JP6147185B2 - Board work equipment - Google Patents

Description

  The present invention relates to a substrate working apparatus, and more particularly, to a substrate working apparatus provided with a substrate transport unit that transports a substrate.

  2. Description of the Related Art Conventionally, there has been known a substrate working apparatus provided with a substrate transport unit that transports a substrate (for example, see Patent Document 1).

  Patent Document 1 discloses a component mounting apparatus (board working apparatus) that includes a pair of conveyors (board transfer units) that transfer boards and a transfer board detection device that detects the boards transferred by the conveyor at a predetermined transfer position. ) Is disclosed. In the component mounting apparatus disclosed in Patent Document 1, the transport board detection device includes a light projecting sensor disposed on one side of the pair of conveyors, a light receiving sensor disposed on the other side of the pair of conveyors, and a distance between the pair of conveyors. And an optical filter for attenuating light projected from the light projecting sensor when the distance between the light projecting sensor and the light receiving sensor is equal to or smaller than a predetermined value. In the component mounting apparatus (substrate working apparatus) of Patent Document 1, light is emitted from the light projecting sensor when the distance between the pair of conveyors is equal to or smaller than a predetermined value and the distance between the light projecting sensor and the light receiving sensor is smaller than a certain value. By providing an optical filter that attenuates light, even when the distance between the pair of conveyors changes, it is possible to adjust the sensitivity of detecting the substrate without adjusting the output of the light projecting sensor or the sensitivity of the light receiving sensor. .

JP 2007-258386 A

  However, in the component mounting apparatus disclosed in Patent Document 1, it is necessary for the user to confirm the trouble of the transport substrate detection device due to a failure of the light projecting sensor or the light receiving sensor by performing an operation such as actually carrying in the substrate. Conceivable. For this reason, there is a problem that it is difficult to reduce a user's work burden for diagnosing a defect in the transport substrate detection apparatus.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to perform a user's work for diagnosing a malfunction of a substrate detection sensor that detects a substrate at a predetermined transport position. To provide a substrate working apparatus capable of reducing the burden.

  In order to achieve the above object, a substrate working apparatus according to one aspect of the present invention includes a substrate transport unit that transports a substrate, a substrate detection sensor that detects a substrate transported by the substrate transport unit at a predetermined transport position, and A state in which the substrate is present at a position where the head is moved and the substrate detection sensor detects the substrate in a state where the head that performs the operation on the substrate and the substrate is not positioned at a predetermined conveyance position of the substrate conveyance unit. And a controller that diagnoses the detection state of the substrate detection sensor by creating (creating a state equivalent to the presence of the substrate).

  In the substrate working apparatus according to one aspect of the present invention, as described above, in a state where the substrate is not positioned at the predetermined transfer position of the substrate transfer unit, the head is moved to a position where the substrate detection sensor detects the substrate. By creating a control unit that diagnoses the detection state of the substrate detection sensor by creating a state in which the substrate exists (creating a state equivalent to the presence of the substrate), the substrate is not actually carried in by the user. Since the detection state of the detection sensor can be diagnosed, the work burden on the user for diagnosing a defect in the substrate detection sensor can be reduced.

  In the substrate working apparatus according to the above aspect, the head is preferably configured such that a detected member that creates a state where the substrate is present at the detection position of the substrate detection sensor is attached, and the control unit is configured to convey the substrate to the substrate. The detection state of the substrate detection sensor is diagnosed by moving the detection member attached to the head to the detection position of the substrate detection sensor in a state where the detection position of the substrate detection sensor is not located at the predetermined conveyance position. . If comprised in this way, the to-be-detected member attached to the head can be automatically located in a detection position instead of a board | substrate, and the malfunction of a board | substrate detection sensor can be diagnosed easily.

  In this case, preferably, the member to be detected includes a dummy substrate having at least a part having the same shape as a part of the substrate. If comprised in this way, since the state which has a board | substrate in the detection position of a board | substrate detection sensor can be produced reliably, the malfunction of a board | substrate detection sensor can be diagnosed reliably.

  In the configuration in which the detected member is attached to the head, preferably, the control unit is positioned at the detection position of the substrate detection sensor in a state where the substrate is not positioned at the predetermined transfer position of the substrate transfer unit. The detection state of the substrate detection sensor is diagnosed by moving the head between the state and the state where the detection target member is not located at the detection position of the substrate detection sensor. If comprised in this way, while the board | substrate detection sensor will be in the state which will be in the state which detects a board | substrate in the state which is not located in a detection position, while being able to detect reliably, a board | substrate is located in a detection position. It is possible to reliably detect a problem that the substrate detection sensor does not detect the substrate in the state.

  In the configuration in which the member to be detected is attached to the head, preferably, the control unit does not detect the member to be detected that has been moved to the detection position of the substrate detection sensor. While moving within the range, the detection state of the substrate detection sensor is diagnosed, and the position where the detected member is detected by the substrate detection sensor is stored as adjustment data. If comprised in this way, while the detection position of a board | substrate detection sensor can be detected correctly, when the detection position of the board | substrate detection sensor of the next time is diagnosed by storing the detected position detected correctly as adjustment data, Furthermore, since the member to be detected can be directly moved to the detection position of the stored adjustment data, the diagnosis time can be shortened.

  In the configuration in which the detected member is attached to the head, preferably, the apparatus further includes a substrate imaging unit that images the substrate, and the control unit does not detect the detected member moved to the detection position of the substrate detection sensor. The imaging unit is configured to image the periphery of the substrate detection sensor and diagnose the state of the substrate detection sensor. If comprised in this way, the malfunction of a board | substrate detection sensor can be diagnosed in more detail based on the image imaged by the board | substrate imaging part.

  The substrate working apparatus according to the above aspect preferably further includes an abnormality notification unit for notifying abnormality based on the detection state of the substrate detection sensor. With this configuration, the user can easily recognize an abnormality such as a failure of the substrate detection sensor.

  According to the present invention, as described above, it is possible to reduce the work burden on the user for diagnosing a defect in the substrate detection sensor that detects the substrate at a predetermined transport position.

