567229 A7 ________B7___ 五、發明說明（I) 〔技術領域〕 本發明係關於一能從自動焊接裝置的噴流焊料槽所產 生之熔渣中將焊料和氧化物分離之裝置。 〔先前技術〕 印刷基板之焊接，係用設有焊劑機、預熱器、噴流焊 料槽、冷卻機等之自動焊接裝置來進行。自動焊接裝置之 噴流焊料槽，係藉由使印刷基板接觸噴嘴所噴出之熔融焊 料，來使焊料附著於焊接部。 噴流焊料槽中設有噴嘴，該噴嘴的下部和導管相連， 在該導管的端部裝設泵。噴流焊料槽內之熔融焊料的移動 ，首先是被導管端部的泵吸入導管內，在導管內流動後從 噴嘴向上方噴流。 噴流焊料槽中之熔融焊料，由於經常接觸空氣，故不 斷進行氧化，表面將被該氧化物覆蓋，但氧化物下的熔融 焊料則保持淸淨狀態。在噴流焊料槽的液面下，淸淨的熔 融焊料會被泵吸入導管內，當其從噴嘴噴出時，因在此會 接觸空氣進行氧化，而產生新的氧化物。然後當噴出的熔 融焊料從噴嘴落下時，將擾亂熔融焊料的液面，將液面的 氧化物推開而使淸淨的熔融焊料露出，露出後之淸淨的熔 融焊料將接觸空氣，在此也會產生氧化。因此，在噴流焊 料槽中，除噴出之熔融焊料的氧化外，噴出後的熔融焊料 之落下時攪拌液面也會產生氧化，可說在所有的場所都在 進行氧化。 然而，一般將噴流焊料槽產生者簡稱爲氧化物，但在 一 3 尺度適用中國國家標準（CNS)A4規格（210 X 297公发) " ~ (請先閱讀背面之注意事項再填寫本頁)567229 A7 ________B7___ 5. Description of the Invention (I) [Technical Field] The present invention relates to a device capable of separating solder and oxides from slag generated by a jet solder bath of an automatic soldering device. [Prior art] The soldering of printed circuit boards is performed by an automatic soldering device provided with a flux machine, a preheater, a jet solder tank, a cooler, and the like. In the jet solder tank of the automatic soldering device, the solder is adhered to the soldered portion by contacting the printed substrate with the molten solder sprayed from the nozzle. A spray nozzle is provided with a nozzle, and a lower portion of the nozzle is connected to a pipe, and a pump is installed at an end of the pipe. The movement of the molten solder in the jet solder tank is first sucked into the pipe by the pump at the end of the pipe, and after flowing in the pipe, it flows upward from the nozzle. The molten solder in the jet solder bath is constantly oxidized due to the constant contact with air, and the surface will be covered by the oxide, but the molten solder under the oxide will remain clean. Under the liquid surface of the jet solder bath, the clean molten solder will be sucked into the pipe by the pump. When it is sprayed from the nozzle, it will contact the air to oxidize and generate new oxides. Then, when the discharged molten solder falls from the nozzle, the liquid surface of the molten solder will be disturbed, and the oxide on the liquid surface will be pushed away to expose the cleaned molten solder. After the exposed molten solder will contact the air, here Oxidation can also occur. Therefore, in the jet flow solder tank, in addition to the oxidization of the molten solder being sprayed, the molten liquid surface is oxidized when the molten solder after the spray is dropped, and it can be said that oxidation is occurring in all places. However, the generator of the jet solder bath is generally referred to as oxide, but the Chinese National Standard (CNS) A4 specification (210 X 297) is applicable on a 3 scale. &Quot; ~ (Please read the precautions on the back before filling this page )
A7 567229 __B7___ 五、發明說明（ V) (請先閱讀背面之注意事項再填寫本頁) 此的氧化物，並非完全都是氧化物之浮游’而是氧化物和 熔融焊料所混合成之呈冰沙狀之所謂熔渣的浮游。隨著時 間之經過該熔渣會大量的產生，若覆蓋到整個噴流焊料槽 ，最後將從噴流焊料槽溢出。由於熔渣爲溶融焊料和氧化 物的混合物，當其從噴流焊料槽溢出時，熔渣中的熔融焊 料將烫傷操作者的腳，或使地板焦黑等，或熔渣會被吸入 噴流泵中，或從噴流噴嘴噴出而附著在印刷基板上等，而 造成問題。 於是，在焊接的作業現場，操作員不斷地監視噴流焊 料槽，當噴流焊料槽中開始有熔渣的積存，就用帶柄杓舀 取，再丟棄到一斗罐般的空罐容器中。丟棄的熔渣，被精 煉業者用便宜的價格買去，運回精煉工廠後從熔渣中回收 焊料。亦即，在焊接現場，含有高價的熔融焊料之熔渣被 精煉業者以低廉的價格買去。 熔渣中大量含有尙可使用的焊料，但因在焊接現場無 法從焊渣中分離焊料，故造成將高價的焊料和氧化物一起 丟棄的現狀。有鑑於該經濟上的損失，日本專利特開 2001-234258號提案出在焊接現場從熔渣中除去氧化物而 取出焊料之分離裝置。又特開2000-190073號提案出，在 自動焊接裝置之噴流焊料槽撒佈芝麻、米糠、菜籽等的糖 類，將噴流焊料槽所產生之熔渣在噴流焊料槽內分離成氧 化物和焊料之方法、裝置。 特開2001-234258號之分離裝置，係在用來使焊料熔 融之熔融槽上部設置罩，在該罩上裝設用來攪拌熔融焊料 4 ^紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） " A7 567229 __B7_______ 五、發明說明（>) 和熔渣之刀片，並在罩上裝設非氧化性氣體供給口。用該 分離裝置來從熔渣中分離氧化物時，須另行將焊接裝置之 焊料槽所產生之熔渣撈取’再將其放在分離裝置的熔融槽 內之熔融狀態焊料上。