CN1051434C - Jig for detecting warp of pringed circuit board and method of producing printed circuit board - Google Patents
Jig for detecting warp of pringed circuit board and method of producing printed circuit board Download PDFInfo
- Publication number
- CN1051434C CN1051434C CN94102939A CN94102939A CN1051434C CN 1051434 C CN1051434 C CN 1051434C CN 94102939 A CN94102939 A CN 94102939A CN 94102939 A CN94102939 A CN 94102939A CN 1051434 C CN1051434 C CN 1051434C
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- solder
- corrugated surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
Abstract
To stabilize the quality of a substrate and improve the yield and the productivity by arranging a detecting jig of fused solder surface or a warp detecting jig of a printed wiring board in a soldering device and controlling the fused solder surface based on the detected signal of a displacing sensor. The detecting jig 30 of the height of the fused solder waveform surface or warp of the printed wiring board arranging plural displacing sensors 8 at each prescribed interval in the advancing direction of the printed wiring board is provided. Then, by keeping and controlling the height of the fused solder waving surface or injecting solder waving surface to the optimum condition, the printed wiring board mounting various kinds of electron parts can quickly be kept up with change of the kind and also the soldering yield and the productivity are improved, and the quality of the printed wiring board is stabilized.
Description
The present invention is on November 3rd, 1992 application, and application number is CN92112705.7, and denomination of invention is divided an application for the application of " welding equipment and method and the device that connect with scolder ".
This invention relates to measures and detection is used to weld the device of melting solder corrugated surface (solder spray corrugated surface) height of various electronic devices (element) on the printed circuit board (PCB).
The welder that uses spraying welder or melting solder to have horizontal corrugated surface is welded into a circuit to the various electronic devices on the printed circuit board (PCB) (comprising kickback transformer, resistance, electric capacity and cross-over connection electric wire).Such spraying welder can be considered Fig. 5 (sectional view of conventional welder vitals).In Fig. 5, weld groove 50 is at the scolder 13 of scolder spout 51 places ejection fusing, and scolder 13 forms the shape of projection in the centre of weld groove 50.The traffic controller 52 of adjustable angle is installed near the scolder spout 51 the support.The scolder 13 that flows out from scolder spout 51 by transfer pump that screw (not marking) is housed along the predefined paths Automatic Cycle.Printed circuit board (PCB) 40 passes through the top of solder spray corrugated surface 54 up, so that the various electronic devices that are contained on the printed circuit board (PCB) 40 are welded.
The device that displacement transducer (be used for controlling solder spray corrugated surface) is housed proposed in Japanese unexamined patent publication 62-199266 number, 1-104465 number and 63-220973 number.
Yet in spraying welder shown in Figure 5, the solder spray corrugated surface is after with the naked eye controlling and monitoring, determines by experience.Therefore, be difficult to the best corrugated surface that all-the-time stable ground obtains solder spray; Moreover, also can not get repeatability owing to can not carry out quantitative control.
When all wanting the different printed circuit board (PCB) 40 of conversion every day, need spend many times to determine the best corrugated surface of solder spray and determine welding condition by test, carry out these tests in addition and also need consume various materials.Moreover, in the process of using this device, amount of solder in the weld groove 50 will reduce, and the oxide of scolder will be stayed on the inner surface of spout 51 simultaneously, and these deposit the corrugated surface 54 that the resistance that oxide solder produced that gets off will change solder spray.Like this, can produce adverse effect, and reduce the welding productive rate the welding condition of printed circuit board (PCB) 40.
At additional scolder or when removing oxide solder, must reset or the corrugated surface of definite solder spray, when therefore finishing these work, all need to spend the time and materials of test at every turn.The method of the detection solder spray corrugated surface height that proposes in Japanese unexamined patent publication 62-199266 number and 1-104466 number is made up of buoyancy aid on the solder spray corrugated surface and the displacement transducer that detects this buoyancy aid.The difference of this patent and this patent is: this patent can be measured the height at least two positions (along the direction of transfer of printed circuit board (PCB), one of them is the top of solder surface) of solder spray corrugated surface simultaneously with some displacement transducers; According to these measuring-signals, can control automatically and be contained in the angle that near the traffic controller driving motor of scolder spout changes traffic controller, perhaps control obtains the desirable corrugated surface of solder spray to the delivery pump driving motor of melting solder circulation thereby make it reach optimum speed automatically.
Japanese unexamined patent publication 63-220973 number is with the difference of this patent: this patent is measured some positions of solder spray corrugated surface simultaneously along the direction of transfer of printed circuit board (PCB) above corrugated surface.
After considering the problems referred to above, first purpose of the present invention is to provide a kind of device that detects the printed circuit board (PCB) warpage degree.
Welding equipment provided by the invention is equipped with the device that detects melting solder corrugated surface (or solder spray corrugated surface) height, or the device that detects the printed circuit board (PCB) warpage degree is housed, and checkout gear is positioned at the top that formula welder or solder spray have the spraying welder of corrugated surface of soaking into that melting solder has horizontal corrugated surface.
According to said structure of the present invention, do not need to change significantly the outward appearance and the shape of conventional welding equipment, but in a short period of time with regard to quantitative setting and the corrugated surface of control melting solder or the corrugated surface of solder spray.The also thermal strain of may command printed circuit board (PCB) simultaneously.To different printed circuit board (PCB)s, can control and write down the best corrugated surface of solder spray in advance.Therefore, can realize the conversion of different printing circuit board fast, improve the welding productive rate and the productivity effect of printed circuit board (PCB).Moreover, the suffered heat load time of electronic device is also fixed on the printed circuit board (PCB), thereby has stablized the quality of electronic device, has prolonged the life-span of the electronic installation (as television set, video recorder) that this printed circuit board (PCB) is housed.
Accompanying drawing is summarized as follows:
Fig. 1 is the perspective view of welding equipment one pith among the present invention;
Fig. 2 is along the S among Fig. 1
1-S
1The sectional view that line obtains;
Fig. 3 is the scolder circulating device of welding equipment among Fig. 1 and the perspective view of scolder spout;
Fig. 4 is the perspective view of displacement transducer, display and the automatic control system of welding equipment among Fig. 1;
Fig. 5 is the sectional view of conventional welding equipment pith.
Preferred embodiment with solder spray corrugated surface of welding equipment of the present invention will be described with Fig. 1 to Fig. 4.This welding equipment comprises spraying welder 10, measure and detect the checkout gear 30 at some positions (with respect to the height of this corrugated surface 11) of solder spray corrugated surface 11 simultaneously with one group of displacement transducer 8, automatically control the automatic control system 49 of various driving motor rotating speeds (or corner) according to the measurement data of these displacement transducers 8, the display unit 48 that on monitor, shows displacement transducer 8 height measurement results, printed circuit board (PCB) conveyer belt (not showing bright), printed circuit board (PCB) preheater (not showing bright), and the control system (not showing bright) of controlling these devices or parts.
Allow melting solder 13 pass kerve 28 to cocycle from the bottom of scolder spout 21 with predetermined speed by delivery pump 26, delivery pump 26 can be made up of the screw (not indicating) that for example is contained on the rotating shaft 27.
According to the measuring-signal of displacement transducer 8, control the rotating speed of the driving motor (not indicating) of delivery pump 26 automatically, so that form the expection corrugated surface 11 of solder spray.
The checkout gear 30 usefulness bolts or the like that detect solder spray corrugated surface 11 are mounted and fixed on the framework 25 of printed circuit board (PCB) conveyer belt, and this device can be removed from framework 25 easily.Also available alignment pin or L shaped guide plate (not indicating) be the installation site of duplicate detection device 30 easily.
Some displacement transducers 8 are installed in the lower surface of sliding stand 3, are separated from each other predetermined distance along the direction of transfer of printed circuit board (PCB) 40 to be welded.In this embodiment, three displacement transducers 8 are placed in the top at three positions (top of corrugated surface, afterbody and between the two) of solder spray corrugated surface 11 respectively.
The measurement data of the height of the solder spray corrugated surface 11 that three displacement transducers 8 are measured is presented on the display screen 48 of monitor all the time, if need also printable one-tenth record data 50.
The measurement result of displacement transducer 8 is imported automatic control system 49 simultaneously.This system 49 calculates the optimum data of solder spray corrugated surface 11 and the difference of measurement data automatically, the rotating speed of the driving motor (not indicating) of the delivery pump 26 of automatic Control Circulation melting solder, and the corner of controlling driving motor 46 automatically regulates 41 pairs of traffic controllers 22 of L shaped connecting rod, so that the corrugated surface 11 of the solder spray that forms is the most suitable for given printed circuit board (PCB) 40.
The angle of traffic controller 22 along with the motion of L shaped connecting rod 41 along arrow R
1The direction adjustment, connecting rod 41 can be around being fixed on pivot 43 on the bearing 42 along arrow R
2Direction rotate.The motion of L shaped connecting rod 41 is by the axial motion decision of the adjusting screw(rod) on the driving motor 46 45.
Parts such as L shaped connecting rod 41, flat board 44, driving motor 46 are installed in certain position respectively, make them can not disturb travelling forward of printed circuit board (PCB) 40.In order to adjust the angle of traffic controller 22, driving motor 46 also can directly link to each other with pivot 43, drives L shaped connecting rod 41, to omit adjusting screw(rod) 45.
Below, will method that utilize top welding equipment welding that the printed circuit board (PCB) 40 of various electronic devices is housed be described.This moment, apparatus for mounting electronic component (not indicating) and above-mentioned welding equipment were arranged on the automatic production line of printed circuit board (PCB) together.
In advance various electronic devices are contained on the printed circuit board (PCB) 40, these devices comprise: the electronic component (as electrolytic capacitor and metalfilmresistor) and the chip component (as resistance, electric capacity and coil) of special-shaped device (as kickback transformer and flange-cooled integrated circuit (IC)), band the end of a thread.
The method that solder spray corrugated surface 11 is set is at first described:
According to the type of the printed circuit board (PCB) 40 that will weld, the data input automatic control system 49 of some displacement transducers 8 by the best corrugated surface height of solder spray of test acquisition in advance.
Then, allow the driving motor (not indicating) of delivery pump 26 of circulation scolder press the desired speed running.Start each displacement transducer 8 and measure the height of solder spray corrugated surface 11, and measurement data input automatic control system 49.Like this, as mentioned above, just can be provided with or control the suitable rotational speed of delivery pump 26 and the suitable corner of flow control platform 22 respectively by automatic control system 49 feedback data.
The sliding stand 3 that detects the checkout gear 30 of solder spray corrugated surface 11 can be on the Width of printed circuit board (PCB) 40 (promptly perpendicular to the direction of transfer arrow Y of printed circuit board (PCB) 40 direction) moves by predetermined amount, and the height of solder spray corrugated surface 11 can record on three positions of printed circuit board (PCB) 40 (both sides of printed circuit board (PCB) 40 and central authorities) at least like this.
If desired, can along continuous straight runs repeat to determine the height of solder spray corrugated surface at predetermined space, thereby be sure of that solder spray corrugated surface 11 has predetermined curved surface, after having done like this, just finished the pre-control of solder spray corrugated surface and essential accurate work.At last, fixedly sliding stand 3 makes it to be positioned at corresponding position, centre with the printed circuit board (PCB) 40 that moves.
Each displacement transducer 8 is measured the height of solder spray corrugated surface 11, and measurement data input automatic control system 49, thereby control each driving motor automatically.Constantly repeat these operations, also can make the corrugated surface of solder spray remain optimum state even amount of solder changes (after for example using welding equipment and additional scolder continuously).
As mentioned above, corrugated surface 11 at solder spray keeps under the condition of optimum shape, printed circuit board (PCB) 40 sends continuously by conveyer belt (not indicating), and each printed circuit board (PCB) 40 can be immersed in the scolder of fusing by the time of setting like this, thereby obtained stable welding condition.
As mentioned above, welding equipment of the present invention is equipped with the checkout gear of solder spray corrugated surface, and this device utilizes simple in structure and low-cost displacement transducer to survey, control and keep the best corrugated surface of solder spray.
In the above-described embodiments, though welding equipment is the type (promptly mobile printed circuit board (PCB) of coming being immersed in the top of solder spray overshooting shape corrugated surface) of spraying welding, the present invention is not limited in this type.For example, the welding equipment that the melting solder surface detection apparatus is housed also can be other types, and as the horizontal stationary surface that printed circuit board (PCB) vertically immerses melting solder, perhaps Pen Tu scolder has general horizontal corrugated surface.In this case, the surface of printed circuit board (PCB) and melting solder move toward one another and being separated from each other mutual vertically.
Have in welding equipment under the situation on static horizontal solder surface and general horizontal ripple solder spray surface, checkout gear 30 can be measured at least two positions on melting solder surface simultaneously, and by feedback data weld groove is moved up and down.In addition, the rotating speed that also can control melting solder circulating device delivery pump automatically makes the melting solder Surface Vertical move on to optimum height.
Displacement transducer can be placed in the desired position respectively, as is placed in the top of solder spray corrugated surface.
Except the corrugated surface of measuring solder spray, the height at the several positions of printed circuit board surface (as both sides and central authorities) can printed circuit board (PCB) during by solder spray corrugated surface top or by after record, thereby also can detect and the warpage degree of control printed circuit board 40.By monitoring the warpage degree of printed circuit board (PCB) 40, can judge whether the welding temperature of welding position and final condition be suitable.
Displacement transducer can adopt arbitrary suitable type, as: laser class, ultrasonic-type, vortex patern, thermosensitive type and light-emitting diodes cast.
As mentioned above, adopt welding equipment of the present invention (comprising device, device that detects the printed circuit board (PCB) warpage degree that detects the melting solder surface and device or the means of controlling the melting solder corrugated surface according to the detection signal of displacement transducer), the quality of printed circuit board (PCB) be can stablize, productive rate and productivity effect improved; Moreover, since various types of printed circuit board (PCB)s of conversion easily, the production of the most suitable multi-varieties and small-batch printed circuit board (PCB) of the present invention.