1 is a plan view schematically showing an overall configuration of a component mounting apparatus according to a first embodiment of the present invention. It is the block diagram which showed the control structure of the component mounting apparatus by 1st Embodiment of this invention. It is the side view which showed the board | substrate detection sensor periphery of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the board | substrate work process by the control apparatus of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the board | substrate detection sensor check process by the control apparatus of the component mounting apparatus by 1st Embodiment of this invention. It is the table | surface which showed the diagnostic result based on the imaging of the board | substrate recognition camera by the control apparatus of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the board | substrate detection sensor adjustment process by the control apparatus of the component mounting apparatus by 1st Embodiment of this invention. It is a flowchart for demonstrating the board | substrate detection sensor check process by the control apparatus of the component mounting apparatus by the modification of 1st Embodiment of this invention. It is the table | surface which showed the diagnostic result based on the imaging of the board | substrate recognition camera by the control apparatus of the component mounting apparatus by the modification of 1st Embodiment of this invention. It is the side view which showed roughly the whole structure of the printing apparatus by 2nd Embodiment of this invention. It is a flowchart for demonstrating the board | substrate work process by the control apparatus of the printing apparatus by 2nd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
With reference to FIGS. 1-3, the structure of the component mounting apparatus 100 by 1st Embodiment of this invention is demonstrated.

  As shown in FIG. 1, the component mounting apparatus 100 is a device that mounts the component 4 on the substrate 2 at a predetermined work position by the substrate 2 being conveyed from the X1 direction side to the X2 direction side by a pair of conveyors 11. The component mounting apparatus 100 is an example of the “board working apparatus” in the present invention.

  As shown in FIG. 1, the component mounting apparatus 100 includes a base 1, a pair of conveyors 11, a head unit 12, a support unit 13, a rail unit 14, a board detection sensor 15, and a control device 16. (See FIG. 2), a component recognition camera 17, a notification unit 18 (see FIG. 2), and a nozzle station 19. Moreover, the component supply part 3 for supplying the components 4 is arrange | positioned at the both sides (Y1 direction side, Y2 direction side) of the conveyor 11. FIG. A plurality of tape feeders 3 a are arranged in the component supply unit 3. The head unit 12 has a function of acquiring (sucking) the component 4 from the tape feeder 3 a and mounting (mounting) the component 4 on the substrate 2 on the conveyor 11. The conveyor 11 is an example of the “substrate transport unit” in the present invention, and the control device 16 is an example of the “control unit” in the present invention. The notification unit 18 is an example of the “abnormality notification unit” in the present invention.

  The tape feeder 3a holds a reel (not shown) around which a tape holding a plurality of components 4 at a predetermined interval is wound. The tape feeder 3a is configured to supply the component 4 from the tip of the tape feeder 3a by sending a tape that holds the component 4 by rotating the reel. Here, the component 4 is a small electronic component such as an IC, a transistor, a capacitor, and a resistor.

  The pair of conveyors 11 has a function of transporting the substrate 2 in the horizontal direction (X direction). Moreover, the conveyor 11 is comprised so that the board | substrate 2 in conveyance may be hold | maintained in the state stopped at the mounting operation position. Further, the pair of conveyors 11 is configured to be able to adjust the interval in the Y direction. Specifically, the distance between the pair of conveyors 11 is adjusted by moving one of the pair of conveyors 11 in the Y1 direction (see FIG. 1) side in the Y direction. The interval between the pair of conveyors 11 is adjusted when the substrate 2 is not detected by the substrate detection sensor 15.

  As shown in FIG. 1, the head unit 12 includes a ball nut 121, six heads 122, six nozzles 123 attached to the lower ends of the six heads 122, a substrate recognition camera 124, and six 6 Z-axis motors 125 (see FIG. 2) respectively provided on the heads 122 and six R-axis motors 126 (see FIG. 2) respectively provided on the six heads 122. The board recognition camera 124 is an example of the “board imaging unit” in the present invention.

  The head unit 12 is configured to be movable in the X direction along the support portion 13. Specifically, the support unit 13 includes a ball screw shaft 131, an X-axis motor 132 that rotates the ball screw shaft 131, and a guide rail (not shown) extending in the X direction. Thereby, the head unit 12 is moved in the X direction together with the ball nut 121 to which the ball screw shaft 131 is engaged (screwed).

  The six heads 122 are arranged in a line along the X direction on the lower surface side of the head unit 12. A nozzle 123 is attached to the tip of each head 122. The head 122 is configured to perform work (mounting of the component 4) on the substrate 2. The nozzles 123 are configured to be able to adsorb and hold the components 4 supplied from the tape feeder 3a by the negative pressure generated at the tip of the nozzle 123 by a negative pressure generator (not shown). ing. Each nozzle 123 is detachably attached to the head 122. That is, the nozzle 123 is configured to be selected according to the component 4 to be mounted and attached to the head 122.

  Each head 122 (nozzle 123) is configured to be movable up and down (moved in the Z-axis direction) with respect to the head unit 12. Specifically, the head 122 can move up and down between a lowered position when the component 4 is sucked or mounted (mounted) and a raised position when the component 4 is transported or photographed. It is configured. The head 122 is configured to be individually driven up and down by a Z-axis motor 125 provided for each head 122. Further, the head 122 is configured to be rotatable around the central axis (Z axis) of the nozzle 123 by an R-axis motor 126 provided for each head 122.

  The board recognition camera 124 is configured to photograph a fiducial mark (not shown) of the board 2. Thereby, it is possible to accurately acquire the mounting position of the component 4 on the substrate 2. The board recognition camera 124 is configured to be able to photograph the component 4 located at the component supply position (component suction position) of the tape feeder 3a. Thereby, it is possible to acquire the position and posture of the component 4 to be picked up.

  The support portion 13 is configured to be movable in the Y direction orthogonal to the X direction along a pair of rail portions 14 fixed on the base 1. Specifically, as shown in FIG. 1, the rail portion 14 includes guide rails 141 that support both end portions (X direction) of the support portion 13 so as to be movable in the Y direction, a ball screw shaft 142 that extends in the Y direction, And a Y-axis motor 143 that rotates the ball screw shaft 142. The support portion 13 is provided with a ball nut 133 to which the ball screw shaft 142 is engaged (screwed). Thereby, the head unit 12 is moved on the base 1 along the Y direction. Therefore, the head unit 12 can move on the base 1 to an arbitrary position along the XY plane.

  The substrate detection sensor 15 is configured to detect the substrate 2 conveyed by the conveyor 11 at a predetermined conveyance position. Specifically, the substrate detection sensor 15 includes a light projecting unit 151 and a light receiving unit 152, as shown in FIGS. The substrate detection sensor 15 is configured as a transmissive sensor that detects the position of the substrate 2 when visible light projected from the light projecting unit 151 to the light receiving unit 152 is blocked by the substrate 2. A plurality of substrate detection sensors 15 are arranged along the transport direction (X direction) of the substrate 2 so as to detect the substrate 2 at a plurality of transport positions.

  The light projecting unit 151 includes an LED (light emitting diode) that generates visible light. Further, as shown in FIG. 3, the light projecting unit 151 is configured to project visible light obliquely upward. Further, the light projecting unit 151 is disposed below the conveyor 11. The light receiving unit 152 is configured to receive visible light projected from the light projecting unit 151. The light receiving unit 152 is disposed on the upper side of the conveyor 11.

  The stopper 111 is provided to position the substrate 2 by stopping the substrate 2 conveyed by the conveyor 11 at a predetermined conveyance position. Further, the stopper 111 is disposed on the lower side of the conveyor 11. The stopper 111 is moved so as to protrude upward when the substrate 2 is stopped. Further, the stopper 111 is moved so as to retreat to the lower side of the conveyor 11 when the substrate 2 is passed. The operation of moving the stopper 111 upward (position where the substrate 2 is stopped) is performed when the substrate 2 is not detected by the substrate detection sensor 15 in the vicinity of the stopper 111.

  The control device 16 is mounted on the component mounting apparatus 100 with a computer as a component. In addition, the control device 16 drives and controls the X-axis motor 132, the Y-axis motor 143, the Z-axis motor 125, and the R-axis motor 126 according to a program stored in advance, so that the component 4 is mounted on the board 2. It is configured. Specifically, the control device 16 moves the head unit 12 above the component supply unit 3 (tape feeder 3a), and at the same time, the negative pressure generated by a negative pressure generator (not shown) of each head 122. The component 4 is adsorbed by the nozzle 123.

  Then, the control device 16 moves the head unit 12 onto the substrate 2. During the movement, the component recognition camera 17 photographs each of the components 4 sucked by the nozzles 123 of the heads 122 through the component recognition camera 17. Based on the photographed image, the mounting position of the component 4 sucked by each head 122 (nozzle 123) is corrected. When the head unit 12 reaches the substrate 2, each head 122 is driven up and down, and the suctioned component 4 is stopped on the substrate 2 by stopping the supply of the negative pressure to the nozzle 123 at a predetermined timing. Mounted (mounted).

  The component recognition camera 17 is fixedly installed on the upper surface of the base 1. The component recognition camera 17 is configured to image the component 4 sucked by the nozzle 123 in order to recognize the suction state of the component 4 prior to mounting the component 4. The component recognition camera 17 is configured to photograph the component 4 adsorbed by the nozzle 123 of each head 122 from below. Thereby, it is possible to acquire the suction posture of the component 4 (the rotation posture and the suction position with respect to the nozzle 123).

  The notification unit 18 is configured to notify an abnormality based on the detection state of the substrate detection sensor 15. For example, the notification unit 18 includes a display unit and notifies by displaying an abnormality of the substrate detection sensor 15. The notification unit 18 may notify the abnormality by voice.

  The nozzle station 19 is configured such that various types of nozzles 123 attached to the head 122 are placed. Further, the nozzle station 19 is configured to place a dummy substrate 150 (see FIG. 3). The dummy substrate 150 is configured to move to the detection position of the substrate detection sensor 15 by the head 122 to create a state in which the substrate 2 is at the detection position of the substrate detection sensor 15. The dummy substrate 150 has at least a portion having the same shape as a portion of the substrate 2 (a portion extending in the XY plane). For example, the dummy substrate 150 includes a plate-like portion 150a extending in the XY plane and a columnar portion 150b extending upward (Z direction) from the plate-like portion 150a. The outer peripheral configuration of the cylindrical portion 150b is the same as the outer peripheral configuration of the upper mounting portion of the nozzle 123 that can be mounted on the head 122, and the dummy substrate 150 is attached to the head 122 instead of the nozzle. Note that the dummy substrate 150 may have only the plate-like portion 150 a that is attracted to the nozzle 123 after the nozzle 123 is attached to the head 122.

  Here, in the first embodiment, as shown in FIG. 3, the control device 16 moves the head 122 so that the substrate detection sensor 15 moves when the substrate 2 is not positioned at a predetermined transport position of the conveyor 11. The detection state of the substrate detection sensor 15 is diagnosed by creating a state in which the substrate 2 exists at a position where the substrate 2 is detected (creating a state equivalent to the presence of the substrate). Specifically, the control device 16 detects the position detected by the substrate detection sensor 15 (light projected from the light projecting unit 151 to the light receiving unit 152 in a state where the substrate 2 is not located at a predetermined transport position of the conveyor 11. The dummy substrate 150 attached to the head 122 is moved to a position where the substrate detection sensor 15 is blocked, thereby diagnosing the detection state of the substrate detection sensor 15.

  The control device 16 also sets the dummy substrate 150 at the detection position of the substrate detection sensor 15 and the detection position of the substrate detection sensor 15 in a state where the substrate 2 is not located at the predetermined transport position of the conveyor 11. The detection state of the substrate detection sensor 15 is diagnosed by moving the head 122 to switch to a state where the dummy substrate 150 is not located.

  Further, when the control device 16 does not detect the dummy substrate 150 moved to the detection position of the substrate detection sensor 15, the control device 16 moves the dummy substrate 150 within a predetermined range from the position where the substrate 2 is detected. The detection state of 15 is diagnosed, and the position where the dummy substrate 150 is detected by the substrate detection sensor 15 is stored as adjustment data. Specifically, when the control device 16 does not detect the dummy substrate 150 at the detection position from the diagnosis result of the substrate detection sensor 15, the control device 16 moves the head 122 in the horizontal direction (XY direction) and the vertical direction (Z direction), The substrate detection sensor 15 searches for a position where the dummy substrate 150 is detected. Then, the control device 16 stores the position where the substrate detection sensor 15 has detected the dummy substrate 150 as the detection position in the adjustment data. Further, the control device 16 uses the stored adjustment data for the diagnosis of the substrate detection sensor 15 from the next time. Further, the control device 16 causes the notification unit 18 to display an error message when the detection position of the substrate detection sensor 15 cannot be specified even when the head 122 is moved.

