JP2022078579A - Component mounting device and component mounting method - Google Patents

Abstract

To provide a component mounting device capable of suppressing reduction in substrate productivity even when a recognition error occurs in image recognition processing for recognizing the state of a component.SOLUTION: A component mounting device 100 comprises: a mounting head that includes a suction nozzle 31a for sucking a component E and mounts the component E on a substrate; a lateral imaging unit 7 that captures images of the component E sucked by the suction nozzle 31a and the periphery of the component E from a side part; and a control unit 8. The suction nozzle 31a has a tip part 311 and a position reference part 312 other than the tip part 311. The control unit 8 is configured to perform first image recognition processing for recognizing the state of the component E using the position reference part 312 and second image recognition processing for recognizing the state of the component E without using the position reference part 312, on the basis of image capturing results of the component E by the lateral imaging part 7.SELECTED DRAWING: Figure 8

Description

The present invention relates to a component mounting device and a component mounting method, and more particularly to a component mounting device and a component mounting method for photographing a component sucked by a suction nozzle from the side.

Conventionally, there is known a component mounting device that images a component sucked by a suction nozzle from the side (see, for example, Patent Document 1).

The above-mentioned Patent Document 1 includes a suction nozzle for sucking an electronic component, and includes a mounting head for mounting the component on a substrate and a side surface image pickup camera for imaging the electronic component sucked on the suction nozzle from the side. The mounting machine (component mounting device) is disclosed. In this surface mounter, image recognition processing using the characteristic portion of the suction nozzle is performed based on the image pickup result of the electronic component by the side image pickup camera, and the suction state of the electronic component is inspected. Further, in this surface mounter, when a recognition error occurs in the image recognition process using the characteristic portion of the suction nozzle, an error process (process of stopping the device) that waits for the return procedure by the operator is performed.

Japanese Patent No. 4331054

However, in the surface mounter described in Patent Document 1, an abnormality (adhesion and chipping of foreign matter, etc.) occurs in the characteristic portion of the suction nozzle, and the state of the component using the characteristic portion of the suction nozzle is recognized. When a recognition error occurs in the image recognition process, the apparatus is stopped, so that there is an inconvenience that the production of the substrate is stopped. Therefore, it is desired to suppress a decrease in the productivity of the substrate even when a recognition error occurs in the image recognition process for recognizing the state of the component.

The present invention has been made to solve the above-mentioned problems, and one object of the present invention is a substrate even when a recognition error occurs in an image recognition process for recognizing the state of a component. It is an object of the present invention to provide a component mounting device and a component mounting method capable of suppressing a decrease in productivity of the above.

The component mounting device according to the first aspect of the present invention includes a suction nozzle for sucking the component, a mounting head for mounting the component on the substrate, a component sucked by the suction nozzle, and a side for imaging the periphery of the component from the side. It includes a one-sided imaging unit and a control unit, the suction nozzle has a tip portion and a position reference unit other than the tip portion, and the control unit is positioned based on the image pickup result of the component by the side image pickup unit. It is configured to perform a first image recognition process for recognizing the state of a component using a reference unit and a second image recognition process for recognizing the state of a component that does not use the position reference unit.

In the component mounting device according to the first aspect of the present invention, as described above, the control unit recognizes the state of the component using the position reference unit based on the image pickup result of the component by the side image pickup unit. It is configured to perform one image recognition process and a second image recognition process for recognizing the state of a component that does not use the position reference unit. As a result, even if a recognition error occurs in one of the image recognition processing of the first image recognition process and the second image recognition process for recognizing the state of the component, the state of the component is obtained by the image recognition process of either one. Can be recognized and the mounting operation of the component on the board can be continued. As a result, unlike the case where the device is stopped immediately and the production of the board is stopped when a recognition error occurs in the image recognition process for recognizing the state of the component, the recognition error is made in the image recognition process for recognizing the state of the component. Even when the above occurs, it is possible to suppress a decrease in the productivity of the substrate.

In the component mounting device according to the first aspect, preferably, the control unit performs the first image recognition process based on the image pickup result of the component by the side image pickup unit, and a recognition error occurs in the first image recognition process. If so, it is configured to perform the second image recognition process. With this configuration, even if an abnormality (adhesion or chipping of foreign matter, etc.) occurs in the position reference portion of the suction nozzle and a recognition error occurs in the first image recognition process using the position reference portion of the suction nozzle. The state of the component can be recognized by the second image recognition process that does not use the position reference portion of the suction nozzle, and the mounting operation of the component on the substrate can be continued. As a result, unlike the case where the device is immediately stopped and the production of the substrate is stopped when a recognition error occurs in the first image recognition process using the position reference portion of the suction nozzle, the first image recognition process using the position reference portion of the suction nozzle is used. Even when a recognition error occurs in the image recognition process, it is possible to suppress a decrease in the productivity of the substrate.

In this case, preferably, the position reference unit has a corner portion, and the control unit uses the tip portion when a recognition error occurs in the first image recognition process using the corner portion of the position reference unit. It is configured to perform image recognition processing. With this configuration, even if a recognition error occurs in the first image recognition process using the corner of the position reference portion of the suction nozzle, the component can be easily processed by the second image recognition process using the tip of the suction nozzle. It is possible to recognize the state of and continue the mounting operation of the component on the board.

When a recognition error occurs in the first image recognition process, in a configuration in which the second image recognition process is performed, preferably, the control unit causes a recognition error based on the tolerance of the thickness of the component or the thickness of the component. It is configured to control whether or not to perform the second image recognition process. With this configuration, it is possible to determine whether or not to perform the second image recognition process in consideration of the thickness tolerance of the parts or the thickness of the parts, so that quality defects do not occur even in the second image recognition process. The second image recognition process may be performed on the parts, while the second image recognition process may not be performed on the parts where quality defects may occur in the second image recognition process. can. As a result, the accuracy of acquiring the state of the component by the first image recognition process or the second image recognition process can be ensured.

