JPH02185055A - Positioning device for semiconductor device - Google Patents
Positioning device for semiconductor deviceInfo
- Publication number
- JPH02185055A JPH02185055A JP1003817A JP381789A JPH02185055A JP H02185055 A JPH02185055 A JP H02185055A JP 1003817 A JP1003817 A JP 1003817A JP 381789 A JP381789 A JP 381789A JP H02185055 A JPH02185055 A JP H02185055A
- Authority
- JP
- Japan
- Prior art keywords
- positioning
- semiconductor device
- turntable
- guide plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 238000007689 inspection Methods 0.000 abstract description 9
- 230000032258 transport Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、フラットタイプ半導体装置の検査装置等に用
いられる半導体装置の位置決め装置に関するものである
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a semiconductor device positioning device used in a flat type semiconductor device inspection device or the like.
（従来の技術）
従来のこの種の半導体装置の位置決め装置について、検
査装置を例として第３図により説明する。(Prior Art) A conventional positioning device for a semiconductor device of this type will be described using an inspection device as an example with reference to FIG.
同図において、半導体装置１は、搬送テーブル２に載せ
られて検査装置Ｉ（図示せず）の傍に送られて来て停止
する。第１０−ダ（図示せず）に装着され吸着パッド３
が、上記の半導体装ＩＩＩを取り上げ検査装置の基台（
図示せず）に固定した位置決め治具４の真上に運ぶ０位
置決め治具４の真上で吸着パッド３から離れた半導体装
ｌｔ１は、案内傾斜面４ａに案内され、所要の方向と位
置に落ち付く。In the figure, a semiconductor device 1 is placed on a transport table 2, transported to the vicinity of an inspection device I (not shown), and stopped there. The suction pad 3 is attached to the 10th holder (not shown).
took up the above-mentioned semiconductor device III and took up the base of the inspection equipment (
The semiconductor device lt1, which is carried directly above the positioning jig 4 fixed to the positioning jig 4 (not shown) and separated from the suction pad 3 directly above the positioning jig 4, is guided by the guide slope 4a and placed in the desired direction and position. Calm down.
次に、第２０−ダ（図示せず）に装着された吸着パッド
５が、位置決め治具４に納っている半導体装！１１を取
り上げ、検査装置のターンテーブル６の上の定位置に運
び搭載する。Next, the suction pad 5 attached to the 20th holder (not shown) is a semiconductor device housed in the positioning jig 4! 11 is picked up, carried to a fixed position on the turntable 6 of the inspection device, and mounted thereon.
（発明が解決しようとする課題）
しかしながら、上記の構成では、第２０−ダが位置決め
治具４により位置および方向が決められた半導体装ｉｌ
ｌを、第２０−ダが検査装置のターンテーブル６に運ぶ
ので、位置決め精度は、上記の第２０−ダの精度に依存
することになり、ばらつきが大きいという問題があった
。(Problem to be Solved by the Invention) However, in the above configuration, the 20-th element is a semiconductor device whose position and direction are determined by the positioning jig 4.
Since the 20th digit transports the 20th digit to the turntable 6 of the inspection device, the positioning accuracy depends on the accuracy of the 20th digit, and there is a problem of large variations.
本発明は上記の問題を解決するもので、精度の高い半導
体装置の位置決め装置を提供するものである。The present invention solves the above problems and provides a highly accurate positioning device for semiconductor devices.
（課題を解決するための手段）
上記の課題を解決するため１本発明は、半導体装置を案
内する案内傾斜面を有する位置決め貫通孔を設けた案内
板と、これを上下する駆動部とからなる半導体装置の位
置決め装置を、ターンテーブルの傍に設置するものであ
る。(Means for Solving the Problems) In order to solve the above problems, the present invention consists of a guide plate provided with a positioning through hole having a guide slope for guiding a semiconductor device, and a drive unit that moves the guide plate up and down. A positioning device for semiconductor devices is installed near a turntable.
（作 用）
上記の構成により、ターンテーブルに密着した案内板の
位置決め貫通孔により、半導体装置は、直接ターンテー
ブル上に位置決めされるので、精度良い位置決めができ
る。なお１位置決めが終了した時点で案内板が上がるの
で、ターンテーブル上の半導体装置を邪魔することはな
い。(Function) With the above configuration, the semiconductor device is directly positioned on the turntable by the positioning through hole of the guide plate that is in close contact with the turntable, so that accurate positioning can be achieved. Note that since the guide plate is raised when one positioning is completed, it does not interfere with the semiconductor device on the turntable.
（実施例）
本発明の一実施例を第１図および第２図により説明する
。(Example) An example of the present invention will be described with reference to FIGS. 1 and 2.
第２図は１本発明による半導体装置の位置決め装置の斜
視図である。FIG. 2 is a perspective view of a positioning device for a semiconductor device according to the present invention.
同図において、半導体装置の位置決め装置は。In the figure, a positioning device for a semiconductor device is shown.
エアシリンダ７を動力源とする、矢印Ａに示す上下方向
に摺動自在の２テーブル８を上記２テーブル８の上端に
逆り字状に装着され、検査装置のターンテーブル６の上
面に沿って伸び、その先端近傍に案内傾斜面９ａを有す
る位置決め貫通孔９ｂを設けた案内板９とから構成され
ている。Two tables 8, which are powered by an air cylinder 7 and can freely slide in the vertical direction shown by arrow A, are mounted on the upper ends of the two tables 8 in an inverted shape, and run along the upper surface of the turntable 6 of the inspection device. The guide plate 9 extends from the guide plate 9 and has a positioning through hole 9b having a guide slope 9a near its tip.
