JP2020043159A - Mounting system, and production management apparatus - Google Patents

Abstract

To produce a circuit board stably by performing feedback on the basis of a factor in a reflow furnace.SOLUTION: A mounting system 100 comprises a mounting line including a mounting device 30 producing a mounting board for mounting multiple components on solder adhering to the surface of a substrate, a mounting board inspection device 40 for inspecting the state of the components on the mounting board, a reflow furnace 60 heating the mounting board for fastening the components on the mounting board to the substrate and producing a circuit board, and a circuit board inspection device 70 for inspecting the state of the components on the circuit board to which the components are fastened by cooling, and a production management device 80 including a value change part 83 for changing parameters related to fastening of the components to the substrate, when there is no abnormal deviation of the components in the inspection results from the mounting board inspection device 40, but there is abnormal deviation of the components in the inspection results from the circuit board inspection device 70.SELECTED DRAWING: Figure 2

Description

  The present disclosure relates to a mounting system including a mounting line for producing a circuit board in which components are fixed to a board by soldering, and a production management device that manages the mounting line.

  2. Description of the Related Art Conventionally, a mounting board is produced by mounting a component such as an electronic component on a board coated with solder by a mounting apparatus. A circuit board is produced by heating the mounted board in a reflow furnace arranged in-line with respect to the mounting apparatus until the solder is melted, and then cooling and solidifying the solder to fix components to the board. Although the terms “mounting board” and “circuit board” are not generally clear, in this specification and in the claims, the term “mounting board” means that components are mounted on a board and solder is solidified. No circuit board is used as the one in which the solder is solidified and the components are fixed to the board. When a large number of circuit boards are produced in the industrial production process as described above, each time a mounting board is produced, the mounting state of components is inspected to detect a defect. When a failure occurs, stable production is enabled by feeding back to the next mounting condition of the mounting board (for example, see Patent Document 1).

JP 2008-199070 A

  The technique described in Patent Document 1 changes the parameters of the mounting apparatus when there is a defect in the inspection before reflow, and changes the parameters of the reflow furnace when there is a defect in the inspection after reflow. However, since the internal factors of the reflow furnace are not specifically detected and the parameters are not changed based on the specific factors, the parameters related to the fixing of the parts are changed based on the internal factors of the reflow furnace, and the failure is appropriately determined. It was difficult to fix.

  Thus, the present disclosure provides a mounting system and a production management device that can execute feedback based on factors inside a reflow furnace and appropriately change parameters.

  A mounting system according to an embodiment of the present disclosure inspects a mounting apparatus that manufactures a mounting board for mounting a plurality of components on solder attached to a surface of a board, and a state of the component on the manufactured mounting board. A mounting board inspection apparatus, a reflow furnace that heats the mounting board in order to produce a circuit board by fixing the component on the mounting board to the board, and the component is cooled by heating after the reflow furnace. A mounting line including a circuit board inspection device for inspecting a state of the component on the circuit board fixed to the substrate; and an inspection result of the mounting board inspection device without any abnormal displacement of the component, and the circuit board inspection. A production management device including a value changing unit configured to change a parameter related to fixation of the component to the substrate when an inspection result of the device includes an abnormal displacement of the component.

  Further, a production management device according to an aspect of the present disclosure includes a mounting device that manufactures a mounting board for mounting a plurality of components on solder attached to a surface of the board, and a state of the component on the mounting board that has been produced. A mounting board inspection apparatus for inspecting the mounting board, a reflow furnace for heating the mounting board to produce a circuit board by fixing the components on the mounting board to the board, and cooling after heating in the reflow furnace. And a circuit board inspection device for inspecting a state of the component on the circuit board in which the component is fixed to the substrate. When there is no abnormal displacement of the component, and when there is an abnormal displacement of the component in the inspection result by the circuit board inspection device, a parameter related to the fixation of the component to the substrate It comprises a value changing section for changing.

  Note that these comprehensive or specific aspects may be realized by a method, an integrated circuit, a computer program or a recording medium such as a computer-readable CD-ROM, and the method, the integrated circuit, the computer program, and the recording medium. Any combination may be implemented.

  The mounting system and the production management device according to the present disclosure can stably produce a circuit board by changing a parameter related to attachment of components to a board based on factors inside a reflow furnace.

FIG. 1 is a diagram illustrating a mounting system according to an embodiment. FIG. 2 is a block diagram illustrating a mounting system according to the embodiment. FIG. 3 is a flowchart showing the flow of the operation of the mounting system. FIG. 4 is a flowchart illustrating a flow of an operation of changing a parameter of the production management device.

