JPH01262700A - Substrate positioning device - Google Patents

Abstract

PURPOSE:To position substrates having different thicknesses by providing a pair of pressing members for pressing the opposite ends of a substrate 2 against a pair of guide rails, such that the pressing members are flush with each pressing pin when the pressing members are in contact with the upper surface of the lowest plate. CONSTITUTION:A substrate 1 is held at a predetermined position on a pair of guide rails 15, 15 by a substrate positioning device 1. An air cylinder 6 is then driven to raise a vertically movable plate 7, whereby a positioning pin 10 is inserted in a positioning hole 4b in the substrate 4 to position the substrate 4. Further, the substrate 4 is pushed up by a pair of lower guide rails 12, 12 and a plurality of pressing pins 9,... such that the opposite ends 4c and the parts 4a other than the opposite ends of the substrate 4 touch the flanges 5b of a pair of upper guide rails 5, 5 and the substrate 4 is stopped there. The top faces 12c, 12c of the rails 12, 12 are flush with the tip ends of the plurality of pushing pins 9, and the opposite ends 4c, 4c of the substrate 4 can be held reliably between the pair of flanges 5b and the top faces 12c, 12c of the rails 12, 12.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention provides a positioning device for positioning a weir plate on which electronic components such as ICs are mounted in close contact with a predetermined position of a pair of guide rails. No matter what.

[Summary of the Invention] The present invention provides a board positioning device that positions a weir plate via a positioning pin on a pair of guide rails for transporting a board on which components are mounted, in which Ii3 is placed on the pair of guide rails. A plurality of pressing pins and positioning pins formed on the board are used to press the parts other than both ends of the board against a pair of guide rails on the top surface of the lifting plate which is arranged to be able to be raised and lowered freely by a lifting mechanism. Insert into the hole,
Positioning pins that are engaged to position the board are each erected, and are brought into contact with the upper surface of the elevating plate so as to be freely releasable, and by raising the elevating plate L, both ends of the board are attached to the pair of guide rails. By forming the pair of pressing members to be pressed so that when they come into contact with the upper surface of the lifting plate, the height thereof is the same as the height of the pressing pin, it is possible to replace the pressing pin or to adjust the height of the lifting plate. Boards with different thicknesses can be held (clamped) and positioned in a predetermined position on a pair of guide rails without making adjustments, and parts can be mounted while preventing the board from wobbling or warping after positioning. This makes it possible to further improve accuracy.

[Prior Art] For example, in an electronic component mounting apparatus, a board positioning method involves transporting and positioning a board on which an electronic component is mounted to a pair of guide rails arranged on an X-Y table that moves left and right after being mounted in a horizontal direction. The device is known. This is the fourth
To explain in detail with reference to the drawings, 21 is a substrate positioning device, and this substrate positioning device 21 includes a rectangular plate-shaped fixing plate 22 fixed to the X-Y table, and two surfaces of this fixing plate 22. A pair of guide rail holding plates 23.23 are vertically opposed to each other at both ends, and the electronic component mounting apparatus is fixed along the upper edge of the opposing inner surfaces of the pair of guide rail holding plates 23.23. A pair of guide rails 25.25 with a U-shaped cross section for transporting the Jλ board 24 on which electronic components are mounted, and four opposing parts 25a, 25a of the pair of guide rails 25.25.
An elevating plate 2 is disposed such that it can be raised and lowered by an air ring 26 with respect to the substrate 24 that is freely conveyed therein.
7 and the pair of guide rails 25 .
A plurality of pressing pins 28. - The end of the rod 29a of the air cylinder 29 fixed to the fixed plate 22 is erected via the plate 30, and is inserted into and engaged with the positioning hole 24a formed in the substrate 24, so that a pair of surface markings are formed. It is composed of positioning pins 31 for positioning the board 24 at a predetermined position on the guide rails 25 and 25.

When electronic components are mounted on the board 24 by the electronic component mounting device, the board positioning device 21 positions the board 24 at a predetermined position on the pair of guide rails 25, 25. At this time, the number of words 24 is positioned at the predetermined position by the positioning pin 31,
The board 24 is held by pushing up the board 24 using the pressing pins 28 so as to hit both ends of the board 24 or the 1-flange 25b of each recess 25a of the pair of guide rails 25, 25.

