guide plate 12c with respect to top of nozzle 12a, length of guide plate 12c, type of wiring board 6 And the data including the transfer speed of the wiring board 6 in the transfer unit 4 is output to the display unit 41. The display unit 41 displays these data.

The soldering method of the present embodiment will be described with reference to FIGS. 5 to 11.
The soldering method of the present embodiment includes forming a diffuse reflection region 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11). The diffuse reflection region 16 may be selectively formed on a part of the surface of the molten solder 14 jetted from the nozzle 12a.

As shown in FIGS. 5 to 7, forming the diffuse reflection region 16 (S11) causes the member 31 to be immersed along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. It may include moving in one direction. Specifically, the drive unit 32 moves the member 31 in the height direction (z direction). As shown in FIG. 6, the member 31 penetrates the solder oxide film 15 formed on the surface of the molten solder 14, and a part of the member 31 is immersed in the molten solder 14. Subsequently, as shown in FIG. 7, the drive unit 32 moves the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. .. Specifically, the drive unit 32 may move the member 31 along the width direction (y direction) while immersing at least a part of the member 31 in the molten solder 14.

The solder oxide film 15 is folded over, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16 may include a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15.

The soldering method of the present embodiment includes measuring the first surface shape of the diffuse reflection region 16 by the measuring unit 20 (S12). As shown in FIG. 8, measuring the first surface shape of the diffuse reflection region 16 (S12) involves irradiating the diffuse reflection region 16 with light 22 and the light diffusely reflected by the diffuse reflection region 16. It may include detecting 22.

The diffuse reflection region 16 (diffuse reflection film 15a) is suspended on the surface of the molten solder 14. The first surface shape of the diffuse reflection region 16 follows the surface shape of the molten solder 14. The first surface shape of the diffuse reflection region 16 (diffuse reflection film 15a) can be regarded as substantially equivalent to the surface shape of the molten solder 14. By measuring the first surface shape of the diffuse reflection region 16 (diffuse reflection film 15a) using the measuring unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be measured. After the first surface shape of the diffuse reflection region 16 is measured by the measuring unit 20, the driving unit 32 may pull the member 31 from the molten solder 14.

The soldering method of the present embodiment further comprises controlling the jet portion 10 including the nozzle 12a (S13, S14) based on the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20. May be good. Controlling the jet portion 10 (S13, S14) compares the first surface shape of the diffuse reflection region 16 with the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a. This may include (S13) and controlling the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection region 16 and the first shape reference data (S14). The first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a is, for example, past data regarding the surface shape of the molten solder 14 jetted from the nozzle 12a immediately after cleaning the nozzle 12a described later. It may be.

Specifically, the memory 43 stores the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a. The control unit 40 compares the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20 with the first shape reference data stored in the memory 43. The control unit 40 controls the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection region 16 and the first shape reference data.

Specifically, the control unit 40 is jetted so that the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 matches the first shape reference data of the molten solder 14 ejected from the nozzle 12a. 10 may be controlled. When the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 does not match the first shape reference data of the molten solder 14 jetted from the nozzle 12a (in the case of NG1 in FIG. 11), the jetting unit 10 (S14), and then, from step (S11) to step (S13), it is confirmed whether or not the first surface shape of the diffuse reflection region 16 matches the first shape reference data. Steps (S11) to (S14) are repeated until the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 matches the first shape reference data of the molten solder 14 jetted from the nozzle 12a.

After matching the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 with the first shape reference data, the component 7 is soldered to the wiring board 6 by the molten solder 14 jetted from the nozzle 12a (). S30). Specifically, the wiring board 6 is conveyed above the nozzle 12a by the conveying unit 4. The component 7 mounted on the front surface 6a of the wiring board 6 is provided on the back surface 6b of the wiring board 6 by bringing the molten solder 14 jetted from the nozzle 12a into contact with the back surface 6b of the wiring board 6. Soldered to electrical wiring.

When the soldering apparatus 1 is used many times, solder oxide is deposited in the opening 12b of the nozzle 12a. This deposited solder oxide impedes the flow of the molten solder 14 in the opening 12b of the nozzle 12a, causing poor soldering. To remove the deposited solder oxide, the nozzle 12a is removed from the soldering apparatus 1 and disassembled and cleaned. After cleaning the nozzle 12a, the nozzle 12a is reassembled and attached to the soldering apparatus 1. When assembling the nozzle 12a, an assembly error may occur. When the nozzle 12a is attached to the soldering apparatus 1, an attachment error may occur. Due to these errors, the surface shape of the molten solder 14 jetted from the nozzle 12a after cleaning may be different from the surface shape of the molten solder 14 jetted from the nozzle 12a before cleaning. These errors can cause solder defects after cleaning the nozzle 12a.

As shown in FIG. 11, in order to prevent these errors from occurring, the soldering method of the present embodiment measures the second surface shape of the nozzle 12a by the measuring unit 20 (S21) and the measuring unit. It may further include controlling the nozzle 12a (S22, S23) based on the second surface shape of the nozzle 12a obtained by 20.

In the step (S21) of measuring the second surface shape of the nozzle 12a by the measuring unit 20, as shown in FIG. 9, the second surface shape of the nozzle 12a is formed without jetting the molten solder 14 from the nozzle 12a. It may be measured by the measuring unit 20. The nozzle 12a is made of, for example, stainless steel whose surface is nitrided. The nozzle 12a has a larger ratio of diffuse reflection on the surface and a smaller ratio of specular reflection on the surface than the solder oxide film 15. Therefore, the second surface shape of the nozzle 12a can be directly measured by the measuring unit 20.

Controlling the nozzle 12a (S22, S23) is to compare the second surface shape of the nozzle 12a with the second shape reference data regarding the second target surface shape of the nozzle 12a (S22) and the nozzle. Controlling the nozzle 12a based on the result of comparison between the second surface shape of 12a and the second shape reference data (S23) may be included. The second shape reference data regarding the second target surface shape of the nozzle 12a may be, for example, past data regarding the second surface shape of the nozzle 12a immediately after cleaning the nozzle 12a.

Specifically, the memory 43 stores the second shape reference data regarding the second target surface shape of the nozzle 12a. The control unit 40 compares the second surface shape of the nozzle 12a obtained by the measurement unit 20 with the second shape reference data stored in the memory 43. The control unit 40 controls the nozzle 12a based on the comparison result between the second surface shape of the nozzle 12a and the second shape reference data.

Specifically, the control unit 40 may control the nozzle 12a so that the second surface shape of the nozzle 12a obtained by the measurement unit 20 matches the second shape reference data of the nozzle 12a. When the second surface shape of the nozzle 12a obtained by the measuring unit 20 does not match the second shape reference data of the nozzle 12a (in the case of NG3 of FIG. 11), the nozzle 12a is controlled (S23), and then By the step (S21) and the step (S22), it is confirmed whether or not the second surface shape of the nozzle 12a matches the second shape reference data. Steps (S21) to (S23) are repeated until the second surface shape of the nozzle 12a obtained by the measuring unit 20 matches the second shape reference data of the nozzle 12a. After matching the second surface shape of the nozzle 12a obtained by the measuring unit 20 with the second shape reference data of the nozzle 12a, the molten solder 14 is jetted from the nozzle 12a and diffusely reflected on the surface of the molten solder 14. The region 16 is formed (S11).

As shown in FIG. 11, when the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 cannot be matched with the first shape reference data only by the steps (S11) to (S14) ( In the case of NG2 in FIG. 11), the nozzle 12a is controlled again by the steps (S21) to the step (S23), and then the first surface of the diffuse reflection region 16 is controlled by the steps (S11) to the step (S14). The shape may be matched with the first shape reference data.