  In order to solve the above-described problem, a mounting system according to an embodiment of the present disclosure includes a mounting apparatus that manufactures a mounting board that mounts a plurality of components on solder attached to a surface of a board, and a mounting apparatus that manufactures the mounting board. A mounting board inspection apparatus for inspecting a state of the component, a reflow furnace for heating the mounting board to fix the component on the mounting board to the board, and produce a circuit board, and heating in the reflow furnace. A mounting line including a circuit board inspection device for inspecting a state of the component of the circuit board in which the component adheres to the substrate by later cooling, and an abnormal deviation of the component in an inspection result by the mounting board inspection device. And a value change unit for changing a parameter related to the fixation of the component to the board when the inspection result of the circuit board inspection apparatus includes an abnormal displacement of the component. And a that production control apparatus.

  Further, a production management device according to an embodiment of the present disclosure includes a mounting device that manufactures a mounting board on which a plurality of components are mounted on solder attached to a surface of the board, and a state of the component on the mounting board that is produced. A mounting board inspection apparatus for inspecting the mounting board, a reflow furnace for heating the mounting board to produce a circuit board by fixing the components on the mounting board to the board, and cooling after heating in the reflow furnace. And a circuit board inspection device for inspecting a state of the component on the circuit board in which the component is fixed to the substrate. When there is no abnormal displacement of the component, and when there is an abnormal displacement of the component in the inspection result by the circuit board inspection device, a parameter related to the fixation of the component to the substrate It comprises a value changing section for changing.

  According to the mounting system and the production management device, a defect that occurs when a substrate having no problem in the inspection before reflow has passed through the reflow furnace is determined as a person in the reflow furnace, and a parameter relating to adhesion is determined based on this. Can be changed. This makes it possible to stably produce the circuit board.

  Further, the parameter may include a mounting condition of the mounting apparatus for a component corresponding to the component for which an abnormal displacement in which the position of the component is shifted beyond an allowable range by the circuit board inspection device is detected. In particular, the parameter may include at least a component pushing amount of the mounting conditions.

  Further, the parameter may include a heating condition of the reflow furnace. Here, the heating condition includes the air volume in the reflow furnace.

  According to these, by applying feedback to at least one of the mounting apparatus and the reflow furnace based on the factors inside the reflow furnace, it becomes possible to more appropriately resolve the problem and stably produce the circuit board. .

  Hereinafter, a mounting system according to an embodiment will be described with reference to the drawings. Each of the embodiments described below shows a specific example of the present disclosure. Numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples and do not limit the present disclosure. In addition, among the components in the following embodiments, components not described in the independent claims indicating the highest concept are described as arbitrary components.

  Each drawing is a schematic diagram, and is not necessarily strictly illustrated. In addition, overlapping description may be omitted or simplified.

  First, the configuration of the mounting system 100 according to the present embodiment will be described. FIG. 1 is a diagram showing a mounting system 100 according to the embodiment. As shown in the figure, the mounting system 100 prints solder according to the wiring pattern on the surface of the board, mounts components on the board on which the solder is printed, produces a mounting board, and heats the produced board. This is a production line for fixing the board and the component by melting the solder. The mounting system 100 also includes an inspection device for inspecting the state of a product in each process and a production management device.

  Mounting here means mounting components on the solder printed on the board. Further, the mounting board means a state where components are mounted on the board and not fixed by soldering. Further, the circuit board means a product obtained by fixing a component to a board by heating a mounting board to melt the solder and then cooling and curing the solder. The board referred to here is a printed board on which a wiring pattern is formed. Components are a general term for objects mounted on a substrate, such as electronic components, plugs, and terminals.

  FIG. 2 is a block diagram illustrating a mounting system according to the embodiment. As shown in FIG. 1, the mounting system 100 includes a solder printing apparatus 10, a print inspection apparatus 20, a mounting apparatus 30, a mounting board inspection apparatus 40, a reflow furnace 60, and a circuit board inspection apparatus 70 as mounting lines. Are provided in-line in the order of the description. The mounting system 100 includes a production management device 80.

  The solder printing apparatus 10 is an apparatus that prints paste-like cream solder on electrodes formed on a substrate via a mask. In addition, the solder printing apparatus 10 prints cream solder on the substrate, but is not limited to this method, and may print solder on the substrate using another known method. The solder printing apparatus 10 includes a print operation unit 11, a print control unit 12, a notification unit 14, a storage unit 15, and a communication unit 16.