In addition, in the surface electronic component mounting apparatus, since electronic components are mounted based on the top surface of the board 24,
The height of the upper surface of 4 is always kept constant by a pressing pin 28.

[Problem to be solved by the invention] However, in the conventional substrate positioning device 21,
When the number 17 of the board 24 is changed, it is necessary to adjust the height of the pressing pin 28 or the height of the elevating plate 27, etc., and position the top surface of the board with different thickness to the predetermined JUL'S height. The work involved was complicated. In addition, since both ends of the bottom surface of the board 24 are not held equally, the board 24 is likely to wobble due to the clearance between the positioning pin 31 and the positioning hole 24a of the board 24 (which may adversely affect the mounting accuracy of electronic components). Furthermore, the center part of the bottom surface of the board 24 is pushed up with the pressing pin 28 to push the board 24 up.
A pair of guide rails 25.25 6 upper tsuba 25b, 25
Since the board 24 is held at the position b, the board 24 tends to curve upward in an arc shape and warp. After the nozzle of the electronic component mounting device is pressed against the board 24 in this warped state and the electronic component is mounted, the board 24 is When the nozzle is moved away from the substrate 33, the electronic components fly off due to the reaction force of the warpage of the substrate 24, which tends to cause problems such as the inability to mount the electronic components on the substrate 24.

Therefore, the present invention provides a substrate positioning device that can position and hold substrates of different thicknesses at predetermined positions without adjusting the height of pressing pins or the like.

[Means for solving the problem] A pair of guide rails for transporting a board on which components are mounted;
An elevating plate is disposed so as to be freely raised and lowered by an elevating mechanism with respect to the substrate placed on the pair of guide rails so as to be freely conveyable, and an elevating plate is provided upright on the upper surface of the elevating plate, and a portion other than both ends of the substrate is raised and lowered. 117j A plurality of pressing pins that press against the pair of guide rails are provided upright on the upper surface of the elevating plate, and are inserted into and engaged with positioning holes formed in the substrate to be positioned at predetermined positions of the pair of guide rails. A dowel pin for positioning the board is made to come into contact with the upper surface of the elevating plate and can be separated from it freely, so that when it comes into contact with the upper surface of the elevating plate, its height becomes the same as the height of each of the pressing pins. and a pair of pressing members for pressing both ends of the Iij marking plate against the pair of guide rails.

"Function" Even if the thickness of the boards is different, both ends of each board will be securely clamped between the pair of guide rails and the pair of pressing parts, and will not wobble. At this time, the heights of the tips of the pair of suppressing members and the tips of the plurality of pressing pins are the same, so the horizontal state of the base is maintained and the board does not warp or the like.

[Example code] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In Figure 1.2, 1 is, for example, X of an electronic component mounting device.
- It is a substrate positioning device provided on a Y table or the like.

This board positioning device 1 includes a rectangular plate-shaped fixing plate 2 fixed to the X-Y table, and a pair of guide rail holding plates 3 that stand vertically opposite to each other at both ends of the upper surface of the fixing plate 2. 3, a pair of upper guide rails 5, 5, which are fixed along the upper edges of the opposing inner surfaces of the pair of guide rail holding plates 3.3 and transport the bracket 4 on which electronic components are mounted; An elevating plate 7 is disposed so as to be movable up and down by an air cylinder (elevating mechanism) 6 with respect to the substrate 4 which is freely conveyed on the upper guide rail 5.5, and a mounting plate 8 is attached to the upper surface 7a of the elevating plate 7. a plurality of pressing pins 9 which are erected through the lower surface of the substrate 4 and push up the portion 4a other than both ends of the lower surface of the substrate 4 toward the respective flanges 5b of the pair of upper guide rails 5.5; 7
a, and a positioning hole 4b formed in the substrate 4.
inserted into and engaged with the pair of upper guide rails 5.5.
a positioning pin 10 for positioning the substrate 4 at a predetermined position;
and a receiving plate +1 fixed to both ends of the upper surface 7a of the lifting plate 7. I! and is formed so that when it comes into contact with a receiving plate 11.11 fixed to the upper surface 7a of the elevating plate 7, its height is the same as the height of each of the pressing pins 9, It is roughly constituted by a pair of lower guide rails (suppressing members) 12, 12 that press both ends 4c, 4c of the substrate 4 against the flanges 5b of the pair of upper guide rails 5, 5.

