JPS61231193A - Partial plating device - Google Patents

Abstract

PURPOSE:To make possible the plating by high-current density and to speed up plating by heating the rear of a part to be plated in the stage of ejecting a plating liquid to the part to be plated of a material to be worked. CONSTITUTION:The material 1 to be worked is fixed between a mask 2 and a fixing plate 9 and the plating liquid is ejected from an injection nozzle 3. Electricity is conducted to a nichrome wire 7 fixed to an aperture 8 of the plate 9 so that said wire generates heat at the same instant when the plating liquid is ejected. The part 4 to be plated is therefore heated from the rear and the quick heating of the plating liquid arises at the boundary between the part 4 and the plating liquid. The ion migration increases accordingly and the diffused layer of the material 1 is decreased by the local micro-boiling effect, by which the electrical conductivity is remarkably improved. The plating by the high-density current is thus made possible and since the part 4 to be plated is heated over a wide area, the plating is speeded up.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a partial plating device.

[Conventional technology]

Fig. 2 is a cross-sectional view showing a conventional partial plating apparatus. 3
) is a nozzle that sprays plating solution at high speed to the area to be plated.
The plating solution spray nozzle (4) is the part to be plated of the workpiece +11, and the mask (2) is opened only in this part.

(5) is an anode provided on the nozzle (31), and (6) is a fixing member that fixes the non-plated surface of the workpiece (1).

For example, a fixed plate.

A conventional partial plating apparatus is configured as described above.

For example, after a workpiece (1) is fixed 11 between a mask (2) and a fixing plate (6), a plating solution is ejected from a plating solution injection nozzle (3). At this time, the wave power loe material (1) is connected to the main terminal of a power source (not shown), and the anode (5) is connected to the positive terminal.

When the plating solution comes into contact with the workpiece (1), it is energized and the plated part (4) of the workpiece (11) is plated. The plating solution is designed to flow down between the nozzles (31).

[Problem that the invention seeks to solve]

When partial plating is performed using the conventional partial plating apparatus as described above, electrolysis is performed at high current density and at high speed in order to increase productivity. In order to perform this at an even higher speed, the jetting speed of the plating solution is increased to forcibly supply more metal ions. Another possible cause is an increase in the metal salt concentration of the plating solution or an increase in the plating bath temperature. However, there is a limit to forcibly supplying metal ions by increasing the ejection speed. Furthermore, as the portion to be plated becomes smaller, the shape of the mask and the ejection nozzle are determined accordingly, making it difficult to increase the ejection speed. Also, if the plating solution is made highly concentrated or heated.

There were problems such as deterioration of the properties of the plating film and deterioration of the plating solution.

This invention was made to solve these problems. 1. To obtain a partial plating device that can perform plating at high current density and perform partial plating at high speed using a normal plating solution. With the goal.

[Means for Solving the Problems] The partial plating apparatus according to the present invention includes a mask that protects parts of the workpiece other than the part to be plated, a nozzle that sprays a plating solution onto the part to be plated, and a workpiece that is fixed. The device is equipped with a fixing member to be plated, a power source that applies a predetermined voltage between the workpiece and the nozzle, and an electric resistor that heats the back surface of the part to be plated in synchronization with the application of this voltage.

[Effect]

In this invention, local heat concentration occurs by heating the workpiece from the back side with an electric resistor, which locally heats the plating solution and causes minute agitation at the interface. This activates the metal ions, promotes the supply of metal ions, and improves plating with high current density.

Additionally, only the back side of the part to be plated can be heated over a wide area.

Partial plating is possible at higher speeds.

〔Example〕

FIG. 1 is a cross-sectional view showing an embodiment of the present invention.
1 is an electrical resistor such as a nichrome wire. The nichrome wire ( ) 1 is fixed to the opening (81) provided in the fixing member 2, for example, the fixing plate (9), and heats, for example, almost the entire surface of the part to be plated (4) from the back side. al is the nichrome wire (71
It is an energized wire that carries electricity. For example, when performing OuK silver plating, CU is used as the workpiece (1).

This is done using a silver cyanide solution as a plating solution.

When performing partial plating in the above-mentioned partial plating apparatus, after fixing the workpiece Tll between the mask +21 and the fixing plate (9) as in the past, the plating liquid is sprayed from the plating liquid spray nozzle (3). gush out. At this time, the two nichrome wires (7) are fixed in the opening (8) at the same time as the plating solution is ejected.
energize through the current-carrying wire a0 and generate 1 heat.

When the plating solution and the workpiece 0) come into contact, plating is applied, but rapid heating of the plating solution occurs at the interface between the plating solution and the part to be plated (4), which is heated from the back side by the nichrome wire ()). This increases ion movement.

Due to the local micro-boiling effect, the diffusion layer of the workpiece (1) is reduced and the conductivity is dramatically increased. Since plating is performed in this state, plating can be performed at a high current density, and furthermore, since the portion to be plated (4) is heated over a wide area, it is possible to speed up the plating.

In this invention, heating of the plating solution is limited to only a very small portion of the entire plating solution.

The plating solution does not deteriorate as would occur if the entire plating solution was heated. Furthermore, even if the part to be plated (4) is miniaturized, the effect of local heating at the interface is large, so the jet of plating solution can plate even small parts, and the mask (2)
) and the shape of the plating liquid injection nozzle (3), plating can be performed at high speed.

In the above embodiment, a nichrome wire is used as the electrical resistor, but the present invention is not limited to this.

For example, even if the portion to be plated (4) of a semiconductor is heated from the back side, the same effect as in the above embodiment can be obtained.

〔Effect of the invention〕

As explained above, the present invention includes a mask that protects and protects parts of the workpiece other than the part to be plated, a nozzle that sprays plating solution onto the part to be plated, a fixing member to which the workpiece is fixed, a workpiece and the nozzle. Tono r! A power supply that applies a predetermined voltage to 1, and in synchronization with the application of the voltage.

Equipped with an electric resistor that heats the back side of the part to be plated, it enables plating with high current density.

This has the effect of speeding up plating and providing a highly productive partial plating device.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional partial plating apparatus. (11...Work material, (2)...Mask, (3)...
... Nozzle, (4) ... Part to be plated, (Fut) ... Electrical resistor, (9) ... Fixing member. In Figure 9, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] A mask that shields parts other than the plated part of the workpiece, a nozzle that sprays plating liquid onto the plated part, a fixing member to which the workpiece is fixed, and a space between the workpiece and the nozzle. A partial plating device comprising: a power source that applies a predetermined voltage; and an electric resistor that heats the back surface of the portion to be plated in synchronization with the application of the voltage.