このように構成された半導体装置の位置決め装置の動作
について第１図（ａ）、 （ｂ）および（ｃ）により説
明する。The operation of the positioning apparatus for a semiconductor device constructed in this way will be explained with reference to FIGS. 1(a), 1(b) and 1(c).
第１図（ａ）において、ターンテーブル６の定位置に搭
載される半導体装置１は、吸着バッド３に吸着された状
態で位置決め貫通孔９ｂの真上まで搬送され、第１図（
ｂ）に示すように、案内板９の上面まで下ろされた後、
切り離される。半導体装ｗ１は案内傾斜面９ａに案内さ
れて、位置決め貫通孔９ｂの底面まで滑り落ち、ターン
テーブル６の定位置に載る０次に、第１図（ｃ）に示す
ように、案内板９がエアシリンダ７によって、半導体装
置１の移動を妨げない位置に上げられ、ターンテーブル
６が回転して半導体装置１を検査位置に移動すると、再
び、案内板９が降下して第１図（ａ）の状態に戻る。In FIG. 1(a), the semiconductor device 1 mounted at a fixed position on the turntable 6 is transported to a position directly above the positioning through hole 9b while being attracted to the suction pad 3, and
As shown in b), after being lowered to the top surface of the guide plate 9,
be separated. The semiconductor device w1 is guided by the guide slope 9a, slides down to the bottom of the positioning through hole 9b, and is placed on the turntable 6 in a fixed position.Then, as shown in FIG. When the air cylinder 7 raises the semiconductor device 1 to a position where it does not interfere with its movement, and the turntable 6 rotates to move the semiconductor device 1 to the inspection position, the guide plate 9 descends again to the position shown in FIG. 1(a). Return to state.
（発明の効果）
以上説明したように、本発明によれば、位置決め治具に
相当する位置決め貫通孔によって、直接ターンテーブル
上に位置決めできるばかりでなく、−台のローダでよい
ため、総合コストの安い精度の高い半導体装置の位置決
め装置が得られる。(Effects of the Invention) As explained above, according to the present invention, not only can positioning be performed directly on the turntable using the positioning through-hole corresponding to the positioning jig, but also a second loader can be used, which reduces the total cost. An inexpensive and highly accurate positioning device for semiconductor devices can be obtained.
第１図（ａ）、 （ｂ）および（ｃ）は本発明による半
導体装置の位置決め装置の動作を説明するための側面断
面図、第−Ｇ位置決め装置の斜視図、第３図は従来の位
置決め装置の構成図である。
１ ・・・半導体装置、 ２・・・搬送テーブル。
３．５・・・吸着パッド、 ４・・・位置決め治具、４
ａ、９ａ・・・案内傾斜面、 ６ ・・・ターンテーブ
ル、 ７・・・エアシリンダ、８・・・Ｚテーブル、９
・・・案内板、 ９ｂ・・・位置決め貫通孔。
第１図
（ａ）
特許出願人 松下電子工業株式会社
−２！
第
図
第
図1(a), (b) and (c) are side sectional views for explaining the operation of the positioning device for a semiconductor device according to the present invention, a perspective view of the positioning device No.-G, and FIG. 3 is a conventional positioning device. It is a block diagram of a device. 1...Semiconductor device, 2...Transportation table. 3.5... Suction pad, 4... Positioning jig, 4
a, 9a...Guide slope, 6...Turntable, 7...Air cylinder, 8...Z table, 9
...Guidance plate, 9b...Positioning through hole. Figure 1 (a) Patent applicant Matsushita Electronics Co., Ltd.-2! Figure Figure
Claims (1)
孔を設けた案内板と、上記の案内板を上下させる駆動部
とから構成される半導体装置の位置決め装置。A positioning device for a semiconductor device, which includes a guide plate provided with a positioning through hole having a guide slope for guiding a semiconductor device, and a drive unit that moves the guide plate up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1003817A JPH02185055A (en) | 1989-01-12 | 1989-01-12 | Positioning device for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1003817A JPH02185055A (en) | 1989-01-12 | 1989-01-12 | Positioning device for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02185055A true JPH02185055A (en) | 1990-07-19 |
Family
ID=11567740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1003817A Pending JPH02185055A (en) | 1989-01-12 | 1989-01-12 | Positioning device for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02185055A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100395925B1 (en) * | 2001-08-01 | 2003-08-27 | 삼성전자주식회사 | Semiconductor Device Loading Apparatus of Test Handler |
| WO2013161892A1 (en) * | 2012-04-27 | 2013-10-31 | 日産自動車株式会社 | Semiconductor device fabrication method, thermally insulated load jig, and thermally insulated load jig mounting method |
-
1989
- 1989-01-12 JP JP1003817A patent/JPH02185055A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100395925B1 (en) * | 2001-08-01 | 2003-08-27 | 삼성전자주식회사 | Semiconductor Device Loading Apparatus of Test Handler |
| WO2013161892A1 (en) * | 2012-04-27 | 2013-10-31 | 日産自動車株式会社 | Semiconductor device fabrication method, thermally insulated load jig, and thermally insulated load jig mounting method |
| EP2843692A4 (en) * | 2012-04-27 | 2016-03-09 | Nissan Motor | Semiconductor device fabrication method, thermally insulated load jig, and thermally insulated load jig mounting method |
| US10020282B2 (en) | 2012-04-27 | 2018-07-10 | Nissan Motor Co., Ltd. | Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig |
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