  The printing work unit 11 contacts a mask having an opening corresponding to the cream solder pattern with the substrate, supplies the cream solder on the mask, and then slides a squeegee on the mask to form a pattern of the cream solder on the substrate. This is a device for performing so-called screen printing for transferring the image.

  The print control unit 12 controls the print operation unit 11 that performs operations of holding the substrate and the mask and sliding the squeegee based on parameters for printing cream solder. The print control unit 12 can also control the printing speed of the cream solder on the substrate. The print control unit 12 transmits parameters for printing cream solder to the production management device 80 via the communication unit 16. The print control unit 12 feeds parameters for printing cream solder to the print inspection device 20 via the communication unit 16.

  The reporting unit 14 reports the occurrence of an abnormality in the solder printing apparatus 10 and the like. The notification here means not only notification to the surroundings by sound, light, video, and the like, but also notification of such information to another device or a portable terminal carried by an operator.

  The notification unit 14 outputs information indicating such notification to the print inspection device 20, the mounting device 30, the mounting substrate inspection device 40, the reflow furnace 60, the circuit substrate inspection device 70, the production management device 80, and the like. You may. Thereby, the mounting system 100 may stop the operation.

  The storage unit 15 stores solder information, parameters for printing cream solder, and the like. The parameters may be newly updated by feedback from the print inspection device 20 or the like.

  The communication unit 16 is a communication module that receives a parameter or the like for printing cream solder and sends status information indicating the status of the solder printing device 10 to the production management device 80.

  The print inspection device 20 is a device that inspects the appearance state of the solder printed on the substrate. The print inspection device 20 includes a print inspection work unit 21, a print inspection control unit 22, a notification unit 24, a storage unit 25, and a communication unit 26.

  The print inspection working unit 21 recognizes the solder printed on the board by processing at least one of the two-dimensional image and the three-dimensional image obtained through the imaging by the inspection camera.

  The print inspection control unit 22 causes the print inspection work unit 21 to inspect the appearance state of the solder printed on the board based on the parameters, and analyzes the appearance state of the solder printed on the board. Specifically, the print inspection control unit 22 determines, for the solder printed on the board, the amount of solder displacement and the area of the solder when viewed from above the board, the solder volume, the solder height, the solder shape, and the like. The analysis is performed to determine whether or not there is a bridge defect connecting the two electrodes, an unfilled defect, a defective solder, a defective solder, a defective solder bleed, a defective foreign matter, or the like.

  The print inspection control unit 22 feeds back the data indicating the inspection result of the solder printed on the analyzed board to the solder printing apparatus 10 via the communication unit 26, feeds the data to the mounting apparatus 30, and feeds the data to the production management apparatus. Send to 80.

  The print inspection control unit 22 creates correction information based on the abnormality when there is an abnormality in the inspection result of the solder and feeds it back to the solder printing device 10 in order to solve the problem of the parameter of the solder printing device 10. For example, based on the parameters of the solder printing apparatus 10, the print inspection control unit 22 creates correction information from the solder printing variation and sends it back to the solder printing apparatus 10 when the solder printing variation is within a predetermined range. . Thereby, the solder printing apparatus 10 rewrites the parameters of the solder printing apparatus 10 based on the correction information. The solder printing apparatus 10 can specify the location of the failure before the failure such that the mounting board becomes a defective product and appropriately perform the feedback control, thereby improving the yield of the component mounting system.

  The print inspection control unit 22 communicates with the solder printing apparatus 10, the print inspection apparatus 20, the mounting apparatus 30, the mounting board inspection apparatus 40, the reflow furnace 60, and the circuit board inspection apparatus 70 when there is an appearance defect of the solder. The work prohibition command may be transmitted via the unit 26. Thereby, the mounting system 100 may stop the operation.

  The notifying unit 24 notifies information indicating that there is a printing failure based on a solder inspection result or the like. Since the notification unit 24 has the same configuration as the notification unit 24 of the solder printing apparatus 10, the description of the same components will be omitted.

  The storage unit 25 stores parameters for inspecting the solder printed on the board. In addition, the storage unit 25 stores data indicating the inspection result of the solder printed on the board, correction information based on the data, and the like.

  The communication unit 26 communicates parameters for inspecting the solder printed on the board, data indicating an inspection result of the solder printed on the board, and the like to the production management apparatus 80 with the production management apparatus 80. It is a communication module.

  The mounting device 30 is a device for mounting components on solder printed on a substrate. Although the mounting device 30 is not particularly limited, in the case of the present embodiment, the mounting device 30 includes a mounting work unit 31, a mounting control unit 32, a notification unit 34, a storage unit 35, and a communication unit 36.