In this case, preferably, the control unit does not perform the second image recognition process when a recognition error occurs when the component thickness tolerance or the component thickness is smaller than the reference value, and the component thickness tolerance or When the thickness of the component is equal to or greater than the reference value, the second image recognition process is performed when a recognition error occurs. With this configuration, it is possible to reliably perform the second image recognition processing on the parts whose thickness tolerance or the thickness of the parts is equal to or larger than the reference value, which does not cause quality defects even in the second image recognition processing. In addition, it is possible to ensure that the second image recognition process is not performed on the parts whose thickness tolerance or the thickness of the parts is smaller than the reference value, which may cause quality defects in the second image recognition process. Can be. As a result, the accuracy of acquiring the state of the component by the first image recognition process or the second image recognition process can be surely ensured.

In the configuration in which the second image recognition process is not performed, the control unit preferably stops the mounting operation of the component on the board and outputs information regarding the occurrence of the recognition error when the second image recognition process is not performed. It is configured to provide control. With this configuration, when the second image recognition process is not performed, it is possible to suppress the occurrence of quality defects by stopping the mounting operation of the component on the substrate. In addition, by outputting information regarding the occurrence of recognition errors, it is possible to notify the operator that an abnormality has occurred in the position reference section of the suction nozzle, so that the operator can be informed of the maintenance work (foreign matter) of the position reference section of the suction nozzle. (Removal of chips, repair of chips, replacement of suction nozzles, etc.) can be performed.

When a recognition error occurs in the first image recognition process, the control unit preferably continues the operation of mounting the component on the substrate when the second image recognition process is successful in the configuration in which the second image recognition process is performed. However, it is configured to control the output of information regarding the occurrence of recognition errors. With this configuration, it is possible to inform the operator of information regarding the occurrence of a recognition error (without stopping the device) while continuing the mounting operation of the component on the board, so that the productivity of the board is not reduced. It is possible to make the operator aware that the maintenance work of the position reference portion of the suction nozzle is necessary.

In the configuration in which the second image recognition process is performed when a recognition error occurs in the first image recognition process, the control unit preferably controls to accumulate information regarding the occurrence of the recognition error when the recognition error occurs. It is configured as follows. With this configuration, the operator can confirm the information regarding the occurrence of the accumulated recognition error later, so that the maintenance work of the position reference part of the suction nozzle and the analysis of the abnormality of the position reference part of the suction nozzle are easy. Can be done.

In this case, preferably, the control unit is configured to control the information regarding the occurrence of the accumulated recognition error to be output to the external display unit so as to be displayable. With this configuration, the information regarding the occurrence of the recognition error can be displayed on the external display unit, so that more workers can confirm the information regarding the occurrence of the recognition error.

In the component mounting device according to the first aspect, preferably, the control unit performs the second image recognition process based on the image pickup result of the component by the side image pickup unit, and a recognition error occurs in the second image recognition process. If so, it is configured to perform the first image recognition process. With this configuration, even if a recognition error occurs in the second image recognition process that does not use the position reference section of the suction nozzle, the state of the component is recognized by the first image recognition process that uses the position reference section of the suction nozzle. Then, the mounting operation of the component on the board can be continued. As a result, unlike the case where the device is stopped immediately and the production of the substrate is stopped when a recognition error occurs in the second image recognition process that does not use the position reference part of the suction nozzle, the second image recognition process that does not use the position reference part of the suction nozzle is not used. Even when a recognition error occurs in the image recognition process, it is possible to suppress a decrease in the productivity of the substrate.

The component mounting method according to the second aspect of the present invention has a tip portion and a position reference portion other than the tip portion, includes a suction nozzle for sucking the component, and is used as a suction nozzle of a mounting head for mounting the component on a substrate. A step of imaging the adsorbed component and the periphery of the component from the side, a first image recognition process for recognizing the state of the component using the position reference unit based on the imaging result of the component from the side, and a first image recognition process. The step includes a step of performing a second image recognition process for recognizing the state of the component that does not use the position reference unit.

In the component mounting method according to the second aspect of the present invention, as described above, the first image recognition process for recognizing the state of the component using the position reference unit based on the image pickup result of the component from the side. Further, a step of performing a second image recognition process for recognizing the state of the component that does not use the position reference unit is provided. As a result, it is possible to suppress a decrease in the productivity of the substrate even when a recognition error occurs in the image recognition process for recognizing the state of the component, as in the component mounting device according to the first aspect.

According to the present invention, as described above, even when a recognition error occurs in the image recognition process for recognizing the state of a component, a component mounting device and a component capable of suppressing a decrease in the productivity of the substrate can be suppressed. An implementation method can be provided.

It is a schematic plan view which shows the component mounting apparatus by one Embodiment. It is a block diagram which shows the control structure of the component mounting apparatus by one Embodiment. It is a schematic diagram which shows the mounting head by one Embodiment. It is a schematic diagram of the side image for demonstrating the 1st image recognition processing by one Embodiment. It is a schematic diagram of the side image for demonstrating the case where the recognition error occurs in the 1st image recognition process by one Embodiment. It is a schematic diagram of the side image for demonstrating the 2nd image recognition processing by one Embodiment. It is a schematic diagram for demonstrating the notification of the information about the recognition error by one Embodiment. It is a flowchart for demonstrating the 1st operation example of the side view recognition process by one Embodiment. It is a flowchart for demonstrating the 2nd operation example of the side view recognition process by one Embodiment. It is a continuation flowchart of FIG.

Hereinafter, embodiments embodying the present invention will be described with reference to the drawings.

The configuration of the component mounting device 100 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 7. In the following description, the direction along the substrate transport direction is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the vertical direction orthogonal to the X direction and the Y direction is the Z direction.

(Configuration of component mounting device)
As shown in FIGS. 1 and 2, the component mounting device 100 is a device for mounting components E (electronic components) such as ICs, transistors, capacitors, and resistors on a substrate P such as a printed circuit board.

