KR930009692A - Height detection jig and control method of solder wave surface, bending detection jig and soldering method of soldering device and printed wiring board - Google Patents

Height detection jig and control method of solder wave surface, bending detection jig and soldering method of soldering device and printed wiring board Download PDF

Info

Publication number
KR930009692A
KR930009692A KR1019920020617A KR920020617A KR930009692A KR 930009692 A KR930009692 A KR 930009692A KR 1019920020617 A KR1019920020617 A KR 1019920020617A KR 920020617 A KR920020617 A KR 920020617A KR 930009692 A KR930009692 A KR 930009692A
Authority
KR
South Korea
Prior art keywords
wiring board
printed wiring
soldering
fractional
solder
Prior art date
Application number
KR1019920020617A
Other languages
Korean (ko)
Other versions
KR960013707B1 (en
Inventor
카오루 시미즈
야스히로 모리타
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR930009692A publication Critical patent/KR930009692A/en
Application granted granted Critical
Publication of KR960013707B1 publication Critical patent/KR960013707B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

본 발명은, 용융땜납파형면 높이 또는 분류(噴瘤) 땜납파형면의 높이검출지그와 제어방법과 납땜장치와 프린트배선기판의 휘어짐검출지그와 제조방법에 관한 것으로서, 최적한 납땜상태를 항상 유지·관리할 수 있는 방법과 장치를 제공하는 것을 목적으로한 것으로서, 그 구성에 있어서, 본 발명의 납땜장치는, 프린트배선기판(40)의 진행방향에 소정간격마다 복수개의 변위센서(8)을 배설해서 이루어진 용융땝납 파형면의 높이 또는 프린트배선기판의 휘어짐검출지그(30)을 구비하고, 용융땜납파형면 높이 또는 분리땜납파형면을 최적상태로 유지·관리하므로서 각종 전자부품을 실장한 프린트배선기판(40)의 기종전환에 신속히 대응할 수 있는 동시에, 납땜수율과 생산성의 향상, 프린트배선기판물질의 안정화를 도모할 수 있는 것을 특징으로 한다.The present invention relates to a height detecting jig and a control method of a height of a molten solder wave surface or a split solder wave surface, and a bending detection jig and a manufacturing method of a soldering apparatus and a printed wiring board, and always maintain an optimum soldering state. It is an object of the present invention to provide a method and an apparatus which can be managed. In the configuration, the soldering apparatus of the present invention includes a plurality of displacement sensors 8 at predetermined intervals in the advancing direction of the printed wiring board 40. Print wirings having various heights of the molten solder corrugated surface or the warp detection jig 30 of the printed wiring board and maintaining the molten solder waveform height or the separated solder waveform surface in an optimal state. It is possible to quickly respond to the model switching of the substrate 40, and to improve the soldering yield and productivity, and to stabilize the printed wiring board material.

Description

땜납파형면의 높이검출지그와 제어방법과 납땜장치와 프린트배선기판의 휘어짐검출지그와 제조방법Height detection jig and control method of solder wave surface, bending detection jig and soldering method of soldering device and printed wiring board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 일실시예에 있어서의 납땜장치의 요부사시도.1 is a main perspective view of a soldering apparatus according to an embodiment of the present invention.

제2도는 제1도를 절단선 S1-S2방향으로부터 본 측면에서의 요부단면도.FIG. 2 is a sectional view showing the main parts of the side surface of FIG. 1 as seen from the cutting line S1-S2. FIG.

제3도는 제1도의 납땜장치를 구성하는 땜납환류장치와 땜납분류노즐의 사시도.3 is a perspective view of a solder reflux apparatus and a solder classification nozzle constituting the soldering apparatus of FIG.

Claims (13)