  The mounting work unit 31 sucks and holds the component supplied to the component supply unit by a suction nozzle provided on the head, the head conveys the component to a mounting position of the board, lowers the suction nozzle, and moves the component on the board. The process of mounting by pressing against solder is repeated by the number of components.

  The mounting control unit 32 controls the suction nozzle based on parameters for mounting components. Specifically, the mounting control unit 32 transfers the head including the suction nozzle to the component supply unit to which each component is supplied, suctions the component to the suction nozzle, and transfers the head to the mounting position of the board. Is pressed against the solder and mounted.

  The component supply unit referred to here is, for example, a portion in which a plurality of tape feeders and the like are detachably provided, and various components are supplied by the tape feeders and the like. The tape feeder is a device that sequentially supplies components held in a tape shape to a component supply unit.

  The mounting control unit 32 receives parameters for mounting components on the board from the production management device 80 via the communication unit 36. Further, it receives the feedback correction value from the production management device 80. Further, the mounting control unit 32 feeds forward parameters for mounting components to the board to the mounting board inspection device 40 via the communication unit 36.

  The notification unit 34 notifies information indicating that the number of components to be supplied has become equal to or less than a predetermined number. The worker replenishes components to be mounted based on the content notified by the notification unit 34. In addition, based on each inspection result by the print inspection device 20, the mounting board inspection device 40, and the circuit board inspection device 70, the notification unit 34 notifies information about the abnormality when any one of the inspection results has an abnormality. . Since the notification unit 34 has the same configuration as the notification unit 34 of the solder printing apparatus 10, the description of the same components will be omitted.

  The storage unit 35 stores component information described later, parameters for mounting the component on the board, and the like.

  The communication unit 36 is a communication module that transmits, to the production management device 80, parameters for mounting components on the board, and receives correction values and the like from the production management device 80 and the like.

  The mounting board inspection apparatus 40 is an apparatus for inspecting the appearance state of components mounted on a board. Although the inspection method of the mounting board inspection apparatus 40 is not particularly limited, in the case of the present embodiment, an AOI (Automated Optical Inspection) is employed. Although the mounting board inspection device 40 is not particularly limited, in the case of the present embodiment, the appearance inspection work unit 41, the appearance inspection control unit 42, the notification unit 44, the storage unit 45, the communication unit 46 And

  The visual inspection working unit 41 recognizes a component mounted on the board by processing at least one of a two-dimensional image and a three-dimensional image obtained through an image captured by a camera based on visible light. .

  The appearance inspection control unit 42 causes the appearance inspection work unit to inspect the appearance state of the component mounted on the board based on the parameters, and analyzes the appearance state of the component mounted on the board. Specifically, the appearance inspection control unit 42 analyzes a positional shift amount of the component when the component is mounted on the substrate when viewed from above the substrate, or connects the two electrodes to the reverse of the component. Analyze the presence or absence of bridge failure, foreign matter attachment, erroneous mounting of components, duplicate mounting of components, deformation of component leads, and the like. In addition, a missing part of a part, a rise of the part, and the like are included in an abnormal displacement of the part. For example, when the difference exceeds a predetermined shift threshold value, it is included in the abnormal shift as a missing part of the component.

  The mounting board inspection device 40 feeds back the data indicating the analysis result of the component mounted on the board to the mounting device 30 via the communication unit 46. Further, the mounting board inspection device 40 transmits data indicating an inspection result of the component mounted on the board to the production management device 80.

  The appearance inspection control unit 42 creates correction information based on the abnormality when the inspection result of the appearance inspection has an abnormality, and feeds it back to the mounting apparatus 30 in order to eliminate the defect of the parameter of the mounting apparatus 30. For example, based on the parameters of the mounting apparatus 30, the appearance inspection control unit 42 creates correction information based on the variation in the arrangement of the components when the variation in the arrangement of the components is an abnormal deviation that is outside a predetermined range. Feedback to Thereby, the mounting device 30 rewrites the parameters of the mounting device 30 based on the correction information. The mounting apparatus 30 can specify the location of the failure and appropriately perform the feedback control before the failure such that the board becomes a defective product, thereby improving the yield of the component mounting system.

  The appearance inspection control unit 42 communicates with the solder printing apparatus 10, the print inspection apparatus 20, the mounting apparatus 30, the mounting board inspection apparatus 40, the reflow furnace 60, and the circuit board inspection apparatus 70 when the parts have a defective appearance. Information may be transmitted via the unit 46. Thereby, the mounting system 100 may stop the operation.