The component mounting device 100 includes a base 1, a board transport section 2, a head unit 3, a head horizontal movement mechanism section 4, a component image pickup section 5, a board image pickup section 6, and a side image pickup section 7 (FIG. 2). (See), a control unit 8 (see FIG. 2), and a storage unit 9 (see FIG. 2).

The base 1 is a base on which each component is arranged in the component mounting device 100. A substrate transport unit 2, a rail unit 42, and a component image pickup unit 5 are provided on the base 1. Further, a control unit 8 is provided in the base 1. Further, on the base 1, a plurality of feeders 10 are arranged on both sides in the Y direction (Y1 direction side and Y2 direction side). The feeder 10 is a tape feeder that supplies the component E to the mounting head 31 described later in the head unit 3 by a component supply tape that holds the component E.

The board transfer unit 2 is configured to carry in the board P before mounting, transport it in the board transport direction (X direction), and carry out the board P after mounting. Further, the substrate transport unit 2 is configured to transport the carried-in substrate P to the mounting stop position Pa and to fix it at the mounting stop position Pa by a substrate fixing mechanism (not shown) such as a clamp mechanism. Further, the substrate transport unit 2 includes a pair of transport belts 21. The substrate transport unit 2 transports the substrate P in the substrate transport direction with a pair of transport belts 21 supporting both ends of the substrate P in the width direction (Y direction) from the lower side (Z2 direction side). It is configured.

The head unit 3 is a head unit for mounting components. The head unit 3 is configured to mount the component E on the substrate P fixed at the mounting stop position Pa. Specifically, the head unit 3 includes a plurality (five) mounting heads 31. The mounting head 31 is configured to hold the component E and mount it on the substrate P. At the tip of the mounting head 31, a suction nozzle 31a for sucking the component E is detachably configured. The mounting head 31 is configured to suck the component E to the suction nozzle 31a by the negative pressure supplied from the negative pressure supply unit (not shown).

As shown in FIG. 3, the suction nozzle 31a has a tip portion 311 and a position reference portion 312 other than the tip portion 311. The tip portion 311 is the lower end portion of the suction nozzle 31a. The component E is adsorbed on the tip portion 311. The position reference unit 312 is a portion that serves as a reference for the position in the vertical direction (Z direction) in the first image recognition process (described later) for acquiring the state of the component E based on the image pickup result by the side image pickup unit 7. The position reference portion 312 has a shape (shoulder shape) protruding outward from the suction nozzle 31a. Further, the position reference portion 312 is provided on the upper side (Z1 direction side) of the tip portion 311. Further, the position reference portion 312 has a corner portion 312a as a characteristic portion. The corner portion 312a is formed by a substantially horizontal surface and a substantially vertical surface, and has an angle of approximately 90 degrees.

As shown in FIGS. 1 and 2, the head unit 3 includes a Z-axis motor 32 (see FIG. 2) that moves the suction nozzle 31a of the mounting head 31 in the vertical direction (Z direction), and the suction nozzle 31a of the mounting head 31. Includes an R-axis motor 33 (see FIG. 2) that rotates around a rotation axis extending in the Z direction. The mounting head 31 is configured to be movable in the vertical direction between a predetermined descending position and a predetermined ascending position by a Z-axis motor 32. Further, the mounting head 31 is configured to be able to adjust the direction of the sucking component E by being rotated by the R-axis motor 33 while holding the component E.

The head horizontal movement mechanism unit 4 is configured to move the head unit 3 in the horizontal direction (X direction and Y direction). The head horizontal movement mechanism portion 4 includes a support portion 41 that movably supports the head unit 3 in the substrate transport direction (X direction), and a rail portion 42 that movably supports the support portion 41 in the Y direction. .. The support portion 41 has a ball screw shaft 41a extending in the substrate transport direction and an X-axis motor 41b for rotating the ball screw shaft 41a. The head unit 3 is provided with a ball nut (not shown) that engages with the ball screw shaft 41a of the support portion 41. The head unit 3 is configured to be movable in the substrate transport direction along the support portion 41 together with the ball nut that engages with the ball screw shaft 41a by rotating the ball screw shaft 41a by the X-axis motor 41b. ..

The rail portion 42 includes a pair of guide rails 42a that movably support both ends of the support portion 41 in the X direction in the Y direction, a ball screw shaft 42b extending in the Y direction, and a Y-axis motor that rotates the ball screw shaft 42b. It has 42c. The support portion 41 is provided with a ball nut (not shown) that engages with the ball screw shaft 42b of the rail portion 42. The support portion 41 can move in the Y direction along the pair of guide rails 42a of the rail portion 42 together with the ball nut that engages with the ball screw shaft 42b by rotating the ball screw shaft 42b by the Y-axis motor 42c. It is configured in.

The head unit 3 is configured to be movable in the horizontal direction on the base 1 by the support portion 41 and the rail portion 42 of the head horizontal movement mechanism portion 4. As a result, the mounting head 31 of the head unit 3 can move above the feeder 10 and suck the component E supplied from the feeder 10. Further, the mounting head 31 of the head unit 3 can move above the substrate P fixed at the mounting stop position Pa, and the adsorbed component E can be mounted on the substrate P.

The component image pickup unit 5 is a camera for component recognition. The component image pickup unit 5 images the component E sucked by the suction nozzle 31a of the mounting head 31 while the component E is being conveyed to the substrate P by the mounting head 31 of the head unit 3. The component image pickup unit 5 is fixed on the upper surface of the base 1, and images the component E sucked by the suction nozzle 31a of the mounting head 31 from the lower side (Z2 direction side) of the component E. Based on the image pickup result of the component E by the component image pickup unit 5, the control unit 8 acquires (recognizes) the state of the component E (rotational posture and suction position with respect to the mounting head 31).

