MY111173A - Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board - Google Patents

Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board

Info

Publication number
MY111173A
MY111173A MYPI92001859A MYPI19921859A MY111173A MY 111173 A MY111173 A MY 111173A MY PI92001859 A MYPI92001859 A MY PI92001859A MY PI19921859 A MYPI19921859 A MY PI19921859A MY 111173 A MY111173 A MY 111173A
Authority
MY
Malaysia
Prior art keywords
circuit board
jig
detecting
height
printed circuit
Prior art date
Application number
MYPI92001859A
Inventor
Morita Yasuhiro
Shimizu Kaoru
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of MY111173A publication Critical patent/MY111173A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

THE PRESENT INVENTION IS DIRECTED TO A JIG FOR DETECTING THE HEIGHT OF A WAVY SURFACE OF MOLTEN SOLDER (11) OR JET SOLDER, A METHOD OF CONTROLLING SUCH A HEIGHT, A SOLDERING APPARATUS, A JIG FOR DETECTING A WARP OF A PRINTED CIRCUIT BOARD (40), AND A METHOD OF PRODUCING A PRINTED CIRCUIT BOARD (40). WITH SUCH DEVICE APPARATUS AND METHOD, THE OPTIMUM SOLDERED CONDITION SOLDERED CAN ALWAYS BE MAINTAINED AND CONTROLLED. THE SOLDERING APPARATUS INCLUDES A DETECTION JIG (30) FOR DETECTING THE HEIGHT OF THE WAVY MOLTEN SOLDER SURFACE (11) OR THE WARP OF THE PRINTED CIRCUIT BOARD (10), THE DETECTION JIG HAVING A PLURALITY OF DISPACEMENT SENSORS (8) PROVIDED AT PREDETERMINED INTERVALS IN A DIRECTION OF TRAVEL OF THE PRINTED CIRCUIT BOARD (40). BY KEEPING AND CONTROLLING THE WAVY SOLDER SURFACE (11) TO THE OPTIMUM CONDITION, THE CHANGE IN THE KIND OF PRINTED CIRCUIT BOARD (40), HAVING VARIOUS ELECTRONIC PARTS MOUNTED THEREON, CAN BE RAPIDLY DEALT WITH, THEREBY ACHIEVING AN IMPROVED YIELDRATE OF THE SOLDERING, AN IMPROVED PRODUCTION EFFICIENCY, AND A STABLE QUALITY OF THE PRINTED BOARD (40).(FIG. 1)
MYPI92001859A 1991-11-05 1992-10-15 Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board MY111173A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28830391 1991-11-05

Publications (1)

Publication Number Publication Date
MY111173A true MY111173A (en) 1999-09-30

Family

ID=17728427

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI92001859A MY111173A (en) 1991-11-05 1992-10-15 Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing circuit board
MYPI98005072A MY126741A (en) 1991-11-05 1992-10-15 Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing printed circuit board

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI98005072A MY126741A (en) 1991-11-05 1992-10-15 Jig for detecting height of wavy solder surface, method of controlling height of solder surface, soldering apparatus, jig for detecting warp of printed circuit board, and method of producing printed circuit board

Country Status (3)

Country Link
KR (1) KR960013707B1 (en)
CN (3) CN1225154C (en)
MY (2) MY111173A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101462414B (en) * 2008-11-28 2011-03-23 江苏康众数字医疗设备有限公司 Printing device and printing method for electronic component integration
JP5288012B2 (en) * 2012-01-25 2013-09-11 千住金属工業株式会社 Jet solder height confirmation jig and its handling method
CN102967273A (en) * 2012-11-16 2013-03-13 上海申和热磁电子有限公司 DBC (Dynamic Break Control) baseplate warping laser measuring device
CN105751694A (en) * 2014-12-19 2016-07-13 泰科电子(上海)有限公司 3D inkjet printing system and method
CN107020430A (en) * 2017-03-29 2017-08-08 歌尔股份有限公司 A kind of wicking method and immersion tin device
CN111201104B (en) * 2017-10-18 2022-05-06 三菱电机株式会社 Soldering apparatus, soldering method, and manufacturing method of wiring board with component
CN109000611B (en) * 2018-10-12 2021-01-19 广东正业科技股份有限公司 Single-region and double-region adjustable detection device and detection method thereof
JP7422884B2 (en) * 2020-08-17 2024-01-26 三菱電機株式会社 Soldering system and method
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing
DE102022118883B4 (en) * 2022-07-27 2025-05-22 Ersa Gmbh Method for determining the wave height of a soldering wave, device for determining the wave height of a soldering wave and wave soldering system

Also Published As

Publication number Publication date
CN1072364A (en) 1993-05-26
KR960013707B1 (en) 1996-10-10
CN1275881A (en) 2000-12-06
CN1225154C (en) 2005-10-26
KR930009692A (en) 1993-06-21
MY126741A (en) 2006-10-31
CN1051434C (en) 2000-04-12
CN1096623A (en) 1994-12-21
CN1030292C (en) 1995-11-22

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