  Further, when the control device 16 does not detect the dummy substrate 150 moved to the detection position of the substrate detection sensor 15, the substrate recognition camera 124 images the periphery of the substrate detection sensor 15 and diagnoses the state of the substrate detection sensor 15. Is configured to do. Specifically, the control device 16 diagnoses whether or not light is being projected from the light projecting unit 151 of the substrate detection sensor 15 by imaging by the substrate recognition camera 124. Further, the control device 16 diagnoses whether or not the installation positions of the light projecting unit 151 and the light receiving unit 152 of the substrate detection sensor 15 are correct based on the image captured by the substrate recognition camera 124. Note that the control device 16 diagnoses the installation position of the substrate detection sensor 15 by comparing the state of the correct installation position of the light projecting unit 151 and the light receiving unit 152 of the substrate detection sensor 15 with the captured image. Further, the control device 6 diagnoses whether or not there is a foreign object near the substrate detection sensor 15 based on the image captured by the substrate recognition camera 124.

  Next, a board work process performed by the control device 16 of the component mounting apparatus 100 will be described with reference to FIG.

  In step S1, when the power of the component mounting apparatus 100 is turned on, the X-axis and Y-axis origin return operations of the head unit 12 are performed. In step S2, the substrate detection sensor 15 is checked (diagnostic). The details of the check (diagnosis) processing of the substrate detection sensor 15 will be described later. In step S3, board data carried into the component mounting apparatus 100 is read. Specifically, substrate data including information such as the type and number of substrates 2 and the type and number of components 4 to be mounted is read.

  In step S4, a user operation input is accepted. In step S5, it is determined whether an end operation has been accepted. Specifically, it is determined whether or not an operation for turning off the component mounting apparatus 100 has been performed. If the end operation is not accepted, the process proceeds to step S6. If the end operation is accepted, the process proceeds to step S14.

  In step S6, it is determined whether a driving start operation has been accepted. Specifically, it is determined whether or not a component mounting operation start operation has been performed. If the operation start operation is accepted, the process proceeds to step S7. If the operation start operation is not accepted, the process returns to step S4. In step S7, an operation start process is performed.

  In step S8, it is determined whether an operation for stopping operation has been accepted. If an operation for stopping operation is accepted, the process returns to step S4. If an operation for stopping operation is not accepted, the process proceeds to step S9. In step S9, it is determined whether or not to check (diagnose) the substrate detection sensor 15. Specifically, the substrate detection sensor 15 is periodically checked during the component mounting operation. For example, the substrate detection sensor 15 is checked every time a predetermined number of substrates 2 are mounted or every predetermined time. If the substrate detection sensor 15 is checked, the process proceeds to step S10. If the substrate detection sensor 15 is not checked, the process proceeds to step S11.

  In step S10, the substrate detection sensor 15 is checked (diagnostic). In step S11, the substrate 2 is carried in. Specifically, the board 2 is received from an apparatus upstream of the component mounting apparatus 100, and the received board 2 is moved to the component mounting (work) position by the conveyor 11. In step S12, an operation is performed on the substrate 2. Specifically, the component 4 is mounted on the substrate 2. In step S13, the substrate 2 is unloaded. That is, the substrate 2 on which the work has been completed (the component 4 is mounted) is delivered to the downstream apparatus. Thereafter, the process returns to step S8.

  When an end operation is received in step S5, in step S14, after the head unit 12 is moved to the origin in the X axis and the Y axis, the power is turned off (OFF), and the substrate work process is ended.

  Next, a board detection sensor check process performed by the control device 16 of the component mounting apparatus 100 will be described with reference to FIG. The substrate detection sensor check process is performed in steps S2 and S10 in FIG.

  In step S21, the light projecting unit 151 of the substrate detection sensor 15 is turned off. In step S <b> 22, it is determined whether or not light is received by the light receiving unit 152 of the substrate detection sensor 15. Here, since the light projection of the light projecting unit 151 is turned off, the light is not received by the light receiving unit 152 if the substrate detection sensor 15 is normal. If no light is received, the process proceeds to step S23, and if light is received, the process proceeds to step S28.

  In step S <b> 23, the light projecting unit 151 of the substrate detection sensor 15 is turned on. In step S <b> 24, it is determined whether light is received by the light receiving unit 152 of the substrate detection sensor 15. Here, since the light projection of the light projecting unit 151 is turned on, the light is received by the light receiving unit 152 if the substrate detection sensor 15 is normal. If light is received, the process proceeds to step S25, and if no light is received, the process proceeds to step S30.

  In step S25, the head 122 to which the dummy substrate 150 is attached is lowered to create a state where the substrate 2 is present at the detection position of the substrate detection sensor 15. In step S <b> 26, it is determined whether or not light is received by the light receiving unit 152 of the substrate detection sensor 15. Here, since there is a dummy substrate 150 at the substrate detection position of the substrate detection sensor 15, light is not received by the light receiving unit 152 if the substrate detection sensor 15 is normal. If no light is received, the process proceeds to step S27, and if light is received, the process proceeds to step S32.

  In step S27, it is determined that the substrate detection sensor 15 is normal, and the head 122 to which the dummy substrate 150 is attached is raised. Thereafter, the substrate detection sensor check process is terminated.

  If light is received in step S22, the substrate detection camera 124 captures the image, and in step S28, the substrate detection sensor 15 is diagnosed by performing image analysis based on the captured image. That is, in step S28, the light receiving unit 152 is in a light receiving state before performing control for projecting the light projecting unit 151 of the substrate detection sensor 15. For this reason, the light projecting unit 151 is imaged by the substrate recognition camera 124 to perform detailed diagnosis of the substrate detection sensor 15. Here, as in the case 1 shown in FIG. 6, if the light projecting unit 151 emits light (when the “light projecting unit light emission?” Column is “◯”), a failure of the light projecting unit 151, or A failure of both the light projecting unit 151 and the light receiving unit 152 can be considered. Further, if the light projecting unit 151 does not emit light (when the “light projecting unit light emission?” Column is “x”), a failure of the light receiving unit 152 is considered. In step S29, a diagnostic result based on the image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  When light is not received in step S24, in step S30, the board | substrate recognition camera 124 image | photographs, image analysis is performed based on the image | photographed image, and the board | substrate detection sensor 15 is diagnosed. That is, in step S30, the light projecting unit 151 of the substrate detection sensor 15 is projected and the light receiving unit 152 does not receive light. For this reason, the board recognition sensor 124 images the board detection sensor 15 and performs detailed diagnosis of the board detection sensor 15.

