CN102967273A - DBC (Dynamic Break Control) baseplate warping laser measuring device - Google Patents
DBC (Dynamic Break Control) baseplate warping laser measuring device Download PDFInfo
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- CN102967273A CN102967273A CN2012104623375A CN201210462337A CN102967273A CN 102967273 A CN102967273 A CN 102967273A CN 2012104623375 A CN2012104623375 A CN 2012104623375A CN 201210462337 A CN201210462337 A CN 201210462337A CN 102967273 A CN102967273 A CN 102967273A
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Abstract
The invention provides a DBC (Dynamic Break Control) baseplate warping laser measuring device comprising a lower baseplate, a measuring platform, an upper baseplate, a sliding mechanism, a measuring mechanism and a heat radiating fin, wherein the measuring platform is arranged on the lower baseplate; the upper baseplate is arranged on the lower baseplate through supporting rods arranged at two sides of the upper baseplate; the sliding mechanism is arranged on the upper baseplate; the measuring mechanism is connected with the sliding mechanism through a support and arranged above the measuring platform; and the heat radiating fin is arranged on the support and between the measuring mechanism and a sample to be measured. The DBC baseplate warping laser measuring device is used for measuring the warping of a non-contact type DBC baseplate through laser transmitting and receiving and improving the measuring precision; and meanwhile, a laser transmitter/receiver is arranged on a guide rail through the support, a gear is driven by the rotation of a bolt to ensure that a slide block moves on the guide rail, and the guide rail is parallel to the measuring platform, so that the warping between laser and a measured object is measured.
Description
Technical field
The invention belongs to semiconductor manufacturing, LED, optical communication field, the measurement, particularly a kind of DBC substrate warp laser measuring device for measuring of warpage when particularly suitable semiconductor cooler, LED, power semiconductor etc. are used the DBC substrate.
Background technology
Because the copper thermal expansivity different from porcelain, after pottery directly covered copper (DBC), the DBC substrate can produce warpage; The DBC substrate is when rear road device welds, because heating also produces warpage simultaneously.These warpages all must be measured to guarantee to produce and carry out.Existing DBC substrate warp is measured useful clearance gauge measurement and is measured two kinds of methods with three-coordinates measuring machine:
A kind of is to measure with clearance gauge is manual, fills in the DBC B.B.P with clearance gauge during measurement, and measuring error is large, can't measure in DBC base plate heating situation simultaneously; Another is to measure with three-coordinates measuring machine, measures loaded down with trivial detailsly, owing to directly contact with measured object, measurement has certain influence to warpage, and the while can't measure in DBC base plate heating situation, can only measure at normal temperatures.
Summary of the invention
The object of the present invention is to provide a kind of DBC substrate warp laser measuring device for measuring that under normal temperature and heating state, can measure.
For solving the problems of the technologies described above, DBC substrate warp laser measuring device for measuring of the present invention comprises: lower shoe; Measuring table, described measuring table are arranged on the described lower shoe; Upper plate, described upper plate are arranged on the described lower shoe, and described upper plate is arranged on the described lower shoe by the support bar of described upper plate both sides; Slide mechanism, described slide mechanism are arranged on the described upper plate; Measuring mechanism, described measuring mechanism is connected with described slide mechanism by support, and described measuring mechanism is arranged on the top of described measuring table; And heat radiator, described heat radiator is arranged on the described support, and described heat radiator is arranged between described measuring mechanism and the testing sample.
Described slide mechanism comprises: guide rail, described guide rail are arranged on the described upper plate, also are provided with tooth bar on described guide rail; Slide block, described slide block are arranged on the described guide rail, also are provided with gear in described slide block, and described gear and described tooth bar are complementary; And adjusting bolt, described adjusting bolt one end is connected with described gear, and an other end is arranged on outside the described slide block.
Described support comprises: lateral frame, and an end of described lateral frame is connected with described sliding shoe; And perpendicular support, an end of described perpendicular support is connected with an other end of described lateral frame.Also further be provided with reinforcement between described perpendicular support and described lateral frame, described reinforcement is connected with described perpendicular support and described lateral frame respectively.
Described measuring mechanism comprises: the protection box, and described protection box is arranged on the described perpendicular support, is provided with exploration hole in a side of described protection box, and described exploration hole is towards described measuring table; And the Laser emission receiver, described Laser emission receiver is arranged in the described protection box, and described Laser emission receiver is electrically connected with the Data Control treating apparatus.
Be respectively equipped with measured hole and louvre at described heat radiator, described measured hole is corresponding with the position of described exploration hole.The quantity of described heat radiator is at least one, and a plurality of described heat radiator space arranges, and wherein the position of upper and lower described louvre is not corresponding, and formation shifts to install.
DBC substrate warp laser measuring device for measuring of the present invention is realized the measurement of contactless DBC substrate warp by Laser emission and acceptance, improves measuring accuracy; Device is equipped with heat radiator between measuring mechanism and testing sample, the heat of producing when reducing the DBC base plate heating is on the impact of Laser emission receiver, realize the measurement of DBC substrate warpage under heating state, the Laser emission receiver is contained on the guide rail by support simultaneously, by the rotating bolt driven gear, make slide block mobile at guide rail, guide rail and measuring table are parallel to each other, and realize the measurement of the warpage between laser and the measured object.
Description of drawings
Fig. 1 is DBC substrate warp laser measuring device for measuring structural representation of the present invention;
Description of reference numerals in the DBC substrate warp laser measuring device for measuring accompanying drawing of the present invention:
1-lower shoe 2-measuring table 3-testing sample
4-upper plate 5-support bar 6-guide rail
7-slide block 8-gear 9-adjusting bolt
10-lateral frame 11-erects support 12-reinforcement
13-protection box 14-exploration hole 15-Laser emission receiver
16-Data Control treating apparatus 17-the first heat radiator 18-the second heat radiator
19-the 3rd heat radiator 20-backing 21-measured hole that scatters
22-louvre 23-data line
Embodiment
Below in conjunction with accompanying drawing DBC substrate warp laser measuring device for measuring of the present invention is described in further detail.
As shown in Figure 1, DBC substrate warp laser measuring device for measuring of the present invention comprises: lower shoe 1; Measuring table 2, measuring table 2 are arranged on the lower shoe 1; Upper plate 4, upper plate 4 are arranged on the lower shoe 1, and upper plate 4 is arranged on the lower shoe 1 by the support bar 5 of upper plate 4 both sides; Slide mechanism, slide mechanism are arranged on the upper plate 4; Measuring mechanism, measuring mechanism is connected with slide mechanism by support, and measuring mechanism is arranged on the top of measuring table 2; And heat radiator, heat radiator is arranged on the support, and heat radiator is arranged between measuring mechanism and the testing sample 3.
Slide mechanism comprises: guide rail 6, guide rail 6 are arranged on the upper plate 4, also are provided with the tooth bar (not shown) on guide rail 6; Slide block 7, slide block 7 are arranged on the guide rail 6, also are provided with gear 8 in slide block 7, and gear 8 is complementary with the tooth bar (not shown); And adjusting bolt 9, adjusting bolt 9 one ends are connected with gear 8, and an other end is arranged on outside the slide block 7.
Support comprises: lateral frame 10, and an end of lateral frame 10 is connected with sliding shoe; And perpendicular support 11, an end of perpendicular support 11 is connected with an other end of lateral frame 10.Also further be provided with reinforcement 12 between perpendicular support 11 and lateral frame 10, reinforcement 12 is connected with perpendicular support 11 and lateral frame 10 respectively.
Measuring mechanism comprises: protection box 13, and protection box 13 is arranged on the perpendicular support 11, is provided with exploration hole 14 in a side of protecting box 13, and exploration hole 14 is towards measuring table 2; And Laser emission receiver 15, Laser emission receiver 15 is arranged in the protection box 13, and Laser emission receiver 15 is electrically connected with Data Control treating apparatus 16 by data line 23.Turning block 7 side adjusting bolts 9 band movable sliders 7 annular wheels 8 are mobile in the tooth bar (not shown), drive whole measuring mechanism and move, and realize the measurement between laser and the measured object.
The first heat radiator 17 that the space arranges, the second heat radiator 18, the 3rd heat radiator 19 and the scatter and are respectively equipped with measured hole 21 and louvre 22 on the backing 20, measured hole 21 connects at a certain angle and is used for passing through of laser, reduces heat by the interference of 21 pairs of Laser emission receivers 15 of measured hole as far as possible; Louvre 22 dislocation do not connect mutually, are used for heat and progressively distribute.
DBC substrate warp laser measuring device for measuring of the present invention is realized the measurement of contactless DBC substrate warp by Laser emission and acceptance, improves measuring accuracy; Device is equipped with heat radiator between measuring mechanism and testing sample, the heat of producing when reducing the DBC base plate heating is on the impact of Laser emission receiver, realize the measurement of DBC substrate warpage under heating state, the Laser emission receiver is contained on the guide rail by support simultaneously, by the rotating bolt driven gear, make slide block mobile at guide rail, guide rail and measuring table are parallel to each other, and realize the measurement of the warpage between laser and the measured object.
Below the preferred embodiment of the invention is specified, but the invention is not limited to described embodiment, those of ordinary skill in the art also can make all modification that is equal to or replacement under the prerequisite of the invention spirit, the modification that these are equal to or replacement all are included in the application's claim limited range.
Claims (7)
1.DBC the substrate warp laser measuring device for measuring is characterized in that, comprising:
Lower shoe;
Measuring table, described measuring table are arranged on the described lower shoe;
Upper plate, described upper plate are arranged on the described lower shoe, and described upper plate is arranged on the described lower shoe by the support bar of described upper plate both sides;
Slide mechanism, described slide mechanism are arranged on the described upper plate;
Measuring mechanism, described measuring mechanism is connected with described slide mechanism by support, and described measuring mechanism is arranged on the top of described measuring table; And
Heat radiator, described heat radiator are arranged on the described support, and described heat radiator is arranged between described measuring mechanism and the testing sample.
2. DBC substrate warp laser measuring device for measuring according to claim 1 is characterized in that described slide mechanism comprises:
Guide rail, described guide rail are arranged on the described upper plate, also are provided with tooth bar on described guide rail;
Slide block, described slide block are arranged on the described guide rail, also are provided with gear in described slide block, and described gear and described tooth bar are complementary; And
Adjusting bolt, described adjusting bolt one end is connected with described gear, and an other end is arranged on outside the described slide block.
3. DBC substrate warp laser measuring device for measuring according to claim 2 is characterized in that described support comprises:
Lateral frame, an end of described lateral frame is connected with described sliding shoe; And
Perpendicular support, an end of described perpendicular support is connected with an other end of described lateral frame.
4. DBC substrate warp laser measuring device for measuring according to claim 3 is characterized in that described measuring mechanism comprises:
The protection box, described protection box is arranged on the described perpendicular support, is provided with exploration hole in a side of described protection box, and described exploration hole is towards described measuring table; And
Laser emission receiver, described Laser emission receiver are arranged in the described protection box, and described Laser emission receiver is electrically connected with the Data Control treating apparatus.
5. DBC substrate warp laser measuring device for measuring according to claim 4 is characterized in that, be respectively equipped with measured hole and louvre at described heat radiator, described measured hole is corresponding with the position of described exploration hole.
6. DBC substrate warp laser measuring device for measuring according to claim 5 is characterized in that, the quantity of described heat radiator is at least one, and a plurality of described heat radiator space arranges, and wherein the position of upper and lower described louvre is not corresponding, and formation shifts to install.
7. DBC substrate warp laser measuring device for measuring according to claim 3 is characterized in that, also further is provided with reinforcement between described perpendicular support and described lateral frame, and described reinforcement is connected with described perpendicular support and described lateral frame respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104623375A CN102967273A (en) | 2012-11-16 | 2012-11-16 | DBC (Dynamic Break Control) baseplate warping laser measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104623375A CN102967273A (en) | 2012-11-16 | 2012-11-16 | DBC (Dynamic Break Control) baseplate warping laser measuring device |
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| Publication Number | Publication Date |
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| CN102967273A true CN102967273A (en) | 2013-03-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104623375A Pending CN102967273A (en) | 2012-11-16 | 2012-11-16 | DBC (Dynamic Break Control) baseplate warping laser measuring device |
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| CN (1) | CN102967273A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103439477A (en) * | 2013-08-30 | 2013-12-11 | 成都中光电科技有限公司 | Glass droop testing platform |
| CN111457852A (en) * | 2020-04-08 | 2020-07-28 | Tcl华星光电技术有限公司 | Substrate warping degree detection monitoring equipment and detection monitoring method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096623A (en) * | 1991-11-05 | 1994-12-21 | 松下电器产业株式会社 | The device of testing circuit slab warping and the method for producing circuit board |
| JP2501498B2 (en) * | 1991-09-02 | 1996-05-29 | 株式会社神戸製鋼所 | Camber measuring device for rolled steel sheets |
| CN102305593A (en) * | 2011-05-20 | 2012-01-04 | 西安迈瑞测控技术有限公司 | Method and device for measuring geometric elements of high-accuracy and wide-range thin-film transistor (TFT) substrate glass |
| CN102374849A (en) * | 2011-09-22 | 2012-03-14 | 清华大学 | High-temperature aerobic loading optical measurement system |
| CN102565076A (en) * | 2012-01-17 | 2012-07-11 | 柳州高华机械有限公司 | On-line detection production line |
-
2012
- 2012-11-16 CN CN2012104623375A patent/CN102967273A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2501498B2 (en) * | 1991-09-02 | 1996-05-29 | 株式会社神戸製鋼所 | Camber measuring device for rolled steel sheets |
| CN1096623A (en) * | 1991-11-05 | 1994-12-21 | 松下电器产业株式会社 | The device of testing circuit slab warping and the method for producing circuit board |
| CN102305593A (en) * | 2011-05-20 | 2012-01-04 | 西安迈瑞测控技术有限公司 | Method and device for measuring geometric elements of high-accuracy and wide-range thin-film transistor (TFT) substrate glass |
| CN102374849A (en) * | 2011-09-22 | 2012-03-14 | 清华大学 | High-temperature aerobic loading optical measurement system |
| CN102565076A (en) * | 2012-01-17 | 2012-07-11 | 柳州高华机械有限公司 | On-line detection production line |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103439477A (en) * | 2013-08-30 | 2013-12-11 | 成都中光电科技有限公司 | Glass droop testing platform |
| CN103439477B (en) * | 2013-08-30 | 2015-06-24 | 成都中光电科技有限公司 | Glass droop testing platform |
| CN111457852A (en) * | 2020-04-08 | 2020-07-28 | Tcl华星光电技术有限公司 | Substrate warping degree detection monitoring equipment and detection monitoring method |
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Application publication date: 20130313 |