The substrate imaging unit 6 is a camera for substrate recognition. The substrate imaging unit 6 has a position recognition mark (a position recognition mark) attached to the upper surface of the substrate P on the substrate P fixed at the mounting stop position Pa before the mounting of the component E on the substrate P by the mounting head 31 of the head unit 3 starts. Fidal mark) F is imaged. The position recognition mark F is a mark for recognizing the position of the substrate P. Based on the image pickup result of the position recognition mark F by the substrate image pickup unit 6, the control unit 8 acquires (recognizes) the accurate position and orientation of the substrate P fixed at the mounting stop position Pa.

The side image pickup unit 7 is a camera for component recognition. As shown in FIG. 3, the side image pickup unit 7 is a component E and a component E that are attracted to the suction nozzle 31a of the mounting head 31 while the component E is being conveyed to the substrate P by the mounting head 31 of the head unit 3. The surrounding area is imaged from the side. Further, a side illumination unit 7a is provided on the opposite side of the side image pickup unit 7 with the mounting head 31 interposed therebetween. The side illumination unit 7a has a light source such as an LED, and emits light when the component E is imaged by the side image pickup unit 7. Further, based on the imaging result of the component E by the side imaging unit 7, the control unit 8 acquires (recognizes) the state of the component E such as the presence / absence of the component E, the thickness of the component E, and the inversion of the component E. The details of acquiring the state of the component E based on the imaging result of the component E by the side imaging unit 7 will be described later.

As shown in FIG. 2, the control unit 8 is a control circuit that controls the operation of the component mounting device 100. The control unit 8 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), and a RAM (Random Access Memory). The control unit 8 is configured to control the board transport unit 2, the feeder 10, the X-axis motor 41b, the Y-axis motor 42c, and the like according to a production program so that the head unit 3 mounts the component E on the board P. Has been done. The storage unit 9 is, for example, a storage medium including a flash memory, and is configured to be able to store information. The storage unit 9 stores the recognition result of the component E by each imaging unit and the like.

(Image of parts by side image pickup unit)
Here, in the present embodiment, as shown in FIGS. 4 to 6, the control unit 8 determines the state of the component E using the position reference unit 312 based on the image pickup result of the component E by the side image pickup unit 7. It is configured to perform a first image recognition process for recognizing and a second image recognition process for recognizing the state of the component E without using the position reference unit 312. Specifically, the control unit 8 performs the first image recognition process based on the image pickup result of the component E by the side image pickup unit 7, and when a recognition error occurs in the first image recognition process, the second image. It is configured to perform recognition processing. More specifically, when a recognition error occurs in the first image recognition process using the corner portion 312a of the position reference unit 312, the control unit 8 performs the second image recognition process using the tip portion 311. It is configured.

As shown in FIG. 4, in the first image recognition process, the control unit 8 determines the corner portion 312a of the position reference unit 312 and the component E from the image pickup result (side image) of the component E by the side image pickup unit 7. It is configured to perform control to recognize the lower end (lowermost end). Then, the control unit 8 has a length from the corner portion 312a of the position reference portion 312 to the lower end (lowermost end) of the component E based on the corner portion 312a of the position reference portion 312 and the lower end (lowermost end) of the component E. It is configured to control the acquisition.

Further, in the first image recognition process, the control unit 8 controls to acquire the length (nozzle length) from the corner portion 312a of the position reference unit 312 acquired in advance to the tip portion 311 of the suction nozzle 31a from the storage unit 9. Is configured to do. The length (nozzle length) from the corner portion 312a of the position reference portion 312 to the tip portion 311 of the suction nozzle 31a is determined by, for example, the side image pickup unit 7 before suctioning the component E by the suction nozzle 31a. The suction nozzle 31a that does not adsorb E can be imaged, and can be acquired in advance based on the image pickup result. Then, the control unit 8 is a length from the length from the corner portion 312a of the position reference portion 312 to the lower end (bottom end) of the component E, from the corner portion 312a of the position reference portion 312 to the tip portion 311 of the suction nozzle 31a. It is configured to control the acquisition of the thickness of the component E by subtracting (nozzle length).

As shown in FIG. 5, when the position reference unit 312 recognizes an abnormality (foreign matter adheres in FIG. 5), the position reference unit 312 recognizes the position reference unit 312 in the first image recognition process. It may not be possible and a recognition error may occur (the first image recognition process fails). The abnormality of the position reference unit 312 includes not only the adhesion of foreign matter but also the chipping of the position reference unit 312. When a recognition error occurs, the control unit 8 performs a second image recognition process using the tip portion 311.

As shown in FIG. 6, in the second image recognition process, the control unit 8 controls to recognize the lower end (lowermost end) of the component E from the image pickup result (side image) of the component E by the side image pickup unit 7. It is configured to do. Further, in the second image recognition process, the control unit 8 is configured to control the position of the tip portion 311 of the suction nozzle 31a acquired in advance from the storage unit 9. As for the position of the tip portion 311 of the suction nozzle 31a, for example, before the suction nozzle 31a sucks the component E, the side image pickup unit 7 takes an image of the suction nozzle 31a that does not suck the component E, and the image pickup result thereof. Can be obtained in advance based on. The control unit 8 is configured to control the length from the tip portion 311 of the suction nozzle 31a to the lower end (lowermost end) of the component E as the thickness of the component E.

Further, in the present embodiment, the control unit 8 is configured to control whether or not to perform the second image recognition process when a recognition error occurs, based on the tolerance of the thickness of the component E. There is. Specifically, when the tolerance of the thickness of the component E is smaller than the reference value (for example, 50 μm), the control unit 8 does not perform the second image recognition process when a recognition error occurs, and the thickness of the component E is not performed. When the tolerance of is greater than or equal to the reference value (for example, 50 μm), the second image recognition process is performed when a recognition error occurs. That is, the control unit 8 is configured so that the second image recognition process is not performed on the extremely small component E, which requires high measurement accuracy, when a recognition error occurs. Further, the control unit 8 is configured to perform a second image recognition process for the component E, which is not required to have high measurement accuracy, when a recognition error occurs. The component mounting device 100 has a first mode (standard check) in which it is not determined whether or not to perform the second image recognition process when a recognition error occurs, and a second image when a recognition error occurs. It is possible to switch between the second mode (detailed check) for determining whether or not to perform the recognition process.