  The notifying unit 44 notifies information indicating that there is a failure based on the inspection result of the parts and the like. Since the notification unit 44 has the same configuration as the notification unit 44 of the solder printing apparatus 10, description of the same components will be omitted.

  The storage unit 45 stores parameters for inspecting components mounted on the board. Further, the storage unit 45 stores data indicating inspection results of components mounted on the board, correction information based on the data, and the like.

  The communication unit 46 is a communication module that transmits, to the production management device 80, data indicating the analysis result of the components mounted on the board.

  The reflow furnace 60 heats the loaded mounting board, melts the solder printed on the board, and joins the component and the wiring pattern of the board by soldering. The reflow furnace 60 includes a heating operation unit 61, a heating control unit 62, a notification unit 64, a storage unit 65, and a communication unit 66.

  The heating section 61 heats the mounting board by exposing it to hot air, infrared rays, or the like, thereby melting the solder printed on the surface of the board. In the case of the present embodiment, the heating operation unit 61 includes a plurality of fans, and each fan can flow hot air in a predetermined direction at a predetermined air volume.

  The heating control unit 62 controls the heating operation unit 61 based on the parameters so that when the mounting board is heated, appropriate temperature management for melting the solder can be performed. Specifically, for example, the heating operation unit 61 is controlled by setting parameters such as a set temperature of each of a plurality of heaters disposed in the furnace and a rotation speed of each of a plurality of fans. The heating control unit 62 transmits data related to heating to the production management device 80 via the communication unit 66. The heating control unit 62 receives a parameter fed back from the production management device 80 via the communication unit 66.

  The notification unit 64 notifies information indicating that the heating operation unit 61 has a problem. Since the notification unit 64 has the same configuration as the notification unit 64 of the solder printing apparatus 10, description of the same components will be omitted.

  The storage unit 65 stores parameters for heating the mounting board, which are received via the communication unit 66, and the like.

  The communication unit 66 is a communication module that transmits and receives parameters related to heating and the like to and from the production management device 80.

  The circuit board inspection device 70 inspects the state of adhesion between the component and the board by soldering. Although the inspection method of the circuit board inspection apparatus 70 is not particularly limited, in the case of the present embodiment, the result of the appearance inspection of the circuit board by the AOI and the transmission inspection of the circuit board obtained by transmitting the X-ray through the circuit board are performed. Obtain the sticking inspection result including the result. For example, the circuit board inspection device 70 inspects the appearance with visible light, and also inspects for a defect in the solder portion that cannot be obtained by the appearance inspection. As the X-ray image, an X-ray transmission image or a CT (Computed Tomography) image may be used. Note that the circuit board inspection apparatus 70 may employ an inspection method of inspecting a defective defect in a bonding state between the component and the substrate by ultrasonic waves. For example, a method called AXI (Automatic X-Ray Inspection) is used.

  The circuit board inspection device 70 includes an adhesion inspection work unit 71, an adhesion inspection control unit 72, a notification unit 74, a storage unit 75, and a communication unit 76.

  The fixing inspection section 71 processes an X-ray image obtained by irradiating a circuit board, which is a product in which the component and the board are fixed with solder, with X-rays, and inspects the fixing state of the solder between the component and the board. In addition, the displacement of the part including the missing part is inspected by processing an image based on visible light.

  The adhesion inspection control unit 72 causes the adhesion inspection work unit 71 to inspect the state of the solder. Also, the state of the component fixed to the substrate is analyzed. Specifically, the adhesion inspection control unit 72 analyzes the amount of solder in the solder between the component and the board, and analyzes the presence or absence of void defects, non-wetting defects, and the like. Furthermore, it analyzes the amount of component misalignment when viewed from the top of the board, faults inversion of components, bridge defects connecting two electrodes, adhesion of foreign matter, incorrect mounting of components, duplicate mounting of components, Or the presence or absence of lead deformation.

  The adhesion inspection control unit 72 produces, via the communication unit 76, data indicating the inspection result of the bonding state of the solder that has joined the board and the component and the result of the appearance inspection including the positional deviation via the communication unit 76. It is transmitted to the management device 80.

  The notification unit 74 notifies information indicating the inspection result of the product. Since the notification unit 74 has the same configuration as the notification unit 14 of the solder printing apparatus 10, description of the same components will be omitted.