接著將熔融槽封罩，並使非氧化性 氣體流入熔融槽內而形成非氧化性環境氣氛後，使裝設於 罩上之攪拌刀片轉動。如此般放在熔融焊料上的熔渣將會 和熔融焊料接觸。由於該熔渣爲熔融焊料和氧化物所混合 而成者，若經攪拌刀片的作用而和熔融槽內之熔融焊料接 觸，熔渣中的熔融焊料會和熔融槽內的熔融焊料融合而和 氧化物分離。這時由於罩內形成非氧化性環境氣氛，焊料 不致產生再氧化。 又特開2000-190073之焊料回收裝置，係具備撒佈機 構，以將氧化分離劑撒佈在自動焊接裝置的噴流焊料槽。 在此，由於在噴流焊料槽內將熔渣分離成焊料和氧化物並 將氧化物丟棄，故噴流焊料槽內之焊料不會增多。 〔發明所要解決的課題〕 然而特開2001-234258號之氧化分離裝置，當熔渣中 的熔融焊料和熔融槽內的熔融焊料融合時，熔融槽內的熔 融焊料會增多。於是將分量增多的熔融焊料用帶柄杓舀出 ，注入擺在地上的鑄錠模內而形成鑄錠。因此，操作員從 氧化分離裝置的熔融槽用帶柄杓舀出熔融焊料後，將裝有 熔融焊料的帶柄杓放低到擺在地上的鑄錠模，再使帶柄杓 內的熔融焊料流入鑄錠模。然而，將帶柄杓從熔融槽放低 到地上的鑄錠模時，若帶柄杓踫撞其他物品、或帶柄杓中 5 ^紙張尺度適用中國S家標準（CNS)A4規格（210 X 297公爱1 " (請先閱讀背面之注意事項再填寫本頁) 訂-- -線 567229 A7 ------B7_ 五、發明說明（/ ) 裝有太大量的熔融焊料，有時放低帶柄杓的途中熔融焊料 會從帶柄杓溢出。溢出的熔融焊料會散到地面，附著在地 面上而使地面焦黑。當溢出的熔融焊料接觸操作員的腳部 而進入操作員的鞋入時，操作員會發生嚴重燙傷而造成很 大的危險。 又熔融槽內的熔融焊料流入鑄錠模時，因鑄錠模很大 ，要使熔融焊料完全固化要相當的時間。要將固化後的焊 料從鑄錠模取出時，必須將大型的鑄錠模翻轉，將鑄錠模 扔到地上而施加衝擊才能取出焊料。將重大的鑄錠模舉起 後取出焊料的作業不僅相當費事，且要處理從鑄錠模取出 的熱焊料之鑄塊也會產生危險。 又當將鑄塊放回噴流焊料槽內再度使用時，由於鑄塊 很大，將會使噴流焊料槽內之熔融焊料之溫度降低，而造 成焊接不良的原因。 特開2000-190073之焊料回收裝置，由於在是自動焊 接裝置之噴流焊料槽中將熔渣分離成氧化物，並不須另外 設置分離裝置。然而，就算在噴流焊料槽內產生大量的熔 渣，若處於焊接作業中，由於印刷基板是不斷地行走於自 動焊接裝置內，故無法進行氧化物之分離作業。因此，特 開2000-190073號之焊料回收裝置，在噴流焊料槽內將積 存大量的熔渣，有時會發生前述般之熔渣溢出噴流焊料槽 的問題。本發明係提供一氧化物之分離裝置，可將熔融槽 所舀出的焊料在當場就處理而成形爲便宜的棒狀焊料，且 不致對自動焊接裝置的作業產生任何的妨礙。 6 +、纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 -線· 567229 A7 ___B7________ 五、發明說明（^ ) 〔用以解決課題之手段〕 本發明人等著眼於，只要在用來使焊料熔融之熔融槽 附近設置可轉動的鑄模（可將焊料澆鑄成棒狀），就不須將 帶柄杓所舀出之熔融焊料放低到地面，又鑄模所鑄造出的 棒狀焊料之處理變得很容易。 本發明之氧化物之分離裝置，其特徵在於：係在本體 設置熔融槽，該熔融槽可使焊料熔融並從熔渣中將氧化物 和焊料分離，且在該熔融槽附近設置可轉動的鑄模，以將 熔融焊料鑄造成棒狀焊料。 〔發明之實施形態〕 本發明所使用之鑄模，係以可翻轉的方式設成可轉動 自如者。若使鑄模可轉動，則鑄模所形成的棒狀焊料將可 容易地取出。若將鑄模設在熔融槽附近之熔融槽前方，即 當操作員站在分離裝置前時係位於熔融槽和操作員之間時 ，當操作員用帶柄杓從熔融槽舀出熔融焊料再倒入鑄模內 時，握住帶柄杓的手不須大幅地上下移動，且不致受到其 他物品的干擾而能容易地進行鑄模作業。 本發明所使用之鑄模，可在兩面刻設溝槽以進行連續 的鑄模作業。亦即，由於在鑄模的單面進行澆鑄的期間， 相反面會被冷卻，故上側完成澆鑄後，只要焊料固化即可 將鑄模翻轉而使澆鑄於上面的焊料落下，使冷卻後的相反 側成爲上側而可馬上進行澆鑄作業。 本發明所使用之鑄模，可在溝槽內裝設爲區別澆鑄後 的棒狀焊料之記號。此乃基於，由於最近的地球環境問題 7 t、紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)A7 567229 __B7___ V. Description of the invention (V) (Please read the precautions on the back before filling this page) The oxides are not all floating of the oxides', but the mixture of oxides and molten solder is ice. The so-called slag floating in sand. Over time, the slag will be generated in large quantities. If it covers the entire jet solder bath, it will eventually overflow from the jet solder bath. Because the slag is a mixture of molten solder and oxide, when it overflows from the jet solder tank, the molten solder in the slag will burn the operator's feet, or make the floor black, etc., or the slag will be sucked into the jet pump. , Or sprayed from a jet nozzle and attached to a printed circuit board, etc., causing problems. Therefore, at the welding operation site, the operator constantly monitors the jet flow solder tank. When slag accumulates in the jet flow solder tank, it is picked up with a handle and discarded into a bucket-like empty tank container. The discarded slag is bought by the refiner at a cheap price, and the solder is recovered from the slag after being transported back to the refining plant. That is, at the welding site, slag containing high-priced molten solder is bought by the refiner at a low price. The slag contains a large amount of solder that can be used. However, since the solder cannot be separated from the slag at the welding site, the current situation of discarding the expensive solder together with the oxide has resulted. In view of this economic loss, Japanese Patent Laid-Open No. 2001-234258 proposes a separation device that removes oxides from the slag at the welding site and removes the solder. JP 