Further, in the present embodiment, the control unit 8 stops the mounting operation of the component E on the substrate P when the second image recognition process is not performed when a recognition error occurs in the second mode (component mounting device 100). It is configured to control the output of information regarding the occurrence of recognition errors. Specifically, the control unit 8 is configured to control to immediately stop the component mounting device 100 when the second image recognition process is not performed when a recognition error occurs in the second mode. Further, the control unit 8 is configured to control notifying the worker of information regarding the occurrence of a recognition error by notifying the worker of an alert. The notification of the occurrence of the recognition error to the worker is performed, for example, by displaying the error on the display screen of the component mounting device 100 or by transmitting the information to the terminal carried by the worker. be able to.

Further, in the present embodiment, when the second image recognition process is successful, the control unit 8 generates a recognition error (without stopping the component mounting device 100) while continuing the mounting operation of the component E on the substrate P. It is configured to control the output of information about. Specifically, the control unit 8 notifies the worker of information regarding the occurrence of a recognition error by notifying the worker of an alert at a predetermined timing while operating the component mounting device 100 without stopping. It is configured to provide control. The predetermined timing is not particularly limited, but for example, when the mounting of the board P being mounted at the time of the recognition error is completed (when the mounting of one board is completed), the predetermined number (N) of the boards from the time of the recognition error occurs. When the mounting of P is completed (when the N board mounting is completed), and after all the mounting of the boards P of the production type (specific type) is completed (when the board mounting of the production type is completed) and the like.

Further, in the present embodiment, when a recognition error occurs, the control unit 8 is configured to perform control for accumulating information regarding the occurrence of the recognition error. Specifically, when a recognition error occurs, the control unit 8 is configured to perform control to store information regarding the occurrence of the recognition error in the storage unit 9 in association with the time when the recognition error occurs. The control unit 8 is configured to control the storage unit 9 to store information regarding the occurrence of a recognition error as an operation history (log) of the component mounting device 100 over time. This makes it possible to analyze the occurrence of the recognition error while confirming the events that occurred before and after the occurrence of the recognition error in the component mounting device 100. Further, the control unit 8 is configured to control the display screen of the component mounting device 100 to display information regarding the occurrence of a recognition error as a log.

Further, as shown in FIG. 7, when a predetermined operation is performed by the operator, the control unit 8 controls to simultaneously display the information regarding the occurrence of the recognition error and the side image in which the recognition error has occurred. It is configured in. In FIG. 7, the display of "no shoulder detected" indicates that the corner portion (shoulder) 312a of the position reference unit 312 was not recognized in the first image recognition process together with the side image. For example, when the operator performs a recognition test operation using a side image, the control unit 8 controls to simultaneously display information regarding the occurrence of a recognition error and the side image in which the recognition error has occurred. It is configured as follows.

Further, in the present embodiment, the control unit 8 is configured to control to output information regarding the occurrence of the accumulated recognition error to the external display unit so as to be displayable. The external display unit is not particularly limited, but is, for example, an external display unit that displays the production status of the mounting line including the component mounting device 100. Such an external display unit is arranged in the factory where the mounting line is arranged. If the information regarding the occurrence of the recognition error is displayed on such an external display unit, the information regarding the occurrence of the recognition error can be confirmed together with the information other than the information regarding the occurrence of the recognition error. It is possible to easily perform the analysis. Further, the control unit 8 is configured to control the information regarding the occurrence of the recognition error and the side image in which the recognition error has occurred to be output to the external display unit so as to be displayable.

(First operation example of side view recognition processing)
Next, with reference to FIG. 8, a first operation example (standard check) of the side view recognition process by the component mounting apparatus 100 of the present embodiment will be described with reference to the flowchart. Each process of the flowchart is performed by the control unit 8.

When the image pickup result of the component E by the side image pickup unit 7 is acquired, first, in step S1, the first image recognition process using the position reference unit 312 is performed, as shown in FIG.

Then, in step S2, it is determined whether or not the first image recognition process is successful. Specifically, in step S2, it is determined whether or not the recognition of the position reference unit 312 is successful in the first image recognition process. If it is determined in the first image recognition process that the recognition of the position reference unit 312 has failed (when a recognition error occurs), the process proceeds to step S3.

Then, in step S3, the second image recognition process using the tip portion 311 is performed. After that, the process proceeds to step S4.

If it is determined in step S2 that the position reference unit 312 has been successfully recognized in the first image recognition process, the process proceeds to step S4 without performing the second image recognition process.

Then, in step S4, the recognition result is stored in the storage unit 9. In step S4, the thickness of the component E, the presence / absence of the component E, the inversion of the component E, the success / failure of the first image recognition process, the success / failure of the second image recognition process, and the like are stored in the storage unit 9 as recognition results. The success or failure of the second image recognition process is saved only when the second image recognition process is performed.

Then, in step S5, it is determined whether or not the first image recognition process is successful. If it is determined that the first image recognition process is successful, the side view recognition process is terminated.

If it is determined in step S5 that the first image recognition process has failed, the process proceeds to step S6.

Then, in step S6, it is determined whether or not the second image recognition process is successful. If it is determined that the second image recognition process is successful, the process proceeds to step S7.

Then, in step S7, an error display is performed. In step S7, for example, information regarding the occurrence of a recognition error is displayed as a log on the display screen of the component mounting device 100. At this time, the information regarding the occurrence of the recognition error may be output to the external display unit so as to be displayable. After that, the side view recognition process is terminated.