  Here, as in the case 2 shown in FIG. 6, if the light projecting unit 151 does not emit light (when the “light projecting unit light emission?” Column is “x”), a failure of the light projecting unit 151, or A failure of both the light projecting unit 151 and the light receiving unit 152 can be considered. In addition, when the light projecting unit 151 emits light (when the “projection unit light emitting?” Column is “◯”), and the position of the substrate detection sensor 15 is diagnosed as incorrect by image analysis (“ If the sensor position is correct? Column is “x”), the substrate detection sensor 15 may be defective. Further, when the light projecting unit 151 emits light (when the “projection unit light emitting?” Column is “◯”), and the position of the substrate detection sensor 15 is correct (the “sensor position is correct?” Column is “○”). ”) And when it is diagnosed by image analysis that there is a foreign object on the conveyor 11 (when the“ existing foreign object on the conveyor? ”Column is“ X ”), it is considered that there is a foreign object on the conveyor 11. . In addition, when the light projecting unit 151 emits light (when the “light projecting unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is diagnosed (“sensor position correct?” When the column is “◯”) and when it is diagnosed that there is no foreign matter on the conveyor 11 (when “There is a foreign matter on the conveyor?” Column is “O”), the optical axis shift or the light receiving unit There are 152 possible failures.

  In step S31, a diagnostic result based on an image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  If light is received in step S26, the head 122 to which the dummy substrate 150 is attached is raised in step S32. Thereafter, in step S33, the substrate recognition camera 124 captures an image, performs image analysis based on the captured image, and diagnoses the substrate detection sensor 15. That is, in the state before the head 122 is raised in step S <b> 32, the light receiving unit 152 is in the light receiving state with the dummy substrate 150 positioned at the detection position of the substrate detection sensor 15. For this reason, the board recognition sensor 124 images the board detection sensor 15 and performs detailed diagnosis of the board detection sensor 15. Here, as in the case 3 shown in FIG. 6, if the light projecting unit 151 does not emit light (when the “projection unit light emission?” Column is “x”), the light projecting unit 151 and the light receiving unit 152 Both failures are possible. Further, when the light projecting unit 151 emits light (when the “projection unit light emitting?” Column is “◯”), and the position of the substrate detection sensor 15 is determined to be incorrect by image analysis (“sensor If the “Position correct?” Column is “X”), the substrate detection sensor 15 may be defective. Further, when the light projecting unit 151 emits light (when the “light projecting unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is correct (“sensor position correct?”). In the case of “◯” in FIG. 9), a failure of the light receiving unit 152 is considered.

  In step S34, a diagnostic result based on the image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  Next, a board detection sensor adjustment process performed by the control device 16 of the component mounting apparatus 100 will be described with reference to FIG. In the substrate detection sensor adjustment process, the position of the substrate detection sensor 15 and the sensitivity of the light receiving unit 152 are adjusted. The board detection sensor adjustment process is performed when the component mounting apparatus 100 is assembled or installed.

  In step S41, the position of the substrate detection sensor 15 (light projecting unit 151 and light receiving unit 152) and the position of the light receiving unit 152 are adjusted. In step S42, the substrate detection sensor 15 shown in FIG. 5 is checked. In step S43, the result of the substrate detection sensor check is confirmed.

  In step S44, it is determined whether there is an error as a result of the substrate detection sensor check. If there is no error, the process proceeds to step S45, where it is determined that the position and sensitivity of the substrate detection sensor 15 are good, and the substrate detection sensor adjustment process is terminated. If there is an error, the process proceeds to step S46, where it is determined that the position or sensitivity of the substrate detection sensor 15 is defective, and the process returns to step S41.

  In the first embodiment, the following effects can be obtained.

  In the first embodiment, as described above, in a state where the substrate 2 is not positioned at the predetermined transport position of the conveyor 11, the substrate 2 is moved to a position where the substrate detection sensor 15 detects the substrate 2 by moving the head 122. By providing a control device 16 for diagnosing the detection state of the substrate detection sensor 15 by creating a state as if it exists (creating a state equivalent to the presence of the substrate), the user does not actually carry in the substrate 2 Since the detection state of the substrate detection sensor 15 can be diagnosed, it is possible to reduce the work burden on the user for diagnosing a defect in the substrate detection sensor 15 that detects the substrate 2 at a predetermined transfer position.

  In the first embodiment, as described above, the head 122 is configured such that the dummy substrate 150 that creates a state in which the substrate 2 exists at the detection position of the substrate detection sensor 15 is attached to the control device. 16 is detected by the substrate detection sensor 15 by moving the dummy substrate 150 attached to the head 122 to the detection position of the substrate detection sensor 15 in a state where the substrate 2 is not positioned at the predetermined detection position of the conveyor 11. Configure to diagnose the condition. Thereby, the dummy board | substrate 150 attached to the head 122 can be automatically located in a detection position instead of the board | substrate 2, and the malfunction of the board | substrate detection sensor 15 can be diagnosed easily.

  The stopper 111 positioned on the lower side when the substrate 2 is unloaded from the predetermined detection position by the conveyor 11 has completed the unloading of the substrate 2 (this is detected by the substrate detection sensor 15 in the vicinity of the stopper 111. After that, the control device 16 determines that the next upstream substrate 2 is moved to protrude upward in order to stop at the predetermined detection position. At this time, if the substrate detection sensor 15 cannot detect the substrate 2 that is still being transported, a problem such as the substrate 111 being carried out jumping up by the stopper 111 occurs. However, since a failure (problem) of the substrate detection sensor 15 can be detected, a failure such as the substrate 2 jumping up by the stopper 111 occurs due to the fact that the substrate 2 could not be detected by the substrate detection sensor 15. Can be surely prevented.

  In the first embodiment, as described above, the dummy substrate 150 is positioned at the detection position of the substrate detection sensor 15 in the state where the control device 16 is not positioned at the predetermined transport position of the conveyor 11. The detection state of the substrate detection sensor 15 is diagnosed by moving the head 122 between the state and the state where the dummy substrate 150 is not positioned at the detection position of the substrate detection sensor 15. Thereby, while the board | substrate 2 is not located in the detection position, the malfunction that the board | substrate detection sensor 15 will be in the state which detects the board | substrate 2 can be detected reliably, and the board | substrate 2 is located in the detection position. It is possible to reliably detect the problem that the substrate detection sensor 15 does not detect the substrate 2 in the state.

  In the first embodiment, as described above, when the control device 16 does not detect the dummy substrate 150 moved to the detection position of the substrate detection sensor 15, the dummy substrate 150 is predetermined from the position where the substrate 2 is detected. , The detection state of the substrate detection sensor 15 is diagnosed, and the position where the dummy substrate 150 is detected by the substrate detection sensor 15 is stored as adjustment data. As a result, the detection position of the substrate detection sensor 15 can be accurately detected, and when the detection position of the substrate detection sensor 15 is diagnosed next time by storing the accurately detected detection position as adjustment data, Since the dummy substrate 150 can be directly moved to the detection position of the stored adjustment data, the diagnosis time can be shortened.

  In the first embodiment, as described above, when the control device 16 does not detect the dummy substrate 150 that has been moved to the detection position of the substrate detection sensor 15, the substrate recognition sensor 124 allows the periphery of the substrate detection sensor 15 to be detected. An image is taken and the state of the substrate detection sensor 15 is diagnosed. Thereby, the malfunction of the board | substrate detection sensor 15 can be diagnosed in more detail based on the image imaged with the board | substrate recognition camera 124. FIG.

  In the first embodiment, as described above, by providing the notification unit 18 that notifies the abnormality based on the detection state of the substrate detection sensor 15, the user can easily recognize an abnormality such as a failure of the substrate detection sensor 15. can do.

(Modification of the first embodiment)
In the first embodiment, the example using the transmission type substrate detection sensor has been described, but a reflection type substrate detection sensor may be used.

  Specifically, the substrate detection sensor 15 is configured to detect the substrate 2 conveyed by the conveyor 11 at a predetermined conveyance position. As shown in FIG. 2, the substrate detection sensor 15 includes a light projecting unit 151a and a light receiving unit 152a. The substrate detection sensor 15 is configured as a reflective sensor that detects the position of the substrate 2 when the visible light projected from the light projecting unit 151a is reflected by the substrate 2 and received by the light receiving unit 152a. Yes.

  Next, a board detection sensor check process performed by the control device 16 of the component mounting apparatus 100 according to the modification of the first embodiment will be described with reference to FIG.

  In step S51, the light projecting unit 151a of the substrate detection sensor 15 is turned off. In step S52, it is determined whether or not light is received by the light receiving unit 152a of the substrate detection sensor 15. Here, since the light projection of the light projecting unit 151a is turned off, if the substrate detection sensor 15 is normal, no light is received by the light receiving unit 152a. If no light is received, the process proceeds to step S53, and if light is received, the process proceeds to step S58.

  In step S53, the light projecting unit 151a of the substrate detection sensor 15 is turned on. In step S54, it is determined whether light is received by the light receiving unit 152a of the substrate detection sensor 15. Here, even if the light projection of the light projecting unit 151a is turned on, the substrate 2 is not located at the detection position. Therefore, if the substrate detection sensor 15 is normal, no light is received by the light receiving unit 152a. If no light is received, the process proceeds to step S55, and if light is received, the process proceeds to step S60.

  In step S55, the head 122 to which the dummy substrate 150 is attached is lowered to create a state in which the substrate 2 is present at the detection position of the substrate detection sensor 15. In step S56, it is determined whether or not light is received by the light receiving portion 152a of the substrate detection sensor 15. Here, since there is a dummy substrate 150 at the substrate detection position of the substrate detection sensor 15, if the substrate detection sensor 15 is normal, light is received by the light receiving unit 152a. If light is received, the process proceeds to step S57, and if no light is received, the process proceeds to step S62.

  In step S57, it is determined that the substrate detection sensor 15 is normal, and the head 122 to which the dummy substrate 150 is attached is raised. Thereafter, the substrate detection sensor check process is terminated.

  When light is received in step S52, in step S58, the board recognition camera 124 takes a picture, and based on the taken picture, image analysis is performed and the board detection sensor 15 is diagnosed. That is, in step S58, the light receiving unit 152a is in a light receiving state before performing control for projecting the light projecting unit 151a of the substrate detection sensor 15. For this reason, the light projecting unit 151a is imaged by the board recognition camera 124, and the board detection sensor 15 is diagnosed in detail. Here, as in the case 4 shown in FIG. 9, if the light projecting unit 151 a emits light (when the “light projecting unit light emission?” Column is “◯”), a failure of the light projecting unit 151 a, or A failure of both the light projecting unit 151a and the light receiving unit 152a can be considered. Further, if the light projecting unit 151a is not emitting light (when the “projection unit light emission?” Column is “x”), a failure of the light receiving unit 152a is considered. In step S59, a diagnostic result based on the image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  If light is received in step S54, the substrate detection camera 124 captures the image, and in step S60, the substrate detection sensor 15 is diagnosed by performing image analysis based on the captured image. That is, in step S60, in the state where the light projecting unit 151a of the substrate detection sensor 15 is projected, the light received by the light receiving unit 152a even though the substrate 2 is not positioned at the detection position (the light is not reflected) It has become. For this reason, the board recognition sensor 124 images the board detection sensor 15 and performs detailed diagnosis of the board detection sensor 15.

  Here, as in case 5 shown in FIG. 9, if the light projecting unit 151 a is not emitting light (when the “light emitting unit light emitting?” Column is “x”), the light projecting unit 151 a and the light receiving unit 152 a Both failures are possible. In addition, when the light projecting unit 151 a emits light (when the “light projecting unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is diagnosed by image analysis (“ If the sensor position is correct? Column is “x”), the substrate detection sensor 15 may be defective. Further, when the light projecting unit 151a emits light (when the “projection unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is correct (the “sensor position is correct?” Column indicates “○ ”) And when it is diagnosed by image analysis that there is a foreign object on the conveyor 11 (when the“ existing foreign object on the conveyor? ”Column is“ X ”), it is considered that there is a foreign object on the conveyor 11. . In addition, when the light projecting unit 151a emits light (when the “projection unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is diagnosed (“sensor position is correct?” When the column is “◯”) and when it is diagnosed that there is no foreign matter on the conveyor 11 (when the “There is a foreign matter on the conveyor?” Column is “O”), a failure of the light receiving unit 152a is considered.

  In step S61, a diagnostic result based on an image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  If no light is received in step S56, the head 122 to which the dummy substrate 150 is attached is raised in step S62. Thereafter, in step S63, the board recognition camera 124 takes a picture, and based on the taken picture, image analysis is performed to diagnose the board detection sensor 15. That is, in the state before raising the head 122 in step S62, the light receiving unit 152a does not receive light while the dummy substrate 150 is located at the detection position of the substrate detection sensor 15. For this reason, the board recognition sensor 124 images the board detection sensor 15 and performs detailed diagnosis of the board detection sensor 15.

  Here, as in the case 6 shown in FIG. 9, if the light projecting unit 151 a is not emitting light (when the “light emitting unit light emission?” Column is “x”), a failure of the light projecting unit 151 a, or A failure of both the light projecting unit 151a and the light receiving unit 152a can be considered. In addition, when the light projecting unit 151a emits light (when the “projection unit light emitting?” Column is “◯”) and it is diagnosed by image analysis that the position of the substrate detection sensor 15 is not correct (“ If the sensor position is correct? Column is “x”), the substrate detection sensor 15 may be defective. In addition, when the light projecting unit 151a emits light (when the “projection unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is diagnosed (“sensor position is correct?” When the column is “◯”) and when it is diagnosed by image analysis that there is a foreign object on the conveyor 11 (when the “existing foreign object on the conveyor?” Field is “X”), the foreign object is present on the conveyor 11. It is believed that there is. In addition, when the light projecting unit 151a emits light (when the “projection unit light emission?” Column is “◯”) and the position of the substrate detection sensor 15 is diagnosed (“sensor position is correct?” When the column is “◯”) and when it is diagnosed that there is no foreign matter on the conveyor 11 (when “There is a foreign matter on the conveyor?” Column is “O”), the optical axis shift or the light receiving unit A failure of 152a is conceivable.

  In step S64, a diagnostic result based on the image captured by the board recognition camera 124 is displayed on the notification unit 18 as an error message. Thereafter, the substrate detection sensor check process is terminated.

  The remaining configuration of the modification of the first embodiment is the same as that of the first embodiment.

(Second Embodiment)
Next, a printing apparatus 200 according to a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, unlike the first embodiment in which the present invention is applied to the component mounting apparatus 100, an example in which the present invention is applied to the printing apparatus 200 will be described.

  The printing apparatus 200 is a screen printing machine, and has a function of applying cream solder for joining electronic components to the substrate 2 on the surface of the substrate 2. In addition, as shown in FIG. 10, the printing apparatus 200 includes a base 201, a control device 210, a pair of conveyors 220, a head unit 230, a solder supply device 240, a mask fixing unit 250, and a substrate detection sensor. 260 and a notification unit 270. The printing apparatus 200 is an example of the “substrate working apparatus” in the present invention, and the control apparatus 210 is an example of the “control unit” in the present invention. Further, the conveyor 220 is an example of the “substrate transport unit” in the present invention, and the notification unit 270 is an example of the “abnormality notification unit” in the present invention.

  The control device 210 is mounted on the printing apparatus 200 with a computer as a component. The control device 210 is configured to drive and control the head unit 230 and the solder supply device 240 in accordance with a program stored in advance, and to perform a solder printing operation on the substrate 2 via the mask 251.

  The pair of conveyors 220 has a function of transporting the substrate 2 in the horizontal direction (X direction). Further, the conveyor 220 is configured to hold the substrate 2 being conveyed in a state of being stopped at the printing work position.

  The head unit 230 includes two heads 231 and a squeegee 232 attached to the tips of the two heads 231. In addition, a dummy substrate 233 can be attached to the tip of the head 231 instead of the squeegee 232. The head 231 is configured to be movable up and down in the vertical direction (Z direction). The head 231 is configured to be movable in the Y direction. The squeegee 232 is configured to expand while rolling (kneading) the paste-like solder on the mask 251 while moving in the Y direction.

  The solder supply device 240 is configured to supply solder onto the mask 251.

  The mask fixing unit 250 is configured to fix the mask 251 above the conveyor 220.

  The substrate detection sensor 260 is configured to detect the substrate 2 conveyed by the conveyor 220 at a predetermined conveyance position. Specifically, the substrate detection sensor 260 includes a light projecting unit 261 and a light receiving unit 262. The substrate detection sensor 260 is configured as a transmissive sensor that detects the position of the substrate 2 when visible light projected from the light projecting unit 261 to the light receiving unit 262 is blocked by the substrate 2.

  The light projecting unit 261 includes an LED (light emitting diode) that generates visible light. Further, as shown in FIG. 10, the light projecting unit 261 is configured to project visible light obliquely upward. The light projecting unit 261 is disposed below the conveyor 220. The light receiving unit 262 is configured to receive visible light projected from the light projecting unit 261. The light receiving unit 262 is disposed on the upper side of the conveyor 220.

  The notification unit 270 is configured to notify an abnormality based on the detection state of the substrate detection sensor 260. For example, the notification unit 270 includes a display unit, and notifies by displaying an abnormality of the substrate detection sensor 260. Further, the notification unit 270 may notify the abnormality by voice.

  Here, in the second embodiment, as shown in FIG. 10, the control device 210 moves the head 231 and causes the substrate detection sensor 260 to move when the substrate 2 is not positioned at a predetermined transfer position of the conveyor 220. The detection state of the substrate detection sensor 260 is diagnosed by creating a certain state of the substrate 2 at a position where the substrate 2 is detected. Specifically, the control device 210 detects the position detected by the substrate detection sensor 260 (light projected from the light projecting unit 261 to the light receiving unit 262 in a state where the substrate 2 is not positioned at a predetermined transport position of the conveyor 220. The dummy substrate 233 attached to the head 231 is moved to a position where the substrate detection sensor 260 is shielded, thereby diagnosing the detection state of the substrate detection sensor 260.

  Next, a substrate work (solder printing) process performed by the control device 210 of the printing apparatus 200 will be described with reference to FIG.

  In step S71, when the power of the printing apparatus 200 is turned on, the X-axis and Y-axis origin return operations of the head unit 230 are performed. In step S72, a check (diagnosis) process of the substrate detection sensor 260 is performed. In the check process of the substrate detection sensor 260, the same process as the process shown in FIG. 5 is performed. Further, the mask 251 is not attached during the check process of the substrate detection sensor 260. A dummy substrate 233 is attached to the head 231 instead of one of the squeegees 232.

  When the check process of the substrate detection sensor 260 is completed, it is determined in step S73 whether the mask 251, the squeegee 232, and the solder are set. The determination in step S73 is repeated until the mask 251, the squeegee 232, and the solder are set. When the mask 251, the squeegee 232, and the solder are set, the board data carried into the printing apparatus 200 is read in step S74. Specifically, substrate data including information such as the type and number of substrates 2 is read.

  In step S75, a user operation input is accepted. In step S76, it is determined whether an end operation has been accepted. Specifically, it is determined whether or not an operation for turning off the printing apparatus 200 has been performed. If the end operation is not accepted, the process proceeds to step S77. If the end operation is accepted, the process proceeds to step S83.

