WO2017170931A1

WO2017170931A1 - Imaging device and inspection device

Info

Publication number: WO2017170931A1
Application number: PCT/JP2017/013397
Authority: WO
Inventors: 志田　淳; 真一山森; 関根　秀一; 昌弘深澤
Original assignee: 株式会社タムラ製作所
Priority date: 2016-03-31
Filing date: 2017-03-30
Publication date: 2017-10-05
Also published as: JP2017181447A; JP6523201B2

Abstract

The present invention makes it possible to accurately inspect an object using an imaging signal. Provided is an imaging device having an imaging element, an imaging lens, and a blowing port for forming an air flow that traverses the front surface of the imaging lens. Also provided is an inspection device that has an imaging device having an imaging element, an imaging lens, and a blowing port for forming an air flow that traverses the front surface of the imaging lens and that uses an imaging signal from the imaging device to inspect an object.

Description

Imaging apparatus and inspection apparatus

The present invention relates to an imaging apparatus and an inspection apparatus using the imaging apparatus.

Non-contact optical inspection (hereinafter referred to as appearance inspection as appropriate) for confirming the presence or absence of defects in manufactured electronic components is known. An inspection device that determines whether soldering is good or bad is still known. For example, an electronic component in which a component lead is inserted into a through hole of a substrate and soldered is called an inserted component. In general, a flow soldering apparatus is used for soldering the insertion part. In the soldering process, poor soldering such as bridges and non-wetting occurs due to various causes. For this reason, the inspection after the mounting process is indispensable. As one of inspection methods, an appearance inspection device that uses an imaging device, a laser, an X-ray, or the like to determine whether soldering is good or bad is known. For example, Patent Document 1 describes an inspection apparatus that inspects a soldering surface of a component mounting board that has undergone a flow soldering process using an imaging apparatus.

JP-A-8-166218

As described in Patent Document 1, when the soldering surface is imaged by the imaging device from the lower side, dust is likely to adhere to the front surface (lens surface) of the imaging device because the imaging device is facing upward. In spite of normal soldering due to dust, there is a problem of misjudgment that soldering is judged to be defective. Further, since the flux is vaporized from the board immediately after being taken out from the soldering apparatus, a gas called fume is generated, resulting in an unclear image, and similarly erroneous determination occurs. Also, since the soldering of the substrate is generally performed continuously, the fume of the flux used for soldering adheres and accumulates over time on the front surface (lens surface) of the imaging device, and maintenance work such as cleaning is performed. Workers had to do it regularly.

Therefore, an object of the present invention is to provide an imaging apparatus and an inspection apparatus that can prevent such erroneous determination and reduce a load such as maintenance work of a worker.

The present invention is an image pickup apparatus having an image pickup element, an image pickup lens, and an air outlet that forms an air flow across the front surface of the image pickup lens. Preferably, it has a suction port for sucking airflow. The present invention includes an imaging device having an imaging device, an imaging lens, and an air outlet that forms an airflow across the front surface of the imaging lens, and inspects an object using an imaging signal of the imaging device It is. Preferably, as the inspection position, the imaging device images the soldering surface of the workpiece to which the component is soldered, inspects the soldering failure from the imaging signal of the imaging device, and stores the soldering failure location. Preferably, the workpiece is one in which components are soldered to the substrate by flow soldering. Preferably, the inspection position has another air outlet that forms an air flow toward the soldering surface of the substrate. Preferably, the inspection position has a suction port for sucking airflow. Preferably, the temperature of the airflow toward the soldering surface of the substrate is set higher than the airflow across the lens front surface.

According to at least one embodiment, it is possible to prevent dust from adhering to the front surface of the imaging device and to blow off the adhering dust. Also, fumes drifting like smoke around the work can be blown away. Therefore, when inspecting based on the captured image of the imaging device, it is possible to prevent a normal one from being erroneously determined as defective. In addition, the effect described here is not necessarily limited, and any effect described in this invention may be sufficient. Further, the contents of the present invention are not construed as being limited by the effects exemplified in the following description.

It is a basic diagram which shows the outline of the flow soldering apparatus which can apply this invention. It is a basic diagram used for description of a local trace soldering apparatus. It is a basic diagram used for description of a local trace soldering apparatus. It is a basic diagram used for description of a local trace soldering apparatus. It is a basic diagram which shows the structural example of the part of the correction apparatus in a flow soldering apparatus. It is a basic diagram which shows the structural example of the part of the correction apparatus in a flow soldering apparatus. It is a basic diagram which shows the structural example of the part of the correction apparatus in a flow soldering apparatus. It is a top view of an example of a work (board). It is sectional drawing of an example of a workpiece | work (board | substrate). It is sectional drawing of an example of a workpiece | work (board | substrate). It is a top view of an example of a work (board). It is sectional drawing and a top view used for description of a soldering defect. It is sectional drawing and a top view used for description of a soldering defect. It is sectional drawing used for description of a soldering defect. It is a top view used for description of a soldering defect. It is sectional drawing used for description of a soldering defect. It is a flowchart used for description of the flow of an example of the process of a flow soldering apparatus. It is a flowchart used for description of the flow of the other example of the process of a flow soldering apparatus. 1 is a plan view showing a configuration of an imaging apparatus and its periphery in an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view illustrating a configuration of an imaging apparatus and its periphery according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional view illustrating a configuration of an imaging apparatus and its periphery according to an embodiment of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional view illustrating a configuration of an imaging apparatus and its periphery according to an embodiment of the present invention. It is a perspective view which shows the structure of an imaging device and its periphery. It is a front view which shows the structure at the time of an external appearance test | inspection. It is a perspective view of an example of a nozzle. It is a block diagram which shows the system configuration | structure of one Embodiment of this invention. It is a flowchart for demonstrating the test | inspection operation | movement of one Embodiment of this invention.

Embodiments of the present invention will be described below. The description will be given in the following order.
<1. Flow soldering apparatus to which this invention can be applied>
<2. Embodiment>
<3. Modification>
The embodiment described below is a preferred specific example of the present invention, and various technically preferable limitations are given. However, the scope of the present invention is particularly limited to the present invention in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

<1. Flow soldering apparatus to which this invention can be applied>
FIG. 1 shows the configuration of the entire system of a flow soldering apparatus to which the present invention can be applied. The workpiece W is carried into a flux coating device (hereinafter referred to as a fluxer as appropriate) 1. In a component insertion step (not shown), for example, the lead of the insertion component is inserted into the through hole on the substrate on which the chip component or the like is surface-mounted. A substrate to which the insertion component is attached is a workpiece W. However, the work W is a term including a silicon wafer and the like in addition to the printed wiring board. The fluxer 1 is, for example, a spray fluxer that applies a flux only to a necessary portion.

The preheater 2 and the soldering device 3 are arranged inline with respect to the fluxer 1. The workpiece W is placed on a conveyor and conveyed to each device. The preheater 2 preheats the workpiece W, and the workpiece W is heated to about 100 ° C., for example.

The soldering device 3 is a device that performs flow soldering. An example of the flow soldering method performed in the soldering apparatus 3 is a flow method in which the workpiece W is passed over the jetted solder to perform soldering. In the case of the flow method, a method capable of performing selective soldering in which solder is jetted only in a necessary region without jetting solder on the entire surface of the workpiece W may be used. Further, not only the flow method but also a dip method in which the back surface of the work is immersed in a solder bath in which solder is melted and soldering may be used.

Furthermore, as the soldering device 3, a suitable device is a local trace soldering device. The local trace soldering device has a configuration in which only the location of the insertion part can be soldered in a preset order (path), and the molten solder that can flexibly accommodate the length and number of the entire insertion part lead is jetted. A jet nozzle.

2A, 2B and 2C are diagrams for schematically explaining the local trace soldering apparatus. As shown in FIG. 2A, a jet nozzle 22 and a solder bath 23 are installed on an XY stage 21. The XY stage 21 can be displaced in the X direction and the Y direction by a servo motor (not shown). Furthermore, the jet nozzle 22 can be displaced also in the Z (vertical) direction. When the workpiece W is positioned above the jet nozzle 22 so as to face the XY stage 21, the jet nozzle 22 is displaced upward, and the lead protruding from the back surface of the workpiece W by the molten solder jetted from the jet nozzle 22 is formed on the substrate. Soldered in place.

¡Leads are soldered at the positions of a plurality of insertion parts in accordance with a preset order by an operation according to the insertion parts. 2A, 2B and 2C, the jet nozzle 22 is displaced in the XY direction, but the jet nozzle 22 is fixed and the workpiece W is displaced in the XY and Z directions. May be.

As shown in FIG. 2B, the jet nozzle 22 has a nozzle 22a and a cylinder 22b concentrically surrounding the nozzle 22a. The molten solder supplied from the solder bath 23 jets upward from the opening at the tip of the nozzle 22a, contacts the soldering location on the back surface of the workpiece W, and is soldered. The molten solder spilled from the nozzle 22a returns to the lower solder tank 23 from the opening of the cylinder 22b. The solder bath 23 is provided with a rotating blade, a power source (motor), and the like for forming a solder flow, and circulates the molten solder.

As shown in FIG. 2C, the lead 26 of the insertion component 25 is inserted into the substrate 24. The jet nozzle 22 moves in a direction parallel to the arrangement direction on one side of the lead 26, and the soldering of the lead 26 is corrected by the solder 27 jetted from the nozzle 22a. When the soldering correction of the lead on one side is completed, the soldering correction is similarly performed on the lead on the other side. As will be described later, the bridge can be satisfactorily corrected by making the moving direction of the jet nozzle 22 parallel to the direction of occurrence of the bridge.

Referring back to FIG. 1, the mounted workpiece W is transferred to the first appearance inspection device 4 by the soldering device 3, and a soldering defect inspection is performed in a non-contact manner. As will be described later, the appearance inspection apparatus 4 captures the mounting surface (soldering surface) of the workpiece W by an imaging device, and an operator looks at the image to determine a defect, or the image is processed by digital signal processing. An automatic determination method can be used. In FIG. 1, the soldering device 3 and the appearance inspection device 4 are shown separately above and below, but this is for easy understanding of the features of the present invention. That is, the appearance inspection device 4 is arranged in line with the soldering device 3, and the workpiece W is continuously conveyed from the soldering device 3 to the appearance inspection device 4.

The correction device 5 is arranged inline with respect to the appearance inspection device 4. The coordinates of the position of the poorly soldered insertion part discovered by the previous appearance inspection apparatus 4 (referred to as defect position information 7 as appropriate) are supplied to the correction apparatus 5. The correction device 5 corrects the soldering defect according to the received defect position information 7.

修正 The corrected workpiece W is conveyed to the second appearance inspection device 6 for final inspection. The appearance inspection device 6 can be the same as the appearance inspection device 4. The work carried out from the appearance inspection apparatus 6 is used for the next step. As will be described later, the work for which the final appearance inspection apparatus 6 has found a soldering defect may be repaired again and repaired, or may be discarded. In the case of repair, the defect position information obtained by the appearance inspection apparatus 6 is used. In the embodiment of the present invention, the preheater 2, the soldering device 3, the appearance inspection device 4, the correction device 5, and the appearance inspection device 6 may be configured as modules that can be separated from each other.

A configuration example of the correction device 5 will be described with reference to FIGS. 3A, 3B, and 3C. FIG. 3A shows an example in which the correction device 5 is configured by a local trace soldering device 8. The defect position information 7 obtained by the appearance inspection device 4 is supplied to the local trace soldering device 8. As described with reference to FIGS. 2A, 2 </ b> B, and 2 </ b> C, the local trace soldering apparatus 8 solders only the portion of the insertion part that is poorly soldered. The soldering operation (path and the like) of the local trace soldering device 8 is determined based on the defect position information.

FIG. 3B shows an example in which the correction device 5 is configured by a local trace soldering device 8 and a fluxer 9. The fluxer 9 is, for example, a spray fluxer, and defect position information is supplied to the fluxer 9 and flux is applied only to the defective portion.

FIG. 3C shows an example in which the correction device 5 is constituted by a local trace soldering device 8, a fluxer 9, and a preheater 10. The fluxer 9 is, for example, a spray fluxer, and defect position information is supplied to the fluxer 9 and flux is applied only to the defective portion. The workpiece W from the fluxer 9 is preheated by the preheater 10 and supplied to the local trace soldering device 8. In addition, it is good also as a module structure which can isolate | separate the local trace soldering apparatus 8, the fluxer 9, and the preheater 10, respectively.

3A, 3B, and 3C can be selected in consideration of the type of soldering failure to use as the correction device 5. However, the correction device 5 having the configuration as shown in FIG. 3C is installed, and control is performed to selectively operate / inactivate (only pass) each of the fluxer 9 and the preheater 10 according to the type of soldering failure. You may do it.

"Examples of workpieces and examples of poor soldering"
4A, 4B, 5A, and 5B show specific examples of the workpiece W. FIG. FIG. 4B shows a cross-sectional view along line AA of the workpiece W shown in FIG. 4A. In the example of the workpiece W, a portion surrounded by a line L1 is a mounting region for a surface mounting component, and a portion surrounded by a line L2 is a mounting region for an insertion component. For example, after the surface mount component is soldered by the reflow apparatus, the insert component is attached to the substrate 24 in the component insertion process. Then, the lead of the insertion part is soldered by flow soldering.

5A is an enlarged view of the cross-section of the mounting area (the portion surrounded by the line L2) of the insertion component. Furthermore, the top view of the soldering surface of the area | region is shown to FIG. 5B. The

leads

26a, 26b, and 26c of the

insertion parts

25a, 25b, and 25c are inserted into the through holes of the substrate 24, and the

leads

26a, 26b, and 26c are soldered to the substrate 24 by flow soldering. 5A and 5B are diagrams in the case where no soldering failure occurs.

FIG. 6A is a cross-sectional view showing a bridge (short) which is an example of a soldering failure and a plan view of a soldering surface. For example, when three leads 26b1, 26b2, 26b3 on one side of the insertion part 25b are inserted into the through holes of the substrate 24 and the leads 26b1, 26b2, 26b3 are soldered onto the substrate by the solder 27, the leads 26b1 and 26b2 is short-circuited by the solder 27. The short circuit is eliminated by the correction device 5 described above.

FIG. 6B is a sectional view showing non-wetting (unsoldered), which is another example of a soldering failure, and a plan view of the soldering surface. For example, the solder 27 is not sufficiently attached to the lead 26b1 of the insertion component 25b. Solder is supplied to the lead 26b1 by the correcting device 5, and non-wetting (unsoldered) is eliminated.

7A, 7B, and 7C are a cross-sectional view (FIG. 7A) showing a blow hole, which is still another example of a soldering failure, a plan view of a soldering surface (FIG. 7B), and a C-part enlarged cross-sectional view (FIG. 7C). ). For example, the solder 27 is attached to the lead 26b3 of the insertion part 25b, but a small spherical blow hole 28 is formed in a part of the soldering portion. The lead 26b3 is soldered again by the correction device 5, and the blow hole 28 is eliminated.

"Flow of correction process"
The flowchart of FIG. 8 shows an example of the flow of correction processing (correction process) according to an embodiment of the present invention. In each step, the following processing is performed.
Step ST1: A mounted work is input to the appearance inspection apparatus 4.
Step ST2: An appearance inspection is performed by the appearance inspection apparatus 4.
Step ST3: The presence or absence of soldering defects is examined.
Step ST4: If it is determined in step ST3 that there is no soldering defect, the process proceeds to the next step.

Step ST5: If it is determined in step ST3 that there is a soldering defect, the coordinates of the defective part are stored as defect position information.
Step ST6: The correction device 5 corrects the defective part using the defect position information.
Step ST7: The appearance inspection apparatus 6 determines whether or not there is a final defect. If it is determined that there is no defect, the process proceeds to the next process (step ST4). If it is determined that there is a defect, the workpiece is again input to the appearance inspection apparatus 4, and the above-described processing is repeated.

When it is determined in step ST7 that there is a defect, as shown in FIG. 9, a defective workpiece may be placed in a stocker and discarded. Furthermore, the work of FIG. 8 and the process of FIG. 9 may be combined to discard a workpiece that remains defective even if it is corrected twice or more.

<2. Embodiment>
"Configuration of imaging device and its surroundings"
The present invention is applied to the appearance inspection apparatus in the above-described flow soldering system. 10A to 10D are a plan view, a front view, and a partial cross-sectional view of the imaging apparatus according to the embodiment, FIG. 11 is a perspective view of the imaging apparatus, and FIG. 12 shows a configuration during an appearance inspection. FIG.

The imaging device 32 is an industrial camera, and an imaging device (not shown) and a lens 34 are provided in a cylinder 33. The imaging device 32 images the soldering surface of the workpiece W from the bottom upward. That is, it is determined from the imaging signal of the imaging device 32 whether or not the above-described defect such as a bridge has occurred on the soldering surface.

The imaging device 32 is mounted on the xy stage. The xy stage has, for example, a moving plate 35 in the y direction,

guide rails

36a and 36b in the y direction, a moving plate 37 in the x direction, and

guide rails

38a and 38b in the x direction. Note that a stepping motor, a position detection sensor, and the like as a drive source of the xy stage are omitted.

The imaging device 32 is mounted on the moving plate 35, and the slider on the lower surface of the moving plate 35 is guided by the

guide rails

36a and 36b.

Guide rails

36 a and 36 b are provided in parallel on the moving plate 37. The slider on the lower surface of the moving plate 37 is guided by

guide rails

38a and 38b.

Guide rails

38 a and 38 b are provided on the base plate 39 in parallel. The imaging device 32 can be displaced in the x and y directions by an xy stage. In FIG. 11, the

guide rails

38a and 38b and the base plate 39 are not shown.

An air outlet 41 for blowing air to the front surface of the lens 34 around the lens 34 of the imaging device 32 is provided. As an example, a linear air outlet 41 having a length equal to or longer than the diameter of the front surface of the lens 34 is provided on the side surface of the tube 33. An air suction port 43 that is opposed to the air blowing port 41 across the front surface of the lens 34 is provided.

As shown in FIG. 12, the airflow formed by blowing air from the air blowing port 41 passes through the front surface of the lens 34 in the x direction and is sucked by the air suction port 43. Accordingly, dust adhering to the front surface of the lens 34 is blown away by the air current. The air suction port 43 is connected to a duct (not shown), and sucked fume, dust, and the like are exhausted outside the work place through the duct.

Furthermore, another air outlet 42 is provided above the air outlet 41. The blowing direction of the air blowing port 42 is obliquely upward, and the airflow formed by blowing air from the air blowing port 42 is directed toward the soldering surface of the workpiece W. The air reflected by the soldering surface is sucked by the air suction port 43. Due to the airflow from the other air outlets 42, fumes around the work W are blown off and exhausted from the air inlet 43 to the outside. In addition, in FIG. 11, illustration of the other air blowing port 42 and the air suction port 43 is abbreviate | omitted. The flux fume from the workpiece W immediately after soldering is not only blown away by the air flow from the

air blowing ports

41 and 42, but is also collected more effectively by being sucked by the air suction port 43. .

As shown in FIG. 12, in the workpiece W, the

leads

26d, 26e, 26f of the

insertion parts

25d, 25e, 25f are inserted into the through holes of the substrate 24, and the

leads

26d, 26e, 26f are obtained by flow soldering. Is soldered to the substrate 24. The workpiece W is transported in a direction orthogonal to the drawing by the

transport conveyors

31a and 31b. The appearance inspection apparatus is configured in a box-shaped casing, and the workpiece W is introduced into the casing by the

transfer conveyors

31a and 31b, and the workpiece W is stopped at a predetermined position for inspection (referred to as an inspection position as appropriate). . The work W is clamped on both sides as necessary during inspection. At the inspection position, the imaging device 32 images the soldering surface of the workpiece W and analyzes the imaging signal to inspect the soldering quality.

The two

air outlets

41 and 42 are configured such that a large number of small outlets are linearly arranged in the y direction, and the air inlet 43 is used in common with the

air outlets

41 and 42. ing. The

air blowing ports

41 and 42 have different air blowing directions, but the air flow is substantially in the x direction. Therefore, the air from each

air outlet

41 and 42 does not interfere and weaken the momentum of the flow. Furthermore, the air from the air outlet 41 and the air from the air outlet 42 may be the same, or the temperature of the air blown out from the air outlet 42 may be made higher. The temperature of the air blown out from the air outlet 42 is increased, so that when the defective portion of the workpiece W after the appearance inspection is corrected by the correction device, it can be used as a preheater for the soldering surface of the workpiece W. Therefore, it becomes possible to correct the defective portion more reliably.

As the

air outlets

41 and 42, for example, as shown in FIG. 13, a fan-shaped nozzle 44 having an outlet (or suction inlet) 45 and an outlet 46 at the tips can be used. The nozzle 44 is made of, for example, resin or metal. Air from an air source (for example, factory air) is introduced from the base of the nozzle 44. A nozzle having the same shape as in FIG. 13 can be used as the air suction port 43. For example, air is sucked in by an ejector.

"System configuration"
A connection configuration of the inspection apparatus according to the embodiment of the present invention will be described with reference to FIG. An imaging signal obtained by the imaging device 32 is supplied to the personal computer 51 that controls the entire system via an analog or digital interface. The personal computer 51 controls the xy stage 52 to control the position of the imaging device 32 with respect to the workpiece W. For example, the work W is divided into a plurality of areas, and the quality of soldering is inspected for each area. The inspection is performed by image processing by the personal computer 51. Information on the obtained defective portion is transmitted to the correction device at the next stage by wire or wirelessly.

The personal computer 51 controls the air control unit 53, and at the time of inspection, the air control unit 53 turns on, for example, an electromagnetic valve to blow out air from the

air blowing ports

41 and 42. The air control unit 53 also has a function of controlling a suction machine, for example, an ejector, and suction is performed in parallel with air blowing. The personal computer 51 controls the work conveyance unit 54 to carry in the work W to the inspection position, fix the work W at the inspection position, and carry out the work W after completion of the inspection. An operator operates the input device 55 for the personal computer 51 to cause the inspection device to perform a desired operation. Further, an image captured by the imaging device 32, a user interface screen, and the like are displayed on the display device 56.