분류납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와, 상기 분류납땜장치에 의해서 납땜되는 프린트 배선기판의 이송방향이고, 또한 상기 분류땜납파형면의 꼭대기부분을 포함하는 적어도 2개소의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착된 복수의 변위센서로 이루어지고, 상기 복수의 변위센서에 의해 상기 분류땜납파형면의 높이를 복구개소 측정하도록 한 것을 특징으로 하는 분류땜납파형면의 높이검출지그.The displacement sensor mounting portion provided at a predetermined interval on the top of the fractional solder waveform surface formed by the fractional soldering apparatus, and the transfer direction of the printed wiring board soldered by the fractional soldering apparatus, And a plurality of displacement sensors mounted on the mounting portion at predetermined intervals in at least two upper positions including the top portion, wherein the height of the fractionated solder wave surface is measured by the plurality of displacement sensors to measure a recovery point. A height detecting jig of a sorted solder wave surface. 분류납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 수평방향으로 이동가능하게 배설한 변위센서장착부와, 상기 분류납땜장치에 의해서 납땜되는 프린트 배선기판의 이송방향이고, 또한 상기 분류땜납파형면의 꼭대기부분을 포함하는 적어도 2개소의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착된 복수의 변위센서로 이루어지고, 상기 복수의 변위센서에 의해 상기 분류땜납파형면의 높이를 복수개소 측정하는 상기 분류땜납파형면의 높이 측정개소를 변경가능하게한 것을 특징으로 하는 분류땜납파형면의 높이검출지그.A displacement sensor mounting part disposed so as to be movable in a horizontal direction disposed at a predetermined interval above the top of the fractional solder waveform surface formed by the fractional soldering device, and a transfer direction of the printed wiring board soldered by the fractional soldering device. And a plurality of displacement sensors mounted on the mounting portion at predetermined intervals in at least two upper positions including the top portion of the fractionated solder waveform surface, wherein the fractionated solder waveform surface is formed by the plurality of displacement sensors. A height detecting jig of a sorting solder waveform surface, wherein a height measuring point of the sorting solder waveform surface for measuring a plurality of heights is changeable. 분류납땜장치가 형성하는 분류땜납파형면의 위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와, 상기 분류땜납장치에 의해서 납땜되는 프린트 배선기판의 이송방향과 직각방향이고, 또한 상기 프린트배선기판의 양단부와 중앙부의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착된 복수의 변위센서로 이루어지고, 상기 복수의 변위센서에 의해 상기 프린트배선기판면의 높이를 복수개소 측정하도록 한 것을 특징으로 하는 프린트배선기판의 휘어짐검출지그.The displacement sensor mounting portion disposed at a predetermined interval on the surface of the wave soldering wave formed by the wave soldering device, and a direction perpendicular to the transfer direction of the printed wiring board soldered by the wave soldering device; A printed wiring board comprising a plurality of displacement sensors mounted on the mounting portion at predetermined intervals at both ends and above the center portion, and measuring a plurality of heights of the surface of the printed wiring board by the plurality of displacement sensors. Warping detection jig. 분류납땜장치가 형성하는 분류땜납파형면의 위쪽에 소정의 간격을 취해서 수평 방향으로 이동가능하게 배설한 변위센서장착부와, 상기 분류땜납장치에 의해서 납땜되는 프린트 배선기판의 이송방향과 직각방향이고, 또한 상기 프린트배선기판의 양단부와 중앙부의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착한 복수의 변위센서로 이루어지고, 상기 복수의 변위센서에 의해 상기 프린트배선기판면의 높이를 복수개소 측정하는 동시에 상기 프린트배선기판의 높이측정개소를 변경가능하게 한 것을 특징으로 하는 프린트배선기판의 휘어짐검출지그.A displacement sensor mounting portion disposed so as to be movable in the horizontal direction at a predetermined interval on the upper surface of the wave solder wave formed by the wave soldering device, and a direction perpendicular to the transfer direction of the printed wiring board soldered by the wave soldering device, In addition, a plurality of displacement sensors attached to the mounting portion at predetermined intervals in the upper position of both ends and the center portion of the printed wiring board, the plurality of displacement sensors measure the height of the surface of the printed wiring board by a plurality of displacement sensors A bending detection jig of a printed wiring board, characterized in that the height measuring point of the printed wiring board can be changed. 용융땜납파형면의 높이를, 적어도 2개소에 있어서 변위센서를 사용해서 측정하고, 측정신호에 의거해서 상기 용융땜잡파형면을 형성하는 땜납조를 상하로 이동해서 자동제어하므로서 용융땜납파형면의 높이를 소망대로 제어하도록 한 것을 특징으로 하는 용융땜납면의 높이제어방접.The height of the molten solder waveform surface is measured by using a displacement sensor in at least two places, and the solder bath forming the molten solder waveform surface is moved up and down automatically based on the measurement signal to automatically control the height of the molten solder waveform surface. The height control contact of the molten solder surface, characterized in that to control as desired. 