The air cylinder 6 is attached to the fixed plate 2, and the tip of the rod 6a is connected and fixed to the center of the lifting plate 7. A plurality of guide pins 13 are suspended from the lower surface of the four-drop plate 7. These guide pins 13 are inserted into a plurality of guide pins 14 fixed to the upper surface of the fixed plate 2, and are inserted into the elevating plate 7.
It is designed to be raised and lowered horizontally without tilting.

The pair of upper guide rails 5.5 and the pair of lower guide rails l2, 12 constitute a pair of guide rails 15.15. In detail, a pair of lower guide rails l2
．． The upper side of 12 is attached to the four parts 5a, 5a formed on the opposing inner surfaces of a pair of upper guide rails 5, 5 so as to be slidable in the vertical direction, and the upper side of the pair of lower guide rails 12.12 3. Each T-shaped slider 16 fixed at the center of the outer surface is connected to a pair of guide rail holding plates 3.3.
It is attached to a pair of substantially U-shaped slider guides 7 and 17 fixed to opposing inner surfaces of the slider guides 17 and 17 so as to be slidable in the vertical direction. In addition, the flanges 12b formed on each lower part 12a of the pair of lower guide rails 12.degree.
8.18, the pair of lower guide rails l2. Both ends 4c, 4c of the board 4 are attached to the concave if portion formed by the upper surfaces 12c of +2 and the flanges 5b of the upper ends flll11 of the pair of upper guide rails 5, 5.
is designed to be inserted and placed. The width of these three groove portions is determined by the position of the stopper 18°18 described in iii, and is slightly wider than the maximum thickness of the substrate 4 used.

According to the board positioning device 1 of the embodiment described above, when an electronic component is mounted on the board 4 by an electronic component mounting device (not shown), the board positioning device 1 positions the board 4 at a predetermined position on the pair of guide rails 15, 15. Position and hold.

That is, the substrate 4 is conveyed to a predetermined position on the pair of guide rails 15, 15 by a moving machine groove (not shown) and stopped. Next, when the air nozzle 6 is driven to raise the elevating plate 7, the positioning pin IO is inserted into the positioning hole 4b of the board 4.
A pair of lower guide rails I 2.12 and a plurality of pressing pins 9.
- Push up the board 4 so that both ends 4C of the board 4 and the portion 4a other than both ends hit the flange part 5b of the pair of trailing rails 5, 5, and stop. As a result, the substrate 1
Both ends 4c, 4c are the flange portion 5b of the pair of upper guide rails 5.5 and the pair of lower guide rails l2. +2 top surface 1
2c and 12c. At this time, as shown in FIG. 2, a pair of lower guide rails l 2, 12
Since the heights 12c and +2c of the upper surface and the heights of the tips of the plurality of pressing pins 9 are the same height, the board 4 does not warp, etc., and the horizontal state is maintained. Positioned and clamped. As a result, the top surface of the substrate 4 is always positioned and maintained at a predetermined standard height.

In this way, both ends 4c, 4c of the board 4 are connected to the flanges 5b of the pair of upper guide rails 5, 5, and the pair of lower guide rails l2.
, 12 and the upper surfaces 12c and +2c of the substrate 4, even if the thickness of the substrate 4 is changed, the height of the pressing pin 9 can be adjusted or the height can be adjusted as before (7).
It is possible to position the upper surfaces of substrates having different thicknesses according to the height position of the predetermined base plate without adjusting the height of the substrate. However, even if there is some clearance between the positioning pin 10 and the positioning hole 4b of the board 4, both ends of the board 4, 1c and 4c, are securely clamped, so no wobbling occurs and the board 4 Accuracy can be improved in the case of detecting pattern image processing, etc., and the degree of mounting PiT of electronic components can be improved. Furthermore, both ends of substrate 1 = I
Since the portions 4a other than c and 4c can be pressed down with a plurality of pressing pins 9, warpage in the longitudinal direction of the board 4 can be corrected, and the electronic component mounting device can be mounted on the board 4. When mounting electronic components by pressing the nozzle, the electronic components can be mounted easily (1-) and securely.
The accuracy of mounting electronic components onto the board 4 can be further improved.

