JPS6272769U - - Google Patents
Info
- Publication number
- JPS6272769U JPS6272769U JP16400685U JP16400685U JPS6272769U JP S6272769 U JPS6272769 U JP S6272769U JP 16400685 U JP16400685 U JP 16400685U JP 16400685 U JP16400685 U JP 16400685U JP S6272769 U JPS6272769 U JP S6272769U
- Authority
- JP
- Japan
- Prior art keywords
- scraping plate
- scum
- liquid level
- solder
- solder liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000007790 scraping Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面はこの考案の実施例を示すもので、第１図
〜第３図はこのハンダ液面のかす排出装置の側断
面図で、かすの掻き取り動作の各動作過程を示す
図、第４図はハンダ槽のかす排出溝部の拡大断面
図、第５図は第１図における右側面図である。
１……ハンダ槽、２……第１のかす掻き取り板
、２ａ……下端部、２′……第２のかす掻き取り
板、２ａ′……下端、３，３′……ハンダ液面、
４……スペーサ、５……かす排出溝、６……かす
受箱、７……汲み上げハンダ槽、８……かす、９
……かす排出口と連接する内壁面角。
The drawings show an embodiment of this invention, and FIGS. 1 to 3 are side sectional views of this device for discharging scum from the solder liquid level. 5 is an enlarged sectional view of the scum discharge groove of the solder bath, and FIG. 5 is a right side view of FIG. 1. 1...Solder tank, 2...First scrap scraping plate, 2a...Lower end, 2'...Second scrap scraping plate, 2a'...Lower end, 3, 3'...Solder liquid level ,
4... Spacer, 5... Drag discharge groove, 6... Drag receiving box, 7... Pumping solder tank, 8... Drag, 9
...Inner wall surface angle that connects with the waste discharge port.
Claims (1)
１のかす掻き取り板と、下端がハンダ液面より僅
かに離れた第２のかす掻き取り板とを所定間隔を
置いて一体にハンダ液面に沿つて移動するように
設けるとともに、その移動に際して前記第２のか
す掻き取り板が第１のかす掻き取り板より先行す
るようにしたことを特徴とするハンダ液面のかす
排出装置。 A first scrap scraping plate whose lower end is immersed in the solder liquid level of the solder tank and a second scrap scraping plate whose lower end is slightly apart from the solder liquid level are placed at a predetermined interval and integrally removed from the solder liquid. 1. A scum discharge device for a solder liquid level, characterized in that the second scum scraping plate is provided to move along a surface, and the second scum scraping plate precedes the first scum scraping plate during the movement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16400685U JPS6272769U (en) | 1985-10-25 | 1985-10-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16400685U JPS6272769U (en) | 1985-10-25 | 1985-10-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6272769U true JPS6272769U (en) | 1987-05-09 |
Family
ID=31092728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16400685U Pending JPS6272769U (en) | 1985-10-25 | 1985-10-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6272769U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008272770A (en) * | 2007-04-26 | 2008-11-13 | Kojima Press Co Ltd | Stationary solder bath device |
-
1985
- 1985-10-25 JP JP16400685U patent/JPS6272769U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008272770A (en) * | 2007-04-26 | 2008-11-13 | Kojima Press Co Ltd | Stationary solder bath device |
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