  The storage unit 75 stores parameters for inspecting a product. In addition, the storage unit 75 stores data indicating the inspection result of the solder bonding state, correction information based on the data, and the like.

  The communication unit 76 is a communication module that transmits and receives data and the like indicating the inspection result of the solder bonding state to and from the production management device 80.

  The production management device 80 exchanges information regarding the production of the mounting board, the inspection of the mounting board, the production of the circuit board, the inspection of the circuit board, etc. with the mounting line, and controls the mounting line in an integrated manner. This is an apparatus that performs smooth production, and includes an information acquisition unit 81, a determination unit 82, a value change unit 83, a storage unit 85, and a communication unit 86.

  The information acquisition unit 81 includes mounting board information indicating an inspection result regarding displacement of components on the mounting board by the mounting board inspection device 40, and circuit board information indicating an inspection result regarding displacement of components on the circuit board using the circuit board inspection device 70. To get. The information acquiring unit 81 further acquires board information for identifying the board from a barcode or the like attached to the board, and records the board information in the storage unit 85 in association with the corresponding mounting board information and circuit board information.

  When the information indicating the component displacement included in the mounting board information is included in the normal range, the determination unit 82 determines that there is no abnormal displacement and performs the normality determination. Further, the same board is identified based on the board information, and it is determined whether the information indicating the component displacement included in the circuit board information on the same board is normal or abnormal. Specifically, for example, a component mounted on the solder printed on the board is drawn to the land side of the board by self-alignment during reflow. For this reason, the position of the component after the reflow may change with respect to the position of the component before the reflow, that is, the data acquired from the mounting board inspection apparatus 40. Therefore, even if the position of the component after the reflow is shifted from the position of the component before the reflow, the sticking inspection control unit 72 does not determine that the product is defective if the position is within a predetermined range. On the other hand, the determination unit 82 performs an abnormality determination when the position of the component is out of the predetermined range and is abnormal. Then, when the component displacement based on the mounting board information is determined to be normal and the component displacement based on the circuit board information is determined to be abnormal, the value change unit 83 is notified to that effect. Furthermore, when it is determined that the component displacement based on the circuit board information is abnormal, it is determined whether a plurality of components are displaced in the same direction within one circuit board, or whether only a specific component is displaced. The defect information may be notified to the value changing unit 83.

  The value changing unit 83 receives a notification from the determination unit 82 that there is no abnormal displacement in the component position based on the mounting board information and that there is an abnormal displacement in the component position based on the circuit board information. The parameters relating to the attachment of the component to the subsequent substrate are changed for the mounting line. Specifically, for example, the parameter changed by the value changing unit 83 includes a correction value of the position of a component corresponding to a component for which an abnormal displacement has been detected by the circuit board inspection device, for example, the position of the same type of component having the same position with respect to the substrate. The parameters are changed by transmitting the mounting conditions to the mounting apparatus 30. In particular, when the value changing unit 83 determines that the same type of component is misaligned, the mounting apparatus 30 increases the component pushing amount of the mounting conditions as a parameter to be changed, as compared with the previous one. Send to Further, when the value changing unit 83 determines that the components included in a certain area in the substrate are misaligned in the same direction, the airflow of the reflow furnace 60 is reduced as a parameter to be changed, as a parameter to be changed. It is transmitted to the reflow furnace 60.

  The storage unit 85 stores board information, component information, solder information, mounting board information, circuit board information, and the like acquired by the information acquiring unit 81 from the mounting line.

  The communication unit 86 is a communication module that transmits and receives information to and from the solder printing apparatus 10, the print inspection apparatus 20, the mounting apparatus 30, the mounting board inspection apparatus 40, the reflow furnace 60, and the circuit board inspection apparatus 70.

  Next, an operation of the mounting system 100 according to the present embodiment will be described. FIG. 3 is a flowchart showing the flow of the operation of the mounting system. As shown in the figure, first, the solder printing apparatus 10 prints solder on a board (n) which is an n-th (n is a natural number) board carried in on a mounting line (S101), and the solder is printed. Create a substrate. This substrate is transported to the print inspection device 20 by a conveyor.

  Next, the print inspection device 20 inspects the appearance state of the solder printed on the board (S102). The print inspection device 20 transmits data indicating the inspection result of the inspection of the appearance of the solder to the production management device 80 for feedback to the solder printing device 10. The board (n) in which no abnormality is detected by inspecting the appearance of the solder is conveyed to the mounting apparatus 30 by a conveyor.

