KR960028718A - Printed Circuit Board Thickness Measurement Apparatus and Method - Google Patents

Printed Circuit Board Thickness Measurement Apparatus and Method Download PDF

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Publication number
KR960028718A
KR960028718A KR1019940038346A KR19940038346A KR960028718A KR 960028718 A KR960028718 A KR 960028718A KR 1019940038346 A KR1019940038346 A KR 1019940038346A KR 19940038346 A KR19940038346 A KR 19940038346A KR 960028718 A KR960028718 A KR 960028718A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
thickness
measuring
substrate
Prior art date
Application number
KR1019940038346A
Other languages
Korean (ko)
Other versions
KR100200835B1 (en
Inventor
구영모
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019940038346A priority Critical patent/KR100200835B1/en
Publication of KR960028718A publication Critical patent/KR960028718A/en
Application granted granted Critical
Publication of KR100200835B1 publication Critical patent/KR100200835B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

본 발명은 인쇄회로 기판의 두께 측정 장치 및 방법에 관한 것이다. 본 발명에 따르면, 인쇄회로 기판(20)의 저면을 지지할 수 있도록 복수개의 지지수단(31)이 제공되어 있으며 상하 운동 구동수단(35)에 의해 소정의 높이로 상승할 수 있는 승강 부재(30), 상기 인쇄회로 기판(20)의 상면 일부를 탄성 부재(15)에 의해 탄성적으로 고정할 수 있는 기판 고정용 부재(16) 및 상기 기판 고정용 부재(16)의 상승 높이를 측정할 수 있는 거리감지 수단(40)을 포함하는 인괘회로 기판의 두께 측정장치가 제공되며, 이장치를 이용한 인쇄회로 기판의 두께 측정 방법이 제공된다.The present invention relates to an apparatus and method for measuring thickness of a printed circuit board. According to the present invention, a plurality of supporting means 31 is provided to support the bottom of the printed circuit board 20, and the lifting member 30 which can be raised to a predetermined height by the vertical movement driving means 35. ), The rising height of the substrate fixing member 16 and the substrate fixing member 16 that can elastically fix a portion of the upper surface of the printed circuit board 20 by the elastic member 15 can be measured. Provided is a thickness measuring apparatus of a printed circuit board including a distance sensing means 40, and a method of measuring a thickness of a printed circuit board using the apparatus is provided.

Description

인쇄회로 기판 두께 측정장치 및 방법Printed Circuit Board Thickness Measurement Apparatus and Method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명에 따른 인쇄회로 기판 두께 측정 장치를 개략적으로 도시한 사시도, 제2도는 제1도에 도시된 장치로 인쇄회로 기판 두께를 측정하는 방법을 개략적으로 도시한 순서도.1 is a perspective view schematically showing a printed circuit board thickness measuring apparatus according to the present invention, and FIG. 2 is a flowchart schematically showing a method of measuring printed circuit board thickness with the apparatus shown in FIG.

Claims (2)

인쇄회로 기판의 두께에 따른 실장기 헤드의 하강 거리를 조절할 수 있도록 제공되는 기판 두께 측정 장치에 있어서, 인쇄회로 기판(20)의 저면을 지지할 수 있도록 복수개의 지지수단(31)이 제공되어 있으며 상하 운동 구동수단(35)에 의해 소정의 높이로 상승할 수 있는 승강 부재(30)상기 인쇄회로 기판(20)의 상면 일부를 탄성 부재(15)에 의해 탄성적으로 고정할 수 있는 기판 고정용 부재(16) 및 상기 기판 고정용 부재(16)의 상승 높이를 측정할 수 있는 거리감지 수단(40)을 포함하는 인쇄회로 기판의 두께 측정 장치.In the substrate thickness measuring apparatus provided to adjust the falling distance of the mounting head according to the thickness of the printed circuit board, a plurality of support means 31 is provided to support the bottom of the printed circuit board 20 Elevating member 30 capable of ascending to a predetermined height by vertical movement driving means 35 A substrate fixing member capable of elastically fixing a part of the upper surface of the printed circuit board 20 by the elastic member 15. And a distance sensing means (40) capable of measuring a rising height of said member (16) and said substrate fixing member (16). 인쇄회로 기판의 두께에 따른 실장기 헤드의 하강 거리를 조절할 수 있도록 제공되는 기판 두께 측정 방법에 있어서, 인쇄회로 기판(20)의 저면을 승강 부재(30)에 제공된 지지수단(31)으로 지지하여 소정의 높이까지 상승시키는 단계 상기 인쇄회로 기판(20)의 상면을 기판 고정용 부재(16)에 의해 탄성적으로 고정하는 단계 및, 상기 기판 고정용 부재(16)의 상승 높이를 측정함으로써 기판의 두께를 산출하는 단계를 포함하는 인쇄회로 기판의 두께 측정 방법.In the substrate thickness measuring method provided to adjust the descending distance of the mounting head according to the thickness of the printed circuit board, by supporting the bottom surface of the printed circuit board 20 with the support means 31 provided on the elevating member 30 Raising to a predetermined height by elastically fixing the upper surface of the printed circuit board 20 by the substrate fixing member 16, and measuring the rising height of the substrate fixing member 16 of the substrate Method for measuring the thickness of a printed circuit board comprising the step of calculating the thickness.
KR1019940038346A 1994-12-28 1994-12-28 A thickness measuring device of pcb and method thereof KR100200835B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940038346A KR100200835B1 (en) 1994-12-28 1994-12-28 A thickness measuring device of pcb and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940038346A KR100200835B1 (en) 1994-12-28 1994-12-28 A thickness measuring device of pcb and method thereof

Publications (2)

Publication Number Publication Date
KR960028718A true KR960028718A (en) 1996-07-22
KR100200835B1 KR100200835B1 (en) 1999-06-15

Family

ID=19404603

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940038346A KR100200835B1 (en) 1994-12-28 1994-12-28 A thickness measuring device of pcb and method thereof

Country Status (1)

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KR (1) KR100200835B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101166777B1 (en) * 2010-06-08 2012-07-26 이용현 Apparatus for forming pattern on embedded printed circuit board, method of forming pattern on embedded printed circuit board and method of manufacturing embedded printed circuit board
KR101091857B1 (en) 2011-08-19 2011-12-12 배석근 Thickness measuring system for pcb

Also Published As

Publication number Publication date
KR100200835B1 (en) 1999-06-15

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