According to the above embodiment, the pair of guide rails 15.1
5, the upper side (upper guide rail 5) is fixed and the lower side (lower guide rail 12) is movable.As shown in FIG. 3, the fixed guide rail 25.2 has a U-shaped cross section.
A vertical hole 25c is formed in each of the four parts 25a of the 5, and a drive pin 19 as a pushing part (O) is provided in each of the vertical holes 25c so as to be movable up and down via a compression coil spring 20. Both ends 4c, 4c of the board 4 may be clamped between each upper flange 25b of the rail 25. Also in this case, the lower portions of the pair of drive pins 19, 19 are fixed to the upper surface 7a of the elevating plate 7. Receiver plate II, I
Since it is formed so that its height is the same as the height of each pressing pin 9 when it comes into contact with I, the same operation and effect as in the previous embodiment can be achieved. Components that are the same as those in the embodiment described in [)η are designated by the same reference numerals and detailed explanations will be omitted.

Further, in each of the embodiments described above, the elevating mechanism for elevating and lowering the elevating plate 7 is the air cylinder 6, but it is needless to say that the present invention is not limited to this.

[Effects of the Invention] As described above, according to the present invention, both ends of the base plate are provided on the upper surface of the base plate, which is disposed so as to be freely raised and lowered by the raising and lowering mechanism with respect to the board placed on the pair of guide rails. Press the other parts against the pair of kite rails described above. , a pair of III plates are brought into contact with and separated from each other by the elevating plate, and the two ends of the board are connected to the pair of guide rails by the field of the elevating plate.
'Since the height of the lifting plate with all the pressure parts is made to be the same as the height of each pressing pin when it comes into contact with the plate, it is easy to replace the pressing pins or adjust the height of the lifting plate. It is possible to hold and position boards of different thickness in the predetermined positions of a pair of guide rails without shifting, and it also reliably prevents the boards from wobbling or warping after positioning, which improves component mounting accuracy. can be further improved.

[Brief explanation of the drawing]

FIG. 1 shows an embodiment of the present invention with a substrate (positioning device η).
Figure 2 is a cross-sectional view showing the state of board positioning process.
FIG. 3 is a sectional view of another embodiment corresponding to FIG. 2, and FIG. 4 is a sectional view of a conventional substrate positioning device. 1.1'... Board positioning device, 4... Board, 4a...
・Parts other than both 114, 4h...Positioning hole, 4C・
・Both ends, 6. Air cylinder (lifting mechanism), 7. Lifting plate, 7a.. Upper surface, 9.. Pressing pin, 10. Positioning pin, 12.. Lower guide rail (suppressing member).
15.25... Guide rail, 19... Drive pin (suppressing member). Fufuji fL! l ogodo > f3 dokuashi? Figure 2

Claims (1)

[Claims] (1) a pair of guide rails for transporting a board on which components are mounted; an elevating plate disposed so as to be movable up and down by an elevating mechanism with respect to the board placed on the pair of guide rails so as to be freely transportable; a plurality of pressing pins erected on the upper surface of the elevating plate and pressing portions other than both ends of the board toward the pair of guide rails; and a plurality of pressing pins erected on the upper surface of the elevating plate and inserted into positioning holes formed in the substrate. , a positioning pin that is engaged to position the board at a predetermined position of the pair of guide rails; and a positioning pin that is able to come into contact with and separate from the top surface of the lifting plate, and when it comes into contact with the top surface of the lifting plate, the height of the positioning pin is fixed. a pair of pressing members formed to have the same height as each of the pressing pins, and pressing both ends of the substrate against the pair of guide rails.