2000-190073 also proposed that sesame, rice bran, rapeseed and other sugars were sprayed in the jet solder tank of the automatic soldering device, and the slag generated by the jet solder tank was separated into oxides and solder in the jet solder tank. Method, device. The separation device of JP 2001-234258 is provided with a cover on the upper part of the melting tank for melting the solder, and a cover for stirring the molten solder is provided on the cover. X 297 mm) " A7 567229 __B7_______ 5. Description of the invention (>) and slag blade, and a non-oxidizing gas supply port is installed on the cover. When using this separation device to separate oxides from the slag, the slag generated from the solder tank of the welding device must be taken separately 'and placed on the molten solder in the melting tank of the separation device. Next, the melting tank is sealed, and a non-oxidizing gas is flowed into the melting tank to form a non-oxidizing ambient atmosphere, and then the stirring blade mounted on the cover is rotated. The slag placed on the molten solder in this way will come into contact with the molten solder. Since the slag is a mixture of molten solder and oxide, if the molten solder in the melting tank is brought into contact with the action of the stirring blade, the molten solder in the slag will fuse with the molten solder in the melting tank and oxidize.物 离。 Object separation. At this time, since a non-oxidizing ambient atmosphere is formed in the cover, the solder is not reoxidized. Also, the solder recovery device of JP-A-2000-190073 is provided with a spraying mechanism for spraying an oxidation separating agent in a jet solder tank of an automatic soldering device. Here, since the slag is separated into solder and oxide in the jet solder bath and the oxide is discarded, the solder in the jet solder bath does not increase. [Problems to be Solved by the Invention] However, in the oxidation separation device of JP-A-2001-234258, when the molten solder in the slag and the molten solder in the melting tank are fused, the amount of molten solder in the melting tank increases. Then, the increased amount of molten solder was scooped out with a handle and poured into an ingot mold placed on the ground to form an ingot. Therefore, after an operator scoops out the molten solder with a handle from the melting tank of the oxidation separation device, the operator lowers the handle with the molten solder to the ingot mold placed on the ground, and then flows the molten solder in the handle with the ingot into the ingot. mold. However, when the handle 带 is lowered from the melting tank to the ingot mold on the ground, if the handle 杓 踫 collides with other items or the handle 杓 5 ^ The paper size applies to the Chinese Standard (CNS) A4 (210 X 297). 1 " (Please read the precautions on the back before filling in this page) Order --- line 567229 A7 ------ B7_ V. Description of the invention (/) There is too much molten solder, sometimes the tape is lowered. During the process of the handle, molten solder will overflow from the handle with the handle. The overflowed molten solder will spread to the ground and adhere to the ground to make the ground black. When the overflowing molten solder contacts the operator's foot and enters the operator's shoe, operate There is a serious risk of severe burns. When the molten solder in the melting tank flows into the ingot mold, because the ingot mold is large, it takes a considerable time for the molten solder to completely solidify. When the ingot mold is taken out, the