JPS647694A - Method and apparatus for connecting both surfaces of printed circuit board - Google Patents
Method and apparatus for connecting both surfaces of printed circuit boardInfo
- Publication number
- JPS647694A JPS647694A JP16299287A JP16299287A JPS647694A JP S647694 A JPS647694 A JP S647694A JP 16299287 A JP16299287 A JP 16299287A JP 16299287 A JP16299287 A JP 16299287A JP S647694 A JPS647694 A JP S647694A
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- conductive pin
- printed circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE:To simply connect patterns formed on both surfaces of a printed circuit board without any complicated processing such as through-hole plating, etc., by connecting a conductive pin inserted into a through-hole with one surface pattern by application of a cream solder and reflowing, and then connecting said conductive pattern with a ground pattern by soldering dip. CONSTITUTION:A conductive pattern 30 is inserted into a through-hole 23 which penetrates between one pattern 21 provided on one surface of a printed circuit board 10 and the other pattern 22 provided on the ground of the board 10. Then, a cream solder 33 is applied on one end 31 of the conductive pin 30 corresponding to the surface of the board 10, and the cream solder 33 is heated and solidified by a reflow method, whereby the conductive pin 30 is connected with the one pattern 21. In succession, the other pattern 22 is connected with the other end 32 of the conductive pin 30 corresponding to the ground of the board 10 by a dip solder 34. The conductive pin 30 employed is one having a flat-shaped head 31 and unevenness on one end thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16299287A JPS647694A (en) | 1987-06-30 | 1987-06-30 | Method and apparatus for connecting both surfaces of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16299287A JPS647694A (en) | 1987-06-30 | 1987-06-30 | Method and apparatus for connecting both surfaces of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS647694A true JPS647694A (en) | 1989-01-11 |
Family
ID=15765148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16299287A Pending JPS647694A (en) | 1987-06-30 | 1987-06-30 | Method and apparatus for connecting both surfaces of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS647694A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0877539A1 (en) * | 1997-05-09 | 1998-11-11 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Improvements in the manufacturing processes of service boxes and their parts |
| EP0878986A1 (en) * | 1997-05-16 | 1998-11-18 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Interconnection system and pin for double-faced printed circuits by double process, wave and reflow soldering |
| FR2833756A1 (en) * | 2001-12-18 | 2003-06-20 | Valeo Electronique | Printed circuit board through hole connection method having hole formed and pillar force fitted pushed through brazing cream and first track brazed then second track |
| US8159833B2 (en) * | 2008-02-29 | 2012-04-17 | Kabushiki Kaisha Toshiba | Printed circuit board, method for forming frame ground for printed circuit board, and electronic device |
| JP2016219557A (en) * | 2015-05-19 | 2016-12-22 | パナソニックＩｐマネジメント株式会社 | Printed circuit board and printed circuit board manufacturing method |
-
1987
- 1987-06-30 JP JP16299287A patent/JPS647694A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0877539A1 (en) * | 1997-05-09 | 1998-11-11 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Improvements in the manufacturing processes of service boxes and their parts |
| WO1998051135A1 (en) * | 1997-05-09 | 1998-11-12 | Lear Automotive Dearborn, Inc. | Improvements in the manufacturing processes of service boxes and their parts |
| EP0878986A1 (en) * | 1997-05-16 | 1998-11-18 | Mecanismos Auxiliares Industriales S.A. M.A.I.S.A. | Interconnection system and pin for double-faced printed circuits by double process, wave and reflow soldering |
| WO1998052392A1 (en) * | 1997-05-16 | 1998-11-19 | Ut Automotive Dearborn, Inc. | An interconnection system and pin for double faced printed circuits by double process, wave and refusion |
| FR2833756A1 (en) * | 2001-12-18 | 2003-06-20 | Valeo Electronique | Printed circuit board through hole connection method having hole formed and pillar force fitted pushed through brazing cream and first track brazed then second track |
| US8159833B2 (en) * | 2008-02-29 | 2012-04-17 | Kabushiki Kaisha Toshiba | Printed circuit board, method for forming frame ground for printed circuit board, and electronic device |
| JP2016219557A (en) * | 2015-05-19 | 2016-12-22 | パナソニックＩｐマネジメント株式会社 | Printed circuit board and printed circuit board manufacturing method |
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