  Next, the mounting apparatus 30 mounts the component on the solder printed on the substrate (n) using a suction nozzle or the like (S103). Here, the mounting conditions for the board (n) may be such that the parameters are changed based on the board (n-1) and the circuit board information of the circuit board produced before passing through the reflow furnace 60. is there. The mounting apparatus 30 transmits data on components mounted on the board (n) to the mounting board inspection apparatus 40 and the production management apparatus 80. The mounting board is transported to the mounting board inspection device 40 by a conveyor.

  Next, the mounting board inspection device 40 inspects the appearance state of the component mounted on the board (S104). The mounting board inspection device 40 transmits data indicating the inspection result of the component mounted on the board to the production management device 80 in order to feed back the data to the mounting device 30. In addition, it analyzes the abnormal displacement of the component, the inversion of the component upside down, the bridging defect connecting the two electrodes, the adhesion of foreign matter, the incorrect mounting of the component, the duplicate mounting of the component, the deformation of the component lead, and the like. If there is, the operator is notified (S106). The board (n) for which it is determined that there is no abnormality in the mounting board inspection apparatus 40 is conveyed to the reflow furnace 60 by a conveyor.

  Next, the reflow furnace 60 heats the board (n) on which these components are mounted by reflow to melt the solder, and then cools and performs soldering (S107). Thus, a circuit board in which the component and the board (n) are fixed by solder is obtained. The circuit board relating to the board (n) is transported to the circuit board inspection device 70 by a conveyor.

  Next, the circuit board inspection device 70 inspects the defective defect in the fixed state between the component and the substrate (n) by X-rays, inspects the component for displacement, and transmits the same to the production management device 80 (S108). If the production management device 80 determines that an error has occurred in the component (S109: Yes), the production management device 80 performs parameter change (S110). On the other hand, when there is no abnormality, the production of the substrate (n) is completed.

  Next, an operation of changing parameters related to soldering of the reflow furnace 60 by the production management device 80 will be described. FIG. 4 is a flowchart illustrating a flow of an operation of changing a parameter of the production management device.

  First, when there is an abnormal displacement of the component with respect to the board (n) after the reflow, the value changing unit 83 of the production management device 80 determines the parameter of the parameter related to the attachment of the same kind of component to the subsequent board such as the board (n + 1). One pushing amount is increased (S201). Note that the determination unit 82 determines whether the component in which the abnormal displacement has occurred is mounted with the same suction nozzle, and if the abnormal displacement has occurred in the same suction nozzle, the value changing unit 83 determines the pushing amount. It may be increased.

  Next, it is determined whether there is a plurality of parts on the board (n) in which an abnormal shift has occurred, and whether or not they are shifted in the same direction (S202), and it is determined that the plurality of parts are shifted in the same direction. If this is done (S202: Yes), the air volume in the reflow furnace 60, which is one of the parameters related to the attachment of the same kind of component to the substrate (n + 1) and thereafter, is reduced (S203).

  Next, the heating profile is changed according to a predetermined rule (S204). Since the actual profile of the reflow furnace 60 slowly approaches the changed parameter, the heating profile of the reflow furnace 60 is sequentially monitored to determine whether or not the change of the heating profile has been completed (S205). When the change of the heating profile is completed (S206: Yes), and there is no abnormal deviation in the newly produced substrate (n + m) (m is a natural number) (S206: Yes), the parameter change is ended. On the other hand, when there is an abnormal displacement in the board (n + m) (S206: No), the flow is repeated again from the step (S201) of increasing the pushing amount of the component.

  Next, the operation and effect of the mounting system 100 and the production management device 80 in the present embodiment will be described.

  As described above, in the mounting system 100 according to the present embodiment, the position shift of the component with respect to the substrate before and after reflow is analyzed, and feedback is performed based on factors inside the reflow furnace 60, and the parameters related to the attachment of the component to the substrate. To change. Accordingly, for example, when an abnormal displacement of a component occurs in a circuit board produced by passing through the reflow furnace 60, the mounting system 100 changes a parameter related to fixation of the component when producing a subsequent board. As a result, the occurrence of abnormal displacement can be suppressed, and stable production of circuit boards can be realized.

  As described above, the present disclosure has been described based on the embodiments, but the present disclosure is not limited to the above-described mounting system and the production management device.

  For example, the case where the production management device 80 determines whether there is an abnormality or the like has been described. It does not matter.

  Further, when a plurality of parts are shifted in the same direction, the case where the air volume in the reflow furnace 60 is reduced has been described. However, since a plurality of parts may be shifted in the same direction depending on a heating profile in the reflow furnace 60, The temperature profile may be changed, or the temperature profile may be changed together with the reduction of the air flow.