large ingot mold must be turned over, and the ingot mold is thrown to the ground to apply an impact to remove the solder. The operation of removing the solder after lifting the large ingot mold is not only laborious, but also has to be handled. Removed from the ingot mold The ingot of the solder can also be dangerous. When the ingot is returned to the jet solder tank for reuse, the temperature of the molten solder in the jet solder tank will be lowered due to the large ingot, which will cause the cause of poor welding. Since the solder recovery device of JP 2000-190073 separates slag into oxides in a jet solder tank which is an automatic soldering device, there is no need to install a separate device. However, even if a large amount of melt is generated in the jet solder tank. If the slag is in the soldering operation, since the printed substrate is constantly walking in the automatic soldering device, the oxide separation operation cannot be performed. Therefore, the solder recovery device of JP 2000-190073 will accumulate in the jet solder tank. A large amount of slag may sometimes cause the aforementioned problem that the slag overflows the jet solder tank. The present invention provides an oxide separation device, which can process the solder extruded from the melting tank on the spot and form it into a cheap one. Rod solder without any obstacle to the operation of the automatic soldering device. 6 +, Paper size applies Chinese National Standard (CNS) A4 specification (21 0 X 297 mm) (Please read the precautions on the back before filling this page) Order-line · 567229 A7 ___B7________ V. Description of the Invention (^) [Means to Solve the Problem] The inventors are waiting to focus on A rotatable mold (which can be cast into a rod shape) is provided near the melting tank for melting the solder, so it is not necessary to lower the molten solder from the handle with the handle to the ground, and the rod-shaped solder cast by the mold The oxide separation device of the present invention is characterized in that a melting tank is provided in the body, the melting tank can melt the solder and separate the oxide and the solder from the slag, and the melting A rotatable mold is provided near the groove to cast molten solder into rod-shaped solder. [Embodiments of the Invention] The mold used in the present invention is provided in a rotatable manner so as to be rotatable. If the mold is made rotatable, the rod-shaped solder formed by the mold can be easily taken out. If the mold is set in front of the melting tank near the melting tank, that is, when the operator stands between the melting tank and the operator when standing in front of the separating device, the operator uses the handle with a handle to pour out the molten solder from the melting tank and pour it When in the mold, the hand holding the handle 杓 does not need to move up and down significantly, and it can easily perform the mold operation without being disturbed by other items. The mold used in the present invention can be grooved on both sides for continuous mold operation. That is, during the casting of one side of the mold, the opposite side is cooled, so after the upper side is finished casting, as long as the solder is solidified, the mold can be turned over to cause the solder cast on the upper side to fall, so that the opposite side after cooling becomes The upper side allows immediate casting work. In the mold used in the present invention, a mark for distinguishing the rod-shaped solder after casting can be installed in the groove. This is based on the recent global environmental problems. 7 t. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (Please read the precautions on the back before filling this page)