Claims (2)
1. be used to detect the device of printed circuit board (PCB) warpage degree, comprise:
The installing component of one displacement transducer, it keeps predetermined distance up with by the top that sprays welder (10) formed solder spray corrugated surfaces (11); And
One group of displacement transducer (8), it is installed on the described transducer installing component with the alternate preset space length of horizontal direction along the printed circuit board (PCB) (40) that is welded by described spraying welder (10);
Horizontal direction from printed circuit board (PCB) (40), when being pressed in spraying welding corrugated surface (11), goes up printed circuit board (PCB) so that measure the described at least leading section of printed circuit board (PCB) (40), during the height of rearward end and core roughly, described displacement transducer (8) lays respectively at the leading section at least of printed circuit board (PCB) (40), on rearward end and the core roughly;
Described displacement transducer (8) is laser class, ultrasonic-type, vortex patern, thermosensitive type and light-emitting diodes cast.
2. device as claimed in claim 1, it is characterized in that, for by making the horizontal movement of transducer placing portion change part, but described transducer placing portion is arranged to the along continuous straight runs motion by the printed circuit board (PCB) (40) of its height of described displacement sensor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP288303/1991 | 1991-11-05 | ||
| JP28830391 | 1991-11-05 | ||
| JP288303/91 | 1991-11-05 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92112705A Division CN1030292C (en) | 1991-11-05 | 1992-11-03 | Jig for detecting height of wavy solder surface, method of controlling height of solder surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1096623A CN1096623A (en) | 1994-12-21 |
| CN1051434C true CN1051434C (en) | 2000-04-12 |
Family
ID=17728427
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92112705A Expired - Fee Related CN1030292C (en) | 1991-11-05 | 1992-11-03 | Jig for detecting height of wavy solder surface, method of controlling height of solder surface |
| CNB981263224A Expired - Fee Related CN1225154C (en) | 1991-11-05 | 1992-11-03 | Method for producing circuit board |
| CN94102939A Expired - Fee Related CN1051434C (en) | 1991-11-05 | 1994-03-16 | Jig for detecting warp of pringed circuit board and method of producing printed circuit board |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92112705A Expired - Fee Related CN1030292C (en) | 1991-11-05 | 1992-11-03 | Jig for detecting height of wavy solder surface, method of controlling height of solder surface |
| CNB981263224A Expired - Fee Related CN1225154C (en) | 1991-11-05 | 1992-11-03 | Method for producing circuit board |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR960013707B1 (en) |
| CN (3) | CN1030292C (en) |
| MY (2) | MY126741A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101462414B (en) * | 2008-11-28 | 2011-03-23 | 江苏康众数字医疗设备有限公司 | Printing device and printing method for integrating electronic components |
| JP5288012B2 (en) * | 2012-01-25 | 2013-09-11 | 千住金属工業株式会社 | Jet solder height confirmation jig and its handling method |
| CN102967273A (en) * | 2012-11-16 | 2013-03-13 | 上海申和热磁电子有限公司 | DBC (Dynamic Break Control) baseplate warping laser measuring device |
| CN105751694A (en) * | 2014-12-19 | 2016-07-13 | 泰科电子(上海)有限公司 | 3D inkjet printing system and method |
| CN107020430A (en) * | 2017-03-29 | 2017-08-08 | 歌尔股份有限公司 | A kind of wicking method and immersion tin device |
| WO2019078021A1 (en) * | 2017-10-18 | 2019-04-25 | 三菱電機株式会社 | Soldering apparatus and soldering method |
| CN109000611B (en) * | 2018-10-12 | 2021-01-19 | 广东正业科技股份有限公司 | Single-region and double-region adjustable detection device and detection method thereof |
-
1992
- 1992-10-15 MY MYPI98005072A patent/MY126741A/en unknown
- 1992-10-15 MY MYPI92001859A patent/MY111173A/en unknown
- 1992-11-03 CN CN92112705A patent/CN1030292C/en not_active Expired - Fee Related
- 1992-11-03 CN CNB981263224A patent/CN1225154C/en not_active Expired - Fee Related
- 1992-11-04 KR KR1019920020617A patent/KR960013707B1/en not_active IP Right Cessation
-
1994
- 1994-03-16 CN CN94102939A patent/CN1051434C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11389888B2 (en) | 2020-08-17 | 2022-07-19 | Illinois Tool Works Inc. | Wave solder nozzle with automated exit wing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1225154C (en) | 2005-10-26 |
| KR960013707B1 (en) | 1996-10-10 |
| CN1096623A (en) | 1994-12-21 |
| KR930009692A (en) | 1993-06-21 |
| CN1030292C (en) | 1995-11-22 |
| CN1275881A (en) | 2000-12-06 |
| CN1072364A (en) | 1993-05-26 |
| MY111173A (en) | 1999-09-30 |
| MY126741A (en) | 2006-10-31 |
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| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |