CN111360353A - Be applied to SMT's dip soldering equipment - Google Patents

Be applied to SMT's dip soldering equipment Download PDF

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Publication number
CN111360353A
CN111360353A CN201811602459.3A CN201811602459A CN111360353A CN 111360353 A CN111360353 A CN 111360353A CN 201811602459 A CN201811602459 A CN 201811602459A CN 111360353 A CN111360353 A CN 111360353A
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China
Prior art keywords
groove
wall
sliding
main machine
smt
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CN201811602459.3A
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CN111360353B (en
Inventor
刘斌
张祥谦
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Shanghai Tuoyi Electronic Technology Co ltd
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Shanghai Tuoyi Electronic Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)

Abstract

The invention provides dip soldering equipment applied to SMT, which relates to the technical field of soaking equipment and comprises the following components: the device comprises a main machine, a groove is formed in the right side of the upper surface of the main machine, a U-shaped groove communicated with the outer wall of the right side of the main machine is formed in the center of the right side of the inner wall of the groove, a tin bath is embedded into the groove, a pipe bank which is positioned at the same vertical horizontal line with the U-shaped groove in an inserted mode is inserted in the center of the right side of the tin bath, the pipe bank is communicated with the tin bath, the main machine comprises a collecting tank which is welded to the middle lower side of the outer wall of the right side of the main machine through laser, a supporting; the sliding assembly is provided with sliding grooves close to the right side on the front and back surfaces of the main machine, and comprises two sliding rods which are symmetrically welded on the front and back sides below the inner wall of the sliding assembly in a spot welding mode; the invention has the beneficial effects that: the tin that the staff will be boiled and melted is discharged/the work efficiency who improves the equipment of soaking conveniently.

Description

Be applied to SMT's dip soldering equipment
Technical Field
The invention relates to the technical field of dip soldering equipment, in particular to dip soldering equipment applied to SMT.
Background
The dip soldering is a multi-spot soldering method which is widely applied to a plug-in process and an SMT red glue surface, a large amount of tin is boiled and melted by hands or machines, a soldering surface is immersed, so that soldering points are soldered, and the dip soldering is a method for soldering a plurality of soldering points by immersing a PCB (printed Circuit Board) inserted with components in a melting tin furnace.
The prior dip soldering equipment applied to the SMT is mainly characterized in that the dip soldering is carried out after the tin is boiled and melted, and after the dip soldering is completed, the boiled and melted tin is not convenient to clean and discharge in the equipment, so that troubles are brought to workers.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: to the problem that prior art exists, a be applied to SMT's dip soldering equipment is provided, can the person of facilitating the use discharge tin through calandria and U type groove to utilize clamping device and sliding assembly can improve greatly and soak efficiency.
The technical problem to be solved by the invention is realized by adopting the following technical scheme: a dip soldering apparatus applied to SMT, the dip soldering apparatus applied to SMT comprising:
the device comprises a main machine, a groove is formed in the right side of the upper surface of the main machine, a U-shaped groove communicated with the outer wall of the right side of the main machine is formed in the center of the right side of the inner wall of the groove, a tin bath is embedded into the groove, a pipe bank which is positioned at the same vertical horizontal line with the U-shaped groove is inserted in the center of the right side of the tin bath, the pipe bank is communicated with the tin bath, the main machine comprises a collecting tank welded to the middle lower side of the outer wall of the right side of the main machine through laser, a support plate which is supported on the collecting tank is fixed in parallel to the;
the sliding assembly comprises two sliding rods which are symmetrically welded on the front side and the rear side below the inner wall of the sliding assembly in a spot welding mode, clamping grooves are formed in the upper surfaces of the sliding rods, and the tail ends of the two sliding rods slide into the sliding grooves in the front side and the rear side of the main machine respectively and are clamped through the clamping grooves, so that the sliding assembly is connected with the main machine in a left-right sliding mode;
clamping device, clamping device includes inner panel, notch plate and gasket, just the inner panel is equipped with two and imbeds respectively in clamping device's inboard bottom both sides about, the notch plate is equipped with two and welds in clamping device's terminal left and right sides through electric arc symmetry, just the gasket passes through the solvent and bonds in notch plate inner wall.
Preferably, slots are formed in the centers of the front side and the rear side of the inner wall of each groove from top to bottom, and inserting blocks matched with the shapes and the sizes of the slots are formed in the centers of the front end and the rear end of the outer wall of the tin bath.
Preferably, a circle of support blocks are fixed on the lower side of the periphery of the inner wall of the groove, at least three heating pipes which are horizontally and equidistantly arranged are placed at the bottom of the inner side of the groove, and the heating pipes are connected with a host machine through electric wires.
Preferably, the host computer still includes display screen, landing leg and apron, just the display screen passes through wire and host computer signal connection, landing leg laser welding is in host computer bottom four corners, just the apron passes through hinge joint in recess left side top and with host computer swing joint.
Preferably, the apron includes observation window and hand is buckled, just the observation window is embedded in apron left surface middle part, the hand is buckled and is opened in apron left surface middle and upper place and be on a parallel with the observation window top.
Preferably, the sliding assembly further comprises a connecting rod vertically welded to the center of the lower surface thereof through an arc, and the bottom surface of the connecting rod is welded to the center of the upper surface of the clamping device through spot welding, and the clamping device is connected with the sliding assembly through the connecting rod and is parallel to the upper part of the groove.
Compared with the prior art, the invention has the beneficial effects that:
according to the dip soldering equipment applied to the SMT, the calandria is embedded into the U-shaped groove from top to bottom, then the pipe orifice of the calandria is sealed through the embedded piston, when tin in the tin groove needs to be discharged, the piston of the calandria only needs to be pulled out, and the tin in the tin groove can be discharged outside through the calandria, so that the tin can be discharged quickly, the operation is simple and convenient, the discharged tin can directly flow into the collecting groove, and the collecting groove can be used for concentrating the discharged tin to facilitate subsequent treatment;
the sliding rod slides into the sliding groove, and then is clamped in the sliding groove through the clamping groove, so that the sliding rod is prevented from sliding out of the sliding groove in the sliding process, and after the sliding rod is installed, the sliding assembly can slide left and right on the host machine, so that the working efficiency of a user during soaking can be improved, and each area of the red glue surface in the SMT can be soaked conveniently;
both sides card is between two concave plates about the SMT that will soak, can play the effect of protection SMT through the gasket in the concave plate, reduce SMT and concave plate's frictional force, SMT according to not unidimensional size, the user can adjust the interval between two concave plates through the inboard inner panel of pulling clamping device, can the person of facilitating the use like this put into different specification and dimension's SMT, be favorable to enlarging clamping device's application scope, not only need not to soak through manual like this, and greatly reduced the potential safety hazard that the during operation exists.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the slide assembly and clamping assembly of the present invention;
fig. 3 is an assembly view of fig. 1 and 2 of the present invention.
The labels in the figure are: 1-a host; 2-cover plate; 201-observation window; 202-hand clasping; 3-a tin bath; 301-an insert block; 302-calandria; 4-a groove; 401-U type groove; 402-branch block; 403-heating tube; 404-slot; 5, collecting tank; 6-a support plate; 7-a chute; 8-a display screen; 9-a support leg; 10-a sliding assembly; 101-a slide bar; 102-card slot; 103-connecting rod; 11-a clamping device; 111-an inner plate; 112-concave plate; 113-shim.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to 3, a dip soldering apparatus for SMT, the dip soldering apparatus for SMT includes:
the main machine 1, the right side of the upper surface of the main machine 1 is provided with a groove 4, the right center of the inner wall of the groove 4 is provided with a U-shaped groove 401 communicated with the right outer wall of the main machine 1, a tin bath 3 is embedded in the groove 4, a calandria 302 which is in the same vertical horizontal line with the U-shaped groove 401 is inserted in the right center of the groove 4, the calandria 302 is communicated with the tin bath 3, the main machine 1 comprises a collecting tank 5 which is welded on the middle lower side of the right outer wall of the main machine 1 through laser, a support plate 6 which is supported on the collecting tank 5 is fixed in parallel with the lower side of the collecting tank 5, the left side of the support plate 6 is welded and fixed with the right lower side of the main machine 1, the front and rear centers of the inner wall of the groove 4 are provided with slots 404 from top to bottom, the centers of the front and rear ends of the outer wall of the tin bath 3 are provided with insertion blocks 301, the pipe orifice of the calandria 302 is positioned at the right end of the host 1, then the pipe orifice of the calandria 302 is sealed by the embedded piston, then tin to be used is placed in the tin bath 3 by a user to be boiled and melted, when the tin in the tin bath 3 needs to be discharged, the piston of the calandria 302 only needs to be pulled out, and the tin in the tin bath 3 can be discharged outside through the calandria 302, so that the tin can be rapidly discharged, the operation is simple and convenient, because the collecting tank 5 is fixed at the middle lower part of the right side of the host 1, the discharged tin can directly flow into the collecting tank 5, the discharged tin can be concentrated by the collecting tank 5 to facilitate subsequent treatment, and the supporting plate 6 plays a role in supporting the collecting tank 5;
in the sliding assembly 10 of the embodiment of the invention, the front and back surfaces of the main machine 1 are provided with the sliding grooves 7 close to the right side, the sliding assembly 10 comprises two sliding rods 101 which are symmetrically welded on the front and back sides below the inner wall of the sliding assembly 10 in a spot welding mode, the upper surfaces of the sliding rods 101 are provided with clamping grooves 102, the tail ends of the two sliding rods 101 respectively slide into the sliding grooves 7 on the front and the back of the main machine 1 and are clamped by the clamping grooves 102, the sliding assembly 10 is connected with the main machine 1 in a left-right sliding manner, a user slides the sliding assembly 10 into the sliding grooves 7 on the front and back surfaces of the main machine 1 through the two sliding rods 101, then clamps the sliding rods 101 in the sliding grooves 7 through the clamping grooves 102, prevents the sliding rods 101 from sliding out of the sliding grooves 7 in the sliding process, and can slide the sliding assembly 10 on the main machine 1 in a left-right sliding manner after being installed, therefore, the working efficiency of a user during soaking can be improved, and each area of the red glue surface in the SMT can be soaked conveniently;
in the clamping device 11 of the embodiment of the invention, the clamping device 11 includes an inner plate 111, a concave plate 112 and a gasket 113, the inner plate 111 is provided with two blocks and is embedded into the left and right sides of the bottom of the inner side of the clamping device 11, respectively, the concave plate 112 is provided with two blocks and is symmetrically welded to the left and right sides of the tail end of the clamping device 11 through an electric arc, and the gasket 113 is adhered to the inner wall of the concave plate 112 through a solvent, the sliding assembly 10 further includes a connecting rod 103 vertically welded to the center of the lower surface thereof through an electric arc, and the bottom surface of the connecting rod 103 is welded to the center of the upper surface of the clamping device 11 through spot welding, the clamping device 11 is connected with the sliding assembly 10 through the connecting rod 103 and is parallel to the upper side of the groove 4, through the two concave plates 112 at the tail end of the clamping device 11, a user clamps the left and right sides of an SMT, according to the SMT of different sizes, the user can adjust the interval between two concave plate 112 through pulling the inboard inner panel 111 of clamping device 11, can the person of facilitating the use like this put into the SMT of different specification and dimension, be favorable to enlarging clamping device 11's application scope, fix SMT after well, alright soak in directly putting into molten tin bath 3 with whole clamping device 11, so not only need not to soak through manual, and greatly reduced the potential safety hazard that the during operation exists.
In this embodiment, recess 4 inner wall is fixed with round piece 402 in the downside all around, and recess 4 inboard bottom has laid three piece at least heating pipes 403 that are horizontal equidistance and arrange, heating pipe 403 passes through electric wire and 1 connection of electric lines of host computer, the user is when embedding recess 4 with molten tin bath 3, with 3 bottom laminating of molten tin bath at piece 402 upper surface can, piece 402 has played the effect that supports molten tin bath 3, then, the user switches on external power supply with host computer 1, because heating pipe 403 and 1 electric connection of host computer, so send the heat through heating pipe 403 and just can boil the melting to the inside tin of molten tin bath 3.
In this embodiment, host computer 1 still includes display screen 8, landing leg 9 and apron 2, and display screen 8 passes through wire and 1 signal connection of host computer, 9 laser welding of landing leg in the four corners of 1 bottom of host computer, and apron 2 hinge in recess 4 left side top and with 1 swing joint of host computer through the hinge, be convenient for learn the work information of host computer 1 through display screen 8, utilize four landing legs 9 to play the effect of supporting host computer 1, and apron 2 has played dirt-proof effect.
In this embodiment, apron 2 includes observation window 201 and hand buckle 202, and observation window 201 imbeds in 2 left surfaces of apron middle part, and hand buckle 202 is opened in 2 left surfaces of apron top and be on a parallel with the observation window 201 top, utilizes observation window 201, when the user covers apron 2 on recess 4, alright observe the condition in recess 4 through observation window 201, utilize hand buckle 202 person of facilitating the use to rotate apron 2 from recess 4 and open.
The display screen is JHD12864-G176BSW-G in model number; the heating pipe model is SUS 304.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, it should be noted that any modifications, equivalents and improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (6)

1. The utility model provides a be applied to dip soldering equipment of SMT which characterized in that, the dip soldering equipment of being applied to SMT includes:
the device comprises a host (1), wherein a groove (4) is formed in the right side of the upper surface of the host (1), a U-shaped groove (401) communicated with the outer wall of the right side of the host (1) is formed in the center of the right side of the inner wall of the groove (4), a tin bath (3) is embedded in the groove (4), a pipe bank (302) which is positioned on the same vertical horizontal line with the U-shaped groove (401) is inserted in the center of the right side of the tin bath (3), the pipe bank (302) is communicated with the tin bath (3), the host (1) comprises a collecting tank (5) welded to the middle and lower side of the outer wall of the right side of the host through laser, a support plate (6) supported on the collecting tank (5) is fixed to the lower side of the collecting tank (5) in parallel with the left;
the sliding assembly (10) is provided with sliding grooves (7) close to the right side on the front and back surfaces of the main machine (1), the sliding assembly (10) comprises two sliding rods (101) which are symmetrically welded to the front and back sides below the inner wall of the sliding assembly (10) in a spot welding mode, clamping grooves (102) are formed in the upper surfaces of the sliding rods (101), and the tail ends of the two sliding rods (101) slide into the sliding grooves (7) on the front and back surfaces of the main machine (1) respectively and are clamped through the clamping grooves (102), so that the sliding assembly (10) is in left-right sliding connection with the main machine (1);
clamping device (11), clamping device (11) include inner panel (111), notch plate (112) and gasket (113), just inner panel (111) are equipped with two and imbed respectively in both sides about the inboard bottom of clamping device (11), notch plate (112) are equipped with two and weld in the terminal left and right sides of clamping device (11) through the electric arc symmetry, just gasket (113) bond in notch plate (112) inner wall through the solvent.
2. The dip soldering apparatus applied to SMT according to claim 1, wherein: slot (404) have been opened from last to down to side center around recess (4) inner wall, just the tip center all opens has plug-in block (301) identical with slot (404) overall dimension around molten tin bath (3) outer wall.
3. The dip soldering apparatus applied to SMT according to claim 1, wherein: a circle of support blocks (402) are fixed to the lower side of the periphery of the inner wall of the groove (4), at least three heating pipes (403) which are horizontally arranged at equal intervals are arranged at the bottom of the inner side of the groove (4), and the heating pipes (403) are connected with a host (1) through electric wires.
4. The dip soldering apparatus applied to SMT according to claim 1, wherein: host computer (1) still includes display screen (8), landing leg (9) and apron (2), just display screen (8) pass through wire and host computer (1) signal connection, landing leg (9) laser welding in host computer (1) bottom four corners, just apron (2) hinge in recess (4) left side top and with host computer (1) swing joint through the hinge.
5. The dip soldering device applied to SMT according to claim 4, wherein: the cover plate (2) comprises an observation window (201) and a hand buckle (202), the observation window (201) is embedded in the middle of the left surface of the cover plate (2), and the hand buckle (202) is arranged above the middle of the left surface of the cover plate (2) and is parallel to the upper side of the observation window (201).
6. The dip soldering apparatus applied to SMT according to claim 1, wherein: the sliding assembly (10) further comprises a connecting rod (103) vertically welded to the center of the lower surface of the sliding assembly through an arc, the bottom surface of the connecting rod (103) is welded to the center of the upper surface of the clamping device (11) through spot welding, and the clamping device (11) is connected with the sliding assembly (10) through the connecting rod (103) and is parallel to the upper side of the groove (4).
CN201811602459.3A 2018-12-26 2018-12-26 Dip soldering equipment applied to SMT Active CN111360353B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811602459.3A CN111360353B (en) 2018-12-26 2018-12-26 Dip soldering equipment applied to SMT

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Application Number Priority Date Filing Date Title
CN201811602459.3A CN111360353B (en) 2018-12-26 2018-12-26 Dip soldering equipment applied to SMT

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CN111360353A true CN111360353A (en) 2020-07-03
CN111360353B CN111360353B (en) 2022-06-10

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008272770A (en) * 2007-04-26 2008-11-13 Kojima Press Co Ltd Stationary solder bath device
CN101829825A (en) * 2010-05-18 2010-09-15 严永农 Intelligent wave soldering tin bath
CN203696345U (en) * 2013-11-14 2014-07-09 浙江世明电器有限公司 Clamp for automatic tin dipping machine
CN204504451U (en) * 2015-01-29 2015-07-29 四川朗峰电子材料有限公司 A kind of tin melting furnace
CN206794970U (en) * 2017-04-24 2017-12-26 贵州理工学院 A kind of automatic dip-soldering machine
CN107745173A (en) * 2017-11-22 2018-03-02 张锡林 A kind of electricity-saving lamp pcb board wicking clamping device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008272770A (en) * 2007-04-26 2008-11-13 Kojima Press Co Ltd Stationary solder bath device
CN101829825A (en) * 2010-05-18 2010-09-15 严永农 Intelligent wave soldering tin bath
CN203696345U (en) * 2013-11-14 2014-07-09 浙江世明电器有限公司 Clamp for automatic tin dipping machine
CN204504451U (en) * 2015-01-29 2015-07-29 四川朗峰电子材料有限公司 A kind of tin melting furnace
CN206794970U (en) * 2017-04-24 2017-12-26 贵州理工学院 A kind of automatic dip-soldering machine
CN107745173A (en) * 2017-11-22 2018-03-02 张锡林 A kind of electricity-saving lamp pcb board wicking clamping device

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