567229 A7 B7 五、發明說明（) ，而變成使用Sn-Ag-Cu系、Sn-Zn系、Sn-Bi系等的各種 無鉛焊料，這些必須依組成的不同而分開。用氧化物分離 裝置來分離各種無鉛焊料的氧化物的情形，當經鑄模鑄成 棒狀焊料時，由於形狀相同，將無法分辨其組成。於是可 依無鉛焊料種類的不同在棒狀焊料上加上記號而加以區別 。爲了在棒狀焊料加上記號，係在鑄模上安裝可拆裝之構 成記號的突狀物。該突狀物，可依突狀物的的形狀來決定 組成，或依突狀物的數目來決定組成，或將突狀物作成附 有焊料元素名之刻印。 〔實施例〕 以下根據圖面來說明本發明的氧化物之分離裝置(以下 簡稱分離裝置）。圖1係本發明的分離裝置之本體罩及熔融 槽罩打開狀態之立體圖；圖2係熔融槽罩閉合狀態之立體 圖；圖3係本體罩及熔融槽罩閉合狀態之立體圖；圖4係 本發明的分離裝置之本體罩及熔融槽罩打開狀態之側面截 面圖；圖5係本體罩及熔融槽罩閉合狀態之側面截面圖； 圖6係在鑄模的單面澆注焊料的狀態之側面截面圖；圖7 係將澆注焊料後的鑄模翻轉中途的側面截面圖；圖8係將 澆注焊料後的鑄模翻轉後的狀態的側面截面圖；圖9係鑄 模之部分擴大立體圖。 本發明之分離裝置，係在本體1上設置熔融槽2和鑄 模3。熔融槽2是用未圖示的加熱器，而使置入其內部的 焊料熔融並保持於既定溫度。熔融槽2上設有可如箭頭A 般開閉之熔融槽罩4。在罩4的內側架設著2根軸5、5， 8 衣纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂： .線· 567229 A7 ____ B7 ___-___ 五、發明說明（j ) 該軸上隔著一定間隔安裝有多數個葉片6…’且安裝成各 葉片的前端位置會描繪出螺旋狀。軸5、5的一端突出熔融 槽罩4的外部，在該突出部裝設齒輪7、7。這些齒輪卡合 於未圖示之鏈條，該鏈條和未圖示的馬達形成連動’馬達 運轉時，齒輪7、7轉動且多數個葉片6…也同時轉勳。由 於多數個葉片6…固定在軸5、5上’該軸設於熔融槽罩4 上，藉由開閉熔融槽罩，可使葉片6…上下移動，而當閉 合熔融槽罩時，可使其浸漬於熔融槽2之熔融焊料S中。 鑄模3上刻設有複數個澆鑄用的溝槽8…。該溝槽內 ，如圖9所示般，若依焊料種類的不同而用螺釘10裝設有 可裝卸的突起物9，則焊料的種類將不會弄錯。亦即依焊 料種類而決定突起物的形狀、數量、元素記號等，或在突 起物附上焊料的元素符號。 鑄模3係設置於本體1上之熔融槽2前方’即當操作 員用分離裝置進行作業時所站的位置和熔融槽2之間。若 將鑄模3設於熔融槽2的前方，當操作員從熔融槽2用帶 柄杓舀出熔融焊料並澆注在鑄模內時，不須大幅地移動從 熔融槽舉起的帶柄杓即可拿到鑄模的上方。 鑄模3的兩端以在鑄模的橫寬方向形成偏心的方式被 軸支於軸11上，在一軸上裝設有旋鈕12。鑄模3以可轉 動的方式設於收納箱13的上部。收納箱13之橫寬、縱長 均較鑄模3爲大，由於鑄模3以在橫寬方向形成偏心的方 式來安裝，用旋鈕12轉動鑄模時，其一側將抵接於收納箱 之一側而停止轉動。又在收納箱13上設有抽屜14。 9 _______________ t、紙張尺度適闬中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)567229 A7 B7 V. Description of the invention (), and various lead-free solders such as Sn-Ag-Cu-based, Sn-Zn-based, and Sn-Bi-based are used. These must be separated according to the composition. In the case of using an oxide separation device to separate oxides of various lead-free solders, when the solder is cast into a rod-shaped solder through a mold, the composition cannot be distinguished because of the same shape. Therefore, it can be distinguished by adding a mark on the rod-shaped solder according to the type of the lead-free solder. In order to add a mark to the rod-shaped solder, a detachable projection formed on the mold is attached to the mold. The composition of the protrusion may be determined by the shape of the protrusion, or the composition may be determined by the number of protrusions, or the protrusion may be engraved with the name of the solder element. [Examples] The oxide separation device (hereinafter referred to as a separation device) of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an open state of a body cover and a melting tank cover of the separation device of the present invention; FIG. 2 is a perspective view of a closed state of the melting tank cover; FIG. 3 is a perspective view of a closed state of the body cover and the melt tank cover; Fig. 5 is a side sectional view of the closed state of the body cover and the melting tank cover of the separating device; Fig. 6 is a side sectional view of the state where the solder is poured on one side of the mold; FIG. 7 is a side cross-sectional view of the mold after the solder is poured; FIG. 8 is a side cross-sectional view of the mold after the solder is poured; FIG. 9 is an enlarged perspective view of a part of the mold. The separating device of the present invention is provided with a melting tank 2 and a mold 3 on the main body 1. The melting tank 2 is a heater (not shown), and the solder placed in the melting tank 2 is melted and maintained at a predetermined temperature. The melting tank 2 is provided with a melting tank cover 4 that can be opened and closed like an arrow A. Two shafts 5, 5, and 8 are erected on the inside of the cover 4. The paper size is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) (please read the precautions on the back before filling this page). Order: Line · 567229 A7 ____ B7 ___-___ 5. Description of the invention (j) A plurality of blades 6 ... 