  Further, the positional shift amount of the component with respect to each substrate may be statistically processed, it may be determined that the abnormal positional shift amount is returning to normal, and the parameter relating to the attachment of the component to the substrate may be gradually changed. Absent.

  Further, in each of the above embodiments, each component may be configured by dedicated hardware or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory.

  The division of functional blocks in the block diagram is merely an example, and a plurality of functional blocks can be implemented as one functional block, one functional block can be divided into a plurality of functional blocks, and some functions can be transferred to other functional blocks. You may. Also, the functions of a plurality of functional blocks having similar functions may be processed by a single piece of hardware or software in parallel or time division.

  Also, the order in which the steps in the flowchart are performed is merely an example for specifically describing the present disclosure, and may be an order other than the above. Also, some of the above steps may be performed simultaneously (in parallel) with other steps. For example, in changing the parameters, first, the pressing amount of the component by the suction nozzle is increased. However, the present invention is not limited to this, and the temperature profile may be changed first.

  In addition, a form obtained by performing various modifications that can be conceived by those skilled in the art to the embodiment, and a form realized by arbitrarily combining the components and functions in the embodiment without departing from the spirit of the present disclosure are also described. Included in disclosure.

  INDUSTRIAL APPLICABILITY The present disclosure is applicable to a mounting system in which components are mounted on a board by a mounting apparatus and soldering is performed by a reflow furnace.

REFERENCE SIGNS LIST 10 solder printing device 11 printing work unit 12 print control unit 14 notification unit 15 storage unit 16 communication unit 20 print inspection device 21 print inspection work unit 22 print inspection control unit 24 notification unit 25 storage unit 26 communication unit 30 mounting device 31 mounting operation Unit 32 mounting control unit 34 notification unit 35 storage unit 36 communication unit 40 mounting board inspection device 41 appearance inspection work unit 42 appearance inspection control unit 44 notification unit 45 storage unit 46 communication unit 60 reflow furnace 61 heating work unit 62 heating control unit 64 Notification unit 65 Storage unit 66 Communication unit 70 Circuit board inspection device 71 Sticking inspection work unit 72 Sticking inspection control unit 74 Notification unit 75 Storage unit 76 Communication unit 80 Production management device 81 Information acquisition unit 82 Judgment unit 83 Value change unit 85 Storage unit 86 communication unit 100 mounting system

Claims (8)

A mounting apparatus for producing a mounting board for mounting a plurality of components on solder attached to a surface of the board,
A mounting board inspection device for inspecting the state of the component on the produced mounting board,
A reflow furnace that heats the mounting board to produce the circuit board by fixing the components on the mounting board to the board,
A mounting line comprising: a circuit board inspection device that inspects a state of the component of the circuit board in which the component is fixed to the substrate by cooling after heating in the reflow furnace;
When there is no abnormal displacement of the component in the inspection result of the mounting board inspection device, and when there is an abnormal displacement of the component in the inspection result of the circuit board inspection device, a parameter related to fixation of the component to the board. And a production management device including a value change unit that changes the value. 2. The mounting system according to claim 1, wherein the parameter includes a mounting condition of the mounting apparatus on a component corresponding to the component for which an abnormal displacement has been detected by the circuit board inspection device. 3. The mounting system according to claim 2, wherein the parameter includes at least a component pushing amount of the mounting conditions. The mounting system according to claim 1, wherein the parameter includes a heating condition of the reflow furnace. A mounting apparatus for producing a mounting board for mounting a plurality of components on the solder attached to the surface of the board, a mounting board inspection apparatus for inspecting a state of the component on the produced mounting board, A reflow furnace that heats the mounting board to produce a circuit board by fixing a component to the board, and a cooling of the component after the heating in the reflow furnace, the component of the circuit board having the component fixed to the board. In a production management device that manages a mounting operation in a mounting line including a circuit board inspection device that inspects a state,
When there is no abnormal displacement of the component in the inspection result of the mounting board inspection device, and when there is an abnormal displacement of the component in the inspection result of the circuit board inspection device, a parameter related to fixation of the component to the board. Production management device provided with a value changing unit for changing the value. The production management device according to claim 5, wherein the parameter includes a mounting condition of the mounting device in a component corresponding to the component for which an abnormal displacement has been detected by the circuit board inspection device. The production management device according to claim 6, wherein the parameter includes at least a component pushing amount of the mounting conditions. The production management device according to claim 5, wherein the parameter includes a heating condition of the reflow furnace.

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