When the type of the wiring board 6 is changed, the same process as in the case of disassembling and cleaning the nozzle 12a may be performed. Specifically, when the type of the wiring board 6 is changed, the process (S21) to the process (S23) are performed. The nozzle 12a is controlled so that the second surface shape of the nozzle 12a obtained by the measuring unit 20 matches the second shape reference data corresponding to the different types of wiring boards 6. Subsequently, the steps (S11) to the step (S14) are performed. The nozzle 12a is controlled so that the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 matches the first shape reference data corresponding to the different types of wiring boards 6. The control unit 40 reads out the type of the wiring board 6 from the memory 43, and uses the first shape reference data and the second shape reference data as the first shape reference data and the second shape reference data corresponding to the different types of wiring boards 6. It may be replaced with the shape reference data of. In this way, even if the type of the wiring board 6 is changed, the occurrence of soldering defects can be suppressed.

The step (S13) of comparing the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20 with the first shape reference data may be performed by the method exemplified below. In the first example, using a computer, from the data of the first surface shape of the diffuse reflection region 16 to the data of the characteristic portion (for example, the highest position of the first surface shape of the diffuse reflection region 16). Data etc.) is extracted. Using a computer, the data of the characteristic portion may be compared with the first shape reference data of the characteristic portion. In the second example, in the step (S13), the first surface shape of the diffuse reflection region 16 and the first shape reference data are displayed on the display unit 41, and these may be visually compared. Similarly, in the step (S22) of comparing the second surface shape of the nozzle 12a obtained by the measuring unit 20 with the second shape reference data, these may be compared by an electric calculator or visual inspection.

In the soldering device 1 and the soldering method of one modification of the present embodiment, the diffuse reflection region 16 (diffuse reflection film) of the present embodiment is used by using the diffuse reflection region forming portion 30c disclosed in the third embodiment. 15a) may be formed.

The effects of the soldering apparatus 1 and the soldering method of the present embodiment will be described.
The soldering device 1 of the present embodiment includes a jet unit 10 and a measuring unit 20. The jet portion 10 includes a nozzle 12a. The measuring unit 20 is configured to measure the first surface shape of the diffuse reflection region 16 formed on the surface of the molten solder 14 jetted from the nozzle 12a. The first surface shape of the diffuse reflection region 16 follows the surface shape of the molten solder 14 jetted from the nozzle 12a. By measuring the first surface shape of the diffuse reflection region 16 by the measuring unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be easily measured. The soldering apparatus 1 of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

The soldering apparatus 1 of the present embodiment may further include a diffuse reflection region forming portion 30 configured to form a diffuse reflection region 16 on the surface of the molten solder 14. Therefore, the diffuse reflection region 16 can be easily formed on the surface of the molten solder 14. The soldering apparatus 1 of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering device 1 of the present embodiment, the diffuse reflection region forming portion 30 may include a member 31 and a driving portion 32. The drive unit 32 may be configured to move the member 31 in one direction along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. Therefore, the diffuse reflection region 16 can be easily formed on the surface of the molten solder 14. The soldering apparatus 1 of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

The soldering device 1 of the present embodiment may further include a control unit 40. The control unit 40 may be configured to control the jet unit 10 based on the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20. The soldering apparatus 1 of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

The soldering apparatus 1 of the present embodiment may further include a memory 43 in which first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a is stored. The control unit 40 may be configured to compare the first surface shape of the diffuse reflection region 16 obtained by the measurement unit 20 with the first shape reference data. The control unit 40 may be configured to control the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection region 16 and the first shape reference data. The soldering apparatus 1 of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering apparatus 1 of the present embodiment, the measuring unit 20 may be configured to further measure the second surface shape of the nozzle 12a. The control unit 40 may be configured to control the nozzle 12a based on the second surface shape of the nozzle 12a obtained by the measurement unit 20. The soldering apparatus 1 of the present embodiment enables more appropriate (better) soldering by using the measurement result of the second surface shape of the nozzle 12a.

In the soldering method of the present embodiment, the diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a (S11), and the first surface shape of the diffuse reflection region 16 is formed by the measuring unit 20. It includes measuring (S12). The first surface shape of the diffuse reflection region 16 follows the surface shape of the molten solder 14 jetted from the nozzle 12a. By measuring the first surface shape of the diffuse reflection region 16 by the measuring unit 20, the surface shape of the molten solder 14 jetted from the nozzle 12a can be measured. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S12) moves the member 31 along the surface of the molten solder 14 while immersing at least a part of the member 31 in the molten solder 14. May include soldering. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. Therefore, the diffuse reflection region 16 can be easily formed on the surface of the molten solder 14. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

The soldering method of the present embodiment further includes controlling the jet unit 10 including the nozzle 12a (S13, S14) based on the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20. May be good. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, controlling the jet portion 10 (S13, S14) means that the first surface shape of the diffuse reflection region 16 and the first target surface shape of the molten solder 14 jetted from the nozzle 12a. The jet unit 10 is controlled based on the comparison result with the first shape reference data regarding (S13) and the comparison result between the first surface shape of the diffuse reflection region 16 and the first shape reference data. (S14) and may be included. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, the second surface shape of the nozzle 12a is measured by the measuring unit 20 (S21), and the nozzle is based on the second surface shape of the nozzle 12a obtained by the measuring unit 20. It may further include controlling 12a (S22, S23). The soldering method of the present embodiment enables more appropriate (better) soldering by using the measurement result of the second surface shape of the nozzle 12a.

Embodiment 2.
The soldering apparatus 1b according to the second embodiment will be described with reference to FIGS. 12 and 13. The soldering apparatus 1b of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

The soldering apparatus 1b includes a measuring unit 20b instead of the measuring unit 20 of the first embodiment. The measuring unit 20b includes a light source unit 21b and a light detecting unit 23b. The light source unit 21b is configured to irradiate the diffuse reflection region 16 with light 22b. The light source unit 21b may emit light 22b having an elongated rectangular shape or a cross-sectional shape of a slit. The light source unit 21b may be, for example, a laser marking device. The light detection unit 23b is configured to detect the light 22b diffusely reflected by the diffuse reflection region 16. The light detection unit 23b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection region 16. The imaging unit may be, for example, a CCD camera. By detecting the light 22b diffusely reflected in the diffuse reflection region 16 by the photodetector 23b, the first surface shape of the diffuse reflection region 16 can be easily measured.

The soldering method of this embodiment will be described with reference to FIGS. 11 to 13. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

The soldering method of the present embodiment includes measuring the first surface shape of the diffuse reflection region 16 by the measuring unit 20b (S12). Measuring the first surface shape of the diffuse reflection region 16 (S12) includes irradiating the diffuse reflection region 16 with light 22b and detecting the light 22b diffusely reflected by the diffuse reflection region 16. .. The measuring unit 20b includes a photodetecting unit 23b. The light detection unit 23b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection region 16. Detecting the diffusely reflected light 22b includes acquiring an image of the first surface shape of the diffuse reflection region 16 by the imaging unit.

The soldering method of the present embodiment includes the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20b and the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a. (S13). Specifically, the control unit 40 uses the image of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a as a first shape reference stored in the memory 43. It may be compared with the data (first reference image). Specifically, the image of the first surface shape of the diffuse reflection region 16 and the first shape reference data (first reference image) are superposed, and the area corresponding to the difference between these images is calculated. Based on this area, the image of the first surface shape of the diffuse reflection region 16 obtained by the measuring unit 20b may be compared with the first shape reference data (first reference image).

The soldering method of the present embodiment may include measuring the second surface shape of the nozzle 12a by the measuring unit 20b (S21). The measuring unit 20b includes a photodetecting unit 23b, which is an imaging unit configured to acquire an image of the second surface shape of the nozzle 12a.

In the soldering method of the present embodiment, the second surface shape of the nozzle 12a obtained by the measuring unit 20b is compared with the second shape reference data regarding the second target surface shape of the nozzle 12a (S22). To be equipped. Specifically, the control unit 40 may compare the image of the second surface shape of the nozzle 12a with the second shape reference data (second reference image) stored in the memory 43. Specifically, the image of the second surface shape of the nozzle 12a and the second shape reference data (second reference image) are superposed, and the area corresponding to the difference between these images is calculated. Based on this area, the image of the second surface shape of the nozzle 12a obtained by the measuring unit 20b may be compared with the second shape reference data (second reference image).

The effects of the soldering apparatus 1b and the soldering method of the present embodiment will be described. The soldering device 1b and the soldering method of the present embodiment have the same effects as those of the soldering device 1 and the soldering method of the first embodiment.

In the soldering device 1b of the present embodiment, the measuring unit 20b detects the light source unit 21b configured to irradiate the diffuse reflection region 16 with the light 22b and the light 22b diffusely reflected by the diffuse reflection region 16. It includes an optical detection unit 23b configured to do so. The light detection unit 23b is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection region 16. In the soldering method of the present embodiment, measuring the first surface shape of the diffuse reflection region 16 (S12) involves irradiating the diffuse reflection region 16 with light 22b and diffuse reflection by the diffuse reflection region 16. Includes detecting the light 22b. Detecting the diffusely reflected light 22b includes acquiring an image of the first surface shape of the diffuse reflection region 16 by the imaging unit. The soldering apparatus 1b and the soldering method of the present embodiment are more appropriate (using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows for better) soldering.

Embodiment 3.
The soldering apparatus 1c according to the third embodiment will be described with reference to FIGS. 14 and 15. The soldering apparatus 1c of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but differs mainly in the following points.

As shown in FIG. 14, the soldering apparatus 1c includes a diffuse reflection region forming portion 30c instead of the diffuse reflection region forming portion 30 of the first embodiment. The diffuse reflection region forming portion 30c includes a gas blowing portion 35 configured to blow a gas 34 containing oxygen toward the surface of the molten solder 14. The gas spraying portion 35 may be configured to selectively spray a gas 34 containing oxygen onto a part of the surface of the molten solder 14. The oxygen-containing gas 34 may be, for example, air. The spout of the gas blowing portion 35 may have, for example, an elongated shape extending along the direction (x direction) in which the molten solder 14 flows out from the nozzle 12a, or may have a circular shape. The gas blowing portion 35 is configured to move with respect to the nozzle 12a.

The portion of the surface of the molten solder 14 to which the gas 34 is sprayed is oxidized preferentially over the other portions. The gas 34 promotes the oxidation of the molten solder 14. As shown in FIG. 15, a diffuse reflection region 16 is selectively formed on a portion of the surface of the molten solder 14 to which the gas 34 is sprayed. The diffuse reflection region 16 may include a diffuse reflection film 15c formed of a solder oxide film, and the diffuse reflection region forming portion 30c may be a diffuse reflection film forming portion. The diffuse reflection film 15c is a thick solder oxide film thicker than the solder oxide film 15 in the region adjacent to the diffuse reflection region 16 (diffuse reflection film 15c).

When the solder oxide thick film is irradiated with the light 22 emitted from the light source unit 21b, interference fringes of the light 22 are formed in the solder oxide thick film, and a larger proportion of the light 22 is diffusely reflected. In this way, the solder oxide thick film functions as a diffuse reflection film 15c. The thickness of the diffuse reflection film 15c (soldering oxide thick film) may be twice or more, or three times or more, the thickness of the solder oxide film 15 adjacent to the diffuse reflection film 15c (solder oxide thick film). It may be 5 times or more, or 10 times or more. The thickness of the diffuse reflection film 15c (solder oxide thick film) may be 0.10 times or more, 0.12 times or more, or 0.15 times or more the wavelength of the light 22. It may be 0.18 times or more, or 0.20 times or more.

The soldering method of the present embodiment will be described with reference to FIGS. 11, 14 and 15. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11) is one of the surfaces of the molten solder 14 as shown in FIG. It includes selectively spraying a gas 34 containing oxygen on the part. The gas 34 promotes the oxidation of the molten solder 14. As shown in FIG. 15, a diffuse reflection region 16 is selectively formed on a portion of the surface of the molten solder 14 to which the gas 34 is sprayed. The diffuse reflection region 16 includes a diffuse reflection film 15c formed of a solder oxide film. The diffuse reflection film 15c is a thick solder oxide film thicker than the solder oxide film 15 in the region adjacent to the diffuse reflection region 16. In the solder oxide thick film, interference fringes of light 22 are formed, and a larger proportion of light 22 is diffusely reflected, so that the solder oxide thick film functions as a diffuse reflection film 15c.

In the soldering apparatus 1c and the soldering method of one modification of the present embodiment, the measuring unit 20 may be replaced with the measuring unit 20b of the second embodiment. In the soldering apparatus 1c and the soldering method of another modification of the present embodiment, the diffuse reflection region 16 (diffuse reflection) of the present embodiment is used by using the diffuse reflection region forming portion 30 disclosed in the first embodiment. A film 15c) may be formed.

The effects of the soldering apparatus 1c and the soldering method of the present embodiment will be described. The soldering device 1c and the soldering method of the present embodiment have the same effects as those of the soldering device 1 and the soldering method of the first embodiment.

In the soldering apparatus 1c of the present embodiment, the diffuse reflection region forming portion 30c includes a gas blowing portion 35 configured to blow a gas 34 containing oxygen toward the surface of the molten solder 14. In the soldering method of the present embodiment, forming the diffuse reflection region 16 includes selectively blowing an oxygen-containing gas 34 onto a part of the surface of the molten solder 14. The diffuse reflection region 16 includes a diffuse reflection film 15c formed of a solder oxide film (solder oxide thick film). Therefore, the diffuse reflection region 16 can be easily formed. The soldering apparatus 1c and the soldering method of the present embodiment are more appropriate (using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows for better) soldering.

Embodiment 4.
The soldering apparatus 1d according to the fourth embodiment will be described with reference to FIGS. 16 to 21. The soldering apparatus 1d of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but is mainly different in the following points.

The soldering apparatus 1d includes a diffuse reflection region forming portion 30d instead of the diffuse reflection region forming portion 30 of the first embodiment. The diffuse reflection region forming portion 30d includes a member 31d and an oscillator 32d. The vibrator 32d is configured to vibrate the member 31d along the surface of the molten solder 14 while immersing at least a part of the member 31d in the molten solder 14. The vibrator 32d causes the member 31d to vibrate, for example, in the width direction (y direction). The vibrator 32d may be, for example, a piezoelectric element made of a ceramic material such as zirconate titanate, barium titanate or titanate, or may be made of an electromagnetic motor, an electrostatic motor or an ultrasonic motor. It may be a vibration motor.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIGS. 16 and 17, a solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by contacting the molten solder 14 jetted from the nozzle 12a with this gas.

As shown in FIGS. 18 to 20, the member 31d is vibrated along the surface of the molten solder 14 by using the vibrator 32d while immersing at least a part of the member 31d in the molten solder 14. The solder oxide film 15 is folded over, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16 is formed on both sides of the member 31d in the width direction (y direction). The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film, and the diffuse reflection region forming portion 30d is a diffuse reflection film forming portion. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. Therefore, the diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 16) than the solder oxide film 15. The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16.

