JPS5817274B2 - Electrodeposition processing method - Google Patents

Description

[Detailed description of the invention] The present invention is an improvement to the electrodeposition process.

In electrodeposition processing, a base material (workpiece) is used as a cathode, an anode electrode is placed opposite the cathode, an electrodeposition liquid is supplied between the two, and electricity is applied to electrodeposit a metal layer on the surface of the base material. However, if the base material is irregularly shaped and complex, uniform electrodeposition over the entire surface cannot be achieved.

Particularly, precipitation is difficult to occur in the recessed portions, particularly in the corner portions, and therefore machining accuracy cannot be improved.

The present invention was proposed to eliminate such conventional drawbacks, and involves selectively irradiating light or laser to areas where the amount of electrodeposition is insufficient or where it is desired to increase the amount of electrodeposition. This is a characteristic.

Electrodeposition can be promoted by activating the electrodeposition liquid in the irradiated area with light or laser irradiation and heating it to increase efficiency.

Detailed description will be given below with reference to the drawings. FIG. 1 is a diagram illustrating the above-described conventional electrodeposition state. Reference numeral 1 denotes a base material (workpiece), and the concave portion is subjected to electrodeposition processing.

Reference numeral 2 denotes an electrodeposited layer, which is deposited in a normal manner by applying current through an electrodeposition liquid, and the electrodeposited layer is deposited thickly on the protrusions 1a where the electric field strength is high, as shown in the figure. However, since the electric field strength is low in the bottom corner part 1b, almost no precipitation occurs, or even if it does, only a very small amount is deposited.

Therefore, in the present invention, in order to deposit and form a uniform electrodeposited layer over the entire surface of the concave portion of the base material 1, light or laser is irradiated to the corner portion 1b where the electric field strength is low and the amount of deposition is small. FIG. 2 shows an example of this.

Reference numeral 3 denotes a laser oscillator whose output laser beam is focused by a lens 4 onto a right-angle prism 5, refracted, and irradiated onto a corner portion 1b.

Irradiation is not performed at a single point on the corner 1b, but by scanning and irradiating the entire corner, it is possible to uniformly electrodeposit the entire corner.

The scanning means are carried out by an NC control and also by a fine control.

6 is an anode electrode, and the electrode may be a stationary electrode or a moving electrode.

7 is an electrodeposition solution such as a Ni plating solution or a Cu plating solution. In the figure, a stationary solution that fills the electrodeposition gap is used, but by circulating a flowing liquid, Alternatively, the material may be supplied to the electrodeposition gap while circulating between the electrodeposition gaps.

Reference numeral 8 denotes a power supply terminal that conducts current with the polarity shown between the base material 1 and the electrode 6.As for the energizing source, pulses, direct current/cross current, etc. can perform better electrodeposition than direct current, and have better electrodeposition efficiency.

By irradiating the corner part 1b where electrodeposition is difficult to occur with laser light, the intervening electrodeposition liquid in that part is activated and heated, improving the deposition efficiency, and allowing electrodeposition to occur in the same way as in other parts. This enables uniform electrodeposition.

If the irradiating light or laser uses infrared rays or long wavelength lasers, it will have a heating effect and increase the temperature of the liquid at the irradiated area, and if ultraviolet rays or short wavelength lasers are used, activation by ionization will be particularly promoted. In any case, the electrodeposition solution in the irradiated area becomes activated and the deposition rate increases.

By accelerating the deposition rate in areas where the electric field strength is low in this way, it is possible to form a uniform electrodeposited layer as a whole.

During electrodeposition processing, it is more effective to use a solution with a low ion concentration for uniform electrodeposition in order to suppress the deposition rate in areas with high electric field strength. Uniform electrodeposition can be achieved by cooling the electrodeposition solution and processing while controlling the temperature rise only in the irradiated area.

Further, in the above embodiment, an example was described in which light is irradiated to areas where electric field strength is particularly low and it is difficult to electrodeposit to accelerate the deposition rate and perform uniform electrodeposition as a whole, but embodiments are not limited to this.
It can also be used in processing where you want to increase the amount of electrodeposition deposits on a uniform plane by irradiating light on areas where you want to increase the amount of electrodeposition compared to other areas, and by selective irradiation, you can perform electrodeposition processing in any desired manner. .

The irradiation light source used is about 500 W to 4 KW, mainly a xenon light source, and especially when a laser is used, one with an output of about 10 to 50 W may be used.

Of course, the light source output is not limited to this, but it was sufficient within the test range.

In the experimental example, light was irradiated onto a corner portion with a width of 57 ILm and a depth of 10 mrIL.

For electrodeposition, a copper sulfate solution was used, and a layer with a thickness of 10 cm was electrodeposited by applying a pulse current with a current pulse width of 10 μs and a current peak value of 50 A.

The electrode was electrodeposited with a PT 5 mm placed in the center, and the light irradiation time was 5 o'clock.When the electrode was not irradiated, the ratio of the amount of precipitation on the flat surface and the corner part was 50:1. After irradiation, the ratio became 1:0.8, and the plane and corner portions became equal.

It was confirmed that it is extremely effective in practice.

[Brief explanation of the drawing]

FIG. 1 of the drawings is for explaining a conventional example, and FIG. 2 is a configuration diagram of an embodiment for explaining the present invention. 1 is a base material, 2 is an electrodeposition layer, 3 is a light source, 4 is a lens, 5 is a rectangular prism, 6 is an electrode, 7 is an electrodeposition liquid, and 8 is a current supply connection terminal.

Claims (1)

[Scope of Claims] 1. In a processing method in which an electrodepositing liquid is supplied between a base material and an electrode and electricity is applied to perform electrodeposition, a portion of the base material where the amount of electrodeposition is insufficient or the amount of electrodeposition is increased. An electrodeposition processing method characterized by selectively irradiating light or laser onto the part to be coated. 2. The electrodeposition processing method according to claim 1, wherein light or laser irradiation is performed under NC or fine control. 3. The electrodeposition processing method according to claim 1, characterized in that the energizing current is a pulsed current.