JPH0645753A - Component mounting system, printed-wiring board and electronic component - Google Patents

Abstract

PURPOSE:To prevent generation of a defective mounting, such as the positional deviation of various electronic components and errected electronic components, and a soldering defect in a soldering mounting of the various electronic components to a printed-wiring board. CONSTITUTION:In a component mounting system constituted of a creamy solder printer 2, a bonding agent coater 3, a component mounter 4, a soldering device 5, a visual inspecting device 6 and the like, the various setting conditions of devices, which are positioned in processes prior to the process using the device 6, are automatically corrected on the basis of feedback data from the device 6. Thereby, the state of soldering and the like are maintained and controlled in the optimum state, a printed-wiring board mounted with various electronic components can correspond rapidly to a change-over of the type of the board and at the same time, the improvement of the yield of soldering and productivity and the stabilization of the quantity of the board can be achieved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board housed and mounted in electronic equipment such as a television receiver,
Various electronic parts, such as semiconductor parts such as QFP, chip parts such as resistors and capacitors, discrete parts, or component mounting systems for soldering variant components such as flyback transformers (FBT), and this component mounting system The present invention relates to a produced printed wiring board and electronic equipment such as a television receiver mounted with the printed wiring board.

[0002]

2. Description of the Related Art Conventionally, printed wiring boards for electronic devices have been
Various electronic parts, for example, semiconductor parts such as QFP (quad flat package), chip parts such as resistors and capacitors, discrete parts, or odd-shaped parts such as flyback transformers (FBT) are mounted and soldered. A screen printer such as solder, an adhesive applicator for temporarily fixing and bonding electronic components (bond applicator), a mounter for electronic components, and a soldering device for a printed wiring board on which electronic components are mounted, A component mounting system including an appearance inspection device and an in-circuit tester for checking a soldering state of a printed wiring board, and a board carrying means for carrying the printed wiring board is used.

[0003]

However, in the conventional component mounting system, various data obtained by the inspection device are fed back to various devices in the preceding process from this inspection device,
It is not configured to automatically correct the setting conditions of various devices. For example, in the relationship between a jet soldering device having a jet solder corrugated surface and a visual inspection device located in a subsequent process, the inspection result of the visual inspection device is manually fed back to determine the molten solder temperature or the jet solder corrugated surface. Height or the shape of the jet solder corrugated surface, the temperature of the flux or the height of the flux surface, or the setting conditions such as the moving speed of the printed wiring board are corrected as necessary to reduce soldering defects. . One of the reasons is that it requires experience and intuition, that is, skill, to set various conditions of the soldering device, and the correspondence varies depending on the type of printed wiring board and the type of electronic components mounted on the board. is there.
In addition, the management of the corrugated surface of the jet solder is done visually.
And it is empirically set each time. Therefore, it is difficult to always stably set the optimum jet solder corrugated surface,
It is not reproducible because it has not been quantitatively grasped. As a result, the soldered state of the printed wiring board 40 deteriorates and the soldering yield decreases.

In view of the above problems, the present invention feeds back the inspection data of the appearance inspection device to various devices in the preceding process of the appearance inspection device to make effective use of the inspection device, to surely mount the component on the printed wiring board, and to perform the production. (EN) Provided are a component mounting system capable of improving the yield, a printed wiring board manufactured by using these component mounting systems, and an electronic device mounted with the printed wiring board.

[0005]

In order to solve the above problems, the component mounting system of the present invention feeds back the inspection data of the appearance inspection device to various devices in the preceding step of the appearance inspection device, for example, a screen printing machine. Alternatively, the setting conditions of at least one of the adhesive applicator, the electronic component mounter, the soldering device, and the printed wiring board conveying means are automatically corrected.

In the appearance inspection apparatus that constitutes the component mounting system of the present invention, for example, excess or deficiency of the amount of solder in the soldering portion, the state of gloss of solder, or deviation of the component mounting position, rising or rising of the component, and component Inspection data relating to the presence / absence of continuity of the soldered portion is collected and analyzed by a means such as a personal computer.