"Operation of inspection equipment"
With reference to the flowchart of FIG. 15, the operation of the embodiment performed under the control of the personal computer 51 will be described. Although not shown, in the initial state such as when the power is turned on, the air control unit 53 blows air against the lens front surface and the soldering surface of the workpiece, and air is sucked from the air suction port 43.
Step ST11: The workpiece W is carried into the inspection position, moved to the inspection position by the workpiece conveyance unit 54, and further the workpiece W is fixed.
Step ST12: The imaging device 32 (denoted as a camera in FIG. 15) is moved to the inspection position by the xy stage.

Step ST13: The object (the soldering surface of the workpiece W) is imaged with the imaging device 32 facing upward.
Step ST14: The captured image is transferred to the personal computer 51.
Step ST15: The image is analyzed by software processing in the personal computer 51, and the quality of soldering is inspected.
Step ST16: The information obtained in step ST15 is transferred to the subsequent correction device.
Step ST17: The workpiece W is carried out. If there is a next workpiece to be inspected, control returns to step ST11.

As can be seen from the above description, according to one embodiment of the present invention, it is possible to prevent dust from adhering to the front surface of the imaging apparatus and to blow off the adhering dust. Also, fumes drifting like smoke around the work can be blown away. Therefore, when analyzing a picked-up image of the image pickup device and inspecting a soldering defect, it is possible to prevent a normal one from being erroneously determined as a defect. Furthermore, by sucking air, it is possible to prevent accumulation of unnecessary materials such as dust and fume in the inspection apparatus.

<3. Modification>
Although the embodiments of the present invention have been specifically described above, the present invention is not limited to the above-described embodiments, and various modifications based on the technical idea of the present invention are possible. Further, the configurations, methods, processes, shapes, materials, numerical values, and the like given in the above-described embodiments are merely examples, and different configurations, methods, processes, shapes, materials, numerical values, etc. are used as necessary. May be. The configurations, methods, steps, shapes, materials, numerical values, and the like of the above-described embodiments can be combined with each other without departing from the gist of the present invention. For example, the imaging apparatus is moved by the xy stage, but the workpiece may be moved in the xy direction. Further, the imaging apparatus may be moved in one direction of the x and y directions, and the work may be moved in the other direction of the x and y directions. Furthermore, an illuminating device or a flash device may be provided in the imaging device to ensure illuminance during imaging. Furthermore, the present invention may be applied to a case where an imaging device is used for a monitor inside the flow soldering apparatus.

According to at least one embodiment, it is possible to prevent dust from adhering to the front surface of the imaging device and to blow off the adhering dust. Also, fumes drifting like smoke around the work can be blown away. Therefore, when inspecting based on the captured image of the imaging device, it is possible to prevent a normal one from being erroneously determined as defective.

W ... Work 3 ...

Soldering device

4, 6 ... Appearance inspection device 5 ...

Correction device

25, 25a, 25b, 25c ... Insertion part 32 ... Imaging device 34 ...

Lens

36a, 36b, 38a, 38b ...

guide rails

41, 42 ... air outlet 43 ... air inlet 51 ... personal computer

Claims

An image sensor;
An imaging lens;
An image pickup apparatus comprising: an air outlet that forms an air flow across the front surface of the image pickup lens.
The imaging apparatus according to claim 1, further comprising a suction port that sucks the airflow.
An image sensor;
An imaging lens;
An imaging device having an air outlet that forms an airflow across the front surface of the imaging lens;
An inspection apparatus that inspects an object using an imaging signal of the imaging apparatus.
The imaging device images the soldering surface of the workpiece to which the component is soldered,
Inspect for soldering defects from the imaging signal of the imaging device,
The inspection apparatus according to claim 3, wherein the soldering defective portion is stored.
The inspection apparatus according to claim 4, wherein the workpiece is obtained by soldering a component to the substrate by flow soldering.
The inspection apparatus according to claim 3, further comprising another air outlet that forms an air flow toward the soldering surface of the substrate.
The inspection position according to claim 3, further comprising a suction port for sucking the airflow.
The inspection apparatus according to claim 6, wherein the temperature of the airflow toward the soldering surface of the substrate is set higher than the airflow across the lens front surface.