If it is determined in step S6 that the second image recognition process has failed, the process proceeds to step S8.

Then, in step S8, error stop is performed. In step S8, the mounting operation of the component E on the substrate P is stopped (the component mounting device 100 is stopped). In this case, the worker is notified of the alert. After that, the side view recognition process is terminated.

(Second operation example of side view recognition processing)
Next, a second operation example (detailed check) of the side view recognition process by the component mounting device 100 of the present embodiment will be described with reference to FIGS. 9 and 10 based on a flowchart. Each process of the flowchart is performed by the control unit 8.

When the imaging result of the component E by the side imaging unit 7 is acquired, first, in step S11, whether or not the tolerance of the component E is smaller than the reference value (whether the component E is small or not), as shown in FIG. Whether or not) is determined. If it is determined that the tolerance of the component E is smaller than the reference value, the process proceeds to step S12.

Then, in step S12, the first image recognition process using the position reference unit 312 is performed. Then, regardless of the success or failure of the first image recognition process, the process proceeds to step S13 without performing the second image recognition process.

Then, in step S13, the recognition result is stored in the storage unit 9. In step S4, the thickness of the component E, the presence / absence of the component E, the inversion of the component E, the success / failure of the first image recognition process, and the like are stored in the storage unit 9 as recognition results.

Then, in step S14, it is determined whether or not the first image recognition process is successful. If it is determined that the first image recognition process is successful, the side view recognition process is terminated.

If it is determined in step S14 that the first image recognition process has failed, the process proceeds to step S15.

Then, in step S15, it is determined whether or not the second image recognition process is performed and the second image recognition process is successful. When the process goes through step S12, it is determined that the second image recognition process is not performed, and the process proceeds to step S17.

Then, in step S17, error stop is performed. In step S17, the mounting operation of the component E on the substrate P is stopped (the component mounting device 100 is stopped). In this case, the worker is notified of the alert. After that, the side view recognition process is terminated.

If it is determined in step S11 that the tolerance of the component E is equal to or greater than the reference value, the process proceeds to step S18 as shown in FIG.

Then, in step S18, the first image recognition process using the position reference unit 312 is performed.

Then, in step S19, it is determined whether or not the first image recognition process is successful. Specifically, in step S19, it is determined whether or not the recognition of the position reference unit 312 is successful in the first image recognition process. If it is determined in the first image recognition process that the recognition of the position reference unit 312 has failed (when a recognition error occurs), the process proceeds to step S20.

Then, in step S20, the second image recognition process using the tip portion 311 is performed. After that, the process proceeds to step S13.

If it is determined in step S13 that the position reference unit 312 has been successfully recognized in the first image recognition process, the process proceeds to step S13 without performing the second image recognition process.

Then, as shown in FIG. 9, in step S13, the recognition result is stored in the storage unit 9. In step S13, the thickness of the component E, the presence / absence of the component E, the inversion of the component E, the success / failure of the first image recognition process, the success / failure of the second image recognition process, and the like are stored in the storage unit 9 as recognition results. The success or failure of the second image recognition process is saved only when the second image recognition process is performed.

Then, in step S14, it is determined whether or not the first image recognition process is successful. If it is determined that the first image recognition process is successful, the side view recognition process is terminated.

If it is determined in step S14 that the first image recognition process has failed, the process proceeds to step S15.

Then, in step S15, it is determined whether or not the second image recognition process is performed and the second image recognition process is successful. If the second image recognition process is performed and the second image recognition process is successful in the case of passing through step S18, the process proceeds to step S16.

Then, in step S16, an error display is performed. In step S16, for example, information regarding the occurrence of a recognition error is displayed as a log on the display screen of the component mounting device 100. At this time, the information regarding the occurrence of the recognition error may be output to the external display unit so as to be displayable. After that, the side view recognition process is terminated.

Further, in step S15, when the process is via step S18 and the second image recognition process is not performed, or when the second image recognition process is performed but the second image recognition process fails, step S17. Proceed to.

Then, in step S17, error stop is performed. In step S17, the mounting operation of the component E on the substrate P is stopped (the component mounting device 100 is stopped). In this case, the worker is notified of the alert. After that, the side view recognition process is terminated.

(Effect of this embodiment)
In this embodiment, the following effects can be obtained.

In the present embodiment, as described above, the control unit 8 recognizes the first image for recognizing the state of the component E using the position reference unit 312 based on the image pickup result of the component E by the side image pickup unit 7. It is configured to perform the processing and the second image recognition processing for recognizing the state of the component E without using the position reference unit 312. As a result, even if a recognition error occurs in either the first image recognition process or the second image recognition process for recognizing the state of the component E (the first image recognition process in the present embodiment). The state of the component E can be recognized by the image recognition process (second image recognition process in the present embodiment) of either one, and the mounting operation of the component E on the substrate P can be continued. As a result, unlike the case where the device is stopped immediately when a recognition error occurs in the image recognition process for recognizing the state of the component E and the production of the substrate P is stopped, the image recognition process for recognizing the state of the component E is performed. Even when a recognition error occurs in the above, it is possible to suppress a decrease in the productivity of the substrate P.

Further, in the present embodiment, as described above, the control unit 8 performs the first image recognition process based on the image pickup result of the component E by the side image pickup unit 7, and a recognition error occurs in the first image recognition process. When it occurs, it is configured to perform the second image recognition process. As a result, even if an abnormality (adhesion or chipping of foreign matter, etc.) occurs in the position reference portion 312 of the suction nozzle 31a and a recognition error occurs in the first image recognition process using the position reference portion 312 of the suction nozzle 31a, even if a recognition error occurs. The state of the component E can be recognized by the second image recognition process that does not use the position reference unit 312 of the suction nozzle 31a, and the mounting operation of the component E on the substrate P can be continued. As a result, unlike the case where the apparatus is stopped immediately and the production of the substrate P is stopped when a recognition error occurs in the first image recognition process using the position reference portion 312 of the suction nozzle 31a, the position reference portion 312 of the suction nozzle 31a is stopped. Even when a recognition error occurs in the first image recognition process using the above, it is possible to suppress a decrease in the productivity of the substrate P.

Further, in the present embodiment, as described above, the position reference unit 312 has the corner portion 312a, and the control unit 8 has a recognition error in the first image recognition process using the corner portion 312a of the position reference unit 312. When it occurs, it is configured to perform a second image recognition process using the tip portion 311. As a result, even if a recognition error occurs in the first image recognition process using the corner portion 312a of the position reference portion 312 of the suction nozzle 31a, the second image recognition process using the tip portion 311 of the suction nozzle 31a can be easily performed. The state of the component E can be recognized and the mounting operation of the component E on the substrate P can be continued.

Further, in the present embodiment, as described above, the control unit 8 controls based on the thickness tolerance of the component E to determine whether or not to perform the second image recognition process when a recognition error occurs. It is configured as follows. As a result, it is possible to determine whether or not to perform the second image recognition process in consideration of the thickness tolerance of the component E. Therefore, for the component E in which quality defects do not occur even in the second image recognition process. While the second image recognition process is performed, the second image recognition process can be prevented from being performed on the component E which may have a quality defect in the second image recognition process. As a result, the accuracy of acquiring the state of the component E by the first image recognition process or the second image recognition process can be ensured.

Further, in the present embodiment, as described above, when the tolerance of the thickness of the component E is smaller than the reference value, the control unit 8 does not perform the second image recognition process when a recognition error occurs, and the component E does not perform the second image recognition process. When the tolerance of the thickness is equal to or larger than the reference value, the second image recognition process is performed when a recognition error occurs. As a result, the second image recognition process can be reliably performed on the component E whose thickness tolerance of the component E, which does not cause quality defects even in the second image recognition process, is equal to or larger than the reference value, and the second image can be performed. It is possible to reliably prevent the second image recognition process from being performed on the component E whose thickness tolerance of the component E, which may cause quality defects in the recognition process, is smaller than the reference value. As a result, the accuracy of acquiring the state of the component E by the first image recognition process or the second image recognition process can be surely ensured.

Further, in the present embodiment, as described above, when the second image recognition process is not performed, the control unit 8 stops the mounting operation of the component E on the substrate P and outputs information regarding the occurrence of the recognition error. It is configured to provide control. As a result, when the second image recognition process is not performed, it is possible to suppress the occurrence of quality defects by stopping the mounting operation of the component E on the substrate P. Further, by outputting the information regarding the occurrence of the recognition error, it is possible to notify the operator that an abnormality has occurred in the position reference unit 312 of the suction nozzle 31a, so that the operator can be notified of the position reference unit 312 of the suction nozzle 31a. Maintenance work (removal of foreign matter, repair of chips, replacement of suction nozzles, etc.) can be performed.

Further, in the present embodiment, as described above, when the second image recognition process is successful, the control unit 8 is controlled to output information regarding the occurrence of a recognition error while continuing the mounting operation of the component E on the substrate P. Is configured to do. As a result, it is possible to inform the operator of information regarding the occurrence of a recognition error (without stopping the device) while continuing the mounting operation of the component E on the board P, so that the productivity of the board P is not reduced. , It is possible to make the operator recognize that the maintenance work of the position reference portion 312 of the suction nozzle 31a is necessary.

Further, in the present embodiment, as described above, the control unit 8 is configured to control the accumulation of information regarding the occurrence of the recognition error when the recognition error occurs. As a result, the operator can confirm the information regarding the occurrence of the accumulated recognition error later, so that the maintenance work of the position reference unit 312 of the suction nozzle 31a and the analysis of the abnormality of the position reference unit 312 of the suction nozzle 31a are easy. Can be done.

Further, in the present embodiment, as described above, the control unit 8 is configured to control the information regarding the occurrence of the accumulated recognition error to be output to the external display unit so as to be displayable. As a result, the information regarding the occurrence of the recognition error can be displayed on the external display unit, so that more workers can confirm the information regarding the occurrence of the recognition error.

[Modification example]
It should be noted that the embodiments disclosed this time are exemplary in all respects and are not considered to be restrictive. The scope of the present invention is shown by the scope of claims rather than the description of the above-described embodiment, and further includes all modifications (modifications) within the meaning and scope equivalent to the scope of claims.

For example, in the above embodiment, an example is shown in which the position reference portion has a shape (shoulder shape) protruding outward of the suction nozzle, but the present invention is not limited to this. For example, the position reference portion may have a shape other than the shoulder shape, such as a flange shape and a shape that retracts inward of the suction nozzle (concave shape).

Further, in the above embodiment, an example is shown in which the position reference portion has a corner portion at a substantially right angle (approximately 90 degrees) as a feature portion, but the present invention is not limited to this. For example, the position reference portion may have an acute-angled or obtuse-angled corner other than a substantially right angle as a feature portion. Further, the position reference portion may have a feature portion other than the corner portion.

Further, in the above embodiment, an example in which the second image recognition process is an image recognition process using a tip portion is shown, but the present invention is not limited to this. For example, the second image recognition process may be an image recognition process using a portion other than the tip portion such as the tapered portion of the suction nozzle.

Further, in the above embodiment, an example of determining whether or not to perform the second image recognition process when a recognition error occurs is shown based on the tolerance of the thickness of the component, but the present invention is not limited to this. .. For example, based on the thickness of the component, it may be determined whether or not to perform the second image recognition process when a recognition error occurs. In this case, if the thickness of the component is smaller than the reference value, the second image recognition process is not performed when a recognition error occurs, and if the thickness of the component is greater than or equal to the reference value, the second image recognition error occurs. 2 Image recognition processing may be performed.