  In step S77, it is determined whether a driving start operation has been accepted. Specifically, it is determined whether or not a solder printing operation start operation has been performed. If the operation start operation is accepted, the process proceeds to step S78, and if the operation start operation is not accepted, the process returns to step S75. In step S78, an operation start process is performed.

  In step S79, it is determined whether an operation for stopping operation has been accepted. If an operation for stopping operation is accepted, the process returns to step S75, and if an operation for stopping operation is not accepted, the process proceeds to step S80. In step S80, the substrate 2 is carried in. Specifically, the board 2 is received from an apparatus upstream of the printing apparatus 200, and the received board 2 is moved to the solder printing (working) position by the conveyor 220. In step S81, an operation is performed on the substrate 2. Specifically, solder is printed on the substrate 2. In step S82, the substrate 2 is unloaded. That is, the substrate 2 on which the operation has been completed (solder is printed) is delivered to a downstream apparatus. Thereafter, the process returns to step S79.

  When an end operation is accepted in step S76, after the head unit 230 is moved to the origin in the X axis and the Y axis in step S83, the power is turned off (OFF), and the substrate work process ends.

  In addition, the other structure of 2nd Embodiment is the same as that of the said 1st Embodiment.

  In the second embodiment, the following effects can be obtained.

  As described above, in the second embodiment, in the same manner as in the first embodiment, in the state where the substrate 2 is not positioned at the predetermined transfer position of the conveyor 220, the head 231 is moved and the substrate detection sensor 260 is moved to the substrate 2. By providing a control device 210 for diagnosing the detection state of the substrate detection sensor 260 by creating a state where the substrate 2 is detected at a position where the substrate detection is performed, the detection of the substrate detection sensor 260 without the user actually carrying in the substrate 2 is performed. Since the state can be diagnosed, it is possible to provide the printing apparatus 200 that can reduce a user's work burden for diagnosing a defect of the substrate detection sensor 260 that detects the substrate 2 at a predetermined transport position. .

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first embodiment, an example in which the present invention is applied to the component mounting apparatus 100 is shown, and in the second embodiment, an example in which the present invention is applied to the printing apparatus 200 is shown. You may apply to a substrate working apparatus. For example, the present invention may be applied to a substrate inspection apparatus that inspects a substrate. In this case, at the time of diagnosis of the substrate detection sensor, a dispense head for performing work on the substrate may be moved to create a state where the substrate is present at a position where the substrate is detected.

  In the first and second embodiments, the example of the substrate detection sensor configured to detect the substrate by irradiating and receiving visible light has been described. However, the present invention is not limited to this. In the present invention, a substrate detection sensor configured to detect a substrate by irradiating and receiving infrared light may be used, or a substrate detection sensor configured to detect a substrate by irradiating and receiving laser light may be used. . Moreover, the board | substrate detection sensor of the structure which detects a board | substrate by transmitting / receiving an ultrasonic wave may be sufficient.

  In the first and second embodiments, the example of the configuration in which the dummy substrate (detected member) attached to the head is moved to the detection position of the substrate detection sensor and the detection state of the substrate detection sensor is diagnosed is shown. However, the present invention is not limited to this. In the present invention, the head itself may be moved to the detection position of the substrate detection sensor to diagnose the detection state of the substrate detection sensor. Further, a detection member other than the dummy substrate may be attached to the head to diagnose the detection state of the substrate detection sensor. For example, the member to be detected may be a nozzle that adsorbs a component.

  Further, in the first embodiment, the example of the configuration in which the check (diagnosis) of the board detection sensor is periodically performed at the time of power-on and board work (component mounting) is shown, but the present invention is not limited to this. In the present invention, for example, the board detection sensor is diagnosed only when the power is turned on, and the board detection sensor need not be diagnosed during board work (part mounting).

  In the first and second embodiments, for convenience of explanation, the processing operation of the control device (control unit) has been described using a flow-driven flowchart in which processing is performed in order along the processing flow. Is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

2 Substrate 11, 220 Conveyor (Substrate transport section)
15, 260 Substrate detection sensor 16, 210 Controller 18, 270 Notification unit (abnormality notification unit)
100 Component mounting equipment (board work equipment)
122, 231 Head 150, 233 Dummy substrate (detected member)
124 Board recognition camera (Board imaging unit)
200 Printing device (substrate working device)

Claims (7)

A substrate transport section for transporting the substrate;
A substrate detection sensor for detecting the substrate transported by the substrate transport unit at a predetermined transport position;
A head for working on the substrate;
In a state where the substrate is not positioned at the predetermined transport position of the substrate transport unit, the head is moved to create a state where the substrate exists at a position where the substrate detection sensor detects the substrate. And a control unit that diagnoses the detection state of the substrate detection sensor. The head is configured such that a detection member that creates a state in which the substrate is present at a detection position of the substrate detection sensor is attached,
The control unit moves the detected member attached to the head to a detection position of the substrate detection sensor in a state where the substrate is not positioned at the predetermined transfer position of the substrate transfer unit. The board | substrate working apparatus of Claim 1 comprised so that the detection state of the said board | substrate detection sensor might be diagnosed.   The substrate working apparatus according to claim 2, wherein the detected member includes a dummy substrate having at least a portion having the same shape as a part of the substrate.   In the state where the substrate is not positioned at the predetermined transport position of the substrate transport unit, the control unit is configured such that the detected member is positioned at a detection position of the substrate detection sensor and the detection of the substrate detection sensor. The substrate work according to claim 2, wherein the substrate operation is configured to diagnose a detection state of the substrate detection sensor by moving the head to switch to a state where the detected member is not positioned at a position. apparatus.   The controller detects the substrate while moving the detected member within a predetermined range from the position where the substrate is detected when the detected member moved to the detection position of the substrate detection sensor is not detected. The board | substrate working apparatus of any one of Claims 2-4 comprised so that the detection state of a sensor may be diagnosed and the position which detected the said to-be-detected member with the said board | substrate detection sensor may be preserve | saved as adjustment data. . A board imaging unit for imaging the board;
The control unit, when not detecting the detected member moved to the detection position of the substrate detection sensor, images the periphery of the substrate detection sensor by the substrate imaging unit and diagnoses the state of the substrate detection sensor. The board | substrate working apparatus of any one of Claims 2-5 comprised as follows.   The board | substrate working apparatus of any one of Claims 1-6 further provided with the abnormality notification part which notifies abnormality based on the detection state of the said board | substrate detection sensor.

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