프린트배선기판반송수단과, 분류식납땜장치와, 이 분류식납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와, 이 분류식 납땜장치에 의해서 납땜되는 프린트배선기판의 이송방향이고, 또한 상기 분류땜납파형면의 꼭대기부분을 포함하는 적어도 2개소의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착한 복수의 변위센서로 이루어진 것을 특징으로 하는 납땜장치.A printed wiring board conveying means, a sorting soldering device, a displacement sensor mounting portion disposed at a predetermined interval above the top of the sorting solder waveform surface formed by the sorting soldering device, and soldered by the sorting soldering device And a plurality of displacement sensors attached to said mounting portion at predetermined intervals in at least two upper positions of said printed wiring board in a conveyance direction and including a top portion of said fractional solder waveform surface. 프린트배선기판반송수단과, 분류식납땜장치와, 이 분류식납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와 상기 분류식 납땜장치에 의해서 납땜되는 프린트배선기판의 이송방향이고, 또한 상기 분류땜납파형면의 꼭대기부분을 포함하는 적어도 2개소의 위쪽위치에 있어서 소정간격으로 상기 장착부에 장착한 복수의 변위센서와, 분류땜납파형면의 높이측정데이터를 모니터표시하는 디스플레이장치를 구비한 것을 특징으로 하는 납땜장치.A printed wiring board conveying means, a sorted soldering apparatus, a displacement sensor mounting portion disposed at a predetermined interval above the top of the fractional solder waveform surface formed by the sorted soldering apparatus, and soldered by the sorted soldering apparatus. A plurality of displacement sensors attached to the mounting portion at predetermined intervals in at least two upper positions in the conveyance direction of the printed wiring board and including the top portion of the wave soldering wave surface, and height measurement data of the wave soldering wave surface. Soldering apparatus comprising a display device for monitoring the display. 프린트배선기판반송수단과, 분류식납땜장치와, 이 분류식납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와, 상기 분류식 납땜장치에 의해서 납땜되는 프린트배선기판의 이송방향과 직각방향이고, 또한 상기 프린트배선기판의 양단부와 중앙부의 위쪽위치에 있어서 소정 간격으로 상기 장착부에 장착한 복수의 변위센서를 구비한 것을 특징으로 하는 납땜장치.A printed wiring board conveying means, a fractional soldering apparatus, a displacement sensor mounting portion disposed at a predetermined interval above the top of the fractional solder waveform surface formed by the fractional soldering apparatus, and soldered by the fractional soldering apparatus And a plurality of displacement sensors attached to the mounting portion at predetermined intervals in a direction perpendicular to the transfer direction of the printed wiring board and at an upper end position of both ends and the center portion of the printed wiring board. 프린트배선기판반송수단과, 분류식납땜장치와, 이 분류식납땜장치가 형성하는 분류땜납파형면의 꼭대기부분위쪽에 소정의 간격을 취해서 배설한 변위센서장착부와, 상기 분류식 납땜장치에 의해서 납땜되는 프린트배선기판의 이송방향과 직각방향이고, 또한 상기 프린트배선기판의 양단부와 중앙부의 위쪽위치에 있어서 소정 간격으로 상기 장착부에 장착한 복수의 변위센서와, 프린트배선기판의 높이측정 데이터를 모니터표시하는 디스플레이장치를 구비한 것을 특징으로 하는 납땜장치.A printed wiring board conveying means, a fractional soldering apparatus, a displacement sensor mounting portion disposed at a predetermined interval above the top of the fractional solder waveform surface formed by the fractional soldering apparatus, and soldered by the fractional soldering apparatus Monitor display of a plurality of displacement sensors attached to the mounting portion at predetermined intervals at a position at a distance between the ends and the center of the printed wiring board at right angles to the transfer direction of the printed wiring board. Soldering apparatus comprising a display device. 프린트배선기판반송수단과, 용융땜납조와, 용융땜납파형면의 높이를 복수개소 동시에 측정하는 복수개의 변위센서와, 측정신호에 의거해서 상기 용융땜납파형면을 형성하는 용융땜납조를 상하로 구동하는 용융땜납조상하위치 자동제어수단을 구비해서 이루어진 것을 특징으로 하는 납땜장치.A printed wiring board conveying means, a molten solder bath, a plurality of displacement sensors for simultaneously measuring a plurality of heights of the molten solder waveform surface, and a molten solder tank for forming the molten solder waveform surface based on a measurement signal are driven up and down. A soldering apparatus comprising a molten solder tank top and bottom position automatic control means. 청구범위 제6항 또는 제7항기재의 납땜장치를 사용해서 납땜하도록 한 것을 특징으로 하는 프린트배선기판의 제조방법.A method for manufacturing a printed wiring board, characterized in that the soldering is carried out using a soldering apparatus according to claim 6 or 7. 프린트배선기판을 특허청구범위 제8항 또는 제9항기재의 납땜장치를 사용해서 납땜하고 또한 프린트배선기판의 휘어진상태를 검출·관리하도록 한 것을 특징으로 하는 프린트배선기판의 제조방법.A method for manufacturing a printed wiring board, wherein the printed wiring board is soldered using a soldering apparatus according to claim 8 or 9, and the curved state of the printed wiring board is detected and managed. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019920020617A 1991-11-05 1992-11-04 Jig for detecting height of wavy solder surface, method of controlling height of solder surface KR960013707B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP91-288303 1991-11-05
JP92-288303 1991-11-05
JP28830391 1991-11-05