Further, in the above embodiment, an example of outputting information regarding the occurrence of a recognition error to an external display unit so as to be displayable has been shown, but the present invention is not limited to this. For example, it is not necessary to output the information regarding the occurrence of the recognition error to the external display unit so as to be displayable.

Further, in the above embodiment, when the second image recognition process is successful, an example is shown in which an alert is notified to an operator at a predetermined timing while operating the component mounting device without stopping. Not limited to this. For example, when the second image recognition process is successful, the component mounting device is operated without stopping, and the component mounting device is made to perform a replacement operation (automatic replacement) of the suction nozzle in which an abnormality is detected at a predetermined timing. You may. In this case, it is sufficient to notify the operator that the suction nozzle replacement operation has been performed at a predetermined timing after the suction nozzle replacement operation. The component mounting device is usually provided with a nozzle arranging portion (nozzle station) in which a plurality of replacement suction nozzles are arranged.

Further, in the above embodiment, for convenience of explanation, the processing operations of the control unit have been described using a flow-driven flowchart in which the processing operations of the control unit are sequentially processed along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven type (event-driven type) processing in which processing is executed in event units. In this case, it may be completely event-driven, or it may be a combination of event-driven and flow-driven.

Further, in the above embodiment, the control unit performs the first image recognition process based on the image pickup result of the component by the side image pickup unit, and when a recognition error occurs in the first image recognition process, the second image recognition. Although an example configured to perform processing is shown, the present invention is not limited to this. For example, the control unit performs the second image recognition process based on the image pickup result of the component by the side image pickup unit, and performs the first image recognition process when a recognition error occurs in the second image recognition process. It may be configured. As a result, even if a recognition error occurs in the second image recognition process that does not use the position reference section of the suction nozzle, the state of the component is recognized by the first image recognition process that uses the position reference section of the suction nozzle, and the component Can be continued to be mounted on the board. As a result, unlike the case where the device is stopped immediately and the production of the substrate is stopped when a recognition error occurs in the second image recognition process that does not use the position reference part of the suction nozzle, the second image recognition process that does not use the position reference part of the suction nozzle is not used. Even when a recognition error occurs in the image recognition process, it is possible to suppress a decrease in the productivity of the substrate. The recognition error in the second image recognition process is, for example, an error when the tip of the suction nozzle is measured in advance. Further, also in this case, if the "first image recognition process" of the above embodiment is read as "second image recognition process" and the "second image recognition process" is read as "first image recognition process", It is possible to appropriately adopt the configuration of the above embodiment.

Further, for example, the control unit always performs both the first image recognition process and the second image recognition process based on the image pickup result of the component by the side image pickup unit, regardless of whether or not a recognition error occurs. It may be configured to do so. In this case, regarding the handling of the data (thickness of the component) obtained by the first image recognition process and the second image recognition process, the data obtained by the first image recognition process or the second image recognition process may be selected. Then, each data may be compared with the component thickness (reference thickness) of the component data, and either data may be selected.

7 Side image pickup unit 8 Control unit 31 Mounting head 31a Suction nozzle 100 Parts mounting device 311 Tip part 312 Position reference part 312a Square part E parts P board

Claims (11)

A mounting head that includes a suction nozzle that sucks parts and mounts the parts on a board,
A side image pickup unit that images the component sucked by the suction nozzle and the periphery of the component from the side.
With a control unit,
The suction nozzle has a tip portion and a position reference portion other than the tip portion.
The control unit uses the first image recognition process for recognizing the state of the component using the position reference unit and the position reference unit based on the image pickup result of the component by the side image pickup unit. A component mounting device configured to perform a second image recognition process for recognizing the state of the component. The control unit performs the first image recognition process based on the image pickup result of the component by the side image pickup unit, and when a recognition error occurs in the first image recognition process, the second image recognition process. The component mounting apparatus according to claim 1, wherein the component mounting device is configured to perform the above-mentioned method. The position reference portion has a corner portion and has a corner portion.
The control unit is configured to perform the second image recognition process using the tip portion when the recognition error occurs in the first image recognition process using the corner portion of the position reference unit. The component mounting device according to claim 2. The control unit is configured to control whether or not to perform the second image recognition process when the recognition error occurs, based on the thickness tolerance of the component or the thickness of the component. The component mounting device according to claim 2 or 3. When the difference in the thickness of the component or the thickness of the component is smaller than the reference value, the control unit does not perform the second image recognition process when the recognition error occurs, and the tolerance of the thickness of the component or The component mounting device according to claim 4, wherein the second image recognition process is performed when the recognition error occurs when the thickness of the component is equal to or greater than the reference value. The control unit is configured to stop the mounting operation of the component on the substrate and output information regarding the occurrence of the recognition error when the second image recognition process is not performed. The component mounting device according to claim 5. The claim is configured to control to output information regarding the occurrence of the recognition error while continuing the mounting operation of the component on the substrate when the second image recognition process is successful. Item 6. The component mounting apparatus according to any one of Items 2 to 6. The component mounting device according to any one of claims 2 to 7, wherein the control unit is configured to perform control for accumulating information regarding the occurrence of the recognition error when the recognition error occurs. The component mounting device according to claim 8, wherein the control unit is configured to control to output the accumulated information regarding the occurrence of the recognition error to the external display unit so as to be displayable. The control unit performs the second image recognition process based on the image pickup result of the component by the side image pickup unit, and when a recognition error occurs in the second image recognition process, the first image recognition process. The component mounting apparatus according to claim 1, wherein the component mounting device is configured to perform the above-mentioned method. The component having a tip portion and a position reference portion other than the tip portion, including a suction nozzle for sucking the component, and the component sucked by the suction nozzle of a mounting head for mounting the component on a substrate and the periphery of the component. And the step of imaging from the side
Based on the image pickup result of the component from the side, the first image recognition process for recognizing the state of the component using the position reference unit and the state of the component not using the position reference unit can be obtained. A component mounting method comprising a step of performing a second image recognition process for recognition.

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