As shown in FIGS. 18 to 20, the width of the diffuse reflection film 15a also increases as the number of vibrations of the member 31d increases. The width of the diffuse reflection film 15a is the length of the diffuse reflection film 15a in the width direction (y direction). The diffuse reflection film 15a having a wide area can be obtained without forming the diffuse reflection film 15a into small pieces. The first surface shape of the diffuse reflection region 16 (the surface shape of the molten solder 14) can be stably measured over a wide area.

The member 31d is made of a material that is difficult to dissolve in the molten solder 14, such as SUS316 or titanium. The member 31d may be a rod member extending along the transport direction (x direction) of the wiring board 6. The member 31d is configured to come into contact with the back surface 6b of the wiring board 6 when the wiring board 6 is conveyed above the nozzle 12a. The back surface 6b is the surface of the wiring board 6 facing the molten solder 14. Specifically, the member 31d extends above the nozzle 12a. The member 31d is arranged in the transport path of the wiring board 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6. The width of the transport path of the wiring board 6 has the same width as the width of the wiring board 6. The width of the wiring board 6 is the length of the wiring board 6 in the width direction (y direction). The width of the transport path of the wiring board 6 is the length of the transport path of the wiring board 6 in the width direction (y direction).

The side surface 6c of the wiring board 6 is gripped by the arm portion 4a of the transport portion 4, but the front surface 6a and the back surface 6b of the wiring board 6 are not gripped by the arm portion 4a of the transport portion 4. The back surface 6b of the wiring board 6 is in contact with the molten solder 14, whereas the front surface 6a of the wiring board 6 is not in contact with the molten solder 14. The temperature of the back surface 6b of the wiring board 6 is higher than the temperature of the front surface 6a of the wiring board 6. Due to the temperature difference between the front surface 6a and the back surface 6b of the wiring board 6, the wiring board 6 tends to warp so as to project toward the nozzle 12a. The member 31d can prevent the wiring board 6 from warping when it comes into contact with the back surface 6b of the wiring board 6.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 16 to 21. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11) means that at least the member 31d is formed as shown in FIGS. 16 to 20. This includes vibrating the member 31d along the surface of the molten solder 14 while immersing a part in the molten solder 14.

A solder oxide film 15 (solder natural oxide film) is formed on the surface of the molten solder 14. When the member 31d is vibrated along the surface of the molten solder 14 while immersing at least a part of the member 31d in the molten solder 14, the solder oxide film 15 folds over and onto the surface of the molten solder 14 jetted from the nozzle 12a. , The diffuse reflection region 16 is formed. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. Therefore, the diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 16) than the solder oxide film 15.

The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 measures the first surface shape of the diffuse reflection region 16 (S12). When the wiring board 6 is not in contact with the member 31d, the diffuse reflection region 16 is formed (S11), and the first surface shape of the diffuse reflection region 16 is measured (S12).

In the soldering method of the present embodiment, in the step of soldering the component 7 to the wiring board 6 by the molten solder 14 ejected from the nozzle 12a (S30), the back surface 6b of the wiring board 6 is in contact with the member 31d for wiring. The substrate 6 is conveyed. The member 31d can prevent the wiring board 6 from warping.

The effects of the soldering apparatus 1d and the soldering method of the present embodiment will be described. The soldering device 1d and the soldering method of the present embodiment have the same effects as those of the soldering device 1 and the soldering method of the first embodiment.

In the soldering apparatus 1d of the present embodiment, the diffuse reflection region forming portion 30d includes a member 31d and an oscillator 32d. The vibrator 32d is configured to vibrate the member 31d along the surface of the molten solder 14 while immersing at least a part of the member 31d in the molten solder 14. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1d of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering apparatus 1d of the present embodiment, the member 31d extends along the transport direction (x direction) of the object to be soldered (wiring board 6). The member 31d is configured to come into contact with the back surface 6b of the object (wiring board 6). The back surface 6b is the surface of the object to be soldered (wiring board 6) facing the molten solder 14. The member 31d can prevent the object to be soldered (wiring board 6) from warping when it comes into contact with the back surface 6b of the object to be soldered (wiring board 6). The soldering apparatus 1d of this embodiment enables more appropriate (better) soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 means that the member 31d is vibrated along the surface of the molten solder 14 while immersing at least a part of the member 31d in the molten solder 14. Including. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, the member 31d extends along the transport direction (x direction) of the object to be soldered (wiring board 6). The object to be soldered (wiring board 6) is conveyed while the back surface 6b of the object to be soldered (wiring board 6) is in contact with the member 31d. The back surface 6b is the surface of the object to be soldered (wiring board 6) facing the molten solder 14. The member 31d can prevent the object to be soldered (wiring board 6) from warping. The soldering method of this embodiment enables more appropriate (better) soldering.

Embodiment 5.
The soldering apparatus 1e according to the fifth embodiment will be described with reference to FIGS. 22 to 27. The soldering apparatus 1e of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but is mainly different in the following points.

The soldering apparatus 1e includes a diffuse reflection region forming portion 30e instead of the diffuse reflection region forming portion 30 of the first embodiment. The diffuse reflection region forming portion 30e includes two stationary members 36. The stationary member 36 is attached to, for example, the transport unit 4. One stationary member 36 is on the downstream side of the wiring board 6 in the transport direction (x direction) with respect to the center line 12 m (see FIG. 23) of the opening 12b of the nozzle 12a in the transport direction (x direction) of the wiring board 6. Is located in. The other stationary member 36 is arranged on the upstream side of the wiring board 6 in the transport direction (x direction) with respect to the center line 12 m of the opening 12b of the nozzle 12a. The stationary member 36 is arranged above the nozzle 12a so that a part of the stationary member 36 is immersed in the molten solder 14. The rest of the stationary member 36 is exposed from the molten solder 14.

The stationary member 36 is arranged outside the transport path of the wiring board 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6. Therefore, it is prevented that the stationary member 36 interferes with soldering. The stationary member 36 is made of a material that is difficult to dissolve in the molten solder 14, such as SUS316 or titanium. In a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6, the stationary member 36 has, for example, a rectangular shape. In a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6, the stationary member 36 may have a polygonal shape, a circular shape, or a circular shape. It may have a streamlined shape.

The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, as shown in FIGS. 22 to 25, the solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by contacting the molten solder 14 with this gas.

The solder oxide film 15 is folded around the stationary member 36, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The reason why the diffuse reflection region 16 is formed is that when the molten solder 14 flows along the stationary member 36, the molten solder 14 comes into contact with the stationary member 36, and the flow of the molten solder 14 is disturbed around the stationary member 36 and is stationary. It is presumed that this is because the flow velocity of the molten solder 14 decreases around the member 36. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film, and the diffuse reflection region forming portion 30e is a diffuse reflection film forming portion. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. Therefore, the diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 22) than the solder oxide film 15. The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 22 to 27. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method according to the present embodiment, forming the diffuse reflection region 16 on the surface of the molten solder 14 jetted from the nozzle 12a (S11) is along the stationary member 36 arranged above the nozzle 12a. Includes flowing molten solder 14. A part of the stationary member 36 is immersed in the molten solder 14. By flowing the molten solder 14 along the stationary member 36, the solder oxide film 15 is folded around the stationary member 36, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. .. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. Therefore, the diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 16) than the solder oxide film 15.

The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 measures the first surface shape of the diffuse reflection region 16 (S12).

In the soldering method according to the present embodiment, the stationary member 36 is arranged outside the transport path of the wiring board 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6. .. Therefore, it is prevented that the stationary member 36 interferes with soldering.

With reference to FIG. 26, in the first modification of the present embodiment, the diffuse reflection region forming portion 30e may include one stationary member 36. The diffuse reflection region forming portion 30e may include three or more stationary members 36.

With reference to FIG. 27, in the second modification of the present embodiment, the stationary member 36 has a shape in which the central portion of the stationary member 36 is bent so as to project toward the nozzle 12a. Even if the height (position in the z direction) of the surface of the molten solder 14 changes, the surface of the molten solder 14 can continue to be in contact with the stationary member 36, so that the diffuse reflection region 16 is stable around the stationary member 36. Can be formed

In the third modification of the present embodiment, the diffuse reflection film 15c (FIG. 15) which is a solder oxide thick film may be formed around the stationary member 36, and the diffuse reflection region 16 is a solder oxide thick film. A diffuse reflective film 15c (FIG. 15) may be included.

The effects of the soldering apparatus 1e and the soldering method of the present embodiment will be described. The soldering apparatus 1e and the soldering method of the present embodiment have the same effects as those of the soldering apparatus 1 and the soldering method of the first embodiment.

In the soldering apparatus 1e according to the present embodiment, the diffuse reflection region forming portion 30e includes the stationary member 36. The stationary member 36 is arranged above the nozzle 12a so that a part of the stationary member 36 is immersed in the molten solder 14. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1e of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method according to the present embodiment, forming the diffuse reflection region 16 (S11) includes flowing the molten solder 14 along the stationary member 36 arranged above the nozzle 12a. A part of the stationary member 36 is immersed in the molten solder 14. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering apparatus 1e and the soldering method according to the present embodiment, the stationary member 36 is viewed in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object to be soldered (wiring board 6). It is arranged outside the transport path of the object (soldering board 6). Therefore, it is prevented that the stationary member 36 interferes with soldering. The soldering apparatus 1e and the soldering method of the present embodiment are more appropriate (using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows for better) soldering.

In the soldering device 1e and the soldering method according to the present embodiment, the stationary member 36 has a shape in which the central portion of the stationary member 36 is bent so as to project toward the nozzle 12a. Even if the height (position in the z direction) of the surface of the molten solder 14 changes, the surface of the molten solder 14 can continue to be in contact with the stationary member 36, so that the diffuse reflection region 16 is stable around the stationary member 36. Can be formed The soldering apparatus 1e and the soldering method of the present embodiment are more appropriate (using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows for better) soldering.

Embodiment 6.
The soldering apparatus 1f according to the sixth embodiment will be described with reference to FIGS. 28 to 32. The soldering device 1f of the present embodiment has the same configuration as the soldering device 1 of the first embodiment, but is mainly different in the following points.

In the soldering apparatus 1f, the diffuse reflection region forming portion 30 of the first embodiment is omitted. The measuring unit 20 is arranged on the downstream side (+ x direction) of the wiring board 6 in the transport direction (x direction) from the nozzle 12a.

With reference to FIGS. 28 to 30, the diffuse reflection region 16 is formed by contacting a part of the wiring board 6 (for example, the back surface 6b or the front side surface 6f of the wiring board 6) with the molten solder 14 jetted from the nozzle 12a. It is formed. The front side surface 6f of the wiring board 6 is a side surface of the wiring board 6 on the transport direction side of the wiring board 6. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film.

Specifically, the molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The solder oxide film 15 is a natural oxide film of solder formed by contacting the molten solder 14 with this gas.

While the wiring board 6 is transported by the transport unit 4, a part of the wiring board 6 comes into contact with the surface of the molten solder 14. Therefore, the solder oxide film 15 is folded over, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. The diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 22) than the solder oxide film 15. The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16. Since the measuring unit 20 is arranged downstream of the nozzle 12a in the transport direction (x direction) of the wiring board 6, the first surface shape of the diffuse reflection region 16 is formed without being hindered by the wiring board 6. Can be measured.

With reference to FIGS. 29, 31 and 32, in the diffuse reflection region 16s, at least a part of the wiring board 6 (for example, the back surface 6b or the front side surface 6f of the wiring board 6) is formed on the molten solder 14 jetted from the nozzle 12a. It is formed by contact. The diffuse reflection region 16s includes a diffuse reflection film 46 composed of a flux residue adhering to the wiring board 6.

Specifically, as shown in FIG. 29, the back surface 6b or the front side surface 6f of the wiring board 6 comes into contact with the surface of the molten solder 14 while the wiring board 6 is conveyed by the conveying unit 4. As shown in FIGS. 31 and 32, the flux residue adhering to the wiring board 6 dissolves a part of the solder oxide film 15 and remains on the surface of the molten solder 14. A diffuse reflection region 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16s includes a diffuse reflection film 46 composed of a flux residue adhering to the wiring board 6. Since the diffuse reflection film 46 composed of the flux residue is thicker than the solder oxide film 15, the diffuse reflection film 46 is more likely to diffuse and reflect light 22 (see FIG. 31) than the solder oxide film 15.

The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16s. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16s. Using the measurement result of the first surface shape of the diffuse reflection region 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, another wiring board 6s (6s) which is conveyed by the conveying unit 4 following the wiring board 6s ( The component 7 mounted (see FIG. 31) is soldered more appropriately (better).

The soldering method of the present embodiment will be described with reference to FIGS. 28 to 33. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) means that a part of the wiring board 6 (for example, the back surface 6b or the front side surface of the wiring board 6) is formed on the molten solder 14 jetted from the nozzle 12a. 6f) includes contacting. The measuring unit 20 is arranged on the downstream side of the wiring board 6 in the transport direction (x direction) with respect to the nozzle 12a. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film.

A solder oxide film 15 (solder natural oxide film) is formed on the surface of the molten solder 14. While the wiring board 6 is transported by the transport unit 4, a part of the wiring board 6 comes into contact with the surface of the molten solder 14. Therefore, the solder oxide film 15 is folded over, and a diffuse reflection region 16 is formed on the surface of the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The diffuse reflection film 15a is, for example, a wrinkled solder oxide film formed by gathering a part of the solder oxide film 15. The diffuse reflection film 15a is more likely to diffuse and reflect light 22 (see FIG. 22) than the solder oxide film 15.

The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16. In this way, the measuring unit 20 measures the first surface shape of the diffuse reflection region 16 (S12). Since the measuring unit 20 is arranged downstream of the nozzle 12a in the transport direction (x direction) of the wiring board 6, the first surface shape of the diffuse reflection region 16 is formed without being hindered by the wiring board 6. Can be measured.

In the soldering method of the present embodiment, the diffuse reflection region 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a (S31), and the first surface shape of the diffuse reflection region 16s is formed by the measuring unit 20. It further includes measuring (S32) and controlling the jet unit 10 including the nozzle 12a (S33, S34). Controlling the jet portion 10 (S33, S34) compares the first surface shape of the diffuse reflection region 16s with the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a. This includes (S33) and controlling the jet unit 10 based on the comparison result between the first surface shape of the diffuse reflection region 16s and the first shape reference data (S34).

Specifically, as shown in FIG. 29, while the wiring board 6 is transported by the transport unit 4, a part of the wiring board 6 (for example, the back surface 6b or the front side surface 6f of the wiring board 6) is the surface of the molten solder 14. Contact. As shown in FIGS. 31 and 32, the flux residue adhering to the wiring board 6 dissolves a part of the solder oxide film 15 and remains on the surface of the molten solder 14. A diffuse reflection region 16s is formed on the surface of the molten solder 14 jetted from the nozzle 12a (S31). That is, forming the diffuse reflection region 16s (S31) includes bringing at least a part of the wiring board 6 into contact with the molten solder 14 jetted from the nozzle 12a. The diffuse reflection region 16s includes a diffuse reflection film 46 composed of a flux residue adhering to the wiring board 6. Since the diffuse reflection film 46 composed of the flux residue is thicker than the solder oxide film 15, the diffuse reflection film 46 is more likely to diffuse and reflect light 22 (see FIG. 31) than the solder oxide film 15.

