JPH0437262U - - Google Patents
Info
- Publication number
- JPH0437262U JPH0437262U JP8042790U JP8042790U JPH0437262U JP H0437262 U JPH0437262 U JP H0437262U JP 8042790 U JP8042790 U JP 8042790U JP 8042790 U JP8042790 U JP 8042790U JP H0437262 U JPH0437262 U JP H0437262U
- Authority
- JP
- Japan
- Prior art keywords
- article
- electroplating
- electrode
- plating
- holding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
Description
第1図は本考案の一実施例による電気メツキ装
置の概略平面図、第2図は第1図を−矢視方
向に見た概略断面図である。
1……電気メツキ装置、2……メツキ液、3…
…メツキ槽、4……電極、5……物品、6……物
品保持装置、6A……フレーム、6B……チヤツ
ク軸、8……支持棒、9……マスク板。
FIG. 1 is a schematic plan view of an electroplating device according to an embodiment of the present invention, and FIG. 2 is a schematic cross-sectional view of FIG. 1 as viewed in the - arrow direction. 1...Electroplating device, 2...Plating liquid, 3...
...Plating tank, 4...Electrode, 5...Article, 6...Article holding device, 6A...Frame, 6B...Chuck shaft, 8...Support rod, 9...Mask plate.
Claims (1)
ツキ装置において、メツキ液を収容したメツキ槽
と、メツキすべき金属で形成され、前記メツキ液
中に所定長さに渡つて設けられた電極と、前記円
筒状の物品を前記メツキ液に浸漬した状態で前記
電極にほぼ平行に保持し、回転させる物品保持装
置と、前記円筒状の物品の端部近傍で該物品と前
記電極との間に配置したマスク板とを有する電気
メツキ装置。 An electroplating device for electroplating a cylindrical article, comprising: a plating tank containing a plating solution; an electrode formed of a metal to be plated and provided over a predetermined length in the plating solution; an article holding device that holds and rotates the cylindrical article substantially parallel to the electrode while immersed in the plating liquid; and an article holding device disposed between the article and the electrode near an end of the cylindrical article. An electroplating device having a mask plate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8042790U JPH0437262U (en) | 1990-07-27 | 1990-07-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8042790U JPH0437262U (en) | 1990-07-27 | 1990-07-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0437262U true JPH0437262U (en) | 1992-03-30 |
Family
ID=31625478
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8042790U Pending JPH0437262U (en) | 1990-07-27 | 1990-07-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0437262U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008047509A1 (en) * | 2006-10-19 | 2008-04-24 | Honda Motor Co., Ltd. | Plating apparatus |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575457B2 (en) * | 1977-04-01 | 1982-01-30 |
-
1990
- 1990-07-27 JP JP8042790U patent/JPH0437262U/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575457B2 (en) * | 1977-04-01 | 1982-01-30 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008047509A1 (en) * | 2006-10-19 | 2008-04-24 | Honda Motor Co., Ltd. | Plating apparatus |
JP2008101243A (en) * | 2006-10-19 | 2008-05-01 | Honda Motor Co Ltd | Plating apparatus |
JP4684979B2 (en) * | 2006-10-19 | 2011-05-18 | 本田技研工業株式会社 | Plating equipment |
US7966897B2 (en) | 2006-10-19 | 2011-06-28 | Honda Motor Co., Ltd. | Plating apparatus |
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