[0007]

According to the present invention, with the above-described structure, the stable setting of components can be achieved by automatically correcting the setting conditions of various devices located in the preceding process of the appearance inspection device without substantially changing the external shape of the conventional component mounting system. Enables reproducible manufacturing condition setting. Therefore, the operator of the component mounting system does not require any skill. Furthermore, it is possible to easily and quickly respond to the change of the model of the printed wiring board, enabling the continuous operation of the component mounting system for a long time. Not only the soldering yield and the productivity of the printed wiring board are improved, but also the high heat load time for the electronic components mounted on the printed wiring board is constant, and the quality of the electronic components can be stabilized. It is possible to extend the life of electronic equipment such as a television receiver and a VTR (video tape recorder) in which the printed wiring board is housed and mounted in a cabinet.

[0008]

EXAMPLES Examples of the present invention will be described below with reference to FIGS.
Will be described with reference to the drawings. FIG. 1 is a process block diagram of a general component mounting system.
This includes the case where only the insert parts, only the surface mount parts, or both the insert parts and the surface mount parts are mixed and mounted. Therefore, in some cases, an adhesive applicator may not be used, and various soldering devices may be used. It goes without saying that, for example, a jet soldering device having a predetermined jet solder corrugated surface, a reflow soldering device, or a light beam soldering device such as a laser may be used. Further, instead of the visual inspection device, an in-circuit tester may be used, and of course, both the visual inspection device and the in-circuit tester may be line-configured.

FIG. 2 is an external perspective view of an insertion component mounting system for a discrete component such as a discrete component or an FBT in which lead wires are arranged in a radial or axial direction. In this case, as the inspection device, both the visual inspection device and the in-circuit tester are used to form a line.

FIG. 3 shows an external perspective view of a mounting system for surface mounting components such as QFPs, resistors and capacitors, and a chip checker is constructed in line as an inspection device.

In the above three types of component mounting systems,
In the appearance inspection device, in-circuit tester, and chip checker, for example, the solder amount of the soldering part is excessive or insufficient, the solder is in a glossy state, the component mounting position is deviated, the chip component is lifted or raised, and the mounted component and the board Inspected for the presence or absence of conduction with the conductor pattern arranged in
The inspection data is aggregated and analyzed by means such as a personal computer. The inspection data is various devices located in the process before the inspection process, such as a cream solder printer, an adhesive applicator, a component mounting device such as a variant component insertion device, a chip component mounting device, a soldering device, or a board transfer means. The setting conditions of various devices are automatically corrected by the feedback.

An example of correcting the setting conditions of various devices based on the feedback data of the inspection device will be described below. (1) In the case of jet soldering device Based on the above inspection result, the device setting conditions such as the molten solder temperature, the shape and height of the jet solder corrugated surface, the temperature of the flux and the height of the flux coating surface are corrected. An example of controlling the shape and height of the corrugated surface of the jet solder will be described below.

The soldering apparatus of one embodiment of the present invention shown in FIG. 4 and FIG. 5 measures / detects the height of the jet soldering apparatus 50 and the height of the jet solder corrugated surface 51 at a plurality of positions at the same time by a plurality of displacement sensors 58. Based on the detection jig 30 and the feedback data from the inspection device or the measurement signal of the displacement sensor 58, the rotation speed (or rotation angle) of each drive motor.
An automatic control device 49 for automatically controlling the displacement sensor 5 and the displacement sensor 5
Display device 4 for displaying the height measurement result of 8 on the monitor
8, a printed wiring board transfer conveyor (not shown), a printed wiring board preheating device (not shown), a control device (not shown) for each of these parts, and the like. The jet soldering device 50 includes a solder bath 20 and a solder jet nozzle 2.
1 and a function of circulating the molten solder 53 (not shown). The solder jet nozzle 21 includes a punching metal 23 that is open at the top and bottom and is located on the large diameter side below the solder jet nozzle 21 so as to be openable and closable, and the solder jet nozzle 2
A straightening vane 22 is provided on the upper small diameter opening side of No. 1 so as to be adjustable in angle around a spindle 24 as a rotation center. The punching metal 23 has a flat plate shape and has a large number of holes through which the molten solder 53 passes, and is opened and closed in a direction of an arrow R3 by a predetermined angle with a spindle 47 as a rotation center by a manual drive motor (not shown). It is configured to be possible. The molten solder 53 is configured to flow back at a predetermined flow rate from below the solder jet nozzle 21 upward by a discharge pump (not shown) configured by a propeller or the like. The rectifying plate 22 is angle-adjusted in the arrow R1 direction by following the movement of the L-shaped lever 41 that swings in the arrow R2 direction around the support shaft 43 provided in the bearing 42 as the rotation center. The L-shaped lever 41 is driven by the back-and-forth movement of the adjusting screw 45 linked to the drive motor 46. The jig 30 for detecting the waveform surface 51 of the jet solder is mounted on the conveyor frame 25 of the printed wiring board and fastened and fixed by bolts or the like, but it is very easy to remove.
As a matter of course, the mounting position of the detection jig 30 is configured so that the mounting position can be easily reproduced by a positioning pin or an L-shaped guide plate (not shown). Further detection jig 3
In No. 0, the slide base 63 is arranged on the lower surface side of the frames 61 and 62 forming the rectangle. The slide base 63 slides in a horizontal plane direction indicated by an arrow Y orthogonal to the traveling direction of the printed wiring board 40 and can be fixed at an arbitrary position.
The slide shaft 65, the slide base fixing screw 66, and the like have a predetermined configuration. On the lower surface of the slide base 63, a plurality of displacement sensors 58 arranged at predetermined intervals in the traveling direction of the printed wiring board 40 to be soldered are arranged. In the embodiment, the displacement sensors 58 are arranged at three positions above the jet solder corrugated surface 51 at a predetermined distance from the top and the end of the corrugated solder waveform surface 51 and in the middle thereof. The measurement result of the height dimension of the jet solder waveform surface of the displacement sensors 58 provided at three locations is constantly displayed on the display device 48 as a monitor, and is also printed out as the record data 60 if necessary. Further, the measurement result of the displacement sensor 58 is naturally sent to the automatic control device 49. The automatic control device 49 automatically calculates the difference between the optimum jet solder waveform calculated based on the feedback data from the appearance inspection device 6 and the measurement data of the jet solder waveform surface 51 at every predetermined time, and the optimum jet solder waveform is obtained. As the surface 51 is formed, the rotation speed of the drive motor (not shown) of the discharge pump that circulates the molten solder and the rotation angle of the L-shaped lever 41 drive motor 46 that adjusts the angle of the straightening plate 22 are automatically adjusted. Control.

Next, using the soldering apparatus having the above-mentioned structure, a printed wiring board 40 on which various electronic parts are mounted is mounted.
A method of soldering will be described. It should be noted that various desired electronic components such as flyback transformers and deformed components such as integrated circuits (ICs) with heat sinks, electronic components with lead wires such as electrolytic capacitors and metal film resistors, and the like are provided on the printed wiring board 40 in advance. Chip parts such as resistors, capacitors, and coils are mounted as needed. First, the jet solder corrugated surface 51 is set. In this case, the optimum jet solder waveform surface height data for each position of each displacement sensor 58, which is obtained in advance by preliminary experiments, corresponding to the type of the printed wiring board 40 to be soldered, is supplied to the automatic control device 49. input. Next, based on the data obtained in advance in the preliminary experiment, the drive motor (not shown) of the discharge pump that recirculates the solder is driven at a predetermined rotation speed, and the inclination angle of the straightening plate 22 is set at a predetermined value. Set to. Further, each displacement sensor 58 is operated to measure the height dimension to the jet solder corrugated surface 51, and the data is transmitted to the automatic control device 49. By this operation, as described above, the jet soldering device 5 is based on the feedback data from the automatic control device 49.
The discharge pump rotation speed of 0 and the angle of the flow straightening plate 22 are corrected as necessary. As a matter of course, if the soldering condition is good, no correction is made.

As described above, the printed wiring board 40 is sequentially conveyed by a predetermined conveyer conveyor (not shown) with the jet solder corrugated surface 11 set and managed to have an optimum waveform, so that the printed wiring board 40 has a purpose. The solder is dipped in the molten solder for a predetermined time, and stable quality soldering is performed. After that, in the process of continuing soldering of the printed wiring board, the data of the optimum jet solder waveform surface is corrected as needed based on the feedback data of the appearance inspection device.

In the soldering apparatus having the above structure, the L-shaped lever 41, the plate 44, the drive motor 46, etc. are, of course, arranged at predetermined positions that do not hinder the movement of the printed wiring board 40. Further, the drive motor 46 is connected to the support shaft 4
3 directly connected to L-shaped lever 4 without adjusting screw 45
Similarly, the angle of the rectifying plate 22 may be adjusted by using any means such as driving 1. Further, the displacement sensor means may be arbitrary, and any measuring means such as an eddy current type, a temperature type or a light emitting diode type may be used in addition to the laser type and the ultrasonic type. The detection jig 30 is
The slide base 53 is arranged in the width direction of the printed wiring board 40, that is, in the direction of the arrow Y perpendicular to the traveling direction of the printed wiring board 40.
The printed wiring board 40 at least
The height of each jet solder corrugated surface can be measured at both ends in the width direction and in the center. Each displacement sensor 58 automatically measures the solder waveform surface height measurement data by an automatic controller 49.
The automatic jet control of each drive motor is constantly repeated, and the optimum jet solder waveform surface is corrected by the feedback data of the appearance inspection device, so that the jet flow is maintained even if the amount of solder changes due to continuous use of the device or solder replenishment. The solder corrugated surface 51 can always maintain the set optimum state.

(2) In the case of screen printing machine Hereinafter, detailed description of the apparatus configuration will be omitted, and only the setting condition items to be corrected based on the feedback data of the inspection apparatus will be described. For example, squeegee printing pressure, squeegee movement speed, printing gap, plate separation speed and timing,
Number of prints to clean the screen ・ Correct the setting conditions such as the number of prints to automatically replace the screen.

(3) In the case of an adhesive applicator (bond applicator) For example: ・ Adhesive application position ・ Adhesive discharge amount ・ Temperature of cartridge filled with adhesive (4) Electronic component mounting machine eg ・ Component pressing force・ Component suction force ・ Component suction position ・ Component suction head (5) Reflow soldering device For example ・ Temperature of residual heat portion ・ Temperature of reflow portion ・ Oxygen or nitrogen concentration ・ Moving speed of printed wiring board (6) Light beam soldering device For example: -Beam output-Beam spot diameter-Beam spot irradiation time As described above, the component mounting system of the present invention is located in the front process of the appearance inspection apparatus with the above-described configuration without substantially changing the external shape of the conventional component mounting system. It automatically corrects the setting conditions of various devices and enables stable component mounting and reproducible manufacturing condition setting.

[0019]

As described above, since the component mounting system of the present invention feeds back the inspection result of the inspection device to correct the setting conditions of various devices, the operator of the component mounting system does not require any skill. In addition, it is possible to easily and promptly change the model of the printed wiring board, enabling continuous long-time operation of the component mounting system. Furthermore, not only the soldering yield and the productivity of the printed wiring board are improved, but also the high heat load time for the electronic parts mounted on the printed wiring board is constant, and the quality of the electronic parts can be stabilized. It is possible to prolong the service life of electronic equipment such as a television receiver and a VTR (video tape recorder) in which the is stored and mounted in a cabinet. Furthermore, since the models of the printed wiring boards can be easily switched, many effects can be obtained, such as being able to support high-mix low-volume production.

[Brief description of drawings]

FIG. 1 is a process block diagram of a component mounting system according to an embodiment of the present invention.

FIG. 2 is an external perspective view of a variant component mounting system such as a discrete component or an FBT according to another embodiment of the present invention.

FIG. 3 is an external perspective view of a mounting system for surface mounting components according to another embodiment of the present invention.

FIG. 4 is a perspective view of a main part of a soldering device used in an embodiment of the present invention.

5 is a cross-sectional view of a main part from the side surface of FIG. 4 viewed from the direction of cutting lines S1 to S1.

6 is a perspective view of a displacement sensor, a display device, and an automatic control device which constitute the soldering device of FIG.

[Explanation of symbols]

 1 Printed Wiring Board Loader 2 Cream Solder Printing Machine 3 Adhesive Applying Machine 4 Component Mounting Machine 5 Soldering Device 6 Appearance Inspection Device 7 Printed Wiring Board Unloader 8-13 Board Transfer Device 20 Solder Tank 21 Solder Jet Nozzle 22 Rectifying Plate 23 Punching Metal 25 Conveyor frame 30 Detection jig 40 Printed wiring board 41 L-shaped lever 42 Bearing 43 Spindle 44 Plate 45 Adjusting screw 46 Drive motor 47 Spindle 48 Display device 49 Automatic control device 50 Jet soldering device 51 Jet solder waveform surface 52 Jet solder waveform section 53 Solder 58 Displacement sensor 60 Recorded data 61, 62 Frame 63 Slide base 64 Bearing 65 Slide shaft 66 Slide base fixing screw 67 Strut

Claims (14)

[Claims] 1. A printed wiring board soldering device having an electronic component mounted thereon, an inspection device for checking a soldering state of the printed wiring board, and a printed wiring board carrying means for carrying the printed wiring board. , The inspection data of the inspection device is fed back, and the solder temperature of the soldering device or the height of the jet solder corrugated surface or the shape of the jet solder corrugated surface, the temperature of the flux or the height of the flux surface, or the printed wiring board A component mounting system characterized in that at least one set condition of the moving speed is automatically corrected. 2. A screen printing machine, an electronic component mounting machine, a printed wiring board soldering device on which electronic components are mounted, an inspection device for checking the soldering state of the printed wiring board, and the print. A printed wiring board carrying means for carrying a wiring board, which feeds back the inspection data of the inspecting device, and outputs the squeegee printing pressure or squeegee moving speed of the screen printing machine, the printing gap, or the plate separation speed and timing, or the A component mounting system characterized in that at least one of the number of times of printing for which automatic replacement is performed or the number of times of cleaning of a screen is automatically corrected. 3. A screen printing machine, an adhesive coating machine,
Electronic component mounter, printed wiring board soldering device on which electronic components are mounted, inspection device for checking soldering state of the printed wiring board, and printed wiring board transfer means for transferring the printed wiring board Consists of
The inspection data of the inspection device is fed back to automatically correct at least one setting condition of the adhesive application position of the adhesive application machine, the discharge amount, or the temperature of the cartridge filled with the adhesive. Characteristic component mounting system. 4. A screen printing machine, an adhesive coating machine,
Electronic component mounter, printed wiring board soldering device on which electronic components are mounted, inspection device for checking soldering state of the printed wiring board, and printed wiring board transfer means for transferring the printed wiring board Consists of
The inspection data of the appearance inspection device is fed back to automatically correct at least one setting condition of the component pressing force of the mounter of the electronic component, the component suction force or the component suction position, or the type of the component suction head. A component mounting system characterized by the above. 5. A reflow soldering device for a printed wiring board on which electronic parts are mounted, an inspection device for checking a soldering state of the printed wiring board, and a printed wiring board carrying means for carrying the printed wiring board. Then, the inspection data of the inspection device is fed back to automatically correct at least one setting condition of the temperature of the preheating part of the reflow soldering device, the temperature of the reflow part, the oxygen concentration, or the moving speed of the printed wiring board. The component mounting system characterized in that 6. A light beam soldering device for a printed wiring board on which electronic parts are mounted, an appearance inspection device for checking a soldering state of the printed wiring board, and a printed wiring board transfer for transferring the printed wiring board. Means for feeding back the inspection data of the appearance inspection device, and automatically correcting at least one of the setting conditions of the beam output or the beam spot diameter or the beam spot irradiation time of the light beam soldering device. Characteristic component mounting system. 7. A screen printing machine, an adhesive coating machine,
Electronic component mounter, printed wiring board soldering device on which electronic components are mounted, inspection device for checking soldering state of the printed wiring board, and printed wiring board transfer means for transferring the printed wiring board Consists of
The inspection data of the inspection device is fed back to automatically correct the device setting condition of at least one of the screen printer, the adhesive applicator, the electronic component mounter, the soldering device, or the printed wiring board transfer device. A component mounting system characterized in that 8. The component mounting system according to claim 1, wherein the inspection device is either an appearance inspection device or an in-circuit tester or both of them. . 9. A printed wiring board on which an electronic component is mounted by using the component mounting system according to claim 1, 2, 3, 4, 5, 6, 7 or 8. 10. An electronic device on which the printed wiring board according to claim 9 is mounted. 11. A displacement sensor mounting portion disposed at a predetermined interval above a top portion of a jet solder corrugated surface formed by the jet soldering device, and a transfer of a printed wiring board to be soldered by the jet soldering device. Direction, and a plurality of displacement sensors attached to the mounting portion at predetermined intervals at least at two upper positions including the top portion of the jet solder corrugated surface, and the height of the jet solder corrugated surface is increased by the plurality of displacement sensors. 8. A component according to claim 1, 2, 3, 4 or 7, wherein the soldering device is provided with a jig for detecting the height of the corrugated surface of the jet solder for measuring the height at a plurality of points. Mounting system. 12. A displacement sensor mounting portion disposed horizontally above a top of a corrugated surface of the jet solder formed by the jet soldering device so as to be movable in a horizontal direction, and soldered by the jet soldering device. A plurality of displacement sensors attached to the mounting portion at predetermined intervals in the transfer direction of the printed wiring board and above at least two locations including the apex of the jet solder corrugated surface. Structure using a soldering device equipped with a jet solder corrugated surface height detection jig capable of measuring the height of the jet solder corrugated surface at a plurality of points and changing the height solder corrugated surface height measurement point The component mounting system according to claim 1, 2, 3, 4, or 7. 13. A printed wiring board carrying means, a jet soldering device, and a displacement sensor mounting portion arranged at a predetermined interval above the top of a jet solder corrugated surface formed by the jet soldering device. A plurality of displacement sensors attached to the mounting portion at predetermined intervals in the transfer direction of the printed wiring board to be soldered by the jet soldering device and at least at two upper positions including the top of the corrugated surface of the jet solder. The component mounting system according to claim 1, 2, 3, 4, or 7, further comprising a soldering device comprising 14. A printed wiring board carrying means, a jet soldering device, and a displacement sensor mounting portion arranged at a predetermined interval above the top of a jet solder corrugated surface formed by the jet soldering device. A plurality of displacement sensors attached to the mounting portion at predetermined intervals in the transfer direction of the printed wiring board to be soldered by the jet soldering device and at least at two upper positions including the top of the corrugated surface of the jet solder. The component mounting system according to claim 1, 2, 3, 4, or 7, further comprising: a soldering device including a display device for displaying height measurement data of a jet solder waveform surface on a monitor.