The measuring unit 20 detects the diffusely reflected light 22 in the diffuse reflection region 16s. In this way, the measuring unit 20 measures the first surface shape of the diffuse reflection region 16s (S32).

Comparing the first surface shape of the diffuse reflection region 16s with the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a (S33) is the first of the diffuse reflection region 16. It is the same as comparing the surface shape of the above with the first shape reference data regarding the first target surface shape of the molten solder 14 jetted from the nozzle 12a (S13). Controlling the jet portion 10 based on the comparison result between the first surface shape of the diffuse reflection region 16s and the first shape reference data (S34) is the first surface shape and the first surface shape of the diffuse reflection region 16. It is the same as controlling the jet unit 10 based on the comparison result with the shape reference data of 1 (S14).

Soldering the component 7 to another wiring board 6s by the molten solder 14 ejected from the nozzle 12a (S40) means soldering the component 7 to the wiring board 6 by the molten solder 14 ejected from the nozzle 12a (S40). It is the same as S30). Another wiring board 6s is conveyed by the transfer unit 4 following the wiring board 6s. Using the measurement result of the first surface shape of the diffuse reflection region 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a, the component 7 mounted on another wiring board 6s is more appropriately (better). To be soldered.

In the present embodiment, the first surface shape of the diffuse reflection region 16 and the first surface shape of the diffuse reflection region 16s are measured using the same measuring unit 20, but the first surface of the diffuse reflection region 16s. The shape may be measured using a measuring unit (not shown) different from the measuring unit 20. This other measuring unit has the same configuration as the measuring unit 20, but may not be arranged downstream of the nozzle 12a in the transport direction (x direction) of the wiring board 6.

The effects of the soldering apparatus 1f and the soldering method of the present embodiment will be described. The soldering device 1f and the soldering method of the present embodiment have the same effects as those of the soldering device 1 and the soldering method of the first embodiment.

In the soldering apparatus 1f of the present embodiment, in the diffuse reflection region 16, a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b or the front surface 6f of the wiring board 6) is It is formed by contact. The measuring unit 20 is arranged downstream of the nozzle 12a in the transport direction (x direction) of the object to be soldered (wiring board 6). The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. The soldering apparatus 1f of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering apparatus 1f of the present embodiment, the diffuse reflection region 16s is at least a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b or the front surface 6f of the wiring board 6). Is formed by contact. The diffuse reflection region 16s includes a diffuse reflection film 46 composed of flux residues adhering to the object to be soldered (wiring substrate 6). The soldering apparatus 1f of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) is a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface 6b of the wiring board 6). Alternatively, it includes contacting the front side surface 6f). The measuring unit 20 is arranged downstream of the nozzle 12a in the transport direction (x direction) of the object to be soldered (wiring board 6). The diffuse reflection region 16 includes a diffuse reflection film 15a formed of a solder oxide film. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16s (S31) means that at least a part of the object to be soldered to the molten solder 14 jetted from the nozzle 12a (for example, the back surface of the wiring board 6). 6b or front side surface 6f) is included in contact. The diffuse reflection region 16s includes a diffuse reflection film 46 composed of flux residues adhering to the object to be soldered (wiring substrate 6). In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16s corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

Embodiment 7.
The soldering apparatus 1g according to the seventh embodiment will be described with reference to FIGS. 34 to 39. The soldering apparatus 1g of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment, but is mainly different in the following points.

In the soldering apparatus 1g, the diffuse reflection region forming portion 30g includes a tubular member 37 provided in the nozzle 12a. The tubular member 37 is arranged so that the diffuse reflection region 16 is formed inside the tubular member 37. Specifically, the tubular member 37 has an inflow port 37i and an upper end opening 37j. The molten solder 14 jetted from the nozzle 12a flows from the inflow port 37i into the inside of the tubular member 37. The molten solder 14 jetted from the nozzle 12a also flows to the outside of the tubular member 37. The upper end opening 37j of the tubular member 37 is exposed from the molten solder 14. The tubular member 37 is made of a material that is difficult to dissolve in the molten solder 14, such as SUS316 or titanium.

The surface of the molten solder 14 jetting from the nozzle 12a is constantly swaying. The inside of the tubular member 37 is surrounded by the tubular member 37. Therefore, the fluctuation of the surface of the molten solder 14 inside the tubular member 37 is smaller than the fluctuation of the surface of the molten solder 14 outside the tubular member 37. Further, the molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 outside the tubular member 37, but inside the tubular member 37, the solder oxide thickness is thicker than that of the solder oxide film 15 on the surface of the molten solder 14. A film is formed. When the solder oxide thick film is irradiated with the light 22 emitted from the measuring unit 20, interference fringes of the light 22 are formed in the solder oxide thick film, and a larger proportion of the light 22 is diffusely reflected. In this way, the solder oxide thick film functions as a diffuse reflection film 15c. The diffuse reflection region 16 includes a diffuse reflection film 15c which is a thick solder oxide film.

The measuring unit 20 incidents light 22 from the upper end opening 37j of the tubular member 37 and detects the light 22 diffusely reflected in the diffuse reflection region 16. In this way, the measuring unit 20 can measure the first surface shape of the diffuse reflection region 16.

In the soldering apparatus 1g, the tubular member 37 is arranged outside the transport path of the wiring board 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6. Therefore, it is prevented that the tubular member 37 interferes with soldering. The tubular member 37 is arranged, for example, in the opening 12b of the nozzle 12a. A plurality of tubular members 37 may be provided in the soldering apparatus 1 g. The plurality of tubular members 37 may be arranged along the direction (x direction) in which the molten solder 14 flows out from the nozzle 12a. The plurality of tubular members 37 may be arranged along the width direction (y direction) at which the molten solder 14 intersects the direction (x direction) in which the molten solder 14 flows out from the nozzle 12a. The tubular member 37 is, for example, a cylindrical member. The tubular member 37 may be a square tubular member or an elliptical tubular member.

With reference to FIGS. 36 and 37, the diffuse reflection region forming portion 30g may further include a flow pressure reducing member 38 that reduces the flow pressure of the molten solder 14. The flow pressure reducing member 38 is provided at the inflow port 37i of the tubular member 37. The flow pressure reducing member 38 is configured to give a pressure loss to the molten solder 14 flowing into the tubular member 37 to reduce the flow pressure of the molten solder 14. Therefore, the flow pressure reducing member 38 reduces the fluctuation of the surface of the molten solder 14 inside the tubular member 37. The diffuse reflection film 15c, which is a thick solder oxide film, can be formed more reliably in a shorter time. The flow pressure reducing member 38 is made of a material that is difficult to dissolve in the molten solder 14, such as SUS316 or titanium.

As shown in FIGS. 36 and 37, the flow pressure reducing member 38 may be composed of a plate member 39b (for example, a plate member having a punching metal structure) having a plurality of minute through holes 39a through which the molten solder 14 flows. Good. As shown in FIGS. 38 and 39, the flow pressure reducing member 38 may be composed of a plurality of plate members 39d. The plurality of plate members 39d are arranged inside the tubular member 37 in a staggered manner along the longitudinal direction (z direction) of the tubular member 37. Each of the plurality of plate members 39d has a size smaller than the inner diameter of the tubular member 37, and a gap through which the molten solder 14 flows is formed between each of the plurality of plate members 39d and the inner wall of the tubular member 37. Has been done.

The soldering method of the present embodiment will be described with reference to FIGS. 11 and 34 to 39. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment, but differs in the following points.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) includes flowing the molten solder 14 into the tubular member 37 provided in the nozzle 12a. The tubular member 37 is arranged so that the diffuse reflection region 16 is formed inside the tubular member 37. Specifically, the tubular member 37 has an inflow port 37i and an upper end opening 37j. The molten solder 14 jetted from the nozzle 12a flows from the inflow port 37i into the inside of the tubular member 37. The molten solder 14 jetted from the nozzle 12a also flows to the outside of the tubular member 37. The upper end opening 37j of the tubular member 37 is exposed from the molten solder 14.

The surface of the molten solder 14 jetting from the nozzle 12a is constantly swaying. The inside of the tubular member 37 is surrounded by the tubular member 37. Therefore, the fluctuation of the surface of the molten solder 14 inside the tubular member 37 is smaller than the fluctuation of the surface of the molten solder 14 outside the tubular member 37. The molten solder 14 jetted from the nozzle 12a is exposed to a gas containing oxygen (for example, air). Therefore, the solder oxide film 15 is formed on the surface of the molten solder 14 outside the tubular member 37, but inside the tubular member 37, the solder oxide thickness is thicker than that of the solder oxide film 15 on the surface of the molten solder 14. A film is formed. The diffuse reflection region 16 includes a diffuse reflection film 15c which is a thick solder oxide film.

In the soldering method of the present embodiment, the tubular member 37 is arranged outside the transport path of the wiring board 6 in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the wiring board 6. Therefore, it is prevented that the tubular member 37 interferes with soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) further reduces the flow pressure of the molten solder 14 flowing into the tubular member 37 by using the flow pressure reducing member 38. Including. The flow pressure reducing member 38 reduces the flow pressure of the molten solder 14 flowing into the inside of the tubular member 37. The flow pressure reducing member 38 reduces the fluctuation of the surface of the molten solder 14 inside the tubular member 37. The diffuse reflection film 15c, which is a thick solder oxide film, can be formed more reliably in a shorter time.

The effects of the soldering apparatus 1g and the soldering method of the present embodiment will be described. The soldering device 1g and the soldering method of the present embodiment have the same effects as those of the soldering device 1 and the soldering method of the first embodiment.

In the soldering apparatus 1g of the present embodiment, the diffuse reflection region forming portion 30g includes a tubular member 37 provided in the nozzle 12a. The tubular member 37 is arranged so that the diffuse reflection region 16 is formed inside the tubular member 37. The diffuse reflection region 16 includes a diffuse reflection film 15c formed of a solder oxide film (solder oxide thick film). The soldering apparatus 1g of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering device 1g of the present embodiment, the tubular member 37 is the object to be soldered in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object to be soldered (wiring board 6). It is arranged outside the transport path of the object (soldering board 6). Therefore, it is prevented that the tubular member 37 interferes with soldering. The soldering apparatus 1g of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering apparatus 1g of the present embodiment, the diffuse reflection region forming portion 30g further includes a flow pressure reducing member 38 that reduces the flow pressure of the molten solder 14. The tubular member 37 has an inflow port 37i into which the molten solder 14 flows. The flow pressure reducing member 38 is provided at the inflow port 37i. Therefore, the diffuse reflection film 15c can be formed in a shorter time and more reliably. The soldering apparatus 1g of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) includes flowing the molten solder 14 into the tubular member 37 provided in the nozzle 12a. The tubular member 37 is arranged so that the diffuse reflection region 16 is formed inside the tubular member 37. The diffuse reflection region 16 includes a diffuse reflection film 15c formed of a solder oxide film (solder oxide thick film). In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, the tubular member 37 is the object to be soldered in a plan view from the direction (z direction) in which the nozzle 12a protrudes toward the object to be soldered (wiring board 6). It is arranged outside the transport path of (wiring board 6). Therefore, it is prevented that the tubular member 37 interferes with soldering. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

In the soldering method of the present embodiment, forming the diffuse reflection region 16 (S11) further includes reducing the flow pressure of the molten solder 14 flowing into the tubular member 37. Therefore, the diffuse reflection film 15c can be formed in a shorter time and more reliably. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

Embodiment 8.
The soldering apparatus 1h according to the eighth embodiment will be described with reference to FIG. 40. The soldering apparatus 1h of the present embodiment has the same configuration as the soldering apparatus 1 of the first embodiment and exhibits the same effect, but is mainly different in the following points.

The soldering device 1h further includes a blower unit 50. The blower unit 50 is configured to blow air toward the measurement unit 20. The blower unit 50 may blow air in parallel with the transport path of the wiring board 6. The blower portion 50 is, for example, an axial fan, a centrifugal fan, a mixed flow fan, or a cross flow fan. Due to the radiant heat from the molten solder 14, the temperature of the measuring unit 20 may rise excessively, causing the measuring unit 20 to malfunction or malfunction. The blower unit 50 cools the measurement unit 20 by blowing air toward the measurement unit 20 to prevent the measurement unit 20 from malfunctioning or malfunctioning. Further, the blower unit 50 prevents the dust of the flux residue and the dust of the solder oxide flying in the housing 3 from adhering to the measuring unit 20. Therefore, the first surface shape of the diffuse reflection region 16 can be accurately and stably measured by using the measuring unit 20. The soldering apparatus 1h of the present embodiment is more appropriate (better) by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

The soldering method of this embodiment will be described with reference to FIGS. 11 and 40. The soldering method of the present embodiment includes the same steps as the soldering method of the first embodiment and has the same effect, but differs in the following points.

The soldering method of the present embodiment further comprises blowing air toward the measuring unit 20 by using the air blowing unit 50. The first surface shape of the diffuse reflection region 16 may be measured (S12) by using the measuring unit 20 while blowing air toward the measuring unit 20. By blowing air toward the measuring unit 20, the measuring unit 20 is cooled to prevent the measuring unit 20 from malfunctioning or malfunctioning. It is possible to prevent the flux residue dust and the solder oxide dust flying in the housing 3 from adhering to the measuring unit 20. Therefore, the first surface shape of the diffuse reflection region 16 can be accurately and stably measured by using the measuring unit 20. In the soldering method of the present embodiment, a more appropriate (better) solder is used by using the measurement result of the first surface shape of the diffuse reflection region 16 corresponding to the surface shape of the molten solder 14 jetted from the nozzle 12a. Allows soldering.

It should be considered that Embodiments 1-8 disclosed this time are exemplary in all respects and not restrictive. As long as there is no contradiction, at least two of Embodiments 1-8 disclosed this time may be combined. For example, the soldering apparatus 1b-1g of the second embodiment may be further provided with the blower portion 50 of the eighth embodiment. The measuring unit 20 of the third embodiment may be replaced with the measuring unit 20b of the second embodiment. The scope of the present invention is shown by the claims rather than the above description, and is intended to include all modifications within the meaning and scope of the claims.

1,1b, 1c, 1d, 1e, 1f, 1g, 1h Soldering device, 3 housing, 4 transport part, 4a arm part, 6,6s wiring board, 6a front surface, 6b back surface, 6c side surface, 6f Front side surface, 7 parts, 9 preheating part, 9h second heater, 9s temperature sensor, 10 jet part, 10s solder tank, 11 duct, 11a opening, 11b bottom, 11f strut, 11h bolt, 11t top, 12 nozzle part , 12a nozzle, 12b opening, 12c guide plate, 12d plate part, 12m center line, 12e hole, 13h first heater, 13m motor, 13n impeller, 13p pump, 14 molten solder, 15 solder oxide film, 15a, 15c, 46 Diffuse reflection film, 16,16s Diffuse reflection area, 18 Elevating part, 20,20b measurement part, 21,21b light source part, 22,22b light, 23,23b light detection part, 30,30c, 30d, 30e, 30g Diffuse Reflection region forming part, 31, 31d member, 32 drive part, 32d oscillator, 33 connecting part, 34 gas, 35 gas blowing part, 36 stationary member, 37 cylinder member, 37i inlet, 37j upper end opening, 38 flow pressure reduction Member, 39a micro through hole, 39b, 39d plate member, 40 control unit, 41 display unit, 43 memory, 50 blower unit.

Claims (34)

The jet part including the nozzle and
A measuring unit configured to measure the first surface shape of the diffuse reflection region formed on the surface of the molten solder jetted from the nozzle is provided .
The diffuse reflection region is a soldering apparatus including a diffuse reflection film formed of a solder oxide film. The soldering apparatus according to claim 1, further comprising a diffuse reflection region forming portion configured to form the diffuse reflection region on the surface of the molten solder. The diffuse reflection region forming portion includes a member and an oscillator.
The transducer, while immersing at least a portion of said member to said molten solder, said along the surface of the molten solder is configured to vibrate the member, soldering apparatus according to claim 2 .. The member extends along the transport direction of the object to be soldered.
The third aspect of the present invention, wherein the member is configured to be in contact with the back surface of the object to be soldered, and the back surface is a surface of the object to be soldered facing the molten solder. Soldering equipment. The diffuse reflection region forming portion includes a stationary member and includes a stationary member.
Wherein the stationary member such that a portion of the stationary member is immersed in the molten solder is located above the nozzle, soldering apparatus according to claim 2. The solder according to claim 5 , wherein the stationary member is arranged outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle protrudes toward the object to be soldered. Soldering device. The soldering device according to claim 5 or 6 , wherein the stationary member has a shape in which a central portion of the stationary member is bent so as to project toward the nozzle. The diffuse reflection region forming portion includes a tubular member provided in the nozzle.
As the diffuse reflection area in the interior of the tubular member is formed, the tubular member is disposed, the soldering apparatus according to claim 2. The solder according to claim 8 , wherein the tubular member is arranged outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle protrudes toward the object to be soldered. Soldering device. The diffuse reflection region forming portion further includes a flow pressure reducing member that reduces the flow pressure of the molten solder.
The tubular member has an inflow port into which the molten solder flows.
The soldering apparatus according to claim 8 or 9 , wherein the flow pressure reducing member is provided at the inflow port. The diffuse reflection region is formed by contacting a part of the object to be soldered with the molten solder jetting from the nozzle.
The measuring unit, than the nozzle is disposed on the downstream side in the transport direction of the soldering object being, soldering apparatus according to claim 1. The jet part including the nozzle and
A measuring unit configured to measure the first surface shape of the diffuse reflection region formed on the surface of the molten solder jetted from the nozzle is provided.
The diffuse reflection region is formed by contacting at least a part of an object to be soldered to the molten solder jetting from the nozzle.
The diffuse reflection area, the comprises a soldered are diffuse reflective film composed of residues of flux which was attached to the object, with I the device. The measuring unit includes a light source unit configured to irradiate the diffuse reflection region with light, and a light detection unit configured to detect the light diffusely reflected in the diffuse reflection region. ,
The soldering according to any one of claims 1 to 12, wherein the light detection unit is an imaging unit configured to acquire an image of the first surface shape of the diffuse reflection region. apparatus. The soldering apparatus according to any one of claims 1 to 13, further comprising a blowing unit configured to blow air toward the measuring unit. With more control
Any one of claims 1 to 14, wherein the control unit is configured to control the jet unit based on the first surface shape of the diffuse reflection region obtained by the measurement unit. Soldering equipment as described in the section. Further provided with a memory in which the first shape reference data regarding the first target surface shape of the molten solder jetted from the nozzle is stored.
The control unit is configured to compare the first surface shape of the diffuse reflection region obtained by the measurement unit with the first shape reference data.
15. The control unit is configured to control the jet unit based on the result of comparison between the first surface shape of the diffuse reflection region and the first shape reference data. The soldering equipment described. The measuring unit is configured to further measure the second surface shape of the nozzle.
The soldering device according to claim 15 or 16, wherein the control unit is configured to control the nozzle based on the second surface shape of the nozzle obtained by the measuring unit. Forming a diffuse reflection region on the surface of the molten solder jetted from the nozzle,
The measuring unit comprises measuring the first surface shape of the diffuse reflection region.
The soldering method, wherein the diffuse reflection region includes a diffuse reflection film formed of a solder oxide film. The soldering according to claim 18 , wherein forming the diffuse reflection region includes vibrating the member along the surface of the molten solder while immersing at least a part of the member in the molten solder. Method. The member extends along the transport direction of the object to be soldered.
While the back surface of the object to be soldered is in contact with the member, the object to be soldered is conveyed, and the back surface is the surface of the object to be soldered facing the molten solder. The soldering method according to claim 19. Forming the diffuse reflection region includes flowing the molten solder along a stationary member arranged above the nozzle.
The portion of the stationary member is immersed in the molten solder, the soldering method according to claim 18. 21. The solder according to claim 21, wherein the stationary member is arranged outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle protrudes toward the object to be soldered. How to attach. The soldering method according to claim 21, wherein the stationary member has a shape in which a central portion of the stationary member is bent so as to project toward the nozzle. Forming the diffuse reflection region includes flowing the molten solder inside a tubular member provided in the nozzle.
As the diffuse reflection area in the interior of said tubular member is formed, the tubular member is disposed, the soldering method according to claim 18. 24. The solder according to claim 24, wherein the tubular member is arranged outside the transport path of the object to be soldered in a plan view from a direction in which the nozzle protrudes toward the object to be soldered. How to attach. The soldering method according to claim 24 or 25, wherein forming the diffuse reflection region further includes reducing the flow pressure of the molten solder flowing into the tubular member. Forming the diffuse reflection region includes contacting a part of the object to be soldered with the molten solder jetting from the nozzle.
The measuring unit, than the nozzle, the is disposed on the downstream side in the transport direction of the soldered object being, soldering method of claim 18. Forming a diffuse reflection region on the surface of the molten solder jetted from the nozzle,
The measuring unit comprises measuring the first surface shape of the diffuse reflection region.
Forming the diffuse reflection region includes contacting at least a part of the object to be soldered with the molten solder jetting from the nozzle.
The diffuse reflection area, the comprises a soldering object being diffuse reflective film composed of residues of the flux adhering to, with I the process. Measuring the first surface shape of the diffuse reflection region includes irradiating the diffuse reflection region with light and detecting the light diffusely reflected by the diffuse reflection region.
The soldering according to any one of claims 18 to 28, wherein detecting the diffusely reflected light includes imaging the first surface shape of the diffuse reflection region by an imaging unit. Method. The soldering method according to any one of claims 18 to 29, further comprising blowing air toward the measuring unit. The aspect according to any one of claims 18 to 30, further comprising controlling a jet portion including the nozzle based on the first surface shape of the diffuse reflection region obtained by the measuring portion. Soldering method. Controlling the jet portion is to compare the first surface shape of the diffuse reflection region with the first shape reference data regarding the first target surface shape of the molten solder jetted from the nozzle. The soldering method according to claim 31, wherein the jet portion is controlled based on a comparison result between the first surface shape of the diffuse reflection region and the first shape reference data. Measuring the second surface shape of the nozzle with the measuring unit,
The soldering method according to claim 31 or 32, further comprising controlling the nozzle based on the second surface shape of the nozzle obtained by the measuring unit. A method for manufacturing a wiring board with parts, which comprises soldering parts to a wiring board by using the soldering method according to any one of claims 18 to 33.

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