JP2008272770A - Stationary solder bath device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stationary solder bath device using a stationary solder bath, and capable of reducing the temperature difference of molten solder in the stationary solder bath and satisfactorily removing an oxide film produced on the liquid surface of the molten solder. <P>SOLUTION: The stationary solder bath device includes: a box shaped stationary solder bath 10 which is open on top to store molten solder 12; a planar stirring/removing plate 21 which removes an oxide film 14 on the liquid level 13 while the molten solder 12 is stirred, by being sunk in the molten solder 12 in the lower part and by moving from a starting position on one side to an ending point position on the other side inside the stationary solder bath 10, with the upper part projected from the liquid level 13 of the molten solder 12; and a driving mechanism 30 which transfers the stirring/removing plate 21 from the starting position to the ending point position. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a static solder bath apparatus.

In the molten solder in the static solder bath, the portion near the heater disposed in the vicinity of the bottom of the molten solder is likely to be heated and becomes high temperature, and the vicinity of the liquid surface is likely to become low temperature by touching the outside air. For this reason, temperature management of molten solder becomes troublesome, and sometimes soldering is affected.
In addition, since the surface of the molten solder is oxidized by contact with the outside air and an oxide film is generated, it is troublesome to frequently remove the oxide film.
Conventionally, for example, a rotary solder tray (rotary solder bath apparatus) disclosed in Patent Document 1 is known.
In this, a tray (circular tray) is rotatably provided in a recess formed in the upper surface of the container, and a motor disposed in the container is used as a drive source on the bottom plate of the recess, and a gear train. The rotating shaft in the vertical direction rotated by the mechanism is rotatably mounted by a rolling bearing, the center of the bottom of the tray is connected to the upper end of the rotating shaft so that torque can be transmitted, and the scum removing body is attached to the liquid surface of the molten solder on the tray. It is the structure which arranged. The molten solder in the tray is kept in a uniform state by the rotation of the tray, and the oxide film on the liquid surface of the molten solder is removed by the scum remover.
Japanese Utility Model Publication No. 7-33456

Incidentally, the rotary solder tray (rotary solder bath apparatus) disclosed in Patent Document 1 cannot be applied to a static solder bath.
In addition, a tray must be placed on the body, and a motor, gear train mechanism, rotating shaft, etc. must be placed inside the body, which tends to increase the size of the entire device, complicate the structure, and increase the cost. .

  In view of the above problems, an object of the present invention is to use a static solder bath, to suppress the temperature difference of the molten solder in the static solder bath, and to improve the oxide film generated on the liquid surface of the molten solder. It is to provide a static solder bath apparatus that can be removed.

In order to achieve the above object, a static solder bath apparatus according to claim 1 of the present invention includes a box-shaped static solder bath opened upward in which molten solder is stored;
The lower part is submerged in the molten solder, and the upper part protrudes from the liquid surface of the molten solder and moves from the start position of one side part to the end point position of the other side part in the static solder bath. A plate-like stirring / removing plate that removes the oxide film on the liquid surface while stirring the solder;
And a drive mechanism for moving the agitation / removal plate from the start position to the end position.

  In the above-described configuration, the molten solder is agitated by a simple structure in which the stirring / removal plate is moved by the drive mechanism from the start position on one side in the static solder bath to the end position on the other side. The difference can be suppressed small, and the oxide film generated on the liquid surface of the molten solder can be satisfactorily removed.

A static solder bath apparatus according to claim 2 of the present invention is the static solder bath apparatus according to claim 1,
The agitation / removal plate is stacked on the integrated oxide film over the upper edge of the static solder tank among the integrated oxide films collected on the other side of the static solder tank by the movement from the start position to the end position. The portion is integrally provided with a discharge portion that discharges the portion from the stationary solder bath.
In the above-described configuration, the stacked portion of the integrated oxide film collected on the other side of the stationary solder bath can be discharged by the discharge portion of the stirring / removal plate. As a result, it is possible to reduce the trouble of manually removing the integrated oxide film, or the cost of manufacturing and assembling a dedicated discharge device for discharging the integrated oxide film.

A static solder bath apparatus according to claim 3 of the present invention is the static solder bath apparatus according to claim 2,
On the outside of the static solder bath, the discharge oxide film discharged by the discharge portion of the stirring / removal plate is received and guided to a predetermined position, and the discharge oxide film guided by the discharge chute is received and collected. A collection box is provided.
In the above configuration, the discharged oxide film discharged by the discharge portion of the agitation / removal plate is received by the discharge chute, guided to a predetermined position, put into the recovery box, and recovered.
For this reason, the trouble of collecting the discharged oxide film becomes unnecessary, and there is no problem that the discharged oxide film is scattered and fouled around the stationary solder bath.

  Next, the best mode for carrying out the present invention will be described with reference to examples.

Example 1
A first embodiment of the present invention will be described with reference to FIGS.
1 is a perspective view showing a stationary solder bath apparatus according to Embodiment 1 of the present invention. FIG. 2 is a side sectional view showing a drive mechanism of the stirring / removal plate. FIG. 3 is an explanatory view showing a state in which the stirring / removal plate is disposed at the start position. FIG. 4 is an explanatory view showing a state in which the stirring / removal plate is moved to just before the end point position. FIG. 5 is an explanatory view showing a state where the stirring / removal plate is moved to the end point position. FIG. 6 is an explanatory view showing a state in which the stirring / removal plate at the end position is raised to the rising end position. FIG. 7 is an explanatory view showing a state in which the stirring / removal plate returned to the start position is lowered to the original lower end position.

As shown in FIGS. 1 and 2, the static solder bath apparatus according to the first embodiment mainly uses pins of various electronic components arranged on the mounting surface of the printed board as lands (conductive wiring). And a stationary solder tank 10, a stirring / removing plate 21, a drive mechanism 30, a discharge chute 40, and a collection box 45.
As shown in FIG. 3, the static solder bath 10 is formed in a rectangular box shape that opens upward, the molten solder 12 is stored in the static solder bath 10, and the heater 11 is installed at the bottom. Yes.

The agitation / removal plate 21 is formed of a stainless steel plate or the like to which the molten solder 12 in the static solder bath 10 is difficult to adhere, and has a width dimension corresponding to the width dimension in the static solder bath 10. In addition, the lower part 22 is submerged in the molten solder 12 (about 1/4 to 3/4 of the depth of the molten solder 12) in the static solder bath 10, and the upper part 23 is the liquid level of the molten solder 12. It is arranged in a state protruding from above.
The agitation / removal plate 21 is reciprocated and moved up and down by a drive mechanism 30 described in detail below.

  As shown in FIGS. 1 and 2, the drive mechanism 30 includes a reciprocating mechanism 32 and an elevating mechanism 36, and the stirring / removing plate 21 is moved from the start position of one side portion in the stationary solder bath 10 to the other side. The oxide film 14 on the liquid surface 13 is removed while stirring the molten solder 12 by moving to the end point position of the part. Furthermore, after the stirring / removal plate 21 is moved to the end point position, the lower end of the stirring / removing plate 21 is raised to the rising end position where the molten solder 12 separates upward from the liquid level to return to the original starting position, and the original lowering end. The operation to descend to is repeated sequentially.

That is, in the first embodiment, the reciprocating mechanism 32 of the drive mechanism 30 is disposed along the longitudinal direction outside the stationary solder tank 10 and is long with the motor (reversible motor) 31 as a drive source. A feed screw 33 rotatably supported in the case body 32a and a nut 34 are provided.
An elevating cylinder 37 as an elevating mechanism 36 is attached to a movable support 35 that is integrally connected to the nut 34 so as to be movable. A stirring / removing plate is attached to the tip of a rod 38 of the elevating cylinder 37. A connecting piece 26 extending from the upper portion of 21 is connected by a screw or the like.
The motor 31 and the lifting cylinder 37 of the drive mechanism 30 are controlled to operate based on a program set by a control device (not shown).

Further, in the first embodiment, the discharge portion 25 is bent downward from the top end of the horizontal overhang portion 24 bent horizontally from the upper end portion of the stirring / removal plate 21. The agitation / removal plate 21 is formed on the other side wall of the static solder bath 10 among the integrated oxide films 15 collected on the other side of the static solder bath 10 by the movement of the start position to the end position. The stacked portion 15a of the integrated oxide film 15 that exceeds the upper edge of the discharge port 10a10a is discharged from the discharge port 10a of the stationary solder bath 10 by the discharge unit 25.
In addition, the height of the upper surface of the discharge port 10a on the other side wall of the stationary solder tank 10 is appropriately lower than the other wall portion. On the other hand, the height of the lower end surface of the discharge portion 25 of the stirring / removal plate 21 at the descending end position is arranged at a position slightly higher than the upper surface height of the discharge port 10a.

  As shown in FIGS. 1 and 3, on the outside of the discharge port 10a on the other side wall of the static solder bath 10, there is a discharge oxide film (stacked on the integrated oxide film 15) discharged by the discharge portion 25 of the stirring / removal plate 21. A discharge chute 40 for discharging and guiding the portion 15a) 16 to a predetermined position is installed at a predetermined inclination angle. The discharge oxide film 16 discharged through the discharge chute 40 is received at the lower inclined end of the discharge chute 40. A collection box 45 for storage is disposed.

The solder bath apparatus according to the first embodiment is configured as described above.
Accordingly, in a state where the stirring / removing plate 21 is disposed at the start position and the lower end position, the motor 31 is operated in the forward direction and the feed screw 33 is rotated in one direction, so that the movable support body together with the nut 34 is supported. As a result, the agitation / removal plate 21 is moved from the start position shown in FIG. 3 to the end point position shown in FIG.

Here, the elevating cylinder 37 is operated, and the stirring / removal plate 21 is raised to the rising end position. Then, the motor 31 is operated in the opposite direction, and the feed screw 33 is rotated in the opposite direction, whereby the movable support 35 is moved backward together with the nut 34. As a result, as shown in FIG. The removal plate 21 is moved backward from the end point position to the original start position.
Here, the agitation / removal plate 21 is lowered to the original lowered end position by the elevating cylinder 37 (see FIG. 7).
In the state where the agitation / removal plate 21 is lowered to the original lower end position, for example, the pin of the electronic component inserted into the through hole of the printed board is on the liquid surface 13 of the molten solder 12 in the stationary solder bath 10. By soaking, the pins of the electronic component are soldered to the land of the printed circuit board.
Then, after the soldering is completed, the agitating / removing plate 21 repeats the above-described operations in order.

  As shown in FIG. 3 and FIG. 5, the static solder bath 10 is moved (moved forward) from the start position on one side of the static solder bath 10 to the end position on the other side in the static solder bath 10. The molten solder 12 in the molten solder 12 can be agitated to suppress the temperature difference between the molten solder 12 and the oxide film 14 generated on the liquid surface 13 of the molten solder 12 can be removed from the other side of the static solder bath 10. And can be removed well.

  Further, while the agitation / removal plate 21 moves from the position immediately before the end point position shown in FIG. 4 to the end point position shown in FIG. By operation, among the integrated oxide film 15 collected on the other side of the static solder bath 10, the upper stacked portion 15a can be discharged from the discharge port 10a. As a result, it is possible to reduce the trouble of manually removing the integrated oxide film 15 or the cost of manufacturing and assembling a dedicated discharge device for discharging the integrated oxide film 15.

Further, in the first embodiment, the discharged oxide film 16 discharged from the discharge port 10a of the stationary solder tank 10 is received by the discharge chute 40 and guided to drop to the lower inclined end of the discharge chute 40, and then the collection box. It is thrown into 45 and collected (see FIG. 5).
For this reason, the trouble of collecting the discharged oxide film 16 becomes unnecessary, and there is no problem that the discharged oxide film 16 is scattered around the stationary solder tank 10 and is contaminated.

(Example 2)
Next, a second embodiment of the present invention will be described with reference to FIGS.
FIG. 8 is a perspective view showing a stationary solder bath apparatus according to Embodiment 2 of the present invention. FIG. 9 is an explanatory view showing a state where the stirring / removal plate is moved from the start position to the end position. FIG. 10 is an explanatory view showing a state where the stirring / removal plate at the end point position is raised to the rising end position and then returned to the original starting position.

As shown in FIG. 8, in the second embodiment, the shape of the stainless steel stirring / removal plate 121 is changed and the installation of the discharge chute and the collection box is abolished.
That is, the agitation / removal plate 121 has a width dimension corresponding to the dimension in the width direction in the tank of the static solder tank 10, and the lower portion 122 is the molten solder 12 (the depth of the molten solder 12 in the static solder tank 10). The upper portion 123 is formed in a square plate shape that is disposed so as to protrude from the liquid level 13 of the molten solder 12.

Also in the second embodiment, the agitation / removal plate 121 is reciprocated and moved up and down by the drive mechanism 30 including the reciprocating mechanism 32 and the elevating cylinder 37 as the elevating mechanism 36 as in the first embodiment. . A connecting piece 126 extending from the top of the stirring / removing plate 121 is connected to the tip of the rod 38 of the lifting cylinder 37 by a screw or the like.
Since other configurations of the second embodiment are configured in the same manner as the first embodiment, the description thereof is omitted.

The static solder bath apparatus according to the second embodiment is configured as described above.
Therefore, in the state where the stirring / removing plate 121 is located at the start position and at the descending end position, as shown in FIG. 9, the stirring / removing plate 121 moves from the start position to the end point position.
Here, after the stirring / removal plate 121 is raised to the rising end position, as shown in FIG. 10, it is returned to the original end position and lowered to the lowering end position.

As shown in FIG. 9, the melting in the static solder bath 10 is performed by the movement of the stirring / removal plate 121 from the start position on one side in the static solder bath 10 to the end position on the other side (advance). The solder 12 can be agitated to suppress the temperature difference between the molten solder 12 and the oxide film 14 generated on the liquid surface 13 of the molten solder 12 is collected on the other side of the static solder bath 10. It can be removed well.
Further, the integrated oxide film 15 collected and collected on the other side of the static solder bath 10 can be discharged from the static solder bath 10 by hand, and a dedicated discharge device is manufactured and installed. You can also respond.

1 is a perspective view showing a stationary solder bath apparatus according to Embodiment 1 of the present invention. It is a sectional side view which similarly shows the drive mechanism of a stirring and removal board. It is explanatory drawing which shows the state by which the stirring / removal board was similarly arrange | positioned in the starting position. Similarly, it is explanatory drawing which shows the state which the stirring and removal board was moved to just before an end point position. It is explanatory drawing which shows the state by which the stirring / removal board was similarly moved to the end point position. It is explanatory drawing which shows the state in which the stirring / removal board of the end point position was similarly raised to the raise end position. It is explanatory drawing which shows the state in which the stirring / removal board similarly returned to the start position was lowered | hung to the original fall end position. It is a perspective view which shows the stationary type solder tank apparatus which concerns on Example 2 of this invention. It is explanatory drawing which shows the state from which the stirring / removal board was similarly moved from the start position to the end point position. It is explanatory drawing which shows the state which is similarly returned to the original start position, after the stirring and removal board of an end point position is raised to a raise end position.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Static type solder tank 12 Molten solder 13 Liquid surface 14 Oxide film 15 Integrated oxide film 16 Discharge oxide film 21, 121 Stirring / removal plate 22, 122 Lower 23, 123 Upper 25 Discharge part 30 Drive mechanism 40 Discharge chute 45 Collection box

Claims (3)

A box-shaped static solder bath opened upward in which molten solder is stored;
The lower part is submerged in the molten solder, and the upper part protrudes from the liquid surface of the molten solder and moves from the start position of one side part to the end point position of the other side part in the static solder bath. A plate-like stirring / removing plate that removes the oxide film on the liquid surface while stirring the solder;
A stationary solder bath apparatus, comprising: a drive mechanism that moves the agitation / removal plate from the start position to the end position. The static solder bath apparatus according to claim 1,
The agitation / removal plate is stacked on the integrated oxide film over the upper edge of the static solder tank among the integrated oxide films collected on the other side of the static solder tank by the movement from the start position to the end position. A static solder bath apparatus having a discharge portion for discharging the portion from the static solder bath in an integrated manner. The static solder bath apparatus according to claim 2,
On the outside of the static solder bath, a discharge chute that receives the discharge oxide film discharged by the discharge part of the stirring / removal plate and guides it to a predetermined position, and a recovery that stores the discharge oxide film discharged through this discharge chute A static solder bath apparatus, wherein a box is disposed.

Images