JPH0269964U - - Google Patents

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Publication number
JPH0269964U
JPH0269964U JP14804988U JP14804988U JPH0269964U JP H0269964 U JPH0269964 U JP H0269964U JP 14804988 U JP14804988 U JP 14804988U JP 14804988 U JP14804988 U JP 14804988U JP H0269964 U JPH0269964 U JP H0269964U
Authority
JP
Japan
Prior art keywords
anode
plating
plating device
jet
net
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14804988U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14804988U priority Critical patent/JPH0269964U/ja
Publication of JPH0269964U publication Critical patent/JPH0269964U/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の実施例を示す噴流式メツキ装
置の断面図、第2図は本考案の噴流式メツキ装置
のアノード部の斜視図、第3図は従来の噴流式メ
ツキ装置の断面図、第4図は従来の噴流式メツキ
装置のアノード板の斜視図である。 11……被メツキ物、12……カソードピン、
13……アノードピン、14……粒状のアノード
、15……網状のアノード電極、16……網状の
保持部材、17……メツキカツプ、18……メツ
キカツプ固定板、19……メツキ液面。
Fig. 1 is a sectional view of a jet plating device showing an embodiment of the present invention, Fig. 2 is a perspective view of the anode portion of the jet plating device of the present invention, and Fig. 3 is a sectional view of a conventional jet plating device. , FIG. 4 is a perspective view of an anode plate of a conventional jet plating device. 11...Object to be plated, 12...Cathode pin,
13... Anode pin, 14... Granular anode, 15... Net-shaped anode electrode, 16... Net-shaped holding member, 17... Metsuki cup, 18... Metsuki cup fixing plate, 19... Metsuki liquid level.

Claims (1)

【実用新案登録請求の範囲】 メツキカツプにカソードに接続される被メツキ
物とアノードとを対向させ、それらの間にメツキ
を噴流させる噴流式メツキ装置において、 (a) 網状のアノード電極と、 (b) 該アノード電極上に配設される複数の粒状
のアノードと、 (c) 該アノード上方に設けられる前記アノード
の保持部材とを具備することを特徴とする噴流式
メツキ装置。
[Claims for Utility Model Registration] A jet plating device in which an object to be plated connected to a cathode of a plating cup and an anode are opposed to each other, and plating is jetted between them, comprising: (a) a net-shaped anode electrode; (b) 1. A jet plating device comprising: (c) a plurality of granular anodes disposed on the anode; and (c) an anode holding member disposed above the anode.
JP14804988U 1988-11-15 1988-11-15 Pending JPH0269964U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14804988U JPH0269964U (en) 1988-11-15 1988-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14804988U JPH0269964U (en) 1988-11-15 1988-11-15

Publications (1)

Publication Number Publication Date
JPH0269964U true JPH0269964U (en) 1990-05-28

Family

ID=31419011

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14804988U Pending JPH0269964U (en) 1988-11-15 1988-11-15

Country Status (1)

Country Link
JP (1) JPH0269964U (en)

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