'are installed on the shaft at a certain interval, and the front ends of the blades are spirally drawn. One ends of the shafts 5 and 5 protrude from the outside of the melting tank cover 4, and gears 7 and 7 are attached to the protruding portions. These gears are engaged with a chain (not shown), which is linked to a motor (not shown). When the motor is in operation, the gears 7, 7 rotate and a plurality of blades 6 ... also rotate at the same time. Since most of the blades 6 are fixed on the shafts 5 and 5, the shaft is provided on the melting tank cover 4. By opening and closing the melting tank cover, the blades 6 can be moved up and down, and when the melting tank cover is closed, it can be made. It is immersed in the molten solder S of the melting tank 2. The mold 3 is engraved with a plurality of grooves 8 for casting. In this groove, as shown in FIG. 9, if the removable projection 9 is attached to the screw 10 depending on the type of solder, the type of solder will not be wrong. That is, depending on the type of solder, the shape, number, element symbol, etc. of the protrusions are determined, or the element symbol of solder is attached to the protrusions. The mold 3 is provided in front of the melting tank 2 on the main body 1, that is, the position between the operator and the melting tank 2 when the operator operates with the separating device. If the mold 3 is set in front of the melting tank 2, when an operator scoops out molten solder from the melting tank 2 with a handle and pours it into the mold, the handle can be obtained without moving the handle 杓 lifted from the melting tank to a large extent. Above the mold. Both ends of the mold 3 are supported on a shaft 11 so as to be eccentric in the widthwise direction of the mold, and a knob 12 is mounted on one shaft. The mold 3 is rotatably provided on the upper portion of the storage box 13. The horizontal width and vertical length of the storage box 13 are larger than those of the mold 3. The mold 3 is installed in an eccentric manner in the horizontal and width directions. When the mold is rotated with the knob 12, one side of the storage box 13 will abut against one of the storage boxes. And stop turning. A drawer 14 is provided on the storage box 13. 9 _______________ t. The paper size is suitable for Chinese National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling in this page)
567229 A7 -------— B7___ 五、發明說明（^ ) 符號15代表用來將從熔渣分離之氧化物落至本體1下 部之斜槽，16代表用來裝從斜槽落下的氧化物之罐，17代 表用來載罐的台車，18代表用來放帶柄杓或篩等（用來處 理從熔渣分離的氧化物）之置物室，19代表覆蓋本體上部 之本體罩，20代表安裝於本體罩之排氣口，21代表用來將 氧化分離劑從熔融槽罩投入熔融槽內之投入孔，22爲投入 孔蓋。 接著說明上述構成之本發明的分離裝置之氧化物的分 離作業。首先使分離裝置的熔融槽2內之焊料S熔融並保 持於既定溫度。這時當噴流焊料槽所使用的焊料爲Sn-3Ag-0.5Cu之無鉛焊料時，在熔融槽內先放入同一組成的 無鉛焊料，並將熔融焊料的溫度保持於比該無鉛焊料的熔 點高約50°C之27(TC。接著如圖1、4所示般將本體罩19 和熔融槽罩4打開，將未圖示之自動焊接裝置的噴流焊料 槽所產生之熔渣D投入熔融槽2內之熔融焊料S上。如圖 2所示般閉合熔融槽罩4而使葉片6…浸在熔融焊料S中後 ，打開熔融槽罩4的蓋22，從投入孔21將芝麻般之氧化 分離劑少量地撒佈在熔融槽2內的熔渣上。將芝麻撒在熔 渣上後，如圖3、5所示般閉合蓋22，再閉合本體罩19後 ，使葉片6轉動，用連接於排氣口 20之未圖示的導管吸引 本體罩內之煙、粉塵等。這時浮游於熔融焊料上的熔渣D 被多數個葉片6…所攪拌，利用攪拌來將氧化物和焊料分 離，並利用芝麻的分離作用來使氧化物和焊料形成大致完 全分離。 10 吞纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)567229 A7 -------- B7___ V. Description of the Invention (^) The symbol 15 represents the chute used to drop the oxide separated from the slag to the lower part of the body 1, and 16 represents the chute used to fall from the chute. Oxide tank, 17 represents the trolley used to carry the tank, 18 represents the storage room for the handle with a handle or sieve (for processing the oxide separated from the slag), 19 represents the body cover covering the upper part of the body, 20 Represents the exhaust port installed on the body cover, 21 represents the input hole used to put the oxidation separation agent from the melting tank cover into the melting tank, and 22 is the input hole cover. Next, the operation of separating oxides of the separation device of the present invention having the above-mentioned configuration will be described. First, the solder S in the melting tank 2 of the separation apparatus is melted and maintained at a predetermined temperature. At this time, when the solder used in the jet solder bath is a lead-free solder of Sn-3Ag-0.5Cu, first place a lead-free solder of the same composition in the melting tank, and keep the temperature of the molten solder higher than the melting point of the lead-free solder. 50 ° C 27 (TC. Then open the body cover 19 and the melting tank cover 4 as shown in Figs. 1 and 4, and put the slag D generated by the jet solder tank of the automatic soldering device not shown in the melting tank 2 Inside the molten solder S. As shown in FIG. 2, the melting tank cover 4 is closed and the blades 6 are immersed in the molten solder S. Then, the cover 22 of the melting tank cover 4 is opened, and the sesame-like oxidation is separated from the insertion hole 21. The agent is scattered on the slag in the melting tank 2. After sesame is sprinkled on the slag, the cover 22 is closed as shown in Figs. 3 and 5, and the body cover 19 is closed, and then the blade 6 is rotated and connected with A duct (not shown) in the exhaust port 20 attracts smoke, dust, etc. in the main body cover. At this time, the slag D floating on the molten solder is stirred by the plurality of blades 6. And the separation of sesame is used to completely separate the oxide and solder. 1 0 Paper swallow size is applicable to China National Standard (CNS) A4 (210 X 297 mm) (Please read the precautions on the back before filling this page)
567229 A7 ___B7____ 五、發明說明（I) (請先閱讀背面之注意事項再填寫本頁) 如此般利用葉片攪拌所產生之分離作用及分離劑的分 離作用來從熔渣中將氧化物和焊料分離後’停止葉片之轉 動，打開本體罩19和熔融槽罩4。在熔融槽2內’原先加 入的焊料中從熔渣分離出之焊料會產生融合’而使焊料量 增加。於是將增加分量的焊料用帶柄杓舀取’澆注於鑄模 3之溝槽8。如圖6所示般，在所有溝槽8內澆注熔融焊料 S並使焊料固化後，如圖7所示般用旋鈕12將鑄模3轉動 ，使鑄模3以裏面成爲上側的方式進行翻轉。鑄模翻轉成 圖8所示般之鑄模3 —側撞擊收納箱13緣時，該衝擊會使 鑄模3的溝槽8內所澆注的焊料落至收納箱13的抽屜14 內。 如此般進行從自動焊接裝置的噴流焊料槽所產生之熔 渣中分離出氧化物和焊料的作業，當抽脈中有棒狀焊料之 堆積時，打開抽屜並取出棒狀焊料，將其投入因舀掉熔渣 而使焊料量變少的噴流焊料槽。 〔發明之效果〕 以上所說明之本發明的分離裝置，因可將熔渣在熔融 槽中分離成氧化物和焊料，且將熔融槽內增多的熔融焊料 在設於熔融槽附近之鑄模內澆注成棒狀焊料’故其澆注作 業既容易又安全。又本發明的分離裝置，由於將鑄模設成 可轉動，在鑄模的單面澆注熔融焊料，當焊料固化後僅須 翻轉鑄模即可簡單地使焊料從鑄模之溝槽中落下’且在一 面的溝槽內之熔融焊料澆注中，由於另一面的溝槽會被冷 卻，故能進行連續澆注，而發揮以往所沒有的優異效果。 π 衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 567229 A7 _B7_______ 五、發明說明（P ) 〔圖式之簡單說明〕 圖1係本發明的分離裝置之本體罩及熔融槽罩打開狀 態之立體圖。 圖2係本發明的分離裝置之熔融槽罩閉合狀態之立體 圖。 圖3係本發明的分離裝置之本體罩及熔融槽罩閉合狀 態之立體圖。 圖4係本發明的分離裝置之本體罩及熔融槽罩打開狀 態之側面截面圖。 圖5係本發明的分離裝置之本體罩及熔融槽罩閉合狀 態之側面截面圖。 圖6係在鑄模的單面澆注焊料的狀態之側面截面圖。 圖7係將澆注焊料後的鑄模翻轉中途的側面截面圖。 圖8係將澆注焊料後的鑄模翻轉後的狀態的側面截面 圖。 圖9係鑄模之部分擴大立體圖。 〔符號說明〕 1 分離裝置本體 2 熔融槽 3 鑄模 6 葉片 11 軸 12 旋鈕 12 (請先閱讀背面之注意事項再填寫本頁)567229 A7 ___B7____ 5. Description of the Invention (I) (Please read the precautions on the back before filling out this page) In this way, the separating effect of the blade stirring and the separating effect of the separating agent are used to separate the oxide and solder from the slag. The rear 'stops the rotation of the blades, and opens the body cover 19 and the melting tank cover 4. In the melting tank 2 ', the solder which has been separated from the slag from the solder which was originally added will cause fusion' and the amount of solder will increase. Then, the increased amount of solder is picked up with a handle and poured into the groove 8 of the mold 3. As shown in FIG. 6, after the molten solder S is poured into all the grooves 8 and the solder is solidified, the mold 3 is rotated with the knob 12 as shown in FIG. 7, so that the mold 3 is turned upside down. When the mold is flipped to the side of the storage box 13 as shown in FIG. 8, the impact will cause the solder poured into the groove 8 of the mold 3 to fall into the drawer 14 of the storage box 13. The operation of separating oxides and solder from the slag generated by the jet solder tank of the automatic soldering device is performed in this manner. When rod-shaped solder deposits are accumulated in the pulse, the drawer is opened and the rod-shaped solder is taken out. Jet solder bath that scoops out slag to reduce the amount of solder. [Effects of the Invention] The separation device of the present invention described above can separate slag into oxides and solder in a melting tank, and the molten solder increased in the melting tank can be poured into a mold provided near the melting tank. The solder is formed into a rod, so its pouring operation is easy and safe. In the separation device of the present invention, since the mold is set to be rotatable, molten solder is poured on one side of the mold. When the solder is solidified, the mold can be simply dropped from the groove of the mold when the mold is turned over. During the pouring of the molten solder in the trenches, the trenches on the other side are cooled, so that continuous casting can be performed, and excellent effects that have not been achieved before are exhibited. π The size of the paper is applicable to the Chinese National Standard (CNS) A4 (210 X 297 mm) 567229 A7 _B7_______ V. Description of the invention (P) [Simplified description of the figure] Figure 1 shows the body cover and melting of the separation device of the present invention A perspective view of the slot cover opened. Fig. 2 is a perspective view of a closed state of a melting tank cover of the separation device of the present invention. Fig. 3 is a perspective view of the closed state of the main body cover and the melting tank cover of the separation device of the present invention. Fig. 4 is a side cross-sectional view showing a state in which a main body cover and a melting tank cover of the separation device of the present invention are opened. Fig. 5 is a side sectional view of a closed state of a main body cover and a melting tank cover of the separation device of the present invention. 6 is a side cross-sectional view of a state where solder is cast on one side of a mold. FIG. 7 is a side cross-sectional view during the turning of the mold after the solder is poured. Fig. 8 is a side cross-sectional view of a state where the mold after the solder is poured is turned over. Fig. 9 is an enlarged perspective view of a part of the casting mold. [Symbol] 1 Separation device body 2 Melting tank 3 Mold 6 Blade 11 Shaft 12 Knob 12 (Please read the precautions on the back before filling this page)
衣紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐）The size of the paper is applicable to China National Standard (CNS) A4 (210 X 297 mm)