Publications (2)

Publication Number Publication Date
KR930009692A true KR930009692A (en) 1993-06-21
KR960013707B1 KR960013707B1 (en) 1996-10-10

Family

ID=17728427

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920020617A KR960013707B1 (en) 1991-11-05 1992-11-04 Jig for detecting height of wavy solder surface, method of controlling height of solder surface

Country Status (3)

Country Link
KR (1) KR960013707B1 (en)
CN (3) CN1225154C (en)
MY (2) MY126741A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101462414B (en) * 2008-11-28 2011-03-23 江苏康众数字医疗设备有限公司 Printing device and printing method for integrating electronic components
JP5288012B2 (en) * 2012-01-25 2013-09-11 千住金属工業株式会社 Jet solder height confirmation jig and its handling method
CN102967273A (en) * 2012-11-16 2013-03-13 上海申和热磁电子有限公司 DBC (Dynamic Break Control) baseplate warping laser measuring device
CN105751694A (en) * 2014-12-19 2016-07-13 泰科电子(上海)有限公司 3D inkjet printing system and method
CN107020430A (en) * 2017-03-29 2017-08-08 歌尔股份有限公司 A kind of wicking method and immersion tin device
JP6844021B2 (en) * 2017-10-18 2021-03-17 三菱電機株式会社 Soldering equipment, soldering method and manufacturing method of wiring board with parts
CN109000611B (en) * 2018-10-12 2021-01-19 广东正业科技股份有限公司 Single-region and double-region adjustable detection device and detection method thereof
US11389888B2 (en) 2020-08-17 2022-07-19 Illinois Tool Works Inc. Wave solder nozzle with automated exit wing

Also Published As

Publication number Publication date
CN1030292C (en) 1995-11-22
MY111173A (en) 1999-09-30
CN1051434C (en) 2000-04-12
MY126741A (en) 2006-10-31
CN1072364A (en) 1993-05-26
CN1275881A (en) 2000-12-06
CN1096623A (en) 1994-12-21
CN1225154C (en) 2005-10-26
KR960013707B1 (en) 1996-10-10

Similar Documents

Publication Publication Date Title
KR930009692A (en) Height detection jig and control method of solder wave surface, bending detection jig and soldering method of soldering device and printed wiring board
KR930004013A (en) Height detection jig and soldering device for classifying solder wave surface
US5617988A (en) Device for measuring the height of a solder wave
US6119915A (en) Alignment fixture for solder-wave machines
KR920012973A (en) Mounting device for lead terminal in liquid crystal display device or printed board
KR870004511A (en) Solder Coating Apparatus and Method of Integrated Circuit Leads
US5148963A (en) Method for solder nozzle height sensing
DK215089D0 (en) DEVICE FOR MEASURING AND CONTROL OF NEW PRODUCED CONCRETE PRODUCTS
US5339536A (en) Apparatus and method for solder paste printing process for printed circuit boards
JP3257965B2 (en) Method and apparatus for measuring wave height and pulsation of jet solder
JP2920285B2 (en) Method and apparatus for measuring wave height and pulsation of jet solder
US4138018A (en) Apparatus and method for sorting substrates
JPH0722800A (en) Method of mounting electronic component and equipment for mounting electronic component
JP2006228793A5 (en)
SU1502957A1 (en) Method of determining deviations from planarity and parallelism of the base of the table tennis racket
JPS642723A (en) Detecting device for bent angle of work
KR960028718A (en) Printed Circuit Board Thickness Measurement Apparatus and Method
US20240033841A1 (en) Method for determining the wave height of a soldering wave, device for determining the wave height of a soldering wave and wave soldering system
JPH0964495A (en) Wiring board with position recognition mark and position recognition method of wiring board
DE59104803D1 (en) Wall bracket.
JPS6225825U (en)
KR900005837Y1 (en) Contact style thermometer
JPS63170071U (en)
KR19980073258A (en) Lead flow height measuring device of soldering machine
KR970032311A (en) Front and back side identification devices for circuit boards and boards with front and back identification marks

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20030924

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee